
LT768x PCB Layout Check flow
1. There is no error in the PCB schematic.
2. The spacing between the power supply and the GND should be sufficient to avoid short circuit in
the board or soldering.
3. Under sufficient condition, the line of high current should be expanded and thickened as much as
possible and the number of PCB holes should be increased.
4. The clock or crystal oscillator should be close to LT768. Make sure there no wire under the crystal
oscillator and the back of the PCB. . It is recommended to surround the circuit with ground wire.
5. The area of the ground wire is as large as possible, and adds PCB holes number as much as
possible.
6. The filter capacitor for the LT768 power supply should be close to the IC's power supply pin.
7. The SPI Flash circuit should be close to the LT768.
8. Layout inspection, label inspection, connector inspection, positive and negative inspection.
9. Increase process test points, such as key signals, power supply voltage signals, etc.
10. Increase the program test point.
11. Debug test points, such as important signals that are difficult to measure, it is best to lead out test
points.
12. Reserve screw holes or fixing holes for the PCB.
2. Size check and inspection.
3. Check the structure to avoid the component being too high
4. Whether the PCB board name and version are clearly marked.
5. The main core circuit of the LT768+MCU chip is recommended (or reserved) to be covered with a
metal cover to increase the anti-interference ability.
6. The anti-jamming choke should be close to the power input.
7. The PCB should retain contact or solder joints with the metal frame of the TFT.