LG FB162-A0U User manual

MODEL: FB162-A0U , FBS162V
SERVICE MANUAL
MODEL: FB162-A0U , FBS162V
CAUTION
BEFORE SERVICING THE UNIT, READ THE “SERVICING PRECAUTIONS”
IN THIS MANUAL.
MINI HOME THEATER
SERVICE MANUAL
P/NO : AFN35036931
Website http://biz.lgservice.com
Internal Use Only
SEPTEMBER, 2007

[CONTENTS]
SECTION 1 SUMMARY
• SERVICING PRECAUTIONS ................................................................................................... 1-2
• ESD PRECAUTIONS ............................................................................................................... 1-3
• SPECIFICATIONS ......................................................................................................................1-5
SECTION 2 EXPLODED VIEWS
1. CABINET AND MAIN FRAME SECTION ................................................................................ 2-1
2. DECK MECHANISM SECTION (DP-10A) ............................................................................... 2-3
3. SPEAKER SECTION .............................................................................................................. 2-5
4. PACKING ACCESSOR SECTION......................................................................................... 2-6
SECTION 3 INTERNAL BLOCK DIAGRAM OF IC’s ...............................................3-1
SECTION 4 ELECTRICAL TROUBLES OOTING GUIDE OF ADUIO PART .........4-1
SECTION 5 ELECTRICAL TROUBLES OOTING GUIDE OF DVD PART .............5-1
SECTION 6 BLOCK DIAGRAM ................................................................................6-1
SECTION 7 CIRCUIT DIAGRAM & VOLTAGE C ART ...........................................7-1
SECTION 8 PRINTED CIRCUIT DIAGRAMS ...........................................................8-1
SECTION 9 REPLACEMENT PARTS LIST ..............................................................9-1
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

1-2
NOTES REGARDING ANDLING OF T E PICK-UP
1. Notes for transport and storage
1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and
impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or
damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason
the adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes!
Absolutely never permit laser beams to enter the eyes!
Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
5) Cleaning the lens surface
If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used
for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cot-
ton swab should be used, taking care not to distort this.
6) Never attempt to disassemble the pick-up.
Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab.
(Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much
of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
Storage in conductive bag Drop impact
NEVER look directly at the laser beam, and don’t let
contact fingers or other exposed skin.
Magnet
How to hold the pick-up
Conductive Sheet
Cotton swab
Pressure
Pressure
SECTION 1 SUMMARY
SERVICING PRECAUTIONS
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

1-3
NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1. Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These components
are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components
can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must be
taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong magnet-
ism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded.
When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is
because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1M Ω)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent
static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
Resistor
(1 Mohm) Conductive
Sheet
Resistor
(1 Mohm)
Armband
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

1-4
ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface
such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO T E C ASSIS OR CIRCUIT, AND OBSERVE ALL OT ER
SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gener-
ate static electricity sufficient to damage an ESD device).
CAUTION. GRAP IC SYMBOLS
THE LIGHTNING FLASH WITH APROWHEAD S MBOL. WITHIN AN EQUILATERAL TRIANGLE, IS
INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED
“DANGEROUS VOLTAGE” THAT MA BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF
ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE
SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFET INFORMATION IN SERVICE
LITERATURE.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

1-5
GENERAL
Power supply Refer to main label
Power consumption Refer to main label
Net Weight 3.31 kg
External dimensions (W x H x D) 170 x 253 x 265 mm
Operating conditions Temperature: 5°C to 35°C, Operation status: Horizontal
Operating humidity 5% to 85%
CD/DVD
Laser Semiconductor laser, wavelength 650 nm
Signal system NTSC 525/60, PAL 652/50
Frequency response (audio) 40 Hz to 2 kHz
Signal-to-noise ratio (audio) More than 75 dB (1 kHz, NOP -3 dB, 20 kHz LPF/A-Filter)
Dynamic range (audio) More than 75 dB
Harmonic distortion (audio) 0.5 % (1 kHz, at 1W position) (20 kHz LPF)
VIDEO
Video output 1.0 V (p-p), 75 Ω, negative sync./ RCA jack x 1
COMPONENT VIDEO OUT ( ) 1.0 V (p-p), 75 ohms, negative sync, RCA jack x 1
(Pb)/(Pr) 0.7 V (p-p), 75 ohms, RCA jack x 1
Tuner
FM
Tuning Range 87.5 - 108.0 MHz or 65.0 - 74.0 MHz, 87.5 - 108.0 MHz
Intermediate Frequency 10.7 MHz
Signal-to Noise Ratio 60/55 dB (Mono)
Frequency Response 50 - 10,000 Hz
AM [ MW ]
Tuning Range 522 - 1,620 kHz or 520 - 1,720 kHz
Intermediate Frequency 450 kHz
AMPLIFIER
Stereo mode 80 W + 80 W
Output Power 80 W + 80 W
T.H.D 0.5 %
Frequency Response 40 - 20000 Hz
Signal-to-noise ratio 75 dB
SPEAKERS
Type 3 Way 3 Speaker
Impedance 4 Ω
Frequency Response 70 - 20,000 Hz
Sound Pressure Level 83 dB/W (1m)
Rated Input Power 80 W
Max. Input Power 160 W
Net Dimensions (W x H x D) 128 x 295 x 240 mm
Net Weight 4.1kg
SPECIFICATIONS
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

2-1 2-2
SECTION 2 EXPLODED VIEWS
1. CABINET AND MAIN FRAME SECTION
B
B
L
K
G
H
L
A
E
E
F
C
I
A
I
J
M
M
F
G
K
H
J
463
463
463
463
463
274
463
463
463
262
259
276
265
263
463
250
463
463 273
463
463
261
463
252
A26
A50
A52
A46
A44
264
468
253
257
463
300
CABLE1
CABLE2
CN303
P5701
P9701
P9702
CN302
NOTES THE EXCLAMATION POINT WITHIN AN
EQUILATERAL TRIANGLE IS INTENDED
TO ALERT THE SERVICE PERSONNEL
TO THE PRESENCE OF IMPORTANT
SAFETY INFORMATION IN SERVICE
LITERATURE.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
A43
CABLE3
275
A47
267
463

2-3 2-4
2. DECK MECHANISM SECTION (DP-10A
026
001
002
00
A01
020
018
014
01
017
4 5
012
A26
019
012
440
015B
015A
015
016
A02
4 9
012A
012A
010
4 2
0 0
025
024
4 9
4 1
4 5
4 0
021
0 6
A0
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

2-5
3. SPEAKER SECTION(FBS162V)
A
C
B
A
C
B
A81
A80A
A80R
A80 A80L
850
851
855
854 856
854
854
863 862
861
860
859
858
864
853
852
:RIGHT CABINET ASS'Y
:LEFT CABINET ASS'Y
:RIGHT SPK ASS'Y
:LEFT SPK ASS'Y
857R
857L
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

2-6
4. PACKING ACCESSORY SECTION
Plug Ass'y, 1Way(BLACK)
Antenna Loop
811
Battery
808
Packing
824
Antenna825
Remote control900
Instruction Ass'y801
Packing803
Box802
Bag804
Clear Sheet805
Accessory Bag
804A
803A
Plug Ass'y, 1Way(Red-White)813
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

3-1
SECTION 3 INTERNAL BLOCK DIAGRAM OF IC’S
1. PD78F0546R(R)
• PIN CONFIGURATION(TOP VIEW)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

3-2
• BLOCK DIAGRAM
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

3-3
• PIN FUNCTION
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

3-4 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

3-5
2. MC4580
• PIN CONFIGURATION
1
2
3
4
8
7
6
5
OUT2
IN2(-)IN1(+)
Vcc-
Vcc+OUT1
IN1(-)
IN2(+)
• TEST CIRCUIT
• ABSOLUTE MAXIMUM RATINGS (TA=25°C)
Vcc+
Vcc-
IN(-)
IN(+)
OUTPUT
SYMBOL RATINGS UNITPARAMETER
Supply Voltage V+/V- ±18 V
Input Voltage VIC ±5 V
Differential Input Voltage VID ±30 V
Output Current Io±50 mA
ower Dissipation D300 (SO -8) mW
800 (DI -8)
250(TSSO -8)
Operating Temperature Range Topr -40 to+85 °C
Storage Temperature Range Tstg -40 to +125 °C
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

3-6
3. IP9009
• PIN CONFIGURATION
• BLOCK DIAGRAM
• PIN DESCRIPTION
No SYMBOL I/O SYMBOL
1 FWD I Loading motor forward input
2 REV I Loading motor reverse input
3 CTL I Loading motor speed control
4 S I ower save
5 IN1 I CH1 input
6 IN2 I CH2 input
7 SVCC - Signal power supply
8 VCC1 - ower supply 1
9 VOL- O Loading driver output(-)
10 VOL+ O Loading driver output(+)
11 VO2- O CH2 driver output(-)
12 VO2+ O CH2 driver output(+)
13 VO1- O CH1 driver output(-)
14 VO1+ O CH1 driver output(+)
No SYMBOL I/O SYMBOL
15 VO4+ O CH4 driver output(+)
16 VO4- O CH4 driver output(-)
17 VO3+ O CH3 driver output(+)
18 VO3- O CH3 driver output(-)
19 GND - Ground
20 VCC2 - ower supply 2
21 MUTE I Mute
22 IN3 I CH3 input
23 IN4 I CH4 input
24 Vdet I Reset controller input
25 Reset O Reset controller output
26 REOadj O Adjustable regulator feedback
27 REBadj O Adjustable regulator control
28 BIAS I Bias
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

3-7
4. CY8C21434
• PIN CONFIGURATION
A, I, M, P0[1]
M, P2[7]
M, P2[5]
M, P2[3]
M, P2[1]
M, P3[3]
QFN
(Top View )
9
10 11 12 13 14 15 16
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
32
31
30
29
28 27 26
25
Vss P0[3], A, I, M P0[7], A, I, M Vdd P0[6], A, I, M P0[4], A, I, M P0[2], A, I, M
M, P3[1]
M, I2 C S CL , P1 [ 7 ]
P0[0 ], A , I, M
P2[6 ], M
P3[0 ], M
XRES
M, I2C SDA, P1[5]
M, P1[3]
M, I2C SCL, P1[1]
Vss
M, I2C SDA, P1[0]
M, P1[2]
M,EXTCLK,P1[4]
M, P1[6]
P2[4 ], M
P2[2 ], M
P2[0 ], M
P3[2 ], M
P0[5], A, I, M
• PIN DESCRIPTION
SYMBOL DescriptionPin No. Type
Digital Analog
1 IO I, M 0[1] Analog column mux input, integrating input.
2 IO M 2[7]
3 IO M 2[5]
4 IO M 2[3]
5 IO M 2[1]
6 IO M 3[3] In CY8C21434 part.
6 ower SM Switch Mode ump (SM ) connection to required external
components in CY8C21634 part.
7 IO M 3[1] In CY8C21434 part.
7 ower Vss Ground connection in CY8C21634 part.
8 IO M 1[7] I2C Serial Clock (SCL).
9 IO M 1[5] I2C Serial Data (SDA).
10 IO M 1[3]
11 IO M 1[1] I2C Serial Clock (SCL), ISS -SCLK*.
12 ower Vss Ground connection.
13 IO M 1[0] I2C Serial Data (SDA), ISS -SDATA*.
14 IO M 1[2]
15 IO M 1[4] Optional External Clock Input (EXTCLK).
16 IO M 1[6]
17 Input XRES Active high external reset with internal pull down.
18 IO M 3[0]
19 IO M 3[2]
20 IO M 2[0]
21 IO M 2[2]
22 IO M 2[4]
23 IO M 2[6]
24 IO I, M 0[0] Analog column mux input.
25 IO I, M 0[2] Analog column mux input.
26 IO I, M 0[4] Analog column mux input.
27 IO I, M 0[6] Analog column mux input.
28 ower Vdd Supply voltage.
29 IO I, M 0[7] Analog column mux input.
30 IO I, M 0[5] Analog column mux input.
31 IO I, M 0[3] Analog column mux input, integrating input.
32 ower Vss Ground connection.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

3-8
5. BU2090
• PIN CONFIGURATION
Control circuit
12-bit shift register
Latch
VSS
2
1
3
4
5
6
7
8
DATA
CLOCK
Q0
Q1
Q2
Q3
Q4
16
15
14
13
12
11
10
9
VDD
VSS
2
1
3
DATA
CLOCK
Q0
Q1
Q2
Q3
Q4
VDD
4
LCK
5
6
7
8
910
11
12
13
14
15
16
OE
17
18
Q11
Q10
Q9
Q8
Q7
Q6
Q5
Q11
Q10
Q9
Q8
Q7
Q6
Q5
Output buffer
(open drain)
BU2090 / F / FS BU2092 / F
Control circuit
Output buffer
(open drain)
12-bit shift register
1 12-bit storage register
VSS
2
1
3
DATA
CLOCK
Q0
Q1
Q2
Q3
Q4
VDD
4
LCK
5
6
7
8
912
13
14
15
16
17
18
OE
19
20
Q11
Q10
Q9
Q8
Q7
N.C.
N.C.
BU2092FV
Control circuit
Output buffer (open drain)
12-bit shift register
12-bit storage register
Q5 10 11 Q6
• PIN DESCRIPTION
PIN NAME FUNCTION
TYPE
BU2092/F
BU2090/F/FS BU2092/FV
1 1 1 DATA GND
2 2 2 CLOCK Serial data input
3 3 3 LCK Data shift clock input
— 4 4 Q0 Data latch clock input
4 5 5 Q1 arallel data output
5 6 6 Q2 arallel data output
6 7 7 Q3 arallel data output
7 8 8 Q4 arallel data output
8 9 9 Q5 arallel data output
9 10 10 Q6 arallel data output
10 11 11 N.C. arallel data output
— — 12 N.C. Not connected
— — 13 Q7 Not connected
11 12 14 Q8 arallel data output
12 13 15 Q9 arallel data output
13 14 16 Q10 arallel data output
14 15 17 Q11 arallel data output
15 16 18 OE arallel data output
— 17 19 VSS Output Enable
16 18 20 VDD ower supply
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

3-9
6. AK5358
• PIN CONFIGURATION
CKS1
VCOM
VD
DGND
AINR
AINL
AGND
VA
Top View
8
7
6
5
4
3
2
1
9
10
11
12
13
14
15
16
DIF
PDN
LRCK
MCLK
SCLK
CKS2
CKS0
SDTO
• BLOCK DIAGRAM
Modulator
MCLK
AINL
LRCK
SCLK
SDTO
DIF
VCOM
Clock Divider
AINR
AGNDVA
Decimation
Filter
Serial I/O
Interface
Voltage Reference
CKS1
DGNDVD
CKS2
Modulator
Decimation
Filter
PDN
CKS0
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only