LG 20LS3R-TA User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP69B
MODEL : 20LS3R 20LS3R-TA
website:http://biz.LGservice.com

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CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ..........................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION ...............................................................10
TROUBLE SHOOTING ............................................................................14
BLOCK DIAGRAM...................................................................................19
EXPLODED VIEW .................................................................................. 22
REPLACEMENT PARTS LIST ............................................................... 24
SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF

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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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1. Application range
This specification is applied to the 20” Wide LCD TV used
LP69B chassis.
2. Requirement for Test
Testing for standard of each part must be followed in below
condition.
(1) Power : Standard input voltage (100-240V~, 50/60Hz)
* Standard Voltage of each products is marked by models.
(2) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(3) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
1) Performance : LGE TV test method followed
2) Demanded other specification
Safety : CE, IEC Specification
EMC : CE, IEC
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
4. General Specification(TV)
No Item Specification Remark
1 Video input applicable system PAL-D/K, B/G, I, SECAM L, NTSC, NTSC. 4.43 (ZA)
2 Receivable Broadcasting System PAL/SECAM BG (ZA/TA)
PAL/SECAM DK EU/Non-EU
PAL I/I (PAL Market)
SECAM L/L’
3 RF Input Channel VHF : E2 ~ E12 PAL
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S41
L/L’ : B, C, D FRANCE
4 Input Voltage 100-240V~, 50/60Hz
5 Market EU
6 Tuning System FVS 100 program PAL, 200 PR.(Option)
FS NTSC
7 Operating Environment Temp : 0 ~ 40 deg
Humidity : 10~90 %RH
8 Storage Environment Temp : -20 ~ 50 deg
Humidity : 10~90 %RH
9 Display LCD Module

1 Viewing Angle R/L 80/80
<CR≥10> U/D 70/70
2 Luminance Luminance (cd/m2) 350 450 PSM : Dynamic, CSM : Normal
3 Contrast Ratio CR 600 700 All white / All black
4 CIE Color Coordinates WHITE Wx Typ. 0.295 Typ.
Wy -0.03 0.305 +0.03 In AV input
RED Rx 0.640 PSM : Dynamic
Ry 0.330 White
GREEN Gx 0.290 (100 IRE)
Gy 0.600
BLUE Bx 0.150
By 0.060
5. Module Specification
5.1. LCD 20” (AUO T200MXW02 V0)
5.2. Electro optical characteristic specifications(module standard)
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1. Display area 443.61 (H) *249.41(V) mm
2. Outline dimension 472.0 (H) x 276.5 (V) x23.0 (D) mm Typ
3. Number of Pixels 1366 (H) x 768(V) 1Pixel=3RGB Cells
4. Cell pitch 324.75um (H) x 324.75um (V) µm 1Pixel=3RGB Cells
5. Color arrangement RGB vertical stripe
6. Weight(net) 3 Kg Max
7. Operating Environment Temperature 0 ~ 50 deg
Humidity 10 ~ 90 %
8 Storage Environment Temperature -20 ~ 60 deg
Humidity 10 ~ 90 %
9 Electrical Interface LVDS
10 Back light Unit 6 CCFL (6 lamps)
11 R/T 8ms Typ.
No. Item Min Typ. Max Unit Remark
No. Item Specification
Min Typ. Max Remark

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7. Component Video Input (Y, PB, PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I)
4 720*480 31.47 59.94 27.000 SDTV 480P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27.000 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45.00 60.00 74.250 HDTV 720P
9 1280*720 37.50 50.00 74.250 HDTV 720P 50Hz
10 1920*1080 33.72 59.94 74.176 HDTV 1080I
11 1920*1080 33.75 60.00 74.250 HDTV 1080I
12 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz
8. RGB Input (PC)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 720*400 31.469 70.08 28.32 DOS
2 640*480 31.469 59.94 25.17 VESA(VGA)
3 640*350 31.468 70.090 25.175 DOS
4 800*600 37.879 60.31 40.00 VESA(SVGA)
5 1024*768 48.363 60.00 65.00 VESA(XGA)
6 1280*768 47.693 60.00 80.14 VESA
7 1360*768 47.700 60.00 84.62 WXGA
6. Model Specification
No Item Specification Remark
1 Market EU
2 Broadcasting system PAL BG/I/DK, SECAM-L/L’,
SECAM BG/DK
3 RF Input Channel VHF : E2 ~ E12 PAL
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S41
L/L’ : B, C, D FRANCE
4 SCART Jack (1EA) PAL, SECAM
5 D-SUB Input (1EA) Y/Pb/Pr, RGB Component Input : 480i/p, 576i/p, 720P/1080i
RGB Input : RGB-PC, RGB-DTV
With RGB input, we can offer Component
input(Y/Pb/Pr) using special cable.
6 HDMI Input (1EA) HDMI-PC, HDMI-DTV
7 Audio Input (1EA) PC Audio, COMPONENT L/R, L/R Input
DVI to HDMI Component Audio also input by connecting the same
PC Audio Jack.

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9. RGB input ( DTV )
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1 720*480 31.47 59.94 27.000 SDTV 480P
2 720*480 31.50 60.00 27.027 SDTV 480P
3 720*576 31.25 50.00 27.000 SDTV 576P
4 1280*720 37.5 50.00 74.250 HDTV 720P 50Hz
5 1280*720 44.96 59.94 74.176 HDTV 720P
6 1280*720 45.00 60.00 74.250 HDTV 720P
7 1920*1080 33.72 59.94 74.176 HDTV 1080I
8 1920*1080 33.75 60.00 74.250 HDTV 1080I
9 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz
11. HDMI/DVI input (DTV)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1. 720*480 31.47 59.94 27.000 SDTV 480P
2. 720*480 31.50 60.00 27.027 SDTV 480P
3. 720*576 31.25 50.00 27.000 SDTV 576P
4. 1280*720 37.5 50.00 74.250 HDTV 720P 50Hz
5. 1280*720 44.96 59.94 74.176 HDTV 720P
6. 1280*720 45.00 60.00 74.250 HDTV 720P
7. 1920*1080 33.72 59.94 74.176 HDTV 1080I
8. 1920*1080 33.75 60.00 74.250 HDTV 1080I
9. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz
10. HDMI/DVI input (PC)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 720*400 31.469 70.08 28.32 DOS
2 640*480 31.469 59.94 25.17 VESA(VGA)
3 640*350 31.468 70.090 25.175 DOS
4 800*600 37.879 60.31 40.00 VESA(SVGA)
5 1024*768 48.363 60.00 65.00 VESA(XGA)
6 1280*768 47.693 60.00 80.125 VESA
7 1360*768 47.700 60.00 84.62 WXGA

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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to 20” LCD TV which is
manufactured in TV (or Monitor) Factory or is produced on the
basis of this data.
2. Specification
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 30 Minutes
6) Adjustment equipments: Color Analyzer(CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote control
3. Main PCB check process
* APC - After Manual-Insult, executing APC
3.1. Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message.
If display “Error”, Check connect computer, jig, and set.
3) Click “Connect” tab.
If display “Can’t ”, Check connect computer, jig, and set.
4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”.
5) Click “Auto” tab and set as below
6) click “Run”.
7) After downloading, check “OK” message.
3.2. ADC Process
(1) PC input ADC
1) Auto RGB Gain/Offset Adjustment
- Convert to PC in Input-source
- Signal equipment displays
Output Voltage : 730 mVp-p
Impress Resolution WXGA (1360 x 768 @ 60Hz)
Model : 107 in Pattern Generator
Pattern : 28 in Pattern Generator(MSPG-925 Series)
[gray pattern that left & right is black and center is
white signal (Refer below picture)].
- Adjust by commanding AUTO_COLOR _ADJUST
(0xF1) 0x00 0x02 instruction.
2) Confirmation
- We confirm whether “0x8B(offset), 0x8C(gain)”
address of EEPROM “0xB4” is “0xAA” or not.
- If “0x8B, 0x8C” address of EEPROM “0xB4” isn’t
“0xAA”, we adjust once more.
- We can confirm the ADC values from “0x00~0x05”
addresses in a page “0xB4”
* Manual ADC process using Service Remote control.
After enter Service Mode by pushing “INSTART” key,
execute “Auto-RGB” by pushing “G” key at “Auto-
RGB”.
(2) COMPONENT input ADC
1) Component Gain/Offset Adjustment
- Convert to Component in Input-source
- Using the special cable(D-sub to RCA cable)
- Signal equipment displays
Impress Resolution 480P
MODEL : 212 in Pattern Generator
(480p Mode, Y : 100%, Pb/Pr : 75%)
PATTERN : 08 in Pattern Generator
(MSPG-925 Series)
filexxx.bin
(6)
(7) .......OK
(5)
<Adjustment pattern (PC)>

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- Adjust by commanding AUTO_COLOR_ADJUST
(0xF1) 0x00 0x02 instruction.
2) Confirmation
- We confirm whether “0x8D(offset), 0x8E(gain)”
address of EEPROM “0xB4” is “0xAA” or not.
- If “0x8D, 0x8E” address of EEPROM “0xB4” isn’t
“0xAA”, we adjust once more.
- We can confirm the ADC values from “0x00~0x05”
addresses in a page “0xB4”.
* Manual ADC process using Service Remote control.
After enter Service Mode by pushing “INSTART” key,
execute “Auto-RGB” by pushing “G” key at “Auto-
RGB”.
3.3. Function Check
AACheck display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV1 (SCART)
3) COMPONENT (480P)
4) RGB (PC : 1360x768 @ 60hz)
5) HDMI
6) PC Audio In
* Display and Sound check is executed by Remote control.
7) RS232 communication
4. Total Assembly line process
4.1. Adjustment Preparation
(1) Above 30 minutes H/run in RF no signal
(2) 15 Pin D-Sub Jack is connected to the signal of Pattern
Generator.
4.2. Confirm color coordinate of RGB
(1) Set Input to RGB.
(2) Input signal : WXGA (1360 x 768 @ 60Hz),Full white
216/255 gray level (85 IRE, Model : 107, Pattern : 78 at
MSPG925L)
(3) Set PSM : Dynamic/ CSM : Cool
(4) Confirm whether x = 0.276±0.03, y = 0.283±0.03 or not.
4.3. Confirm color coordinate of component
(1) Set Input to COMPONENT.
(2) Input signal : 480P
Full white 216/255 gray level (85 IRE Model : 212, Pattern :
78 at MSPG925L)
(3) Set PSM : Dynamic / CSM : Cool
(4) Confirm whether x = 0.276±0.03, y = 0.283±0.03 or not.
4.4. Other quality
AConfirm that each items satisfy under standard condition
that was written product spec.
AConfirm Video and Sound at each source
(1) AV
1) Select input AV1 and whether picture is displayed or not.
- SCART output displayed or not.
(2) TV
- Select input TV and check below item
* In Gumi Factory
C05 (E05) – TELETEXT Function Check
; (Applicable to the model that has Teletext code set-up
item in Product spec)
C07 (E07) – Nicam DUAL Check.
C52 (E52) – Nicam Stereo Check.
(3) RGB
- Select input RGB and whether picture is displayed or not.
(4) COMPONENT
- Select input COMPONENT and whether picture is
displayed or not.
(5)HDMI
- Select input HDMI and whether picture is displayed or not
4.5. DDC EDID Write
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Connect HDMI Signal Cable to HDMI Jack.
3) Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
4) Check whether written EDID data is correct or not.
5) Check whether FACTORY-MODE(Write Protection) is 1.
Default is 1.
(1) 20LS3R EDID DATA
1) ANALOG DATA
2) DIGITAL DATA

4.6. HDCP SETTING
(High-Bandwidth Digital Contents Protection)
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Input HDCP key with HDCP-key- in-program.
3) HDCP Key value is stored on EEPROM(AT24C64) which is
E00~F20 addresses of 0xBC~0xBE page.
4) AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925.
5) HDCP Key value is different among the sets.
4.7. RS232C Check (RJ12 Jack)
- Do not connect D-sub Signal Cable to D-Sub Jack.
- Connect the RJ12 to RS232C cable to RJ12 Jack.
- Open the TVLINK-Commercial Tester file as above the
program.
- Push the button (1) for connection.
- Select the ETC (2) in the list and push the power button (3)
one time.
- Check whether the DC power turn off or not.
- Push the power button one time again.
- Check whether the DC power turn on or not.
4.8. Outgoing condition Configuration
1) After all function test., press IN-STOP Key by SVC Remote
control. And Make Ship Condition.
2) When pressing IN-STOP key by Service remote control,
Green and red LED are blinked alternatively. And then
Automatically turn off. (Must not AC power OFF during
blinking)
4.9. Internal pressure
- Confirm whether is normal or not when between power
board's ac block and GND is impacted on 1.5kV(dc) or
2.2kV(dc) for one second.
4.10. Option data setting(SVC OSD setting)
(1) PAL Model (Change by Suffix)
- 12 -
Option1
1 200PR 0
2ACMS 1
3 TEXT 1 TOP / FLOF
4 CH+AU 0 0 : Except below area
1 : China, Australia
5 BOOSTER 0 AGC Threshold point
Option2
1 SYS 0
2 A2 ST 1
3 I II SAVE 0
4 HDEV 0
5 V-CURVE 0
6 MONO 0
Option3
1 KEY-TYPE 2
Option4
1 Default Lang 00
2 Lang 0 English Deutsch French Italiano
Spanish Nederlands Svenska
Norsk Dansk Suomi
Portuguese Romaneste Polski
Magyar Chesky ΡУССКИЙ
3 T-Lang 0 AUSTRIA BULGARIA CROATIA
CZECH DENMARK ENGLAND
ESTONIA FINLAND FRANCE
GERMANY GREECE HUNGARY
ITALY LATVIA NETHERLANDS
NORWAY POLAND PORTUGAL
RUMANIA RUSSIA SERBIA
SLOVAKIA SLOVENIA SPAIN
SWEDEN SWITZERLAND
TURKEY ARAB HEBREW Others
Option5
1 2 HR-OFF 1
2 TV-LINK-TUNER 1
3 FACTORY MODE 0
4 CHANNEL-MUTE 1
No. Item Condition Remark
(1)
(2)
(3)

- 13 -
5. Adjustment Command
5.1. Adjustment Commands(LENGTH=84)
5.2 EEPROM DATA READ
(1) Signal Table
(2) Command Set
* Purpose : To read the appointment Address of E2PROM by
128(80h)-byte
5.3. E2PROM Data Write
(1) Signal Table
LEN : 84h+Bytes
CMD : 8Eh
ADH : E2PROM Slave Address(A0,A2,A4,A6,A8), Not
00h(Reserved by BufferToEEPROM)
ADL : E2PROM Sub Address(00~FF)
Data : Write data
(2) Command Set
* Purpose
1) EDID write : 16-byte by 16-byte, 8 order (128-byte)
write(TO “00 – 7F” of “EEPROM Page A4”).
2) FOS Default write : 16-mode data (HFh, HFl, VF, STD,
HP, VP, Clk, ClkPh, PhFine) write.
3) Random Data write : write the appointment Address of
E2PROM.
5.4. VRAM Read
1) Send CMD(70h) to read Video RAM value from MICOM
And save its value to 128-Bytes Buffer(Common Buffer for
the use of EDID)
2) Delay 500ms ( Time to Wait and Read Video RAM from
MICOM)
3) Be transmitted the contents of MICOM’s 128-bytes Buffer to
PC. (128th Data is the CheckSum of 127-bytes data :
That’s OK if the value of adding 128-bytes Data is Zero)
FACTORY ON E0 00 00 Factory mode on
FACTORY OFF E2 00 00 Factory mode off
EEPROM ALL INIT. E4 00 00 EEPROM All clear
EEPROM Read E7 00 00 EEPROM Read
EEPROM Write E8 00 data EEPROM Write by some
values
COLOR SAVE
(R/G/B cutoff, Drive, EB 00 00 Color Save
Contrast, Bright)
H POSITION 20 00 00 – 100 They have different range
V POSITION 30 00 00 – 100 each mode, FOS Adjustment
CLOCK 90 00 00 – 100
PHASE 92 00 00 – 100
R DRIVE 16 00 00 – FF Drive adjustment
G DRIVE 18 00 00 – FF
B DRIVE 1A 00 00 – FF
R CUTOFF 80 00 00 – 7F Offset adjustment
G CUTOFF 82 00 00 – 7F
B CUTOFF 84 00 00 – 7F
BRIGHT 10 00 00 – 3F Bright adjustment
CONTRAST 12 00 00 - 64 Luminance adjustment
AUTO_COLOR_ F1 00 02 Auto COLOR Adjustment
ADJUST
CHANGE_COLOR F2 00 0,1,2,3 0: COOL
_TEMP 1: NORMAL
2: WARM
3: USER
FACTORY_DEFAULT F3 00 00 Factory mode off
& II_SW is “1”
& Input change to “ TV”
AUTO_INPUT F4 00 0,1,2,4 0 : TV
CHANGE 1 : AV1
2 : AV2
3 : Component
4 : RGB
5 : DVI
ADR VAL Description
CMD
(hex)
Adjustment Contents
128 Bytes
Delay 100ms
Data 128
EEPROM READ E7 A0 0 0-Page 0~7F Read
80 0-Page 80~FF Read
A2 0 1-Page 0~7F Read
80 1-Page 80~FF Read
A4 0 2-Page 0~7F Read
80 2-Page 80~FF Read
A6 0 3-Page 0~7F Read
80 3-Page 80~FF Read
Adjustment contents CMD(hex) ADH(hex) ADL(hex) Details
EEPROM WRITE E8 94 16-Byte Write
84+n n-byte Write
Adjustment contents CMD(hex) ADH(hex) Details

TROUBLE SHOOTING
1. No Power (LED indicator off) : [A] Process
- 14 -
Check 16V or
16V of adapter.
Fail
Pass
Check short of main B/D
or change adapter.
Check Output
of IC800.
Fail
Pass
Change IC800.
Check Output of
IC101(R195, R196).
Fail Re-soldering of change
defect part of IC101.
Pass
Check Q924, Q925.
Pass
Check LED Assy.
Pass
Check P902 Connector.
Fail
Fail
Change Q924, Q925.
Change LED Assy.

- 15 -
2. No RASTER : [B] Process
Check LED status
on display unit.
Fail
Pass
Repeat [A] PROCESS.
Check
IC801, IC802, IC803,
IC901, IC902, IC903,
Q803, Q804.
Pass
Fail Change IC801, IC802, IC803, IC901,
IC902, IC903, Q803, Q804.
Check Input/
Output of IC100.
Fail Change IC101.
Pass
Change Panel link cable
or module.
Check inverter
connector or
inverter.
Pass
Check Panel link
cable or module.
Pass
Check inputting source
cable and jack.
Fail
Fail Change inverter connector
or inverter.

- 16 -
3. No RASTER on PC Signal & Component signal
Repeat [A, B]
process.
Pass
Check
the input/ output
of JA601(R623
R624).
Fail Check JA601.
Pass
Re-soldering or change the defect part.
Check the X100.
Check
the input/output
of IC101(R119, R121,
R124, R122).
Pass
Check the
input/output of
IC101.
Pass
Check input source cable and jack.
Fail
Fail
Re-soldering or Change the defect part.

- 17 -
4. No Raster on HDMI Signal
Repeat [A, B]
process.
Pass
Check the input/
output of IC101.
Fail Re-soldering or change the defect part.
Check X100.
Pass
Check input source cable and jack.
5. No Raster on AV Signal(Scart) 6. No Raster on TV(RF) Signal
Check input source cable and jack.
Repeat [A, B]
process.
Fail Check output
of TU500.
Pass Pass
Fail Check 5V of TU500.
Re-Soldering or change
the defect part.
Check input/ output
of JA700(L704).
Fail
Change L704.
Pass
Check input/
output of IC101
Pass
Fail Re-soldering or Change the defect part.
Check the X100.
Pass Pass

7. No sound
- 18 -
Check the input
Source.
Fail
Pass
Change the source input.
Check input/
Output of IC101.
Fail
Pass
Re-soldering of Change the defect part.
Check the X110.
Check the input/
output of IC400
Fail Re-soldering of Change
the defect part.
Pass
Check the Speaker
Pass
Check the Speaker wire.
Fail
Change the Speaker.

- 19 -
HDMI
HDMI SCART
SCART RS232C
PC
AUD
D-SUB
COMP ADAPTER
ADAPTER
LVDS
LED KEY
INVERTER
MST96889
SPK
SPK
IR_LED
HY5DU2816 22E
DDR
AUDIO AMP
TPA3005D
7P
7P
10P
DC-DC CON
5V
DC-DC CON
3.3V
RESET
AT24C64
EEPROM
MX25L
SODERI NG
SI4925
DAC IC
SI4925
1.8V
REG
1.8V
REG
ST3232
5P
5P
24C02
AUDIO
DATA
DEBUG
4P
12V
REG
2.5V
REG
VIDEO
8 OHM
3W
3.3V 5V 15V 5V_E_LED
PWR
LED
KEY
IR
STAND
LED
5V
REG
FLASH
TAFV-W303P
TUNER
6700MF0017C
REG
9V
14.3Mhz
CRYSTAL
BLOCK DIAGRAM
1. MAIN

2. POWER FLOW CHART
- 20 -
DC-DC CON
ST_3.3V
IC800
(MP1583)
ADAPTER
ST-15V
DC-DC CON
ST_5V
(MP1583)
IC801
FET 1CH
(SI4925)
ST-3.3V
3.3V_MST
5V_TUNER
5V_G
5V_PANEL
ST-5V
FET 2CH
(SI4925)
REGULATER
ST_1.8
IC802
ST-1.8V
15V
FET 1CH
(SI4925)
FET 2CH
(SI4925)
REGULATER
2.5V
IC803
2.5V_MST
2.5_DDR
15V (AMP)
REGULATER
12V
IC901
12V_DAC5V_E_LED
5V_G
Q804 Q803