LG 26LK310 User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91J
MODEL : 26LK310/310Y 26LK310/310Y-TA
MODEL : 26LK311 26LK311-TB
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL62461531 (1104-REV01)

LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION .................................................................9
TROUBLE SHOOTING ............................................................................14
BLOCK DIAGRAM...................................................................................17
EXPLODED VIEW .................................................................................. 18
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω

LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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Only for training and service purposes
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
4. Electrical specification
4.1. Model Specification
1. Application range
This spec sheet is applied to LCD TV used LP91J chassis.
2. Specification
Each part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3) Power Voltage: Standard input voltage(100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
No Item Specification Remark
1. Market NON EU
2. Broadcasting system PAL/SECAM B/G/D/K,
PAL I/II, NTSC-M
3. Available Channel BAND PAL NTSC China(DK) Australia(BG)
VHF/UHF E2-C69 2~78 C1~C62 C1~C75
CATV S21~S47 1~71 S1~S41 S2~S44
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC 22LK310/311 : Rear 1EA,
26/32LK310/311 : Rear 1EA, Side 1EA
6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear
7. RGB Input RGB-PC, S/W Upgrade Rear
8. HDMI Input HDMI-DTV, Only PCM MODE 26/32LK310/311 Rear 2EA
22LK310/311 Rear 1EA
9. Audio Input (4EA) PC Audio, Component, AV (2EA) L/R Input (22LK310/311: AV Audio Input 1EA)
10. RS-232C Remote control, Commercial control Rear
11. USB Input (1EA) Divx, MP3, JPEG Only Side

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5. Component Video Input (Y, PB, PR)
No Specification Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50 Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50 Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50 Hz
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
No Specification Proposed Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
6. RGB
(Analog PC, RGB-DTV - NOT SUPPORT)

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7. HDMI input - PC
(Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
8. HDMI input (DTV)
No Specification Proposed Remarks
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P

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- 9 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP91J
chassis.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
4) The input voltage of the receiver must keep 100-220 V,
50/60 Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration - RGB / Component
(4) Check SW Version.
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
(2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened.
2) Click the “Connect” button and confirm “Dialog Box”.
3) Click the “Config.” button and Change speed I2C Speed
setting : 350 Khz ~ 400 Khz.
4) Read and write bin file.
Click “(1)Read” tab, and then load download file
(XXXX.bin) by clicking “Read”.
1
Filexxx.bin
1
Filexxx.binFilexxx.bin

5) Click “(2)Auto” tab and set as below.
6) Click “(3)Run”.
7) After downloading, you can see the “(4)Pass” message.
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the USB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”
4) After Finished the Download, Automatically DC Off -> On
5) If the TV is turn on, check the updated SW Version and tool
option.
4.2. Input tool option
Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because being
different with some setting value depend on module
maker, inch and market.
(2) Equipment : adjustment remote control.
(3). Adjustment method
- The input methods are same as other chassis.(Use IN-
START key on the Adjust remote control.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value
Caution : Don’t Press “IN-STOP” key after completing the
function inspection.
4.3. EDID Download method
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID. If not possible, recommend that
connect the MSPG equipment.
There are two methods of downloading the EDID data.
4.3.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2 seconds.
4.3.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, HDMI EDID data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear “OK”, then complete.
4.3.3. RS-232C command Method
(1) Command : AE 00 10
* Caution
Don’t connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of EDID could be
failed.
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1
Filexxx.bin

4.3.4. EDID data
(1) Analog(RGB): 128bytes>
(2) HDMI 1 : 256Bytes
(3) HDMI 2 : 256Bytes
4.4. ADC Calibration
4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote control for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60 Hz 100 % Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on Remote control for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : Component” by using D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear.
4.4.2. ADC Calibration - RGB
4.4.2.1. Method of Using External pattern
(1) Required Equipments
- Remote control for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60 Hz Horizontal Color Bar
signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on remote control for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear.
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OK
OK
0123456789ABCDEF
0 00FFFFFFFFFFFF001E6D01 0001 01 0101
10 01 15 01 03 08 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B A1 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88
40 35 00 BC 88 21 00 00 1C 0E 1F 00 80 51 00 1E 30
50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 00 55
0123456789ABCDEF
0 00FFFFFFFFFFFF001E6D01 0001 01 0101
10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C2
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 2A
0123456789ABCDEF
0 00FFFFFFFFFFFF001E6D01 0001 01 0101
10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C2
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 20 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 1A

4.4.2.1. Method of Using Internal pattern
(1) Apply model : 22/26/32LK310/311
(2) Process
1) Change the Input to RGB mode..
2) Press ADJ key on remote control for adjustment.
3) Enter Password number. Password is “0 0 0 0”.
4) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).
5) ADC adjustment is executed automatically .
6) When ADC adjustment is finished, this OSD appear.
* Caution : No need to connect external input cable.
* Caution : Adjustment result is applied after SET Off/On.
4.5. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-control.
2) SW Version check
Check “SW VER : V3.xx”
5. PCB assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s Language and
signal Condition.
(2) Equipment : Adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remote control.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value.
5.2. Adjustment of White Balance
(For Automatic Adjustment)
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm
- Required Equipment
1) Remote control for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV(ch : 9)
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for Auto adjustment)
5.2.1 Adjustment of White Balance (For automatic adjustment)
* LP91J Support RS-232C & I2C Interface For ADC/DDC
Adjustment.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-
run pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, 00)
(4) Release the adjust mode of white balance
- Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
- 12 - LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
OK
MODEL : 32LK310
SW VER : V3.04
Mode : Hom e Use UTT 6
ADC CAL. RGB : NG
RGB: OK HDMI1 : NG
Comp onent SD : OK HDMI2 : NG
Comp onent HD : OK
Tool Option 1 816
Tool Option 2 4181
Area Option 40
Option 1 0
Option 2 0
System Con trol
System Con tro l 2
Pow er Off History
Davinci/Auto Test
Area Option ETC
Lang. Group NTSC-ALL
MODEL : 32LK310
SW VER : V3.04
Mode : Hom e Use UTT 6
ADC CAL. RGB : NG
RGB: OK HDMI1 : NG
Comp onent SD : OK HDMI2 : NG
Comp onent HD : OK
Tool Option 1 816
Tool Option 2 4181
Area Option 40
Option 1 0
Option 2 0
System Con trol
System Con tro l 2
Pow er Off History
Davinci/Auto Test
Area Option ETC
Lang. Group NTSC-ALL

5.2.2. Adjustment of White Balance (for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter “0000” (Password)
6) Select “3. W/B ADJUST”
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on Adjustment remote control.
9) Adjust R/G/B Gain using F/G(VOL +/-) key on
Adjustment remote control.
10) Adjust three modes all (Cool/ Medium/ Warm) : Fix the
one of R/G/B gain and change the others
11) When adjustment is completed, Enter “COPY ALL”.
12) Exit adjustment mode using EXIT key on Adjustment
remote control.
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
- 22LK310/311(Small size inch’s color coordinate is different
from others, so use below table.)
- To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : Select Vivid and change Dynamic Contrast :
Off, Dynamic Colour : Off -> Picture Mode change ->
Vivid(User)
(If you miss the upper condition, the coordinates of W/B can
be lower than the spec.
- 13 - LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Coordinate
Mode xy Temp uv∆
Cool 0.269 ± 0.002 0.273 ± 0.002 13,000 K 0.000
Medium 0.285 ± 0.002 0.293 ± 0.002 9,300 K 0.000
Warm 0.313 ± 0.002 0.329 ± 0.002 6,500 K 0.003
Coordinate
Mode xy Temp uv∆
Cool 0.285 ± 0.002 0.293 ± 0.002 9,300 K 0.000
Medium 0.295 ± 0.002 0.305 ± 0.002 8,000 K 0.000
Warm 0.313 ± 0.002 0.329 ± 0.002 6,500 K 0.003

LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 14 -
TROUBLESHOOTING
No power
(LED indicator off)
Check 24V, 12V, 3.5V
of Power B/D
Check short of Main B/D
or Change Power B/D
Pass
Check Output of
IC1001, IC1003, IC1007
Check P400 Connector
Change LED Assembly
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assembly
Change IC1002, IC1008, Q1003
Pass
Check short of IC1001,
IC1003, IC1007
Fail
Re-soldering or Change defect
part of IC1001, IC1003, IC1007
Fail
No Raster [B]: Process
Check LED status
On Display Unit Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802
Fail
Change Inverter Connector
Or Inverter
Fail
Pass
Fail
Pass
Change Module
Fail
Check LVDS Cable
Pass
Check Panel Link Cable
Or Module
Change Panel Link Cable
Or Module
Check Inverter Connector
Or Inverter
Pass

LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
No Raster on PC Signal
Check Input source Cable
And Jack
Pass
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC201 Fail
Re-soldering or
Change the defect part,
Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/Output
Of J202 Fail
Pass
Check the Input/Output
Of IC800 Fail
Re-soldering or
Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source
Cable And Jack
Pass
Re-soldering or
Change the defect part
Check the Input/Output
Of IC800 Fail
Pass
Re-soldering or
Change the defect part
Repeat [A], & [B] Process
Check The Input/Output
Of JK101 Fail
Pass
No Raster on HDMI Signal
Check Input source
Cable And Jack
Pass
Check the Input/Output
of JK301, JK302 Fail
Re-soldering or
Change the defect part
Pass
Pass
Check the Input/Output
of IC300, IC301 Fail
Re-soldering or
Change the defect part
Check HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/Output
of IC800 Fail
Re-soldering or
Change the defect part
Repeat [A], & [B] Process

LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 16 -
No Sound
Check The Input Sourse
Check The Input/Output
Of IC600
Re-soldering or
Change the defect partFail
Pass
Pass
Check The Speaker Change Speaker
Fail
Check The Speaker Wire
Pass
Change The Source Input
Fail
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source
Cable And Jack
Pass
Check Input source
Cable And Jack
Pass
Check The Input/Output
of JK102
Re-soldering or
Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Pass
Check the Input/Output
of IC800 Fail
Re-soldering or
Change the defect part
Pass
Check The Input/Output
Of TU500
Re-soldering or
Change the defect part
Pass
Fail
Pass
Check the Input/Output
of IC800 Fail
Re-soldering or
Change the defect part
Repeat [A], & [B] Process

LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
BLOCK DIAGRAM
RGB-PC
(JK202)
TUNER
(TU500)
COMPONENT / AV1
Audio out (JK102)
AV2
(JK201)
AV_LIN/RIN : 500mVrms
SPK_L
SPK_R
COMPONENT_L/R : 500m Vrm s
AV_VIN :1Vpp
NTP3200L
COMP_Y/Pb/Pr
IR & LED (P201)
HDMI_DATA0
TU_MAIN
COMPONENT_Y/Pb/Pr : 1/0.7Vpp
AV_VIN COMP_LIN/RIN
L_CH
R_CH
AV_LIN/RIN
PC-SOUND
(JK203)
I2S_MCLK I2S_SDO I2S_WS I2S_SCK
TMDS
LIPS
RL_ON/IDISP_EN
PANEL_STATUS
E-DIM
OPC_OUT
EEPROM
(24LC256)
Serial Flash
(MX25L64)
EEPROM
HDCP
(24WC08)
EEP_SCL/SDA
EEP_SCL/SDA
TXCE2± TXCE3±
TXCLKE±
TXCE1± TXCE0
TXCO1± TXCO3± TXCO2± TXCO0±
TXCLKO±
M_SCL/SDA
MAIN SCLAER
Matri x
(LGE4767A)
(IC800)
EEPROM
24C02
IC302
TU500
IC802 IC803 IC801
IC600
P402 P403
M_SCL/SDA
SIDE
REAR
HDMI3
(JK303)
USB
(JK204)
RS-232C
(JK200)
USB(SVC)
(JK205)
HDMI1
(JK301)
HDMI2
(JK302)
EEPROM
24C02
IC301
EEPROM
24C02
IC300
EEPROM
24C02
IC300
DDC_SCL1/SDA1 DDC_SCL2/SDA2 DDC_SCL3/SDA3
Controller
ST3232CDR
IC200
RXD/TXD
EEPROM
24C02
IC201
DSUB_SCL/SDA
P401
SPI_CZ/DO
SPI_CLK/DI
HDMI_DATA1 HDMI_DATA2
USB DN/DP PC_R/G/B PC_VS/HS TXD/RXD PC_AUD_L/R
TXCO4±
TXCE4±
FHD LVDS connector
HD LVDS conn ector
DDR2 SDRAM
(512M Byte)
IC900
DDR2_CKE
DDR2_WEZ
DDR2_DQS0 ±
DDR2_MCLK
DDR2_BA0/1
DDR2_DQS1 ±
DDR2_ODT
DDR2_DQM0/1
SIDE_VIN SIDE_LIN/RIN

- 18 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LV1
800
120
122
500
300
510
A2
A21 A5 A10
540
521
530
400
810
910
550
900
200
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CVBS_LIN
ZD100
SD05
ZD103
SD05
ZD105
SD05
CVBS_VIN
CVBS_RIN
ZD104
SD05
ZD101
SD05
ZD102
SD05
D101
30V
D100
30V
D104
30V
D105
30V
COMP2_Y
COMP2_PB
COMP2_PR
COMP2_L
COMP2_R
R109
75
R108
75
R107
75
R104
220K R118 12K
R117
12K
R119
12K
R120
12K
R113
10K
R115
10K
R116
10K
R100
220K
R111
220K
R112
220K
R110
75
R114
10K
R121
75
JP102
Q102
RT1C3904-T112
EB
C
R105
470
MNT_VOUT_T
P_12V_SMALL_15V
JP101 R101
220
R102
402
READY
R103
68
Q101
ISA1530AC1
EB
C
R106
47
C104
5600pF
50V
ZD106
30V
ZD107
30V
C101 10uF
16V
Q105
RT1C3904-T112
EB
CMUTE_LINE
R124
1K
C103
5600pF
50V R122
0
R123
1K
Q103
RT1C3904-T112
EB
C
Q106
RT1C3904-T112
EB
C
MNT_LOUT
Q104
RT1C3904-T112
EB
C
C102 10uF
16V
MNT_ROUT
R125
0
MUTE_LINE
JK101
PPJ238-01
NON_AUDIO_OUT
5D
[GN2]O-SPRING
6D
[GN2]E-LUG
4D
[GN2]CONTACT
7E
[BL2]E-LUG-S
5E
[BL2]O-SPRING
7F
[RD2]E-LUG-S
5F
[RD2]O-SPRING_1
5G
[WH2]O-SPRING
4H
[RD2]CONTACT
5H
[RD2]O-SPRING_2
6H
[RD2]E-LUG
6A
[YL1]E-LUG
5A
[YL1]O-SPRING
4A
[YL1]CONTACT
5B
[WH1]O-SPRING
4C
[RD1]CONTACT
5C
[RD1]O-SPRING
6C
[RD1]E-LUG
JK102
PPJ239-03
AUDIO_OUT
5J
[GN2]O-SPRING
6J
[GN2]E-LUG
4J
[GN2]CONTACT
7K
[BL2]E-LUG-S
5K
[BL2]O-SPRING
7L
[RD2]E-LUG-S
5L
[RD2]O-SPRING_1
5M
[WH2]O-SPRING
4N
[RD2]CONTACT
5N
[RD2]O-SPRING_2
6N
[RD2]E-LUG
6D
[WH1]E-LUG
5D
[WH1]O-SPRING
7E
[RD1]E-LUG-S
5E
[RD1]O-SPRING_1
7F
[YL1]E-LUG-S
5F
[YL1]O-SPRING_1
4F
[YL1]CONTACT_1
5G
[WH1]O-SPRING_2
4H
[RD1]CONTACT_2
5H
[RD1]O-SPRING_2
6H
[RD1]E-LUG
1 9
INPUT1
COMPONENT / AV IN / AV AUDIO OUT
GAIN X 4
POP NOISE
POP NOISE
AUDIO_OUT OPTION BLOCK
2010/11/22
LK310
LP91J
EAX64045802
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

USB DOWN STREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDE_LIN
SIDE_RIN
ZD203
5.6B
SIDE_AV
SIDE_V
ZD202
5.6B
SIDE_AV
IR_OUT
+3.5V_MST
TXD
R204
4.7K
IC200
ST3232CDR
3
C1-
2
V+
4
C2+
1
C1+
6
V-
5
C2-
7
T2OUT
8
R2IN 9R2OUT
10 T2IN
11 T1IN
12 R1OUT
13 R1IN
14 T1OUT
15 GND
16 VCC
R205
4.7K RXD
+3.5V_MST
ZD200
SD05
DSUB_SDA
PC_VS
ZD201
SD05
PC_B
DSUB_SDA
PC_AUD_R
PC_G
DSUB_SCL
IC201
CAT24C02WI-GT3
RGB_EEPROM_CATAL
3
A2
2
A1
4
VSS
1
A0
5SDA
6SCL
7WP
8VCC
DDC_WP
PC_HS
PC_AUD_L
DSUB_SCL
PC_R
D202
30V
CDS3C30GTH
D203
30V
CDS3C30GTH
D200
30V
D201
30V
D206
30V
SIDE_AV
D205
30V
SIDE_AV
D204
30V
D209
30V
C203
0.1uF
16V
C200
0.1uF
16V
C201
0.1uF
16V
C202
0.1uF
16V
C205
0.01uF
R202
100
R203
100
R227
75
SIDE_AV
R223
220K
READY
R222
220K
READY
R226
12K
SIDE_AV
R228
12K
SIDE_AV
R211
75
R212
75
R213
75
R214
4.7K
R215
4.7K
R231
220K
R232
220K
R233
10K
R234
10K
R235
12K
R236
12K
R220
4.7K R221
4.7K
R216
100
R217
100
R218
100
C208
0.1uF
50V
OCP_READY C209
10uF
16V
OCP_READY
L200
120OHM
OCP_READY
+5V_USB
R209
1K
OCP_READY R210
4.7K
OCP_READY
R237
0
Non_OCP
C210
10uF
6.3V
R207
68
R208
68
C213
68pF
50V
C211
68pF
50V
R219
4.7K
READY
L201
500C212
220uF
16V
C214
100uF
16V D213
OCP_READY
A
AC
C
R238
510
OCP_READY
R224
10K
SIDE_AV
R225
10K
SIDE_AV
JK200
SPG09-DB-009
1
2
3
4
5
6
7
8
9
10
JK201
PPJ235-01
SIDE_AV
4A
[YL]O-SPRING
5A [YL]E-LUG
3A [YL]CONTACT
4B [WH]O-SPRING
3C [RD]CONTACT
4C [RD]O-SPRING
5C [RD]E-LUG
JK202
SPG09-DB-010
6630TGA004Q
RED
1
GREEN
2
BLUE
3
GND_1
4
DDC_GND
5
RED_GND
6
GREEN_GND
7
BLUE_GND
8
NC
9
SYNC_GND
10
GND_2
11
DDC_DATA
12
H_SYNC
13
V_SYNC
14
DDC_CLOCK
15
SHILED16
JK203
PEJ027-01
6B T_TERMINAL2
7B B_TERMINAL2
5T_SPRING
4R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3E_SPRING
D211
ENKMC2838-T112
A1
CA2
+5V_MULTI
R200
0
D207
30V
D208
30V
D210
30V
USB_DN
USB_DP
ZD204
30V
READY ZD205
30V
READY
JK205
KJA-UB-0-0037
REAR_USB
1
2
3
4
5
R229
0
REAR_USB
USB_DL_P
R230
0
REAR_USB
USB_DL_N
USB_DL_P
USB_DL_N
IC202
AP2191SG-13
OCP_READY
3IN_2
2IN_1
4EN
1GND
5
FLG
6
OUT_1
7
OUT_2
8
NC
+3.5V_MULTI
JK204
KJA-UB-4-0004
SIDE_USB
1234
5
IC201-*1
R1EX24002ASAS0A
RGB_EEPROM_RENESAS
3
A2
2
A1
4
VSS
1
A0
5SDA
6SCL
7WP
8VCC
2 9
INPUT2
2010/11/22
USB
It’s possibel to 27~47ohm
** 1A Design
SIDE AV
RS-232C
PC EDID
PC SOUND
Close to SIDE_USB
PC
LK310
LP91J
EAX64045802
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only