
Contents
About this manua . . . . . . . . . . . . iii
Chapter 1. Safety information . . . . . . 1
General safety . . . . . . . . . . . . . . . . 1
Electrical safety . . . . . . . . . . . . . . . . 1
Safety ins ection guide . . . . . . . . . . . . . 2
Handling devices that are sensitive to electrostatic
discharge . . . . . . . . . . . . . . . . . . 3
Grounding requirements . . . . . . . . . . . . 4
Safety notices (multilingual translations) . . . . . . 4
Chapter 2. Genera checkout . . . . . 21
What to do first . . . . . . . . . . . . . . . 21
CRU list . . . . . . . . . . . . . . . . . . 22
Chapter 3. Identifying FRUs
(CRUs) . . . . . . . . . . . . . . . . . 23
Locate FRUs and CRUs . . . . . . . . . . . 23
Chapter 4. Removing an FRU or
CRU . . . . . . . . . . . . . . . . . . 27
Service tools . . . . . . . . . . . . . . . . 27
General guidelines. . . . . . . . . . . . . . 27
Handling thermal interface materials . . . . . . 28
Ty e, quantity, and areas of thermal interface
materials a lication on the heat sink . . . . 28
Area on the system board where thermal
interface materials are a lied . . . . . . . 29
Remove the lower case . . . . . . . . . . . . 29
Remove the battery ack . . . . . . . . . . . 30
Remove the 2242 solid-state drive (SSD), thermal
ad, and holder . . . . . . . . . . . . . . . 31
Remove the 2nd solid-state drive (SSD) module (for
selected models) . . . . . . . . . . . . . . 33
Remove the Wi-Fi card . . . . . . . . . . . . 35
Remove the heat sink . . . . . . . . . . . . 36
Remove the I/O board . . . . . . . . . . . . 36
Remove the fan . . . . . . . . . . . . . . . 38
Remove the s eakers and the s eaker cable
rubber . . . . . . . . . . . . . . . . . . 40
Remove the finger rint sensor bracket, cable and
board (for selected models) . . . . . . . . . . 41
Remove the system board and the I/O board
cable . . . . . . . . . . . . . . . . . . . 43
Use a Golden Key U1 tool to flash-write key id
information . . . . . . . . . . . . . . . 45
Remove the LCD unit . . . . . . . . . . . . 46
Remove the u er case (with keyboard) . . . . . 48
Disassemble the LCD unit . . . . . . . . . . . 49
Remove the hinge cover. . . . . . . . . . 49
Remove the LCD bezel . . . . . . . . . . 49
Remove the hinges. . . . . . . . . . . . 50
Remove the LCD anel . . . . . . . . . . 51
Remove the EDP cable . . . . . . . . . . 52
Remove the micro hone rubber. . . . . . . 53
Remove the camera board. . . . . . . . . 54
Remove the camera cable . . . . . . . . . 56
Remove the lid board . . . . . . . . . . . 57
Remove the LCD cover . . . . . . . . . . 58
Appendix A. Labe ocations. . . . . . 59
Trademarks . . . . . . . . . . . . . . . . . lxi
© Co yright Lenovo 2024 i