LG 55LF6000 User manual

Printed in KoreaP/NO : MFL68606903(1502-REV00)
CHASSIS : LA55H
MODEL : 55LF6000 55LF6000-UB
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

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CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS.................................................................... 4
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING............................................................................14
BLOCK DIAGRAM.................................................................................. 19
EXPLODED VIEW .................................................................................. 20
SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX

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Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LED TV used LA55H
chassis.
2. Test condition
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C, CST: 40 °C ± 2 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
Safety : UL, CSA, IEC specification
EMC: FCC, ICES, IEC specification
4. General Specification
No Item Specication Result Remark
1. Receiving System ATSC / NTSC-M / 64 & 256 QAM
2. Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3. Input Voltage AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz (N.America)
4. Market NORTH AMERICA
5. Screen Size 42/49 inch Wide (1920 × 1080) FHD + 60Hz All models without HD models
60 Inch Wide (1920X1080) FHD + M120Hz
32 inch Wide (1366 × 768) HD + 60Hz
6. Aspect Ratio 16:9
7. Tuning System FS
8. Module POLA LC500DUE-MGA3 LGD 50LF6000-Ux.xxxWxxx
NC500DUN-VXBP1 INX 50LF6000-Ux.xxxJxxx
T550HVF04.1 AUO 55LF6000-Ux.xxxDxxx
HC550DUN-VSHS1 HS (CSOT Panel) 55LB6000-Ux.xxxCxxx
LC550DUE-MGA3 LGD 55LF6000-Ux
HC600DUF-VHHS1 HS (Sharp Panel) 60LB6000-Ux
9. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %

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5. Supported video resolutions
5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 720*480 15.730 60.000 13.513 SDTV ,DVD 480I
2 720*480 15.730 59.940 13.500 SDTV ,DVD 480I
3 720*480 31.500 60.000 27.027 SDTV 480P
4 720*480 31.470 59.940 27.000 SDTV 480P
5 1280*720 45.000 60.000 74.250 HDTV 720P
6 1280*720 44.960 59.940 74.176 HDTV 720P
7 1920*1080 33.750 60.000 74.250 HDTV 1080I
8 1920*1080 33.720 59.940 74.176 HDTV 1080I
9 1920*1080 67.500 60.000 148.500 HDTV 1080P
10 1920*1080 67.432 59.940 148.352 HDTV 1080P
11 1920*1080 27.000 24.000 74.250 HDTV 1080P
12 1920*1080 26.970 23.976 74.176 HDTV 1080P
13 1920*1080 33.750 30.000 74.250 HDTV 1080P
14 1920*1080 33.710 29.970 74.176 HDTV 1080P

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5.2. HDMI Input (DTV / PC)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel
clock(MHz)
Proposed Remarks
DTV
1 640*480 31.46 59.94 25.125 SDTV 480P
2 640*480 31.5 60.00 25.125 SDTV 480P
3 720*480 15.73 59.94 13.500 SDTV 480I Spec. out, but display
4 720*480 15.75 60.00 13.514 SDTV 480I Spec. out, but display
5 720*480 31.47 59.94 27.000 SDTV 480P
6 720*480 31.5 60.00 27.027 SDTV 480P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.250 HDTV 720P
9 1920*1080 33.72 59.94 74.176 HDTV 1080I
10 1920*1080 33.75 60.00 74.250 HDTV 1080I
11 1920*1080 26.97 23.97 74.176 HDTV 1080P
12 1920*1080 27.00 24.00 74.250 HDTV 1080P
1920*1080 33.71 29.97 74.176 HDTV 1080P
1920*1080 33.75 30.00 74.250 HDTV 1080P
1920*1080 67.43 59.94 148.352 HDTV 1080P
1920*1080 67.5 60.00 148.500 HDTV 1080P
PC
1 640*350 31.46 70.09 25.17 EGA X
2 720*400 31.46 70.08 28.32 DOS O
3 640*480 31.46 59.94 25.17 VESA(VGA) O
4 800*600 37.87 60.31 40.00 VESA(SVGA) O
5 1024*768 48.36 60.00 60.00 VESA(XGA) O
6 1152*864 54.34 60.05 80.00 VESA O
7 1280*1024 63.98 60.02 108.0 VESA (SXGA) O Full HD model Only
8 1360*768 47.71 60.01 85.50 VESA (WXGA) O
9 1920*1080 67.5 60.00 148.5 WUXGA(CEA 861D) O Full HD model Only

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ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA55H Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15 ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p
(2) EDID download: HDMI and RGB-PC
■ Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly tages can be checked by using the INSTART
Menu(1.ADJUST CHECK)
Component 1080p and RGB-PC Adjust will be calculated by
480i adjust value.
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
3.3. Appendix
(1) Shipment conditions
(2) Tool option menu
(3) USB Download (S/W Update, Option and Service only)
(4) Preset CH Information
4. MAIN PCBA Adjustments
4.1. ADC Calibration
4.1.1. Overview
▪ ADC adjustment is needed to find the optimum black level and
gain in Analog-to-Digital device and to compensate RGB
deviation
4.1.2. Equipment & Condition
(1) Protocol: RS-232C
(2) Inner Pattern
- Resolution : 1080p(Comp) / 1024*768(RGB)
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level : 0.7±0.1 Vp-p
4.1.3. Adjustment
4.1.3.1. Adjustment method
- Connect to Jig by using RS-232(USB), adjust Component
※ Manual adj (If needed in Final Assembly)
- Required equipment : Adjustment R/C
- Enter Service Mode by pushing “ADJ” key,
- Start ‘OTP’ ADC Type by pushing ‘►’ key at [7. ADC Calibration]
※In L13 case, Adjust ADC(OTP) is automatically ‘OK’
4.1.3.2. Adj. protocol (only Internal patten)
4.2. EDID Download
4.2.1. Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust by using remote controller
Protocol CMD 1 CMD 2 Data 1 Data 2 Remark
Enter adj
mode
a a 00 00 When transfer
the ‘Mode
In’,Carry the
command.
Start
ADC adj
a d 00 10 Automatically
adjustment (Use
internal pattern)

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4.2.3. Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
※Caution) When EDID Download, must remove RGB/HDMI
Cable.
4.2.3.1. Models for EDID Data
2D
8bit-FHD
(HDMI2)
10bit-FHD
(HDMI2)
North America (PCM) 50/55LF6000-Ux 60LF6000-Ux
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range.
● Case : Cool Mode
- To adjust the white balance without the saturation, G gain
should be adjust at least 172 and change the others (R,B
Gain)
▪ When R or B gain is over 255, G gain can be adjust below
172)
● Case : Medium / Warm Mode
- To adjust the white balance without the saturation, Fix the
one of R/G/B gain to 192 (default data) and decrease the
others.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
→ Only when internal pattern is not available
※Color Analyzer Matrix should be calibrated using CS-1000
5.1.3. Equipment connection
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND Explanation
CMD DATA ID
Wb 00 00 Begin White Balance adj.
Wb 00 ff End White Balance adj.
(internal pattern disappears )
(2) Adjustment Map
Adj.
item
Command
(lower caseASCII)
Data Range
(Hex.)
Default
(Decimal)
CMD1 CMD2 MIN MAX
Cool R Gain j g 00 C0 TBD
G Gain j h 00 C0 TBD
B Gain j i 00 C0 TBD
R Cut TBD
G Cut TBD
B Cut TBD
Medium R Gain j a 00 C0 TBD
G Gain j b 00 C0 TBD
B Gain j c 00 C0 TBD
R Cut TBD
G Cut TBD
B Cut TBD
Warm R Gain j d 00 C0 TBD
G Gain j e 00 C0 TBD
B Gain j f 00 C0 TBD
R Cut TBD
G Cut TBD

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5.1.5. Adjustment method
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.1.5.2. Manual adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key → EZ adjust using adj. R/C → 8. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 204 Gray(80IRE) internal
pattern will be displayed)
(4-a) Adjust modes (Cool) : Fix the G gain at least 172 and
change the others (R/B Gain).
▪ If R or B gain is over 255, G gain can be adjust below 172.
(4-b) Adjust two modes ( Medium / Warm) : Fix the one of
R/G/B gain to 192 (default data) and decrease the
others.
※CASE : Cool mode
First adjust the coordinate far away from the target value(x,
y).B
(1) x, y >target
(2) x, y< target
(3) x >target , y< target
(4) x < target , y >target
- Every 4 case have to t y value by adjusting B Gain and
then t x value by adjusting R-Gain
- In this case, increasing/decreasing of B Gain and R Gain
can be adjusted.
► How to adjust
(1) Fix G gain at least 172 : Adjust R, B Gain ( In Case of
Mostly Blue Gain Saturation )
(2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※CASE : Medium / Warm mode
First adjust the coordinate far away from the target value(x, y).
(1) x, y >target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
5.1.6. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 204 Gray, 80IRE
** (normal line) LGD Cell
** Except Gumi winter season (Mar ~ Dec) & Global
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
L14 Aging time
(Min)
Cool Medium Warm
X Y X Y X Y
271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
** (Aging chamber) LGD Cell
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
** (normal line) LGD Cell
** Gumi winter season (Jan ~ Feb) & Global, except Cinema
Screen models
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
GP4 Aging time
(Min)
Cool Medium Warm
X Y X Y X Y
271 270 286 289 313 329
1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346
4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
** INX, AUO, Sharp, CSOT Models (Cool Mode Spec :
13000K)
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
cool med warm
xyxyxy
spec 271 270 286 289 313 329
target 278 280 293 299 320 339

- 12 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.2. Option selection per country
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: LA43B/M Chassis applied to CANADA and
MEXICO
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu
(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX.
Selection is done using +, - KEY
5.2.3. Tool Option inspection
▪ Press Adj. key on the Adj. R/C, then select Tool option
* Tool option can be reconstructed by Software
6. GND and HI-POT Test
6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically.
6.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
7.2. Specification
No Item Min Typ Max Unit Remark
1 Audio practi-
cal max
Output, L/R
(Distor-
tion=10%
max Output)
9.0
8.5
10.0
8.9
12.0
9.9
W
Vrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)
(3) 60LB6000-UH
2 Audio practi-
cal max
Output, L/R
(Distor-
tion=10%
max Output)
9.0
8.5
10.0
8.9
12.0
9.9
W
Vrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)
(3)
8. Control Key Check UI
8.1. Test method
(1) Condition : Power Only Full White Mode
(2) When you check the operation of control key, appear the UI
such as below figure on TV Screen.
(3) In case of the model applied the joystick type control key
(xxLF56, xxLF55, xxLF60 and xxLF62), the UI Sequence is
CH+, CH-, Vol+, Vol-, Enter and TEST OK such as figure 1.
(4) In case of the model applied rotary switch type (xxLF640R-
NA KR only), the UI Sequence is Channel Up, Channel
Down, Volume Up, Volmue Down, Enter, Test OK, Input
Select and Power such as figure 2.

- 13 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
8. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
(7) In terms of FRC version update, below sequence are the
only for LA55J Chassis. (60LF6000-Ux model)
1) When the main sw downloading was finished, if FRC SW
version of TV Set is lower than the FRC version
Included in downloading version, FRC verison update
will be started automatically during displaying the below
figure.
2) Be careful to not be off of TV Power.
3) Udating the FRC is completed, the TV will restrart
automatically.
4) Check your updated FRC version on TV set with pushing
“IN-START” key in service remote controller.
5) In references, FRC version value shown in TV may differ
from below value.
Refer to the BOM aobut the latest FRC version.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)

- 14 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
TROUBLE SHOOTING
1. Power-up boot check
Check stand-by Voltage.
L413 : +3.5V_ST
Main B/D 3.5V Line
Short Check
Check X101 clock
24 MHz Replace X101
Check P401 PWR_ON
1pin : 3.3V
Check PSU DC Voltage
P401_5,6,7,8 pin : 13.2V
Replace PSU
Check Inverter Control
P401_11pin : High
Check Power Board or Module
Check DC Output Voltage
IC400 : 1.15V+5V / IC404 : 1.5V
Q406 : 3.3V
Replace IC400, IC404, Q406
Check Micom Voltage
L206 : +3.3V (AVDD_NODIE) Replace L206
Check LVDS Power Voltage
Q405 : 13.2V Replace Q405
Check Mstar LVDS Output Replace Mstar(IC101) or Main Board
Change Module
ok
ok
ok
ok
ok
ok
ok
ok
No
No
ok
Replace IC405 (DCDC)
ok
No
No
No
No
No
No
No
Re-download software.
(IC102, IC1300)
Main B/D 3.5V Line
Short Check

- 15 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
2. Digital / Analog TV Video
3. AV Video
Check RF Cable & Signal
Check Tuner 3.3V Power
L1600 Replace L1600 or Tuner
Check IF_P/N Signal
TU1601 6/7 Pin
Check Mstar LVDS Output Replace Mstar(IC101) or Main Board.
ok
ok
ok
No
No
No
Bad Tuner. Replace Tuner.
Check input signal f ormat.
Is it supported?
Check AV Cable f or damage
for damage or open conductor
Check JK1702, CVBS Signal Line
R237
ok
ok
ok
No Replace Jack
ok
Check CVBS_DET Signal
R1713 Replace R1713 or R1710
No
Check Mstar LVDS Output Replace Mstar(IC101) or Main Board.
No

- 16 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4. Component Video
Check input signal f ormat.
Is it supported?
Check Component Cable
for damage or open conductor.
Check JK1702
Y/PB/PR signal Line
ok
ok
ok
No Replace Jack
Check COMP_DET Signal Replace R1710 or R1712
No
Check Mstar LVDS Output Replace Mstar(IC101) or Main Board.
ok
No
5. HDMI Video
Check input signal f ormat.
Is it supported?
Check HDMI Cable conductors
for damage or open conductor.
Check EDID
R810,R811,R815,R816 I2C Signal
Check JK800, JK801
ok
ok
ok
No
No
Re-download EDID data
ok
Replace Jack
Check HDMI Signal Check other set
If no problem, check signal line
No
Check Mstar LVDS Output Replace Mstar(IC101) or Main Board.
ok
No
Replace Main Board
No
Check HDMI_DET(HPD) No
ok
Replace R809, R814

- 17 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Check the TV Speaker Menu
(Menu -> Audio -> Sound Out -> TV Speaker)
On
ok
ok
Check Output Signal P5600
1, 46, 36, 39 pin. Replace Audio AMP IC(IC5600)
ok
No
Check Connector & P5600 Replace connector
if found to be damaged.
ok
No
Check speaker resistance
and connector damage. Replace speaker.
ok
No
Off Toggle the Menu
Check AMP IC(IC5600) Power
24V, 3.3V
No Replace Amp IC(IC5600)
Check Mstar I2S Output
IC5600 20,21,22 Pin
No Check signal line. Or replace Mstar(IC101)
Check Mstar AUDIO_MASTER_CLK
IC5600 15 Pin
No Replace Mstar(IC101) or Main Board.
ok
Check AMP I2C Line
IC5600 23,24 Pin
No Check signal line. Or replace Mstar(IC101)
6. All Source Audio

- 18 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
7. Digital / Analog TV Audio
8. AV/Comp Audio
Check RF Cable & Signal
Follow procedure
‘6. All source audio’
trouble shooting guide.
ok
Check Tuner 3.3V Power
L1600 Replace L1600
Check IF_P/N Signal
TU1601 6/7 Pin
ok
ok
No
No Bad Tuner. Replace Tuner.
Check AV Cable f or damage
for damage or open conductor
Check JK1702 Signal Line
R1714,R1715
ok
ok
No Replace Jack
Follow procedure
‘7. All source audio’
trouble shooting guide.

- 19 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
BLOCK DIAGRAM
(P1101)
30P HD LVDS wafer
51P FHD LVDS wafer
(P1100)
COMP2_L/R_IN
COMP2_Y+/AV_CVBS_IN, COMP2_Pb+/Pr+
CK+/-, D0+/-, D1+/-, D2+/-_HDMI2
DDC_SCL/SDA_2, HDMI_CEC
Serial Flash
(8Mbit)
IC1300
SPI_SCK/SDI/SDO/CS
System EEPROM
(256Kbit)
IC104
I2C_SCL/SDA
NAND FLASH
(1Gbit)
IC102
PCM_A[0-7],…
< FHD >
RXA0+/-~RXA4+/-, RXAC K+/-
RXB0+/-~RXB4+/-, RXBCK+/-
SPK_R
SPK_L
AMP_SCL/SDA
AUD_MASTER_CLK,
AUD_LRCH,
AUD_LRCK, AUD_SCK
TAS5733
(IC5600)
Connector
(P600)
KEY1/2, LED_R, IR
REAR
HDMI1
(JK801)
TU_SCL / SDA
SIF
D_IF
CVBS
Comp1 & AV1
(JK1701)
SPDIF_OUT
SPDIF(Optic)
(JK1001)
SIDE
USB
(JK700)
HDMI2(MHL)
(JK803)
CK+/-, D0+/-, D1+/-, D2+/-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC
SIDE_USB_DM/DP
USB1_OCD/CTL
TPS65282
+5V_USB
MHL_CD_SENSE
HP_L/ROUT, SIDE_HP_MUTE
Headphone
(JK1500)
(only KR)
< HD >
RXA0+/-~RXA3+/-, RXAC K+/-
IC101
Main SOC
M1A - 256MB DDR3 ⇨㣙
DDR Clock freq. (Max) : 792MHz

- 20 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
900
200
400
410
540
521
530
820
120
121
LV1
A2 A10
Set + Stand
350
*Option
200T