LG 32LH250H User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LA96C
MODEL : 32LH250H 32LH250H-UB
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL62195519 (1006-REV00)

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 2 -
CONTENTS
CONTENTS ............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING .......................................................................... 16
BLOCK DIAGRAM.................................................................................. 22
EXPLODED VIEW .................................................................................. 24
SVC. SHEET ...............................................................................................

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 6 -
1. Application Range
This specification sheet is applied to the LCD TV used LA96C
chassis.
2. Specification
Each part is tested as below without special appointment
1) Temperature : 25 ± 5°C (77 ± 9ºF), CST : 40 ± 5ºC
2) Relative Humidity : 65 ±10%
3) Power Voltage : Standard input voltage
(100-240V@ 50/60Hz)
* Standard Voltage of each products is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance : LGE TV test method followed.
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC : FCC, ICE, IEC specification
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
4. General Specification(TV)
No Item Specification Remark
1 Receivable System 1) VSB/64 & 256 QAM/NTSC-M
2 Available Channel VHF : 02 ~ 13
UHF : 14 ~ 69
DTV : 02 ~ 69
CATV : 01 ~ 135
CADTV : 01 ~ 135
3 Input Voltage 1) AC 100 ~ 240V 50/60Hz
4 Market North America
5 Screen Size 32 inch Wide(1366 x 768) FHD 32LH250H-UB
6 Aspect Ratio 16:9
7 Tuning System FS
8 LCD Module T315XW03-V1 AUO 32LH250H-UB
9 Operating Environment Temp : 0 ~ 40 deg
Humidity : ~ 80 %
10 Storage Environment Temp : -20 ~ 60 deg
Humidity : -85 %

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Only for training and service purposes - 8 -
7. RGB input (PC)
8. HDMI input (PC/DTV)
6. Component Video Input (Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.50 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.0 SDTV 480P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 33.75 60.00 74.25 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 67.500 60 148.50 HDTV 1080P
10. 1920*1080 67.432 59.94 148.352 HDTV 1080P
11. 1920*1080 27.000 24.000 74.25 HDTV 1080P
12. 1920*1080 26.97 23.976 74.176 HDTV 1080P
13. 1920*1080 33.75 30.000 74.25 HDTV 1080P
14. 1920*1080 33.71 29.97 74.176 HDTV 1080P
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC
1 640*350 31.469 70.08 25.17 DOS
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
7 1280*768 47.776 59.87 79.50 CVT(WXGA) O
8 1360*768 47.720 59.799 84.75 CVT(WXGA) O
DDC
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC
1. 640*480 31.469 59.94 25.17 VESA(VGA) O
2. 800*600 37.879 60.31 40.00 VESA(SVGA) O
3. 1024*768 48.363 60.00 65.00 VESA(XGA) O
4. 1280*768 47.776 59.87 79.50 CVT(WXGA) O
5. 1360*768 47.720 59.799 84.75 CVT(WXGA) O
DTV
1 720*480 31.47 60 27.027 SDTV 480P
2 720*480 31.47 59.94 27.00 SDTV 480P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 44.96 59.94 74.176 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I
6 1920*1080 33.72 59.94 74.176 HDTV 1080I
7 1920*1080 67.500 60 148.50 HDTV 1080P
8 1920*1080 67.432 59.939 148.352 HDTV 1080P
9 1920*1080 27.000 24.000 74.25 HDTV 1080P
10 1920*1080 26.97 23.976 74.176 HDTV 1080P
11 1920*1080 33.75 30.000 74.25 HDTV 1080P
12 1920*1080 33.71 29.97 74.176 HDTV 1080P

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Application Object
This spec sheet is applied all of the LCD TV with LA96C
chassis.
2. Designation
2.1 The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2.2. Power Adjustment: Free Voltage
2.3. Magnetic Field Condition: Nil.
2.4. Input signal Unit: Product Specification Standard
2.5. Reserve after operation: Above 15 Minutes
2.6. Adjustment equipments: Color Analyzer (CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent),
DDC Adjustment Jig equipment, SVC remote controller
Caution : When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch),
there can some afterimage in the black level area.
3. Method of PTC MICOM Download
3.1 Connection of MICOM JIG
1) Connect port(3) with Power Code
2) Connect jack(1) with PTC Micom.
3) Connect USB Cable to the computer
4) Download Program execution (SAP Configuration)
• Notice!
Because PTC Download JIG has internal memory, it can save
download files using download program (SAP Configuration).
Push the START button (4) after file saving, then it execute
download.
3.2 Execution of download program (SAP
Configuration)
3.2.1 Execution of SAP Configuration
1. Select HCS12
2. Target Frequency Settings :
A. Checking the factor -> Use Specified Target Frequency…,
Unsecure target….
B. Insert Target Bus Frequency -> 7372800
3. Specify Algorithm: 9S12dt128_128k .12P
4. Specify S Record: select download file.
5. Checking factor: Erase Device, Blank Check Device,
Program Device, Verify Device
• Notice!
Don’t check other checking boxes. You must follow fig.
6. Push the ‘Save Image to Cyclone PRO’ button, files
transfer from PC to the Download JIG.
- 9 -
ADJUSTMENT INSTRUCTION
1
2
3 4

- 10 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.3 PTC download by USB
a. Attach the USB Memory to TV
b. MENU > OPTION
-> press left arrow key once
-> press the key ‘7’ for 7 times
c. Select PTC Software.
d. Select downloading file. (*.s19)
e. Downloading.
- When the downloading is completed, TV will reset itself
automatically.
- If you fail to download, retry to download with PC.
- Do not remove USB in downloading.
4. Main PCB check process
* APC - After Manual-Insult, executing APC
4.1 Download
4.1.1 Boot file Download
1. Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2. Set as below, and then click “Auto Detect” and check “OK”
message If display “Error”, Check connect computer, jig,
and set.
3. Click “Read” tab, and then load download file (XXXX.bin) by
clicking “Read”
4. Click “Connect” tab.
If display “Can’t ”, Check connect computer, jig, and set.
5. Click “Auto” tab and set as below
6. Click “Run”.
7. After downloading, check “OK” message.
(3)
filexxx.bin
(1) (4)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
filexxx.bin
(5)
(7) .OK
(5)
(6)

- 11 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
* USB DOWNLOAD(*.epk file download)
1. Put the USB Stick to the USB socket
2. Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low, it
didn’t work. But your downloaded version is High, USB data
is automatically detecting
3. Show the message “Copying files from memory”
4. Updating is staring.
5. Updating Completed, The TV will restart automatically.
6. If your TV is turned on, check your updated version and Tool
option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a
DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1. Push "Adj" key in service remote controller.
2. Select "Tool Option 1~ 4" and Push “OK”button.
3. Punch in the number. (Each model has their number.)
4. Completed selecting Tool option
4. Board-level adjustment
4.1 ADC adjustment
4.1.1 Overview
ADC adjustment is needed to find the optimum black level and
gain in Analog-to-Digital device and to compensate RGB
deviation.
4.1.2 Equipment & Condition
1) Jig (RS-232C protocol)
2) Input : MSPG-925FS(Model : 209 ,Pattern : 65, Only
component))
3) RGB Adjust use internal pattern.
4.1.3 Adjustment
4.1.3.1 Method
•Using RS-232, adjust items listed in 3.1 in the order shown in
“4.1.3.3”.
4.1.3.2 Adj. protocol
Ref.) ADC adj. RS232C Protocol_Ver1.0
4.1.3.3 Adj. order
•ad 00 00 [Enter ADC adj. mode]
•ad 00 10 [Adjust 480i Comp1/1080p Comp1/1024*768 RGB]
•ad 00 90 End adj.
Model
Tool option1 Tool option1 Tool option1 Tool option1
37LH260H-UB 33056 1576 33056 1024
42LH260H-UB 26769 1576 33056 1024
32LH250H-UB 18499 1576 33056 1024
Protocol Command Set ack
Enter adj. ad 00 00 d 00 OK00x
mode
Begin adj. ad 00 10
Return adj. OKx (Success)
result NGx (Fail)
Read adj. (main) (main)
data ad 00 20
000000000000000000000000007c007b006dx
(sub ) (Sub)
ad 00 21
000000070000000000000000007c00830077x
Confirm adj. ad 00 99 NG 03 00x (Fail)
NG 03 01x (Fail)
NG 03 02x (Fail)
OK 03 03x (Success)
End adj. ad 00 90 d 00 OK90x

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 12 -
5. ADC Process
5.1 PC input ADC
5.1.1 Auto RGB Gain/Offset Adjustment
•Convert to PC in Input-source.
•Signal equipment displays.
Output Voltage : 700 mVp-p
- Impress Resolution XGA (1024 x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 65 in Pattern Generator (MSPG-925 SERISE)
Adjustment pattern (PC)
•Adjust by commanding AUTO_COLOR_ADJUST.
5.1.2 Confirmation
•We confirm whether “0xAA (RGB)”address of EEPROM
“0xA2”is “0xAA”or not.
•If “0xAA (RGB)”address of EEPROM “0xA2”isn’t “0xAA”, we
adjust once more.
•We can confirm the ADC values from “0xA4~0XA9 (RGB)”
addresses in a page “0xA2”
* Manual ADC process using Service Remocon. After enter
Service Mode by pushing “ADJ”key, execute “ADC Adjust”by
pushing “•” key at “5. ADC Calibration”and click “Start”.
5.2 COMPONENT input ADC
5.2.1 Component Gain/Offset Adjustment
•Convert to Component in Input-source.
•Signal equipment displays.
- Impress Resolution 480i

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Only for training and service purposes - 13 -
MODEL: 209 in Pattern Generator(480i Mode)
PATTERN : 65 in Pattern Generator( MSPG-925 SERISE)
- Impress Resolution 1080p
MODEL: 223 in Pattern Generator(1080p Mode)
PATTERN: 65 in Pattern Generator( MSPG-925 SERISE)
5.2.2 Confirmation
•We confirm whether “0xB3 (480i)/0xBC (1080p)”address of
EEPROM “0xA2”is “0xAA”or not.
•If “0xB3 (480i)/0xBC(1080i)”address of EEPROM “0xA2”
isn’t “0xAA”, we adjust once more.
•We can confirm the ADC values from “0xAD~0XB2
(480i)/0XB6~BB(1080p)”addresses in a page “0xA2”
* Manual ADC process using Service Remocon. After enter
Service Mode by pushing “ADJ”key, execute “ADC Adjust”by
pushing “•” key at “5. ADC Calibration”and then click “Start”.
- Impress Resolution 480i/1080p/RGB
5.3 Function Check
5.3.1 Check display and sound
•Check Input and Signal items. ( cf. work instructions)
1.TV
2. AV (CVBS/ S-Video)
3.COMPONENT (480i)
4.RGB (PC : 1024 x 768 @ 60hz)
5.HDMI
6.PC Audio In and H/P Out
* Display and Sound check is executed by Remote controller.
5.4 EDID(The Extended Display Identification Data)
/ DDC(Display Data Channel) download
5.4.1 Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any necessity of
user input. It is a realization of “Plug and Play”.
5.4.2 Equipment
•Adj. R/C
•Since embedded EDID data is used, EDID download jig,
HDMI cable and D-sub cable are not need.
5.4.3 Download method
1) Press Adj. key On the Adj. R/C, press Adj. key then select
EDID D/L. By pressing Enter key, EDID download will
begin.
2) If Download is successful, OK is displayed.
3) If Download is a failure, NG is displayed.
4) Re-try download.
5.4.4 EDID DATA
•Reference: Download is only possible in POWER ON MODE.
•HDMI I [C/S: 1DBA]

•HDMI II [C/S: 1DAA]
•RGB [C/S: 71FF]
6. Final Assembly adj.
6.1 White Balance adj.
6.1.1 Overview
•W/B adj.: Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range.
In order to prevent saturation of Full Dynamic
range and data, one of R/G/B is fixed at 192,
and the other two is lowered to find the
desired value.
6.1.2 Equipment
1) Color Analyzer : CA-210 (NCG: CH 9 / WCG: CH12 /LED
Module:CH14)
2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
3) Adj. R/C
4) Video Signal Generator MSPG-925F 720p/216Gray
(Model:217, Pattern:78)
-> Only when internal pattern is not available
•Color Analyzer Matrix should be calibrated using CS-1000
6.1.3 Equipment connection map
6.1.4 Adj. Command (Protocol)
•Protocol
<Command Format>
- LEN: Number of Data Byte to be send
- CMD: Command
- VAL: FOS Data
- CS: Checksum of sent Data
- A: Acknowledge
Ex) [Send: JA_00_DD] / [Ack: A_00_okDDX]
•Adj. Map
- Applied model:
- 14 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Color Analyzer
Computer
RS-232C
# Pattern Generator
* If TV internal pattern is used,not needed
Signal Source
Probe RS-232C
RS-232C
START 6E A 50 A LEN A 03 A CMD A 00 A VAL A CS A STOP
RS-232C COMMAND
[CMD ID DATA] Explanation
Wb 00 00 Begin White Balance adjust.
Wb 00 10 Begin Gain adjust (internal white pattern)
Wb 00 1f End Gain adjust
Wb 00 20 Begin Offset adjust (internal white pattern)
Wb 00 2f End Offset adjust
Wb 00 ff End White Balance adjust(internal pattern
disappears )
Item Command
(lower case ASCII) Data Range (Hex.) Default (Decimal)
CMD1 CMD2 MIN MAX
R Gain j g 00 C0 TBD
G Gain j h 00 C0 TBD
B Gain j i 00 C0 TBD
R Cut TBD
G Cut TBD
Cool
B Cut TBD
R Gain j a 00 C0 TBD
G Gain j b 00 C0 TBD
B Gain j c 00 C0 TBD
R Cut TBD
G Cut TBD
Medium
B Cut TBD
R Gain j d 00 C0 TBD
G Gain j e 00 C0 TBD
B Gain j f 00 C0 TBD
R Cut TBD
Warm
G Cut TBD

6.1.5 Adj. method
6.1.5.1 Auto adj. method
1) Set TV in adj. mode using POWER On Key
2) Zero calibrate probe then place it on the center of the
Display
3) Connect Cable(RS-232C)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sign), check adj. status per
mode (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
•Adj. must begin w/ command “wb 00 00”, and end w/“wb 00
ff”and adj. offset if needed.
6.1.5.2 Manual adj. method
Dynamic contrast : off
Dynamic color : off
OPC : Off
Energy saving mode : Off
1) Set TV Picture Mode to Standard and in Advanced Control,
set Dynamic Contrast and Color ‘Off’.
2) Set TV in adj. mode using POWER On Key
3) Press ADJ key -> EZ adjust using adj. R/C
4) Using CH + / - KEY, select 10.TEST PATTERN then press
Enter to place in HEAT RUN mode and wait for 30 minutes.
5) Zero calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10 cm of the surface.
6) Press ADJ key -> 7. White-Balance then press the cursor
to the right (KEY )
(When is pressed Full White internal pattern will be
displayed)
7) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
8) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature
•If internal pattern is not available, use HDMI input. In EZ Adj.
menu 7.White Balance, you can select one of 3 options:
None, Inner, HDMI. Default is inner. By selecting HDMI, you
can adjust using HDMI signal.
• Adj. condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower than 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
- LCD: Color Analyzer (CA-210) probe should be within 10cm
and perpendicular of the module surface (80°~ 100°)
- In case of LCD, B/L on should be checked using no signal or
Full white Pattern
6.1.6 Reference (White Balance adj. coordinate and color
temperature)
6.1.6.1 Adjustment Preparation
•W/B Equipment condition
CA210: CH 9, Test signal: Inner pattern (85IRE)
•Above 5 minutes H/run in the inner pattern. (“power on”key
of adjust remote control)
•15 Pin D-Sub Jack is connected to the AUTO W/B
EQUIPMENT.
•Adjust Process will start by execute I2C Command (Inner
pattern (0xF3, 0xFF)).
∆Manual White Balance adjust process using Service Remo-
con. After enter Service Mode by pushing “ADJ”key, enter
“White Balance”by pushing “•” key at “6. White Balance”.
(CA-210, CH-9)
*Adjust “R/G/B - GAIN”by pushing “”, “”key at “Cool”
*Adjust “R/G/B - GAIN”by pushing “”, “”key at “Medium”
*Adjust “R/G/B - GAIN”by pushing “”, “”key at “Warm”
- 15 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Cool 11,000 K X=0.276 ± 0.003
Y=0.283 ± 0.003
Medium 9,300 K X=0.285 ± 0.003
Y=0.293 ± 0.003
Color
Temperature
Warm 6,500 K X=0.313 ± 0.003
Y=0.329 ± 0.003
<Test Signal>
Inner pattern
(216gray, 85 IRE)

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 16 -
TROUBLESHOOTING
1. Power-up boot check
Check stand-by Voltage.
P701 10pin : +3.5V_ST
Check X100 clock
Check Power connector
and AC S/W on?
OK
No
OK
Check Q706 Output.
12V, 5V
Replace Power board.
Replace X100.
OK
Check Fuse.
OK
No
Check P701 PWR_ON.
1pin : 3.5V
OK
Re-download software.
No
OK
Check Multi Voltage
P701 7pin : 12V, 2pin : 24V Replace Power board
No
Replace Mstar(IC100) or Main board
OK
Replace Q706
No
Check inverter control & error
P701 24pin : Low
P701 18pin : high
OK
Check Power board or Module
No
Check Mstar LVDS output
R812, R813,..., R821 Replace Mstar(IC100) or Main board
No
OK

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 17 -
2. Digital TV Video
Check RF cable & Signal.
Check Tuner 5V Power
IC1001 4pin
OK
OK
Check Check Demodulator Input
Clock(X1005)
Check IC1002
(19",22")Check IC1002.
No
Check IF_P/N Signal
OK
Replace Tuner.
No
Replace X1005.
No
OK
Check Mstar LVDS output
R812, R813,..., R821
Check IC1004(LGDT) Output
- AR1070, AR1071
OK
Replace IC1004.
No
Replace Mstar(IC100) or Main board.
No
3. Analog TV Video
Check RF cable.
Check Tuner 5V Power.
IC1001 4pin
OK
Check CVBS signal.
TU1001 #19 Pin
Check IC1002
Check IC1005(19",22")
No
OK
Bad Tuner.
No
OK
Check Mstar LVDS output Replace Mstar(IC100) or Main board.
No

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 18 -
4. Component Video
Check Component Cable.
Check JK1200.
OK
Check input signal format.
Is it supported?
OK
Replace Jack.
No
OK
Check Mstar LVDS output Replace Mstar(IC100) or Main board.
No
5. RGB Video
Check RGB Cable conductors for
damage.
Check JK1204.
OK
OK
Check input signal format.
Is it supported?
OK
Check signal R/G/B/H/V-Sync
C113, C108, C114, R146, R149
Replace Jack.
No
Check EDID.
OK
Replace the defective IC or re-download EDID data
No
Check other set.
If no problem, check signal line.
No
OK
Check Mstar LVDS output Replace Mstar(IC100) or Main board.
No

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 19 -
6. AV Video
Check AV Cable for damage or open conductor.
Check JK1200(*JK1202).
OK
Check input signal format.
Is it supported?
OK
Replace Jack.
No
OK
Check Mstar LVDS output Replace Mstar(IC100) or Main board.
No
Check HDMI Cable conductors for
damage of open conductor.
Check JK500, 501, 502
OK
OK
Check input signal format.
Is it supported?
OK
Check EDID & EEPROM
IC500, 501, 502.
I2C Signal (#5, #6)
Replace Jack.
No
Replace the defective IC or re-download
EDID data.
No
Check HDCP key NVRAM(IC105)
power & I2C Signal (#5, #6) Replace the defective IC.
No
OK
Check HDMI Signal Check other set.
If no problem, check signal line.
No Replace Main board. No
OK
7. HDMI Video
OK
Check Mstar LVDS output Replace Mstar(IC100) or Main board.
No

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 20 -
8. All Source Audio
Check Mstar I2S Output
R604, R605, R606
Check IC500 Power
*24V, 3.3V, 1.8V.
OK
OK
Make sure you can’t hear any audio.
OK
Check Mstar AUDIO_MASTER_CLK
OK
Check Connector & P600
Check Regulator IC601, IC704
No
Check signal line. Or replace IC100.
No
Replace Mstar(IC100) or Main board.
No
Check Output Signal P600 1, 2, 3, 4 pin.
OK
Replace NTP(Audio AMP) IC500
No
Replace connector if found to be damaged.
No
OK
Check speaker resistance
and connector damage. Replace speaker.
No