LG CHAMELEON V 32LD320H User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LD91X
MODEL : 32LD320H 32LD320H-TA
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL62461527 (1007-REV00)

LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
BLOCK DIAGRAM.................................................................................. 14
EXPLODED VIEW .................................................................................. 15
SVC. SHEET ...............................................................................................

LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15 uF
Ω

LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 %-99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LCD TV used LD91X
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC (77 ºF ± 9 ºF), CST: 40 ºC ± 5ºC
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~ 50 / 60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC/EN60065
- EMC:CE, IEC
4. Module optical specification
- AUO Module
1) Standard Test Condition (The unit has been ‘ON’)
2) Stable for approximately 30 minutes in a dark environment at 25 ºC ± 2 ºC.
3) The values specified are at approximate distance 50 cm from the LCD surface.
4) Ta= 25 °C ± 2 °C, VLCD= 12.0 V, fV= 60 Hz, Dclk= 74.25 MHz VBR_A= 1.65 V, ExtVBR_B= 100 %
No. Item Specification Min. Typ. Max. Remark
1. Viewing Angle [CR>10] Right/Left/Up/Down 178 Degree
2. Luminance Luminance (cd/m2) 360 450
Variation - 1.3 MAX /MIN
3. Contrast Ratio CR 4000 5000
4. CIE Color Coordinates White Wx 0.28
Wy 0.29
RED Xr 0.64
Yr 0.33 Typ
Green Xg 0.29 ±0.03
Yg 0.60
Blue Xb 0.15
Yb 0.05

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5. Component Video Input (Y, CB/PB, CR/PR)
No Specification Remark
Resolution H-freq(kHz) V-freq(Hz)
1. 720x480 15.73 60.00 SDTV,DVD 480i
2. 720x480 15.63 59.94 SDTV,DVD 480i
3. 720x480 31.47 59.94 480p
4. 720x480 31.50 60.00 480p
5. 720x576 15.625 50.00 SDTV,DVD 625 Line
6. 720x576 31.25 50.00 HDTV 576p
7. 1280x720 45.00 50.00 HDTV 720p
8. 1280x720 44.96 59.94 HDTV 720p
9. 1280x720 45.00 60.00 HDTV 720p
10. 1920x1080 31.25 50.00 HDTV 1080i
11. 1920x1080 33.75 60.00 HDTV 1080i
12. 1920x1080 33.72 59.94 HDTV 1080i
13. 1920x1080 56.250 50 HDTV 1080p
14. 1920x1080 67.5 60 HDTV 1080p
No Specification Proposed Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1. 720*400 31.468 70.08 28.321 For only DOS mode
2. 640*480 31.469 59.94 25.17 VESA Input 848*480 60 Hz, 852*480 60 Hz
-> 640*480 60 Hz Display
3. 800*600 37.879 60.31 40.00 VESA
4. 1024*768 48.363 60.00 65.00 VESA(XGA)
5. 1280*768 47.78 59.87 79.5 WXGA
6. 1360*768 47.72 59.8 84.75 WXGA
7. 1280*1024 63.595 60.0 108.875 SXGA FHD model
8. 1920*1080 66.587 59.93 138.625 WUXGA FHD model
6. RGB (PC)

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7. HDMI Input (PC/DTV)
(1) DTV Mode
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*400 31.468 70.08 28.321 HDCP
2. 640*480 31.469 59.94 25.17 VESA HDCP
3. 800*600 37.879 60.31 40.00 VESA HDCP
4. 1024*768 48.363 60.00 65.00 VESA(XGA) HDCP
5. 1280*768 47.78 59.87 79.5 WXGA HDCP
6. 1360*768 47.72 59.8 84.75 WXGA HDCP
7. 1280*1024 63.595 60.0 108.875 SXGA HDCP/FHD model
8. 1920*1080 67.5 60.00 138.625 WUXGA HDCP/FHD model
(2) PC Mode
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*480 31.469/31.5 59.94/60 27.00/27.03 SDTV 480P
2. 720*576 31.25 50 54 SDTV 576P
3. 1280*720 37.500 50 74.25 HDTV 720P
4. 1280*720 44.96/45 59.94/60 74.17/74.25 HDTV 720P
5. 1920*1080 33.72/33.75 59.94/60 74.17/74.25 HDTV 1080I
6. 1920*1080 28.125 50.00 74.25 HDTV 1080I
7. 1920*1080 26.97/27 23.97/24 74.17/74.25 HDTV 1080P
8. 1920*1080 33.716 /33.75 29.976/30.00 74.25 HDTV 1080P
9. 1920*1080 56.250 50 148.5 HDTV 1080P
10. 1920*1080 67.43/67.5 59.94/60 148.35/148.50 HDTV 1080P

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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV with
LD91X chassis.
2. Designation
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 ºC ± 5 ºC
Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz
6) Adjustment equipments: Color Analyzer (CA-210 or CA-
110), Pattern Generator(MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, Service remote control.
7) Push the “IN STOP” key - For memory initialization.
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot file Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message
If “Error” is displayed, Check connection between
computer, jig, and set.
3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
4) Click “Connect” tab. If “Can’t” is displayed, check
connection between computer, jig, and set.
5) Click “Auto” tab and set as below
6) Click “Run”.
7) After downloading, check “OK” message.
* USB DOWNLOAD(*.epk file download)
1) Put the USB Stick to the USB socket
2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work. But your downloaded version is High, USB
data is automatically detecting
3) Show the message “Copying files from memory”
filexxx.bin
(4)
(7) ……….OK
(5)
(6)
(1)
filexxx.bin
(2) (3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
Case1 : Software version up
1. After downloading S/W by USB, TV set will reboot
automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at first.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.

4) Updating is staring.
5) Fishing the version uploading, you have to put USB stick
and “AC Power” off.
6) After putting “AC Power” on and check updated version on
your TV.
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote controller
2) Select “Tool Option 1” and Push “OK” button.
3) Punch in the number. (Each model hax their number)
4) Completed selecting Tool option.
3.1. ADC Process
(1) ADC
• Input signal : Component 480i
• Signal equipment displays.
- Component 480I
MODEL: 209 in Pattern Generator(480i Mode)
PATTERN : 65 in Pattern Generator(MSPG-925 Series)
- RGB 1024x768 @60 Hz
Using the Inner Pattern
• After enter Service Mode by pushing “ADJ” key,
• Enter Internal ADC mode by pushing “G” key at “5. ADC
Calibration”
<Caution> Using ‘power on’ button of the Adjustment R/C ,
power on TV.
* ADC Calibration Protocol (RS232)
Adjust Sequence
• aa 00 00 [Enter Adjust Mode]
• xb 00 40 [Component1 Input (480i)]
• ad 00 10 [Adjust 480i Comp1]
• xb 00 60 [RGB Input (1024*768)]
• ad 00 10 [Adjust 1024*768 RGB]
• aa 00 90 End Adjust mode
* Required equipment : Adjustment R/C.
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Module Tool option1 Tool option2 Tool option3 Tool option4
AUO FHD 16528 1572 50464 3584
Item CMD1 CMD2 Data0
Adjust A A 0 0 When transfer the ‘Mode In’,
‘Mode In’ Carry the command.
ADC Adjust A D 1 0 Automatically adjustment
(The use of a internal pattern)
Adjustment pattern

3.2. Function Check
* Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART1/SCART2/ CVBS)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60 hz)
5) HDMI
6) PC Audio In
* Display and Sound check is executed by Remote control.
<Caution> Not to push the INSTOP key after completion if the
function inspection
4. Total Assembly line process
4.1. Adjustment Preparation
· W/B Equipment condition
CA210 : CH 9, Test signal : Inner pattern (85IRE)
· Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
* Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER ON ->
Enter the mode of White-Balance, the pattern will come out.
* Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10 lux).
2) Adhere closely the Color Analyzer (CA210) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
• Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0. (when R/G/B Gain are all
C0, it is the FULL Dynamic Range of Module)
* Manual W/B process using adjusts Remote control.
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “G” key at “6. White
Balance”.
* After done all adjustments, Press “In-start” key and
compare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is not
same, then correct it same with BOM and unplug AC cable.
For correct it to the model’s module from factory Jig model.
* Push the “IN STOP” key after completing the function
inspection.
And mechanical power switch must be set “ON”.
4.2. DDC EDID Write (RGB 128Byte )
• Connect D-sub Signal Cable to D-sub Jack.
• Write EDID Data to EEPROM(24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4.3. DDC EDID Write (HDMI 256Byte)
• Connect HDMI Signal Cable to HDMI Jack.
• Write EDID Data to EEPROM(24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
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Cool 11,000 ºK X=0.276(±0.002)
Y=0.283(±0.002) <Test Signal>
Medium 9,300 ºK X=0.285(±0.002) Inner pattern
Y=0.293(±0.002) (216gray,85IRE)
Warm 6,500 ºK X=0.313(±0.002)
Y=0.329(±0.002)
Full White Pattern
COLOR
ANALYZER
TYPE: CA-210
RS-232C Communication
CA-210
RS-232C COMMAND MIN CENTER MAX
[CMD ID DATA] (DEFAULT)
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128

4.4. EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
- Auto Download
• After enter Service Mode by pushing “ADJ” key,
• Enter EDID D/L mode.
• Enter “START” by pushing “OK” key.
* Edid data and Model option download (RS232)
- Manual Download
* Caution
1) Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
2) Never connect HDMI & D-sub Cable at the same time.
3) Use the proper cables below for EDID Writing
4) Download HDMI1, HDMI2, separately because HDMI1 is
different from HDMI2.
(1) FHD RGB EDID data
(2) FHD HDMI EDID data
* Detail EDID Options are below
ⓐProduct ID
ⓑSerial No: Controlled on production line.
ⓒMonth, Year: Controlled on production line:
ex) Monthly : ‘02’ -> ‘02’
Year : ‘2009’ -> ‘13’
ⓓModel Name(Hex):
ⓔChecksum: Changeable by total EDID data.
ⓕVendor Specific(HDMI)
Model Name HEX EDID Table DDC Function
FHD Model 0001 01 00 Analog/Digital
HD Model 0000 00 00 Analog/Digital
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 12 -
MODEL MODEL NAME(HEX)
all 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Item
Manufacturer ID
Version
Revision
Condition
GSM
Digital : 1
Digital : 3
Data(Hex)
1E6D
01
03
D-sub to D-sub DVI-D to HDMI or HDMI to HDMI
For HDMI EDIDFor Analog EDID
INPUT MODEL NAME(HEX)
HDMI1 67030C001000B82D
HDMI2 67030C002000B82D
012 3 4 5 67 8 9 A BCD EF
00 00 FF FF FF FF FF FF 00 1E 6D a b
10 c 0103687341780ACF74A3574CB023
20 09 48 4C A1 08 00 81 80 61 40 45 40 31 40 01 01
30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 7E 8A 42 00 00 1E 01 1D 00 72 51 D0 1E 20
50 6E 28 55 00 7E 8A 42 00 00 1E 00 00 00 FD 00 3A
60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d
70 d 00 e
80 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
90 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
A0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
B0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
C0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
D0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
E0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
F0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
012 3 4 5 67 8 9 A BCDEF
00 00 FF FF FF FF FF FF 00 1E 6D a b
10 c 0103807341780ACF74A3574CB023
20 09 48 4C A1 08 00 81 80 61 40 45 40 31 40 01 01
30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 7E 8A 42 00 00 1E 01 1D 00 72 51 D0 1E 20
50 6E 28 55 00 7E 8A 42 00 00 1E 00 00 00 FD 00 3A
60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d
70 d 01 e
80 02 03 26 F1 4E 10 1F 84 13 05 14 03 02 12 20 21
90 22 15 01 26 15 07 50 09 57 07 f
A0 f E3050301011D8018711C1620582C
B0 25 00 7E 8A 42 00 00 9E 01 1D 00 80 51 D0 0C 20
C0 40 80 35 00 7E 8A 42 00 00 1E 02 3A 80 18 71 38
D0 2D 40 58 2C 45 00 7E 8A 42 00 00 1E 66 21 50 B0
E0 51 00 1B 30 40 70 36 00 7E 8A 42 00 00 1E 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 F9
NO Item CMD1 CMD2 Data0
Enter download Download A A 0 0 When transfer the ‘Mode In’,
Mode ‘Mode In’ Carry the command.
EDID data and Download A E 00 10 Automatically Download
Model option (The use of a internal pattern)
download

- 13 - LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.5. Outgoing condition Configuration
- When pressing IN-STOP key by Service remote control, Red
LED are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.6. Internal pressure
Confirm whether is normal or not when between power
board’s ac block and GND is impacted on 1.5 kV(dc) or 2.2
kV(dc) for one second
5. Model name & Serial number D/L
• press “Power on” key of service remocon.
(Baud rate : 115200 bps)
• Connect RS232 Signal Cable to RS-232 Jack.
• Write Serial number by use RS-232.
• Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
5.1. Signal TABLE
CMD : A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 +…+ Data_n
Delay : 20ms
5.2. Command Set
* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write : Model Name and Serial Number write in
EEPROM,.
5.3. Method & notice
A. Serial number D/L is using of scan equipment.
B. Setting of scan equipment operated by Manufacturing
Technology Group.
C. Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0.
* Manual Download (Model Name and Serial Number)
If the TV set is downloaded by OTA or Service man,
sometimes model name or serial number is initialized.(Not
always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the ‘instart’ key of ADJ remote control.
2) Go to the menu ‘5.Model Number D/L’ like below photo.
3) Input the Factory model name(ex 42LH4000-ZA) or Serial
number like photo.
4) Check the model name Instart menu -> Factory name
displayed (ex 42LH4000-ZA)
5) Check the Diagnostics (DTV country only) ->s Buyer model
displayed (ex 42LH4000)
CMD LENGTH ADH ADL DATA_1 . . . Data_n CS DELAY
No. Adjust mode CMD(hex) LENGTH(hex) Description
1 EEPROM WRITE A0h 84h+n n-bytes Write (n = 1~16)

BLOCK DIAGRAM
- 14 - LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 15 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
300
200
801
802
804
805
806
520
530
540
550
400
900
120
510
500
LV1
560
A2 A10
A5
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PCM_A[0]
PCM_A[1]
PCM_A[2]
PCM_A[3]
PCM_A[4]
PCM_A[5]
PCM_A[6]
PCM_A[7]
PCM_A[7]
PCM_A[6]
PCM_A[5]
PCM_A[4]
PCM_A[0]
PCM_A[1]
PCM_A[3]
PCM_A[2]
EEPROM_SDA
FE_TUNER_SDA
IC102
HY27US08121B-TPCB
OPT
26 NC_17
27 NC_18
28 NC_19
29 I/O0
30 I/O1
31 I/O2
32 I/O3
33 NC_20
34 NC_21
35 NC_22
36 VSS_2
37 VCC_2
38 PRE
39 NC_23
40 NC_24
41 I/O4
42 I/O5
43 I/O6
44 I/O7
45 NC_25
46 NC_26
47 NC_27
48 NC_28
17
ALE
3
NC_3
6
NC_6
16
CLE
15
NC_10
14
NC_9
13
VSS_1
12
VCC_1
11
NC_8
10
NC_7
9
CE
8
RE
7
R/B
4
NC_4
5
NC_5
25 NC_16
24
NC_15
23
NC_14
2
NC_2
22
NC_13
21
NC_12
1
NC_1
20
NC_11
19
WP
18
WE
Q100
KRC103S
OPT
E
B
C
+3.3V
PCM_A[0-7]
+3.3V +3.3V
SPI_DI
/PF_CE0
SPI_CS
+3.3V
Q101
KRC103S
OPT
E
B
C
+3.3V
+5V_ST
FE_TUNER_SCL
FE_DEMOD_SDA
FE_DEMOD_SCL
Flash_WP_1
R102
0
OPT
R193
1M
R172 0
AR102
22
AR103
22
/PF_CE0
/PF_CE1
/PF_OE
/PF_WE
PF_WP
PF_ALE
/F_RB
AR100
22
AR101
22
/F_RB
/PF_OE
/PF_WE
/PF_CE1
PF_ALE
PF_WP
PCM_A[0-7]
SPI_CS
SPI_CK
SPI_CK
SPI_DO
R101
0
SPI_DO
SPI_DI
MST_IR
NTP_MUTE
BIT_SEL
AMP_RST
ERROR_OUT
BUF_TS_VAL_ERR
BUF_TS_SYN
BUF_TS_CLK
BUF_TS_DATA[0]
USB_CTL
PWM1
C104
0.1uF
C106 0.1uF
C103
0.1uF
R112 1K
OPT
R105 1K
OPT
R103
10K
R104
10K
R111 3.9K
R1524 33
R1525 33
R1526 33
R1530
33
R1533
4.7K
+3.3V
S6_EEPROM_SDA
R1539
1K
R1540 1K
L102
EEPROM_SCL
IC107
CAT24WC08W-T
3
A2
2
A1
4
VSS
1
A0
5SDA
6SCL
7WP
8VCC
+5V_ST
EEPROM_SDA
EEPROM_SCL
Flash_WP_1
SCL1
SDA1
USB_OCD
SDA_SUB/AMP SDA1
FE_DEMOD_SDA
SCL_SUB/AMP
R128 0
R129 0
EEPROM_SDA
R124
4.7K
FE_DEMOD_SCL
EEPROM_SCL
R125
4.7K
SCL1
+5V_ST
S6_EEPROM_SCL
ISP_RXD
COMP_DET
DSUB_DET
R151 0
R1509 0
OPT
X100
12MHz
+3.3V
R115
10K
IC101
KIA7427F
2
GND
3OUT
1
VCC
C101
0.022uF
16V
R107
470
SIDE_USB_DM
R132
15K
OPT
R133
15K
OPT
R179 0 26~52"
R178 0 26~52"
SIDE_USB_DP
OPC_EN
PWM0
PWM1
IC105
M24512-WMW6
3
E2
2
E1
4
VSS
1
E0
5SDA
6SCL
7WC
8VCC
MST_DBG_RX
LVDS_SEL
+3.3V
C105
10uF 6.3V
/FE_RESET MODEL_OPT_3
+3.3V
MODEL_OPT_1
FE_AGC_SPEED_CTL
MODEL_OPT_1
R189 0
MODEL_OPT_3
FE_BOOSTER_CTL
+5V_GENERAL
R1504
4.7K
FE_TUNER_SCL
R1505
4.7K
FE_TUNER_SDA
C111
20pF
C112
20pF
+3.3V
R1507
1.2K
R1506
1.2K
POWER_DET
+5V_ST
R1544 100
PWM0
PWM2PWM_DIM
A_DIM
C1500
1uF
OPT
C1501
2.2uF
OPT
+24V/+15V +12V/+15V
PWM2
PWM0+3.3V_TUNER
R146 0
R1160
R173 0
R100
0
C114
0.1uF
C100
0.1uF
R147 100
R157 100
R166 100
R148 100
R160 100
R154 100
R153 100
R190 100 OPT
R177 100
R191 100 OPT
R188 100
R159 100
R167 100
R1534 100 OPC
R192 100
R1601 100
OPT
R1543
10K
R198
1K
R1500
1K
OPT
R199
1K
OPT
R1501
1K
R161 22
R171 22
R140 22
R141 22
R142 22
R143 22
R1537 22
R1538 22
R169 22
R170 22
R158
4.7K
R152
4.7K
OPT
R1527
1K
1%
26~32"(24V POWER_DET)
R1528
2.7K
1%
37~47"(12V POWER_DET)
R1529
1.8K
37~47"(12V POWER_DET)
C102
10uF
6.3V
R1502
2.2K
R1503
2.2K
R1611 100
R1603
3.3K
FHD
R1605
3.3K
LED_NORMAL
R1607
3.3K
FRC/LVDS_B
IC1500
KIA7042AF
2
G
3O
1
I
R1545 100
R1508
1.8K
OPT
R109 4.7K
R1606
3.3K
LED_MOVING
R1604
3.3K
HD
R1608
3.3K
NO_FRC/LVDS_A
R110 22
R113 22
R1536 0
R165 0
R164 0
R163 0
R162 0
R1535 0
C107
8pF
OPT
C108
8pF
OPT
R1521
3.9K
1%
19~32"(24V POWER_DET)
SIDE_HP_MUTE
R108 100
HP_DET
R106 100
R114 100
R119 100
OPT
SUBAMP_MUTE
EXT_VOL+
EXT_VOL-
R15410
OPT
SOC_RESET
R1542 100
OPT
5V_HDMI_2
R1546 0 OPT
5V_HDMI_1
MODEL_OPT_0
R1645 0
OPT
R1646 0
OPT
R1647 0 OPT
R1651 0 OPT
R1653 0
MEMC_SCL
MEMC_SDA
R1654 0
OPT
R1655 0
OPT
R126 0
R168 0
MODEL_OPT_2
R1609
3.3K
VESA
R1610
3.3K
JEIDA
MODEL_OPT_0
MODEL_OPT_2
R1600 100
OPT
MEMC_RESET
SUBAMP_SD
+3.3V
+5V_ST
R1656
4.7K
R1657 100
OPT
IC100
LGE3369A (SATURN6 NON RM)
HWRESET
D4
PCMD0/CI_D0
AC16
PCMD1/CI_D1
AA15
PCMD2/CI_D2
AA16
PCMD3/CI_D3
AC6
PCMD4/CI_D4
Y10
PCMD5/CI_D5
Y11
PCMD6/CI_D6
Y12
PCMD7/CI_D7
Y13
PCM_A0/CI_A0
AB16
PCM_A1/CI_A1
AC15
PCM_A2/CI_A2
AC14
PCM_A3/CI_A3
AB14
PCM_A4/CI_A4
AC12
PCM_A5/CI_A5
AB8
PCM_A6/CI_A6
AC13
PCM_A7/CI_A7
AA9
PCM_A8/CI_A8
AB5
PCM_A9/CI_A9
AA4
PCM_A10/CI_A10
V4
PCM_A11/CI_A11
Y4
PCM_A12/CI_A12
AB9
PCM_A13/CI_A13
AA7
PCM_A14/CI_A14
AD6
PCM_RST/CI_RST
AA14
PCM_CD/CI_CD
AB18
/PCM_OE
Y5
PCM_REG/CI_CLK
AB15
PCM_WAIT/CI_WACK
AA10
/PCM_IRQA
AC8
/PCM_WE
AC7
PCM_IOWR/CI_WR
AA5
PCM_IOR/CI_RD
W4
/PCM_CE
T4
/PF_CE0
AE6
/PF_CE1
AF6
/PF_OE
AA12
/PF_WE
AA11
PF_ALE
AC9
PF_AD15
Y14
F_RBZ
AB11
UART2_TX/SCKM
F8
UART2_RX/SDAM
D11
DDCR_DA
AB21
DDCR_CK
AC21
DDCA_CLK
J1
DDCA_DA
J2
UART_RX2
W5
UART_TX2
V5
PWM0
AB13
PWM1
AB12
PWM2
AD12
PWM3
AA13
SAR0
A4
SAR1
B4
SAR2
F4
SAR3
E4
IRIN
C4
GPIO44
AC11
GPIO96
D9
GPIO88
D10
GPIO90/I2S_OUT_MUTE
D7
GPIO91
E11
GPIO97
E8
GPIO98
E10
GPIO99
D6
GPIO103/I2S_OUT_SD3
D5
GPIO102
C5
XIN B3
XOUT A3
TESTPIN/GND E6
SPI_DI AE11
SPI_DO AF12
/SPI_CS AE12
SPI_CK AD11
USB_DP_1 B5
USB_DM_1 A5
USB_DM_2 AC10
USB_DP_2 AB10
GPIO_PM0/GPIO134 E5
GPIO_PM1/GPIO135 F5
GPIO_PM2/GPIO136 G5
GPIO_PM3/GPIO137 H5
GPIO_PM4/GPIO138 F6
GPIO_PM5/INT1/GPIO139 G6
GPIO_PM6/INT2/GPIO140 H6
GPIO131/LDE/SPI_WPn1 AC17
GPIO130/LCK AB17
GPIO132/LHSYNC/SPI_WPn AF11
GPIO60/PCM2_RESET/RX1 AA18
GPIO62/PCM2_CD_N/TX1 AA17
LHSYNC2/I2S_OUT_MUTE/RX1 E7
LVSYNC/GPIO133 AC18
GPIO79/LVSYNC2/TX1 C6
UART2_RX/GPIO84 F9
UART2_TX/GPIO85 F10
UART1_RX/GPIO86 A6
UART1_TX/GPIO87 B6
GPIO42/PCM2_CE_N AF5
GPIO43/PCM2_IRQA_N AF10
TS0_D0 AA8
TS0_D1 Y8
TS0_D2 Y9
TS0_D3 AB7
TS0_D4 AA6
TS0_D5 AB6
TS0_D6 U4
TS0_D7 AC5
TS0_SYNC AC4
TS0_VLD AD5
TS0_CLK AB4
TS1_D0 AB19
TS1_SYNC AA20
TS1_VLD AC19
TS1_CLK AA19
ET_TXD0 C10
ET_TXD1 B11
ET_TX_CLK A9
ET_RXD0 C11
ET_RXD1 C9
ET_TX_EN B10
ET_MDC A10
ET_MDIO B9
ET_COL A11
GPIO67 A7
GPIO68 B8
KEY1
KEY2
ISP_TXD
MST_DBG_TX
MST_NEC_RX
MST_NEC_TX
INV_CTL
PANEL_CTL
R1648 100
R1649 100
R1650 100
R1652 100
POWER_DET
IC103
W25X32VSSIGE
OPT
3
WP
2
DO
4
GND
1
CS
5DIO
6CLK
7HOLD
8VCC
R155 100 OPT
AV1_DET
EEPROM
Serial FLASH MEMORY
for BOOT
I2C
NAND FLASH MEMORY
10 : BOOT 51
11 : BOOT RISC
MCU BOOT STRAP
1 12
MSTAR_1
/PF_CE0
H : Serial Flash
L : NAND Flash
/PF_CE1
H : 16 bit
L : 8 bit
Addr:10101--
HDCP EEPROM
IC105: EAN43352801(ATMEL SHRINK)
1386 WON
$0.76 $0.418
$0.199
Interrupt for ISP Wake up in STB Mode
VOLTAGE DETECTOR
*Mstar reset:Active high reset
SIDE_USB
0IMMRMP008A(MICROCHIP)
POWER DETECT
MODEL OPTION
080923_Time Delay
DIMMING
MODEL_OPT_1
LOW
MODEL_OPT_2
PIN NAME
PDP
HD
MODEL OPTION
MODEL_OPT_0
E11
PIN NO.
MODEL_OPT_3
HIGH
FRC
LCD
NO_FRC
D7
LED_NORMAL LED_MOVING
B9
D6
FHD
LVDS_ALVDS_B
B9(FHD)
B9(HD)
2010.03.10
EAX62121501
xxLD320H-TA
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MAIN_2
FE_VMAIN
AV1_R_IN
AV1_L_IN
SPDIF_OUT
AV1_CVBS_IN
R228 100
R209 100
C230 2.2uF
C229 2.2uF
DSUB_HSYNC
DSUB_VSYNC
R229 390
1%
Check
FE_SIF
R241 47
MS_LRCK
MS_LRCH
AUDIO_MASTER_CLK
MS_SCK
R231 22
R232 22
R233 22
R234 22
+3.3V
R242 47
+3.3V_AVDD
+1.8V_DDR
+3.3V_S6
L209
BLM18PG121SN1D
+3.3V
+3.3V_S6
L206
BLM18PG121SN1D
+3.3V_S6
+3.3V_S6
L210
BLM18PG121SN1D
+3.3V_VDDP
+3.3V
+1.8V_DDR
C2006 2.2uF
C2007 2.2uF
+3.3V_AVDD_MPLL
+1.26V_VDDC
+1.26V_VDDC
+3.3V_VDDP
R204 100
R210 47
OPT
R215 47
R216 47
R211 47
R213 47
R217 47
R212 47
R218 47
R220 47
R224 47
R205 47
R219 47
R223 47
R222 47
R227 47
R246 22
R245 22
C222 0.047uF
C214 0.047uF
C201 0.047uF
C221 0.047uF
C210 0.047uF
C207 0.047uF
C216 0.047uF
C206 0.047uF
C204 0.047uF
C212 0.047uF
C200 0.047uF
C218 0.047uF
C205 0.047uF
C215 0.047uF
C213 0.047uF
C202 0.047uF
C231 0.1uF
C232 0.1uF
C224 0.1uF
C2013 2.2uF
C2014 2.2uF
C2015 2.2uF
C2016 2.2uF
C2024 0.047uFR235 47
C2019 0.047uFR236 47
R237 100
R238 100
R250 100
R251 100
R252
22K
R253
22K
R256
22K
R257
22K
C2018
0.01uF
C2023
0.01uF
C2017
0.01uF
C2022
0.01uF
C239
22pF
OPT
C236
22pF
OPT
C238
22pF
OPT
C237
22pF
OPT
R243
10K R244
10K
CK-_HDMI1
DDC_SDA_1
D2+_HDMI1
D1+_HDMI1
D1-_HDMI1
CK+_HDMI1
D0+_HDMI1
D0-_HDMI1
DDC_SCL_1
HPD1
D2-_HDMI1
D0-_HDMI2
D2-_HDMI2
CK-_HDMI2
D0+_HDMI2
HPD2
D2+_HDMI2
DDC_SCL_2
CK+_HDMI2
D1+_HDMI2
DDC_SDA_2
D1-_HDMI2
MST_HDMI_CEC
DSUB_R
DSUB_G
DSUB_B
COMP_Pr
COMP_Pb
COMP_Y
PC_L_IN
PC_R_IN
COMP_L_IN
COMP_R_IN
LVA_2M
LVB_3M
LVB_2P
LVB_0M
LVA_4M
LVB_1M
LVA_CKP
LVB_0P
LVA_1M
LVA_0P
LVB_3P
LVA_4P
LVA_3P
LVA_CKM
LVB_4M
LVB_1P
LVB_4P
LVA_0M
LVB_CKP
LVA_2P
LVA_3M
LVB_CKM
LVA_1P
LVB_2M
R258
22 R259
22
R261
22
R260
22
R264
22
R262
22 R263
22
R265
22
R267
22 R268
22 R269
22 R270
22 R271
22 R272
22 R273
22 R275
22
R276
22 R277
22 R278
22 R279
22 R280
22 R281
22 R282
22 R283
22
R247 100
+3.3V_S6
C225 10uF 6.3V
C2044
10uF
C2043
10uF
C2025
10uF
6.3V
R214 470
R225 470
R221 470
C209 1000pF
C208 1000pF
C203 1000pF
R208 0
R201 0
R202 0
R207 0
C223 0.1uF
C226 0.1uF
C2031
0.1uF
C246
0.1uF
C2004
0.1uF C2026
0.1uF C247
0.1uF
C252
0.1uF C2034
0.1uF C2042
0.1uF
C297
0.1uF
C259
0.1uF
C275
0.1uF
C249
0.1uF C2038
0.1uF
C264
0.1uF C2035
0.1uF
C245
0.1uF C248
0.1uF
C257
0.1uF
C258
0.1uF C241
0.1uF
C281
0.1uF C2005
0.1uF
C2003
0.1uF
C296
0.1uF
C2041
0.1uF
C265
0.1uF
C2036
0.1uF
C251
0.1uF
C2001
0.1uF
C289
0.1uF
C253
0.1uF
C2039
0.1uF
C283
0.1uF
C243
0.1uF C2000
0.1uF
C294
0.1uF
C276
0.1uF
C242
0.1uF
C2040
0.1uF
C277
0.1uF
C254
0.1uF C291
0.1uF
C2032
0.1uF C2033
0.1uF C2037
0.1uF
C266
0.1uF
C250
0.1uF C244
0.1uF
C2030
0.1uF
C262
0.1uF
C293
0.1uF
C2029
0.1uF
C273
0.1uF
C256
0.1uF
C279
0.1uF
C271
0.1uF
C260
0.1uF
C284
0.1uF
C263
0.1uF
C267
0.1uF
C274
0.1uF
C269
0.1uF
C286
0.1uF
C234 0.1uF
C235 0.1uF
C233
0.1uF
R203 100
R230 100
C227 1uF
C2027
10uF
C228 4.7uF
EXT_L_AMP
EXT_R_AMP
HP_ROUT
HP_LOUT
LGE3369A (SATURN6 NON RM)
IC100
RXACKP
F1
RXACKN
F2
RXA0P
G2
RXA0N
G3
RXA1P
H3
RXA1N
G1
RXA2P
H1
RXA2N
H2
DDCD_A_DA
A1
DDCD_A_CK
B2
HOTPLUG_A
A2
RXBCKP
C3
RXBCKN
B1
RXB0P
C1
RXB0N
C2
RXB1P
D2
RXB1N
D3
RXB2P
E3
RXB2N
D1
DDCD_B_DA
E1
DDCD_B_CK
F3
HOTPLUG_B
E2
RXCCKP
AE8
RXCCKN
AD8
RXC0P
AD9
RXC0N
AF8
RXC1P
AF9
RXC1N
AE9
RXC2P
AE10
RXC2N
AD10
DDCD_C_DA
AE7
DDCD_C_CK
AF7
HOTPLUG_C
AD7
CEC
J3
HSYNC0/SC1_ID
N2
VSYNC0/SC1_FB
N1
RIN0P/SC1_R
P2
GIN0P/SC1_G
R3
BIN0P/SC1_B
R1
SOGIN0/SC1_CVBS
P3
RINM
P1
BINM
T3
GINM
R2
HSYNC1/DSUB_HSYNC
K3
VSYNC1/DSUB_VSYNC
K2
RIN1P/DSUB_R
L1
GIN1P/DSUB_G
L3
BIN1P/DSUB_B
K1
SOGIN1
L2
RIN2P/COMP_PR+
V1
GIN2P/COMP_Y+
V2
BIN2P/COMP_PB+
U1
SOGIN2
V3
VSYNC2
J5
CVBS1/SC1_CVBS
U3
CVBS2/SC2_CVBS
U2
CVBS3/SIDE_CVBS
T1
VCOM1
T2
CVBS4/S-VIDEO_Y
M1
CVBS6/S-VIDEO_C
M2
CVBS5
N3
CVBS7
M3
CVBS0/RF_CVBS
W1
VCOM0
Y3
CVBSOUT0/SC2_MNTOUT
Y2
CVBSOUT1
AA2
LVA0P AE16
LVA0M AD16
LVA1P AD15
LVA1M AF16
LVA2P AF15
LVA2M AE15
LVA3P AD13
LVA3M AF14
LVA4P AF13
LVA4M AE13
LVACKP AE14
LVACKM AD14
LVB0P AE20
LVB0M AD20
LVB1P AD19
LVB1M AF20
LVB2P AF19
LVB2M AE19
LVB3P AD17
LVB3M AF18
LVB4P AF17
LVB4M AE17
LVBCKP AE18
LVBCKM AD18
AUR0 AA3
AUL0 Y1
AUR1 AE1
AUL1 AF3
AUR2 AE3
AUL2 AE2
AUR3 AA1
AUL3 AB1
AUR4 AB2
AUL4 AC2
AUR5 AB3
AUL5 AC3
SIF0P W3
SIF0M W2
SPDIF_IN F11
SPDIF_OUT E9
AUOUTR0/HP_ROUT AF1
AUOUTL0/HP_LOUT AF2
AUOUTR1/SC1_ROUT AD3
AUOUTL1/SC1_LOUT AD1
AUOUTR2/SC2_ROUT AC1
AUOUTL2/SC2_LOUT AD2
I2S_OUT_MCK A8
I2S_OUT_WS B7
I2S_OUT_BCK C7
I2S_OUT_SD D8
I2S_IN_SD C8
VCLAMP K4
REFP H4
REFM J4
REXT G4
AUCOM AE5
AUVRM AE4
AUVRP AF4
AUVAG AD4
IC100
LGE3369A (SATURN6 NON RM)
VDDC_1 D16
VDDC_2 D17
VDDC_3 D18
VDDC_4 D19
VDDC_5 D20
VDDC_6 H18
VDDC_7 H19
VDDC_8 H20
VDDC_9 J20
VDDC_10 K20
VDDC_11 L20
VDDC_12 M20
VDDC_13 P7
VDDC_14 R7
VDDC_15 T7
VDDC_16 T22
VDDC_17 U7
VDDC_18 U20
VDDC_19 U22
VDDC_20 V7
VDDC_21 V22
VDDC_22 W11
VDDC_23 W12
VDDC_24 W19
VDDC_25 W20
VDDC_26 W22
VDDC_27 Y22
VDDP_1 H9
VDDP_2 H10
VDDP_3 H11
VDDP_4 H12
VDDP_5 N20
VDDP_6 P20
VDDP_7 W9
VDDP_8 W10
AVDD_AU W7
AVDD_DDR_1 G12
AVDD_DDR_2 G13
AVDD_DDR_3 H13
AVDD_DDR_4 H14
AVDD_DDR_5 H15
AVDD_DDR_6 H16
AVDD_DDR_7 W14
AVDD_DDR_8 W15
AVDD_DDR_9 W16
AVDD_DDR_10 W17
AVDD_DDR_11 W18
AVDD_MEMPLL_1 H17
AVDD_MEMPLL_2 T20
AVDD_MEMPLL_3 V20
AVDD_LPLL R20
AVDD_MPLL H7
AVDD_33_1 J7
AVDD_33_2 K7
AVDD_33_3 L7
AVDD_33_4 M7
AVDD_33_5 N7
AVDD_DM W8
AVDD_USB H8
GND_2
E16
GND_3
E17
GND_4
E18
GND_5
F7
GND_6
L9
GND_7
L10
GND_8
L11
GND_9
L12
GND_10
L13
GND_11
L14
GND_12
L15
GND_13
L16
GND_14
L17
GND_15
L18
GND_16
M9
GND_17
M10
GND_18
M11
GND_19
M12
GND_20
M13
GND_21
M14
GND_22
M15
GND_23
M16
GND_24
M17
GND_25
M18
GND_26
N4
GND_27
N9
GND_28
N10
GND_29
N11
GND_30
N12
GND_31
N13
GND_32
N14
GND_33
N15
GND_34
N16
GND_35
N17
GND_36
N18
GND_37
P4
GND_38
P9
GND_39
P10
GND_40
P11
GND_41
P12
GND_42
P13
GND_43
P14
GND_44
P15
GND_45
P16
GND_46
P17
GND_47
P18
GND_48
R4
GND_49
R9
GND_50
R10
GND_51
R11
GND_52
R12
GND_53
R13
GND_54
R14
GND_55
R15
GND_56
R16
GND_57
R17
GND_58
R18
GND_59
T5
GND_60
T9
GND_61
T10
GND_62
T11
GND_63
T12
GND_64
T13
GND_65
T14
GND_66
T15
GND_67
T16
GND_68
T17
GND_69
T18
GND_70
U5
GND_71
W13
GND_72
Y21
GND_73
AA23
+3.3V_AVDD_MPLL
L207
BLM18PG121SN1D
C295
0.1uF
16V
+3.3V
R206 0
OPT
R200 0
OPT
Close to IC
as close as possible
HDMI
DSUB
CVBS
TV/MNT
COMP
AUDIO IN
LVDS OUT
AUDIO OUT
VDDC : 970mA
VDDP : 102.3mA
AVDD_AU : 36.11mA
AVDD_MEMPLL : 23.77mA
AVDD_LPLL : 4.69mA
AVDD_33 : 281mA
AVDD_DM : 0.03mA
AVDD_OTG : 22.96mA
2 12
MSTAR_2
EAX62121501 2010.03.10
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR2
SDDR_A[12]
SDDR_A[11]
SDDR_A[10]
SDDR_A[9]
SDDR_A[0]
SDDR_A[1]
SDDR_A[2]
SDDR_A[3]
SDDR_A[4]
SDDR_A[5]
SDDR_A[6]
SDDR_A[7]
SDDR_A[8]
SDDR_A[1]
SDDR_A[10]
SDDR_A[12]
SDDR_A[7]
SDDR_A[0]
SDDR_A[2]
SDDR_A[4]
SDDR_A[6]
SDDR_A[11]
SDDR_A[8]
TDDR_A[4]
TDDR_A[11]
TDDR_A[3]
TDDR_A[10]
TDDR_A[12]
TDDR_A[2]
TDDR_A[5]
TDDR_A[8]
TDDR_A[1]
TDDR_A[0-12]
TDDR_A[1]
TDDR_A[4]
TDDR_A[3]
TDDR_A[11]
TDDR_A[5]
TDDR_A[12] TDDR_A[6]
TDDR_A[2]TDDR_A[10]
TDDR_A[0]
TDDR_A[8]
TDDR_A[9]
TDDR_A[7]
TDDR_A[0]
TDDR_A[6]
TDDR_A[9]
SDDR_D[10]
SDDR_D[11]
SDDR_D[12]
SDDR_D[10]
SDDR_D[8]
SDDR_D[3]
SDDR_D[8]
SDDR_D[1]
SDDR_D[9]
SDDR_D[4]
SDDR_D[3]
SDDR_D[5]
SDDR_D[1]
SDDR_D[6]
SDDR_D[2]
SDDR_D[4]
SDDR_D[14]
SDDR_D[15]
SDDR_D[6]
SDDR_D[9]
SDDR_D[7]
SDDR_D[0]
SDDR_D[13]
SDDR_D[5]
SDDR_D[2]
SDDR_D[0]
SDDR_D[12]
SDDR_D[13]
SDDR_D[14]
SDDR_D[15]
SDDR_D[7]
SDDR_D[11]
TDDR_D[2]
TDDR_D[6]
TDDR_D[1]
TDDR_D[5]
TDDR_D[11]
TDDR_D[3]
TDDR_D[7]
TDDR_D[4]
TDDR_D[9]
TDDR_D[1]
TDDR_D[8]
TDDR_D[3]
TDDR_D[8]
TDDR_D[10]
TDDR_D[12]
TDDR_D[11]
TDDR_D[15]
TDDR_D[10]
TDDR_D[14]
TDDR_D[13]
TDDR_D[12]
TDDR_D[0]
TDDR_D[2]
TDDR_D[5]
TDDR_D[13]
TDDR_D[0]
TDDR_D[7]
TDDR_D[9]
TDDR_D[6]
TDDR_D[15]
TDDR_D[14]
TDDR_D[4]
SDDR_BA[0]
SDDR_BA[1]
ADDR2_BA[2]
/ADDR2_MCLK
SDDR_CKE ADDR2_CKE
/SDDR_CK
SDDR_CK
/SDDR_RAS
/SDDR_CAS
/SDDR_WE
SDDR_DQS1_P
SDDR_DQS0_P
SDDR_DQM1_P
SDDR_DQM0_P
SDDR_DQS1_N
SDDR_DQS0_N
/ADDR2_RAS
ADDR2_ODT
/ADDR2_CAS
/ADDR2_WE
ADDR2_DQS1_P
ADDR2_DQS0_P
ADDR2_DQM1_P
ADDR2_DQM0_P
ADDR2_DQS0_N
ADDR2_DQS1_N
BDDR2_DQM0_P
BDDR2_DQS1_P
BDDR2_ODT
BDDR2_DQS0_N
TDDR_CKE
TDDR_MCLK
BDDR2_DQS0_P
BDDR2_MCLK
/TDDR_MCLK
TDDR_DQM1_P
BDDR2_DQS1_N
BDDR2_DQM1_P
/TDDR_CAS
BDDR2_BA[2]
TDDR_BA[1]
/TDDR_WE
TDDR_DQS1_P
TDDR_BA[0]
TDDR_DQS1_N
TDDR_DQS0_P
BDDR2_BA[0]
/TDDR_RAS
BDDR2_BA[1]
TDDR_DQM0_P
/BDDR2_MCLK
TDDR_DQS0_N
SDDR_A[3]
SDDR_A[0-12]
ADDR2_A[0-12]
ADDR2_A[0]
ADDR2_A[1]
ADDR2_A[3]
ADDR2_A[2]
ADDR2_A[5]
ADDR2_A[7]
ADDR2_A[6]
ADDR2_A[4]
ADDR2_A[9]
ADDR2_A[8]
ADDR2_A[10]
ADDR2_A[11]
ADDR2_A[12]
ADDR2_A[3]
ADDR2_A[1]
ADDR2_A[10]
ADDR2_A[9]
ADDR2_A[12]
ADDR2_A[7]
ADDR2_A[0]
ADDR2_A[2]
ADDR2_A[4]
ADDR2_A[6]
ADDR2_A[11]
ADDR2_A[8]
ADDR2_BA[0]
ADDR2_BA[1]
ADDR2_MCLK
BDDR2_A[0-12]
BDDR2_A[0]
BDDR2_A[1]
BDDR2_A[2]
BDDR2_A[3]
BDDR2_A[4]
BDDR2_A[5]
BDDR2_A[6]
BDDR2_A[7]
BDDR2_A[8]
BDDR2_A[9]
BDDR2_A[10]
BDDR2_A[11]
BDDR2_A[12]
BDDR2_A[9]
BDDR2_A[3]
BDDR2_A[1]
BDDR2_A[10]
BDDR2_A[5]
BDDR2_A[12]
BDDR2_A[0]
BDDR2_A[2]
BDDR2_A[4]
BDDR2_A[6]
BDDR2_A[11]
BDDR2_A[8]
BDDR2_CKE
/BDDR2_RAS
/BDDR2_CAS
/BDDR2_WE
ADDR2_D[0-15]
ADDR2_D[0]
ADDR2_D[1]
ADDR2_D[3]
ADDR2_D[2]
ADDR2_D[5]
ADDR2_D[4]
ADDR2_D[6]
ADDR2_D[7]
ADDR2_D[12]
ADDR2_D[9]
ADDR2_D[8]
ADDR2_D[14]
ADDR2_D[10]
ADDR2_D[15]
ADDR2_D[11]
ADDR2_D[13]
ADDR2_D[11]
ADDR2_D[12]
ADDR2_D[4]
ADDR2_D[3]
ADDR2_D[1]
ADDR2_D[6]
ADDR2_D[9]
ADDR2_D[14]
ADDR2_D[15]
ADDR2_D[13]
ADDR2_D[10]
ADDR2_D[8]
ADDR2_D[5]
ADDR2_D[7]
ADDR2_D[2]
ADDR2_D[0]
SDDR_D[0-15]
BDDR2_D[0-15]
BDDR2_D[0]
BDDR2_D[1]
BDDR2_D[2]
BDDR2_D[3]
BDDR2_D[6]
BDDR2_D[4]
BDDR2_D[7]
BDDR2_D[5]
BDDR2_D[10]
BDDR2_D[8]
BDDR2_D[12]
BDDR2_D[14]
BDDR2_D[15]
BDDR2_D[11]
BDDR2_D[9]
BDDR2_D[13]
BDDR2_D[11]
BDDR2_D[12]
BDDR2_D[14]
BDDR2_D[9]
BDDR2_D[13]
BDDR2_D[10]
BDDR2_D[8]
BDDR2_D[15]
BDDR2_D[4]
BDDR2_D[3]
BDDR2_D[1]
BDDR2_D[6]
BDDR2_D[7]
BDDR2_D[5]
BDDR2_D[0]
BDDR2_D[2]
TDDR_D[0-15]
SDDR_A[9]
SDDR_A[5] ADDR2_A[5]
BDDR2_A[7] TDDR_A[7]
SDDR_ODT
TDDR_BA[2]
SDDR_BA[2]
+1.8V_DDR +1.8V_DDR
+1.8V_DDR +1.8V_DDR
+1.8V_DDR
+1.8V_DDR
+1.8V_DDR
AR300
56
AR301
56
AR302
56
AR303
56
AR305
56
AR304
56
AR306
56
AR308
56
AR307
56
AR309
56
AR310
56
AR312
56
AR311
56
AR313
56
R30622
R30722
R300
150
OPT
R344
150
OPT
R331 22
R330 22
+1.8V_DDR
+1.8V_DDR
+1.8V_DDR
+1.8V_DDR
C324
10uF
C303
10uF
IC301
H5PS5162FFR-S6C
J2
VREF
J8
CK
H2 VSSQ2
B7
UDQS
N8
A4
P8
A8
L1
NC4
L2
BA0
R8
NC3
K7
RAS
F8 VSSQ3
F3
LDM
P3
A9
M3
A1
N3
A5
K8
CK
R3
NC5
L3
BA1
J7
VSSDL
L7
CAS
F2 VSSQ4
B3
UDM
M2
A10/AP
K2
CKE
R7
NC6
M7
A2
N7
A6
M8
A0
J1
VDDL
K3
WE
E8
LDQS
P7
A11
K9
ODT
A2
NC1
N2
A3
P2
A7
H8 VSSQ1
F7
LDQS
A8
UDQS
R2
A12
L8
CS
E2
NC2
E7 VSSQ5
D8 VSSQ6
D2 VSSQ7
A7 VSSQ8
B8 VSSQ9
B2 VSSQ10
P9 VSS1
N1 VSS2
J3 VSS3
E3 VSS4
A3 VSS5
G9 VDDQ1
G7 VDDQ2
G3 VDDQ3
G1 VDDQ4
E9 VDDQ5
C9 VDDQ6
C7 VDDQ7
C3 VDDQ8
C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J9 VDD3
E1 VDD4
A1 VDD5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
IC300
HY5PS1G1631CFP-S6
J2 VREF
J8 CK
H2
VSSQ2
B7 UDQS
N8 A4
P8 A8
L1 BA2
L2 BA0
R8 NC3
K7 RAS
F8
VSSQ3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC5
L3 BA1
J7 VSSDL
L7 CAS
F2
VSSQ4
B3 UDM
M2 A10/AP
K2 CKE
R7 NC6
M7 A2
N7 A6
M8 A0
J1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC1
N2 A3
P2 A7
H8
VSSQ1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC2
E7
VSSQ5 D8
VSSQ6 D2
VSSQ7 A7
VSSQ8 B8
VSSQ9 B2
VSSQ10
P9
VSS1 N1
VSS2 J3
VSS3 E3
VSS4 A3
VSS5
G9
VDDQ1 G7
VDDQ2 G3
VDDQ3 G1
VDDQ4 E9
VDDQ5 C9
VDDQ6 C7
VDDQ7 C3
VDDQ8 C1
VDDQ9 A9
VDDQ10
R1
VDD1 M9
VDD2 J9
VDD3 E1
VDD4 A1
VDD5
B9
DQ15 B1
DQ14 D9
DQ13 D1
DQ12 D3
DQ11 D7
DQ10 C2
DQ9 C8
DQ8 F9
DQ7 F1
DQ6 H9
DQ5 H1
DQ4 H3
DQ3 H7
DQ2 G2
DQ1 G8
DQ0
R351
0
R350
0
OPT
C306
0.1uF
C337
0.1uF
C320
0.1uF
C326
0.1uF
C340
0.1uF
C338
0.1uF
C331
0.1uF
C329
0.1uF
C334
0.1uF
C336
0.1uF
C341
0.1uF
C327
0.1uF
C319
0.1uF
C310
0.1uF
C342
0.1uF
C316
0.1uF
C323
0.1uF
C330
0.1uF
C305
0.1uF
C317
0.1uF
C332
0.1uF
C314
0.1uF
C302
0.1uF
C339
0.1uF
C308
0.1uF
C318
0.1uF
C307
0.1uF
C304
0.1uF
C328
0.1uF
C315
0.1uF
C313
0.1uF
C312
0.1uF
C325
0.1uF
C333
0.1uF
C301 0.1uF
C300 0.1uF
C335
0.1uF
C311
0.1uF
C309 0.1uF
R345
1K
1%
R343
1K
1%
R321
1K 1%
R322
1K 1%
R301
1K 1%R302 1K 1%
R348 4.7K
OPT
R347 4.7K
OPT
R346 4.7K
OPT
R349 4.7K
OPT
R336 56
R320 56
R319 56
R31756
R31556
R31056 R334 56
R31356
R333 56
R31856
R327 56
R30856
R30956
R339 56
R31156
R340 56
R31256
R332 56
R329 56
OPT
R30556
R30356
R341 56
R31456 R338 56
R30456
R325 56
R337 56
R335 56
R326 56
R342 56
R328 56
R31656
IC100
LGE3369A (SATURN6 NON RM)
B_DDR2_A0 T26
B_DDR2_A1 AF26
B_DDR2_A2 T25
B_DDR2_A3 AF23
B_DDR2_A4 T24
B_DDR2_A5 AE23
B_DDR2_A6 R26
B_DDR2_A7 AD22
B_DDR2_A8 R25
B_DDR2_A9 AC22
B_DDR2_A10 AD23
B_DDR2_A11 R24
B_DDR2_A12 AE22
B_DDR2_BA0 AC23
B_DDR2_BA1 AC24
B_DDR2_BA2 AB22
B_DDR2_MCLK V25
/B_DDR2_MCLK V24
B_DDR2_CKE AB23
B_DDR2_ODT U26
/B_DDR2_RAS U25
/B_DDR2_CAS U24
/B_DDR2_WE AB24
B_DDR2_DQS0 AB26
B_DDR2_DQS1 AA26
B_DDR2_DQM0 AC25
B_DDR2_DQM1 AC26
B_DDR2_DQSB0 AB25
B_DDR2_DQSB1 AA25
B_DDR2_DQ0 W25
B_DDR2_DQ1 AE26
B_DDR2_DQ2 W24
B_DDR2_DQ3 AF24
B_DDR2_DQ4 AF25
B_DDR2_DQ5 V26
B_DDR2_DQ6 AE25
B_DDR2_DQ7 W26
B_DDR2_DQ8 Y26
B_DDR2_DQ9 AD25
B_DDR2_DQ10 Y25
B_DDR2_DQ11 AE24
B_DDR2_DQ12 AD26
B_DDR2_DQ13 Y24
B_DDR2_DQ14 AD24
B_DDR2_DQ15 AA24
A_MVREF
D15
A_DDR2_A0
C13
A_DDR2_A1
A22
A_DDR2_A2
B13
A_DDR2_A3
C22
A_DDR2_A4
A13
A_DDR2_A5
A23
A_DDR2_A6
C12
A_DDR2_A7
B23
A_DDR2_A8
B12
A_DDR2_A9
C23
A_DDR2_A10
B22
A_DDR2_A11
A12
A_DDR2_A12
A24
A_DDR2_BA0
C24
A_DDR2_BA1
B24
A_DDR2_BA2
D24
A_DDR2_MCLK
B14
/A_DDR2_MCLK
A14
A_DDR2_CKE
D23
A_DDR2_ODT
D14
/A_DDR2_RAS
D13
/A_DDR2_CAS
D12
/A_DDR2_WE
D22
A_DDR2_DQS0
B18
A_DDR2_DQS1
C17
A_DDR2_DQM0
C18
A_DDR2_DQM1
A19
A_DDR2_DQSB0
A18
A_DDR2_DQSB1
B17
A_DDR2_DQ0
B15
A_DDR2_DQ1
A21
A_DDR2_DQ2
A15
A_DDR2_DQ3
B21
A_DDR2_DQ4
C21
A_DDR2_DQ5
C14
A_DDR2_DQ6
C20
A_DDR2_DQ7
C15
A_DDR2_DQ8
C16
A_DDR2_DQ9
C19
A_DDR2_DQ10
B16
A_DDR2_DQ11
B20
A_DDR2_DQ12
A20
A_DDR2_DQ13
A16
A_DDR2_DQ14
B19
A_DDR2_DQ15
A17
DDR2 1.8V By CAP - Place these Caps near Memory
3 12
DDR2
Close to DDR Power Pin Close to DDR Power Pin
EAX62121501 2010.03.10
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

Fiber Optic
USB DOWN STREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INTERFACE
DSUB_B
ISP_RXD
PC_L_IN
IC403
MAX3232CDR
3
C1-
2
V+
4
C2+
1
C1+
6
V-
5
C2-
7
DOUT2
8
RIN2 9ROUT2
10 DIN2
11 DIN1
12 ROUT1
13 RIN1
14 DOUT1
15 GND
16 VCC
DSUB_G
COMP_R_IN
DSUB_R
COMP_Pr
COMP_DET
ISP_TXD
+5V_ST
+5V_ST
COMP_Y
+3.3V
JK401
PEJ024-01
6B T_TERMINAL2
8SHIELD_PLATE
7B B_TERMINAL2
5T_SPRING
4R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3E_SPRING
COMP_L_IN
PC_R_IN
DSUB_HSYNC
DSUB_VSYNC
DSUB_DET
COMP_Pb
+3.3V
EDID_WP
R412
10K R416
100
D400
ENKMC2838-T112
A1
C
A2
+5V_ST
C402
18pF
50V
C401
18pF
50V
+5V_GENERAL
+5V_GENERAL
JK403
JST1223-001
1
GND
2
VCC
3
VINPUT
4
FIX_POLE
SIDE_USB_DP
SIDE_USB_DM
D425
5.6V
CDS3C05HDMI1
26~52"
D426
5.6V
CDS3C05HDMI1
26~52"
IC400
CAT24C02WI-GT3
3
A2
2
A1
4
VSS
1
A0
5SDA
6SCL
7WP
8VCC
D408
30V
AMOTECH
D409
30V
AMOTECH
D413
30V D414
30V
ADUC30S03010L_AMODIODE
D415
30V
ADUC30S03010L_AMODIODE
D416
30V
ADUC30S03010L_AMODIODE
D417
30V
ADUC30S03010L_AMODIODE
D423
30V
OPT
D424
30V
OPT
D407
30V
AMOTECH
D410
5.6V
AMOTECH
D411
5.6V
AMOTECH
D412
5.6V
AMOTECH
D418
5.6V
ADMC5M03200L_AMODIODE
OPT
D419
5.6V
ADMC5M03200L_AMODIODE
OPT
D420
5.6V
ADMC5M03200L_AMODIODE
OPT
D421
5.6V
OPT
AMOTECH
D422
5.6V
OPT
AMOTECH
ZD403
AMOTECH
OPT
JK405
KJA-UB-4-0004
26~52"
1234
5
R461 0
C407
10uF
OPT
USB_CTL
+5V_USB
USB_OCD
C403
0.1uF
R458
6.2K R457
6.2K
R456
0
R419
0
R435
0
R436
0
R455
0
R446
0
OPT
R440 0
R437 0
C430
0.047uF
25V
C431
0.1uF
16V
C405
0.1uF
C406
0.1uF
16V
C400
0.1uF
16V
C429
0.33uF
16V
C428
0.33uF
16V
C425
0.33uF
16V
R459
100
R460
100
C415
1000pF
50V
C417
1000pF
50V
C422
100pF
50V
C424
100pF
50V
R420
10K
R431
10K
R432
10K
R433
12K
R434
12K R448
1K
R462
1K
OPT
R425
1K
R444
22 R445
22
C427
220pF
50V
C426
220pF
50V
R418
4.7K
R447
4.7K
R403
47
R450
470K
R429
470K
R430
470K
R449
470K
C419
OPT
C420
OPT
C418
OPT
R452
15K
R451
15K
R454
10K
R453
10K
JK400
PPJ229-01
4A [GN]CONTACT
2A [GN]1P_CAN
3A [GN]O_SPRING
2B [BL]1P_CAN
5B [BL]C_LUG_L
2C [RD]1P_CAN1
5C [RD]C_LUG_L
2D [WH]1P_CAN
5D [WH]C_LUG_L
2E [RD]1P_CAN2
4E [RD]CONTACT
3E [RD]O_SPRING
IC402
MP6211DH
3IN_2
2IN_1
4EN
1GND
5
FLAG
6
OUT_1
7
OUT_2
8
OUT_3
R406
4.7K
R404
4.7K
R427
75
1%
R426
75
1%
R428
75
1%
R441
75
1%
R442
75
1%
R443
75
1%
+5V_GENERAL
SPDIF_OUT
R407
22
1/10W
1%
IC401
NL17SZ00DFT2G
3
GND
2
B
4Y
1
A5VCC
R402
4.7K
C408
0.1uF
16V
R405 0
OPT
P400
SPG07150941-1
1RED
2GREEN
3BLUE
4GND_1
5DDC_GND
6RED_GND
7GREEN_GND
8BLUE_GND
9NC
10 SYNC_GND
11 GND_2
12 DDC_DATA
13 H_SYNC
14 V_SYNC
15 DDC_CLOCK
16 SHILED
P401
SPG07150941
1
2
3
4
5
6
7
8
9
10
IC404
NLASB3157DFT2G
EAN38256201
ANALOG SWITCH
ON SEMICONDUCTOR
3B0
2GND
4
A
1B1
6
SELECT
5
VCC
C433
0.1uF
IC405
NLASB3157DFT2G
EAN38256201
ANALOG SWITCH
ON SEMICONDUCTOR
3B0
2GND
4
A
1B1
6
SELECT
5
VCC
R469
0
OPT
UART_RX
+5V_ST
UART_DBG_SW
C410
1uF
10V
OPT
C409
1uF
10V
OPT
JK406
PEJ024-01
6B T_TERMINAL2
8SHIELD_PLATE
7B B_TERMINAL2
5T_SPRING
4R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3E_SPRING
JK407
PEJ024-01
6B T_TERMINAL2
8 SHIELD_PLATE
7B B_TERMINAL2
5 T_SPRING
4 R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3E_SPRING
EXT_OUT_R
IR_OUT_RS232C
EXT_OUT_L
EXT_5V
EXT_12V
R483
0
EXT_12V_9P
R484
0
EXT_5V_7P
R485
0
OPT
R467
100
UART_TX
NEC_DBG_RX
MST_DBG_TX
NEC_DBG_TX
C416
0.1uF
+5V_ST
IC410
NLASB3157DFT2G
EAN38256201
ANALOG SWITCH
ON SEMICONDUCTOR
3B0
2GND
4
A
1B1
6
SELECT
5
VCC
UART_SW1
IC411
NLASB3157DFT2G
EAN38256201
ANALOG SWITCH
ON SEMICONDUCTOR
3B0
2GND
4
A
1B1
6
SELECT
5
VCC
R464
100
NEC_TX
RS232_MST_TX
RS232_MST_RX
NEC_RX
R463
4.7K
+3.3V
BSS83
Q402
S
B
D
G
R438
4.7K
+5V_ST
EXT_VOL+
DBG_SW
R400
100
IC409
NLASB3157DFT2G
EAN38256201
ANALOG SWITCH
ON SEMICONDUCTOR
3B0
2GND
4
A
1B1
6
SELECT
5
VCC
IC408
NLASB3157DFT2G
EAN38256201
ANALOG SWITCH
ON SEMICONDUCTOR
3B0
2GND
4
A
1B1
6
SELECT
5
VCC
+5V_ST
C404
0.1uF
EXT_VOL-
R414
6.8K
R422
6.8K
+5V_ST
+5V_ST
UART_SW2
UART_TX
NEC_RX
C498
0.1uF
+5V_ST
RS232_MST_RX
NEC_TX
RS232_MST_TX
UART_RX
IC412
NLASB3157DFT2G
EAN38256201
ANALOG SWITCH
ON SEMICONDUCTOR
3B0
2GND
4
A
1B1
6
SELECT
5
VCC
IC413
NLASB3157DFT2G
EAN38256201
ANALOG SWITCH
ON SEMICONDUCTOR
3B0
2GND
4
A
1B1
6
SELECT
5
VCC
R497
100
R495
100
R491
100
MST_DBG_RX
L1402
R492
0
R465
1K
R439
47K
OPT
D403
50V
BAP70-02 R417
0
R408
0
R413
3.6K
R421
3.6K
BOX_5V
RJP_CTRL_1
R410
10K
RJP_CTRL_3
+5V_GENERAL
R411
10K
RJP_DET
JK409
MJ-657PT-8-SD
1
2
3
4
5
6
7
8
9
RJP_CTRL_0
R409
10K
+12V_RJP
R401
10K
RJP_CTRL_2
COMPONENT
PC AUDIO
RS232C
4 12
INTERFACE
PC - RGB
SPDIF OPTIC JACK
USB
L
H
SELECT CONNECTION
B0 - A
B1 - A
EXT_SPEAKER
EXT_SPK_CONTROL/DEBUG UART SWITCH
EAX62121501
RJP
2010.03.10
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PCMCIA
IC502
74LVC541A(PW)
BUFFER
3
A1
2
A0
4
A2
1
OE1
6
A4
5
A3
7
A5
8
A6
9
A7
10
GND 11 Y7
12 Y6
13 Y5
14 Y4
15 Y3
16 Y2
17 Y1
18 Y0
19 OE2
20 VCC
+3.3V_CI
FE_TS_CLK
FE_TS_VAL_ERR
FE_TS_SYN
BUF_TS_CLK
BUF_TS_VAL_ERR
BUF_TS_SYN
BUF_TS_DATA[0]
FE_TS_DATA[0]
C512
0.1uF
R522
10K
R523
10K
R526
47
R528
47
R527
47
R525
47
C513
22pF
50V
MDS61887701
M1
MDS61887701
M2
MDS61887701
M3
MDS61887701
M4
DVB-CI SERIAL BUFFER TS
5 12
PCMCIA
EAX62121501 2010.03.10
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
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