LG EzSign 42LD452B User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LA01Z
MODEL : 42LD452B 42LD452B-UA
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL66679907 (1105-REV00)

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 2 -
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SPECIFICATION....................................................................................... 6
ADJUSTMENT INSTRUCTION............................................................... 11
EXPLODED VIEW .................................................................................. 17
SVC. SHEET ...............................................................................................

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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Only for training and service purposes - 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Application range
This spec sheet is applied all of the 37”, 42”, 47” LCD TV with
LA01Z chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25±5ºC, (77°±9ºF), CST: 40±5°C
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
No Item Specification Remark
1 Receivable System 1) ATSC / NTSC-M
2 Available Channel VHF : 02 ~ 13
UHF : 14 ~ 69
DTV : 02 ~ 69
CATV : 01 ~ 135
CADTV : 01 ~ 135
3 Input Voltage 1) AC 100 ~ 240V 50/60Hz
4 Market North America
5 Screen Size 47 inch Wide FHD
42 inch Wide FHD
37 inch Wide FHD
6 Aspect Ratio 16:9
7 Tuning System FS
8 LCD Module LC470WUG-SCA1 LGD
LC420WUG-SCA1 LGD
V420H2-L02 CMO
T420HW06-V0 AUO
T370HW03-VB AUO
LC370WUG-SCA1 LGD
9 Operating Environment Temp : 0 ~ 40 deg
Humidity : ~ 80 %
10 Storage Environment Temp : -20 ~ 60 deg
Humidity : -85 %

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Only for training and service purposes
5. Chrominance & Luminance
5.1. 42LD450C-UA-LC420WUG-SCA1 (LGD)
No. Item Min Typ Max Unit Remarks
1 Max Luminance
300 350 cd/m2
(Center 1-point / Full White Pattern)
2 Luminance uniformity 1.3 5point
3 Color coordinate RED X Typ. 0.636 Typ.
(Default) Y -0.03 0.335 +0.03
GREEN X 0.291
Y 0.603
BLUE X 0.146
Y 0.061
WHITE X 0.279
Y 0.292
4 Contrast ratio 1100 1500
6 Color Temperature Cool Typ. 0.269 Typ. The W/B Tolerance is
-0.015 0.273 +0.015 ±0.015 for Adjustment
Medium Typ. 0.285 Typ.
-0.015 0.293 +0.015
Warm Typ. 0.313 Typ.
-0.015 0.329 +0.015
No. Item Min Typ Max Unit Remarks
1 Max Luminance
400 500 cd/m2
(Center 1-point / Full White Pattern)
2 Luminance uniformity 1.3 5point
3 Color coordinate RED X Typ. 0.639 Typ.
(Default) Y -0.03 0.334 +0.03
GREEN X 0.290
Y 0.606
BLUE X 0.146
Y 0.061
WHITE X 0.279
Y 0.292
4 Contrast ratio 1200 1500
6 Color Temperature Cool Typ. 0.269 Typ. The W/B Tolerance is
-0.015 0.273 +0.015 ±0.015 for Adjustment
Medium Typ. 0.285 Typ.
-0.015 0.293 +0.015
Warm Typ. 0.313 Typ.
-0.015 0.329 +0.015
5.2. 42LD450C-UA-V420H2-L02 (CMO)

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Only for training and service purposes
No. Item Min Typ Max Unit Remarks
1 Max Luminance
360 450 cd/m2
(Center 1-point / Full White Pattern)
2 Luminance uniformity 1.3 5point
3 Color coordinate RED X Typ. 0.640 Typ.
(Default) Y -0.03 0.330 +0.03
GREEN X 0.281
Y 0.590
BLUE X 0.144
Y 0.060
WHITE X 0.280
Y 0.290
4 Contrast ratio 3200 4000
6 Color Temperature Cool Typ. 0.269 Typ. The W/B Tolerance is
-0.015 0.273 +0.015 ±0.015 for Adjustment
Medium Typ. 0.285 Typ.
-0.015 0.293 +0.015
Warm Typ. 0.313 Typ.
-0.015 0.329 +0.015
5.3. 42LD450C-UA-T420HW06-V0 (AUO)

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Only for training and service purposes
6. Component Video Input (Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.50 60 27.027 SDTV
4. 720*480 31.47 59.94 27.0 SDTV
5. 1280*720 45.00 60.00 74.25 HDTV
6. 1280*720 44.96 59.94 74.176 HDTV
7. 1920*1080 33.75 60.00 74.25 HDTV
8. 1920*1080 33.72 59.94 74.176 HDTV
9. 1920*1080 67.500 60 148.50 HDTV
10. 1920*1080 67.432 59.94 148.352 HDTV
11. 1920*1080 27.000 24.000 74.25 HDTV
12. 1920*1080 26.97 23.976 74.176 HDTV
13. 1920*1080 33.75 30.000 74.25 HDTV
14. 1920*1080 33.71 29.97 74.176 HDTV
7. RGB Input (PC)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
PC DDC
1. 640*350 31.468 70.09 25.17 EGA X
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4 . 800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1280*768 47.776 59.87 79.50 CVT(WXGA) X
7. 1360*768 47.712 60.015 85.50 VESA(WXGA) X
8. 1280*1024 63.981 60.020 108.00 VESA(SXGA) O
9. 1600*1200 75.00 60.00 162 VESA(UXGA) O
10. 1920*1080 66.587 59.934 148.5 HDTV 1080P O

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8. HDMI input (PC/DTV)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
PC DDC
1. 640*350 31.468 70.09 25.17 EGA X
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4 . 800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1280*768 47.776 59.870 79.50 CVT(WXGA) X
7. 1360*768 47.712 60.015 85.50 VESA(WXGA) X
8. 1280*1024 63.981 60.020 108.00 VESA(SXGA) O
9. 1600*1200 75.00 60.00 162 VESA(UXGA) O
10. 1920*1080 67.5 60 148.5 HDTV 1080P O
DTV
1 720*480 31.5 60 27.027 SDTV 480P
2 720*480 31.47 59.94 27.00 SDTV 480P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 44.96 59.94 74.176 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I
6 1920*1080 33.72 59.94 74.176 HDTV 1080I
7 1920*1080 67.500 60 148.50 HDTV 1080P
8 1920*1080 67.432 59.939 148.352 HDTV 1080P
9 1920*1080 27.000 24.000 74.25 HDTV 1080P
10 1920*1080 26.97 23.976 74.176 HDTV 1080P
11 1920*1080 33.75 30.000 74.25 HDTV 1080P
12 1920*1080 33.71 29.97 74.176 HDTV 1080P

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ADJUSTMENT INSTRUCTION
1. Application range
This spec. sheet applies to LA01Z Chassis applied LCD TV all
models manufactured in TV factory
2. Specification
2.1 Because this is not a hot chassis, it is not necessary
to use an isolation transformer. However, the use of
isolation transformer will help protect test instrument.
2.2 AdjThe adjustment must be performed in the
circumstance of 25 ±5 C of temperature and
65±10% of relative humidity if there is no specific
designation.
2.4 The input voltage of the receiver must keep
100~240V, 50/60Hz.
2.5 The receiver must be operated for about 5 minutes
prior to the adjustment when module is in the
circumstance of over 15
In case of keeping module is in the circumstance of
0°C, it should be placed in the circumstance of above
15°C for 2 hours
In case of keeping module is in the circumstance of
below -20°C, it should be placed in the circumstance of
above 15°C for 3 hours,.
Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
3. Adjustment items
3.1 Board Level Adjustment
•Adjust 480i Comp1(ADC)
•EDID/DDC download
Above adjustment items can be also performed in Final
Assembly if needed. Both Board-level and Final assembly
adjustment items can be check using In-Star Menu 1.ADJUST
CHECK. Component 1080p and RGB-PC Adjust will be
calculated by 480i adjust value.
3.2 Final assembly adjustment
•White Balance adjustment
•RS-232C functionality check
•Factory Option setting per destination
•Ship-out mode setting (In-Stop)
3.3 Etc
•Ship-out mode
•Service Option Default
•USB Download(S/W Update, Option, Service only)
•ISP Download (Optional)
4. Automatic Adjustment
4.1. ADC Adjustment
(1) Overview
ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate
RGB deviation.
(2) Equipment & Condition
1) Jig (RS-232C protocol)
2) MSPG-925 Series Pattern Generator(MSPG-925FA)
- Resolution : 480i Comp1 (MSPG-925FA: model-209,
pattern-65)
- Resolution : 1024*768 RGB (Inner Pattern)
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level : 0.7±0.1 Vp-p
(3) Adjustment
1) Adjustment method
- Using RS-232, adjust items listed in 3.1 in the other
shown in “4.1.3.3”
2) Adj. protocol
Ref.) ADC Adj. RS232C Protocol_Ver1.0
3) Adj. order
- aa 00 00 [Enter ADC adj. mode]
- xb 00 40 [Change input source to Component1(480i)]
- ad 00 10 [Adjust 480i Comp1]
- xb 00 60 [Change input source to RGB(1024*768)]
- ad 00 10 [Adjust 1024*768 RGB]
- ad 00 90 End adj.
Protocol Command Set ACK
Enter adj. mode aa 00 00 a 00 OK00x
Source change xb 00 40 b 00 OK40x (Adjust 480i Comp1 )
xb 00 60 b 00 OK60x (Adjust 1024*768 RGB)
Begin adj. ad 00 10
Return adj. result OKx (Case of Success)
NGx (Case of Fail)
Read adj. data (main) (main)
ad 00 20 000000000000000000000000007c007b006dx
(sub) (Sub)
ad 00 21 000000070000000000000000007c00830077x
Confirm adj. ad 00 99 NG 03 00x (Fail)
NG 03 01x (Fail)
NG 03 02x (Fail)
OK 03 03x (Success)
End adj. aa 00 90 a 00 OK90x

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Only for training and service purposes
5. Manual Adjustment
5.1. ADC Adjustment
(1) Overview
ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate
RGB deviation.
(2) Equipment & Condition
1) Adjust Remocon
2) 801GF(802B, 802F, 802R) or MSPG925FA Pattern
Generator
- Resolution: 480i Comp1(MSPG-925FA: Model-209,
Pattern-65)
- Resolution: 1024*768 RGB(Inner Pattern)
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level: 0.7±0.1 Vp-p
- Image
3) Must use standard cable
(3) Adjust method
• ADC 480i/1080p Comp1, RGB
1) Check connected condition of Comp1 cable to the
equipment
2) Give a 480i Mode, Horizontal 100% Color Bar Pattern
to Comp1.
(MSPG-925FA -> Model: 209, Pattern: 65)
3) Change input mode as Component1 and picture mode
as “Standard”
4) Press the In-start Key on the ADJ remote after at least
1 min of signal reception. Then, select 5.ADC
Calibration. And Press OK Button on the menu “Start”.
The adjustment will start automatically.
5) If ADC Comp 480i is successful, “ADC Component
Success” is displayed and Comp480i/1080p is
completed.
If ADC calibration is failure, “ADC Component Fail” is
displayed.
6) If ADC calibration is failure, after rechecking ADC
pattern or condition, retry calibration
7) After completing ADC Component, input mode will be
changed to RGB automatically.
8) If ADC calibration is successful, “ADC RGB Success”
is displayed. If ADC calibration is failure, “ADC RGB
Fail” is displayed.
9) If ADC calibration is failure, after recheck ADC pattern
or condition, retry calibration
5.2 EDID/DDC Download
(1) Overview
It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
(2) Equipment
• Adjust remocon.
• Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
(3) Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4)If Download is successful, OK is display, but If
Download is failure, NG is displayed.
5) If Download is failure, Re-try downloads.
•Caution) When EDID Download, must remove RGB/HDMI
Cable.
(4) EDID DATA
1)LD450 Tool(FHD)
• HDMI 1 EDID Table
• HDMI 2 EDID Table

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Only for training and service purposes
• HDMI 3 EDID Table
• HDMI 4 EDID Table
• Analog RGB EDID Table
5.3. White Balance Adjustment
(1) Overview
• W/B adj. Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic
Range. In order to prevent saturation of
Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is
lowered to find the desired value.
- Adj. condition : normal temperature
1) Surrounding Temperature: 25±5ºC
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
(2) Equipment
1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model:217, Pattern:78)
-> Only when internal pattern is not available
• Color Analyzer Matrix should be calibrated using CS-1000
(3) Equipment connection MAP
(4) Adj. Command (Protocol)
1) RS-232C Command used during auto-adj.
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.
wb 00 ff -> End white balance auto adj.
Color Analyzer
Computer
Pattern Generator
RS-232C
RS-232C
RS-232C
Probe
Signal Source
* If TV internal pattern is used, not needed
Connection Diagram of Automatic Adjustment
RS-232C COMMAND Meaning
[CMD ID DATA]
wb 00 00 Begin White Balance adj.
wb 00 ff End White Balance adj.(Internal pattern disappeared)

- 14 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
2) Adjustment Map
Applied Model : 37LD450C-UA, 42LD450C-UA,
47LD450C-UA
(5) Adj. method
•Auto adj. method
1) Set TV in adj. mode using POWER ON key
2) Zero calibrate probe then place it on the center of the
Display
3) Connect Cable(RS-232C)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sing), check adj. status pre
mode (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
* W/B Adj. must begin as start command “wb 00 00”, and
finish as end command “wb 00 ff”, and Adj. offset if
need
•Manual adj. method
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place
it on the center of LCD module within 10cm of the
surface..
3) Press ADJ key -> EZ adjust using adj. R/C > 6. White-
Balance then press the cursor to the right (KEYG).
(When KEY(G) is pressed 216 Gray internal pattern
will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at
192, and the rest will be lowered to meet the desired
value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes
of color temperature.
- If internal pattern is not available, use RF input. In EZ
Adj. menu 6.White Balance, you can select one of 2
Test-pattern: ON, OFF. Default is inner(ON). By
selecting OFF, you can adjust using RF signal in 216
Gray pattern.
* Adj. condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
- LCD: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module
surface (80°~ 100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked
using no signal or Full-white pattern.
(6) Reference (White Balance Adj. coordinate and color
temperature)
•Luminance: 216 Gray
•Standard color coordinate and temperature using CS-
1000
•Standard color coordinate and temperature using CA-210
ITEM Command Data Range Default
(Hex.) (Decimal)
Cmd 1 Cmd 2 Min Max
Cool R-Gain j g 00 C0
G-Gain j h 00 C0
B-Gain j i 00 C0
R-Cut
G-Cut
B-Cut
Medium R-Gain j a 00 C0
G-Gain j b 00 C0
B-Gain j c 00 C0
R-Cut
G-Cut
B-Cut
Warm R-Gain j d 00 C0
G-Gain j e 00 C0
B-Gain j f 00 C0
R-Cut
G-Cut
Mode Color Coordination Temp ∆UV
xy
COOL 0.269 0.273 13000K 0.0000
MEDIUM 0.285 0.293 9300K 0.0000
WARM 0.313 0.329 6500K 0.0000
Mode Color Coordination Temp ∆UV
xy
COOL 0.269±0.002 0.273±0.002 13000K 0.0000
MEDIUM 0.285±0.002 0.293±0.002 9300K 0.0000
WARM 0.313+0.002 0.329±0.002 6500K 0.0000

- 15 -
5.4. HDCP SETTING
- HDCP setting is not necessary in Saturn5 model.
5.5 Option selection per country
(1) Overview
- Option selection is only done for models in Non-USA
North America due to rating
-Applied model: LA92A Chassis applied None USA
model(CANADA, MEXICO)
(2) Method
1) Press ADJ key on the Adj. R/C, then select Country
Group Menu
2) Depending on destination, select KR or US, then on the
lower Country option, select US, CA, MX. Selection is
done using +, - KEY
5.6. Tool Option selection
•Method: Press Adj. key on the Adj. R/C, then select Tool
option.
5.7. Ship-out mode check (In-stop)
•After final inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode.
•After final inspection, Always turn on the Mechanical S/W.
6. GND and Internal Pressure check
6.1. Method
1) GND & Internal Pressure auto-check preparation
- Check that Power Cord is fully inserted to the SET.
(If loose, re-insert)
2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V
arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
6.2. Checkpoint
•TEST voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
•TEST time: 1 second
•TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &
NEUTRAL
•LEAKAGE CURRENT: At 0.5mArms
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Model Tool 1 Tool 2 Tool 3 Tool 4 Tool5 Menu
37LD450C(AUO) 2 HDMI
37LD450C(LGD) 2HDMI
42LD450C(LGD) 2 HDMI
42LD450C(CMO) 2 HDMI
42LD450C(AUO) 2 HDMI
47LD450C(LGD) 2 HDMI

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 16 -
7. USB S/W Download (option)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work.
But your downloaded version is High, USB data is
automatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote controller.
2) Select "Tool Option 1" and Push “OK”button.
3) Punch in the number. (Each model has their number.)

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 17 -
300
200
530
810
400
510
120
500
A4 A5
A2 A10
A21 900
910
800
LV1 LV2
540
521
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

150K
1%
TCON_32_FHD
R635-*1
27K
1%
TCON_32_FHD
R636-*1 24K
1%
TCON_32_FHD
R641-*1
510K
TCON_32_FHD
1%
R609-*1
150K
1%
TCON_32_FHD
R610-*1
150K
1%
TCON_37_FHD
R643-*2
20K
TCON_37_FHD
R637-*2
1%
910K
1%TCON_37_FHD
R635-*2 470K
1%TCON_37_FHD
R640-*2
56K
1%TCON_37_FHD
R636-*2 56K
1%
TCON_37_FHD
R641-*2
470K
TCON_37_FHD
1%
R609-*2
510K
TCON_42_FHD
1%
R609-*3
150K
1%
TCON_42_FHD
R635-*3
150K
1%
TCON_42_FHD
R610-*3
150K
1%
TCON_47_FHD_60_LAMP
R610-*4
510K
TCON_47_FHD_60_LAMP
1%
R609-*4
15K
1%
TCON_42_FHD
R641-*3
56K
1%
TCON_42_FHD
R620-*3
20K
1%
TCON_47_FHD_60_LAMP
R641-*4
510K
TCON_47_FHD
1%
R609-*5
150K
1%
TCON_47_FHD
R610-*5
12K
1%
TCON_37_FHD
R622-*2
22K
1%
TCON_32_FHD
R620-*1
20K
1%
TCON_47_FHD
R641-*5
220K
1%
TCON_32_FHD
R621-*1
11K
1%
TCON_32_FHD
R622-*1
51K
1%
TCON_32_FHD
R637-*1
270K
TCON_32_FHD
R643-*1
1%
200K
TCON_32_FHD
R611-*1
1%
47K
1%
TCON_37_FHD
R620-*2 220K
1%
TCON_37_FHD
R621-*2
91K
TCON_37_FHD
R610-*2
1%
220K
1%
TCON_42_FHD
R621-*3
75K
TCON_42_FHD
R636-*3
1% 200K
TCON_42_FHD
R611-*3
1%
11K
1%
TCON_42_FHD
R622-*3
220K
1%
TCON_47_FHD_60_LAMP
R621-*4
11K
1%
TCON_47_FHD_60_LAMP
R622-*4
30K
1%
TCON_47_FHD_60_LAMP
R620-*4 51K
1%
TCON_47_FHD_60_LAMP
R637-*4
270K
TCON_47_FHD_60_LAMP
R643-*4
1%
180K
1%
TCON_47_FHD_60_LAMP
R635-*4
68K
1%
TCON_47_FHD_60_LAMP
R636-*4 220K
TCON_47_FHD_60_LAMP
1%
R611-*4
51K
1%
TCON_47_FHD
R620-*5 220K
1%
TCON_47_FHD
R621-*5
11K
1%
TCON_47_FHD
R622-*5
51K
1%
TCON_47_FHD
R637-*5
270K
TCON_47_FHD
R643-*5
1%
75K
TCON_47_FHD
R636-*5
1%
180K
1%
TCON_47_FHD
R635-*5
220K
TCON_47_FHD
1%
R611-*5
27K
1%
TCON_55_FHD
R637-*6
150K
TCON_55_FHD
1%
R643-*6
180K
TCON_55_FHD
1%
R609-*6
68K
1%
TCON_55_FHD
R610-*6 56K
TCON_55_FHD
1%
R611-*6
510K
1%
TCON_55_FHD
R620-*6
27K
1%
TCON_55_FHD
R622-*6
68K
1%
TCON_55_FHD
R621-*6
150K
1%
TCON_55_FHD
R635-*6
75K
TCON_55_FHD
1%
R636-*6 15K
1%
TCON_55_FHD
R641-*6
27K
1%
TCON_42_FHD
R637-*3
150K
TCON_42_FHD
R643-*3
1%
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
1K
1%
R601-*1
TCON_32_FHD
1K
1%
R652-*1
TCON_32_FHD
1K
1%
R602-*1
TCON_32_FHD
1K
1%
TCON_37_FHD
R602-*2
1K
1%
TCON_37_FHD
R601-*2
1K
1%
TCON_42_FHD
R652-*3
1K
1%
TCON_42_FHD
R602-*3
1.5K
5%
TCON_37_FHD
R652-*2
1K
1%
TCON_47_FHD
R602-*5
1K
1%
TCON_47_FHD
R652-*5
1K
1%
TCON_47_FHD
R601-*5
0
5%
TCON_55_FHD
R652-*6
1K
1%
TCON_42_FHD_60_LAMP
R602-*4
1K
1%
TCON_42_FHD_60_LAMP
R652-*4
GP2_Saturn7M
15
T-CON Power Table
VGH VGL
VDD HVDD
32_FHD
R640 OPEN
R611 OPEN
VGH VGL
VDD HVDD
37_FHD
VGH
VDD
42_FHD
VGL
R640 OPEN
HVDD
HVDD
VDD
R640 OPEN
47_FHD_60_LAMP
VGL
47_FHD
VGH
HVDD
VDD
VGL
R640 OPEN
VGH VGH
HVDDVDD
VGL
55_FHD
(Without 60Hz Lamp)
(Without 60Hz Lamp)
R640 OPEN
VCOM FEED BACK VCOM FEED BACK VCOM FEED BACK
R601 OPEN
VCOM FEED BACK VCOM FEED BACK
R601 OPEN R602 OPEN
VCOM FEED BACK
VCOM FEED BACK
HVDD
42_FHD_60_LAMP
SHEET7
SHEET7
VDD
VGH
SHEET7
SHEET7
VGL
R601 OPEN
SHEET7
PStoPDF trial version. http://www.oakdoc.com

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
B-MBA1
A-TMA13
A-TMA12
B-TMDQSLB
B-MDQSUB
A-MA6
B-MA5
0.1uF
C1224
B-TMA5
B-MDQU2
B-TMDQL6
A-MA10
A-MDQU5
B-TMDQL5
B-MDQU6
B-TMDQU5
A-MDQU2
A-TMDQU4
B-MDQL3
B-TMA1
B-MDQU3
B-TMDQU6
A-TMDQU3
10
R1207
B-MDQSLB
A-MRASB
B-MVREFCA
B-TMA9
A-TMA4
B-MDQSL
0.01uF
25V
C1240
+1.5V_DDR
1000pF
C1202
A-TMDQL2
A-MA4
A-TMODT
B-TMDQU6
A-TMDQSLB
A-TMDQL7
A-MA2
0.1uF
C1243
A-TMDQU0
A-TMBA0
A-MDQU1
A-TMA2
B-MDQL2
240
1%
R1203
A-MDQL2
B-TMRESETB
A-TMDQL2
B-TMDQU2
0.1uF
C1241
A-TMDQL3
10K
R1232
10
R1215
0.1uF
C1211
B-TMA11
10
AR1219
B-MCASB
A-TMDQL4
B-MA13
A-MA9
0.1uF
C1228
H5TQ1G63BFR-H9C
IC1201
DDR_1333_HYNIX
A0 N3
A1 P7
A2 P3
A3 N2
A4 P8
A5 P2
A6 R8
A7 R2
A8 T8
A9 R3
A10/AP L7
A11 R7
A12/BC N7
A13 T3
A15 M7
BA0 M2
BA1 N8
BA2 M3
CK J7
CK K7
CKE K9
CS L2
ODT K1
RAS J3
CAS K3
WE L3
RESET T2
DQSL F3
DQSL G3
DQSU C7
DQSU B7
DML E7
DMU D3
DQL0 E3
DQL1 F7
DQL2 F2
DQL3 F8
DQL4 H3
DQL5 H8
DQL6 G2
DQL7 H7
DQU0 D7
DQU1 C3
DQU2 C8
DQU3 C2
DQU4 A7
DQU5 A2
DQU6 B8
DQU7 A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
NC_6
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
A-MWEB
B-MCKE
A-TMA5
B-TMDMU 10
AR1217
B-MA1
A-TMA13
A-MDQU4
B-TMA12
0.1uF
C1223
0.1uF
C1245
A-TMCK
0.1uF
C1218
H5TQ1G63BFR-H9C
IC1202
DDR_1333_HYNIX
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
A15
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA M8
VREFDQ H1
ZQ L8
VDD_1 B2
VDD_2 D9
VDD_3 G7
VDD_4 K2
VDD_5 K8
VDD_6 N1
VDD_7 N9
VDD_8 R1
VDD_9 R9
VDDQ_1 A1
VDDQ_2 A8
VDDQ_3 C1
VDDQ_4 C9
VDDQ_5 D2
VDDQ_6 E9
VDDQ_7 F1
VDDQ_8 H2
VDDQ_9 H9
NC_1 J1
NC_2 J9
NC_3 L1
NC_4 L9
NC_6 T7
VSS_1 A9
VSS_2 B3
VSS_3 E1
VSS_4 G8
VSS_5 J2
VSS_6 J8
VSS_7 M1
VSS_8 M9
VSS_9 P1
VSS_10 P9
VSS_11 T1
VSS_12 T9
VSSQ_1 B1
VSSQ_2 B9
VSSQ_3 D1
VSSQ_4 D8
VSSQ_5 E2
VSSQ_6 E8
VSSQ_7 F9
VSSQ_8 G1
VSSQ_9 G9
B-TMDQL7
A-MVREFCA
A-TMDML
0.1uF
C1221
0.1uF
C1203
0.1uF
C1222
A-MDMU
56
1%
R1237
1K 1%
R1225
B-MWEB
B-MCKB
0.1uF
C1220
B-TMDQL7
B-MDQL0
A-MDQU6
A-MDQU1
0.1uF
C1238
0.1uF
C1234
10
AR1214
A-TMA8
B-MDMU
10
AR1209
0.1uF
C1206
B-TMRASB
A-MDQU4
10
R1214
A-MDML
VCC_1.5V_DDR
A-MVREFCA
B-TMDQL2 B-MDQL2
B-TMA7
A-TMA7
A-TMBA0
B-MODT
B-TMA2
B-TMA12
A-TMDQL4
A-TMDQSU
A-TMA9
B-TMDMU
B-TMDQL1
A-MDQU7
B-MODT
A-TMDQL0
B-TMDQL4
A-MDQSLB
10
R1213
B-MA6
A-TMDQL0
B-TMBA2
0.1uF
C1237
B-TMA0
B-TMA3
A-MDQSL
A-MODT
VCC_1.5V_DDR
B-MA11
B-MA13
B-TMDQU7
B-MDQU7
B-TMA13
VCC_1.5V_DDR
B-TMCKB
A-TMDQU2
B-MDQU1
A-TMDQU1
B-TMDQU5
A-MDQL6
A-TMDQL5
A-TMBA1
1K 1%
R1205
0.1uF
C1215
A-TMA5
A-MDQL0
B-MVREFDQ
B-TMCKE
0.1uF
C1229
A-MCASB
10
AR1202
240
1%
R1226
0.1uF
C1201
A-TMA10
B-MDQL1
B-TMDQL1
B-TMDML
1K 1%
R1201
10
AR1208
10
R1210
A-MDQL6
A-MBA2
10
R1212
B-TMDQSL
B-MDML
A-MA10
B-TMBA1
A-TMDQL1
A-TMDQU4
A-MBA0
A-MCK
10
AR1205
A-MCKE
B-MA12
B-MDQL0
B-TMDQU3
A-TMWEB
B-TMCKB
B-TMCASB
10uF
10V
C1225
B-MDQSU
56
1%
R1236
B-MA8
B-TMBA2
A-MDQL2
10
AR1213
A-MDQU0
VCC_1.5V_DDR
1K 1%
R1227
B-TMDQU1
10
R1216
A-MDQU2 B-TMDQL5
B-TMDQSU
B-TMA1
B-MBA0
B-TMDQSLB
A-TMRASB
1K 1%
R1204
B-MA11
B-MA3
B-TMWEB
A-TMA1
A-MA0
A-MBA2
A-MDQU7
1K 1%
R1228
0.1uF
C1213
A-MA1
A-MCKB
A-MA2
B-MA4
A-TMA2
B-TMA10
1000pF
C1249
B-MDMU
0.1uF
16V
C1226
B-MDQU6
B-TMA6
B-MA7
B-MRASB
B-TMDQU0
A-TMA6
A-TMDQL5
B-TMA6
10
R1218
B-MDML
0.1uF
C1242
B-TMODT
10K
R1231
10
R1209
1000pF
C1204
B-MRASB
A-TMA9
B-TMDQL4
B-TMA0
A-TMDQU7
A-TMDQSLB
0.1uF
C1214
A-TMRASB
B-MDQU7
B-MCK
B-TMA3
B-TMDQU4
B-MBA2
B-TMA9
A-TMDQU5
A-TMA12
10
AR1201
A-TMDQU6
1000pF
C1247
A-MDQSUB
A-MCKE
10
R1223
0.1uF
C1217
A-MDQSU
B-MBA2
A-MA7
1K 1%
R1202
B-TMA8
10
R1220
B-TMDQU7
A-MRASB
A-MA1
B-TMCASB
A-TMDQU1
B-MA9
B-MDQSLB
10K R1234
A-TMA4
B-TMDQU2
10
AR1215
B-MDQL5
B-MA0
A-TMDQSU
B-MRESETB
B-TMDML
A-MDQL3
10
AR1210
B-TMDQL3
0.01uF
25V
C1209
A-MBA1
0.1uF
C1216
10KR1233
B-MDQSU
0.1uF
C1250
A-TMCKB
A-TMA10
A-MA13
A-MA0
B-TMBA0
A-TMA1
B-MCK
0.1uF
C1248
B-MBA0
A-TMA0
A-MCKB
B-MA8
A-TMA11
A-MDQU0
A-MA12
56
1%
R1238
B-TMA7
10
R1208
B-MDQU3
A-MA7
B-MA0
B-MDQU4
A-TMDQSL
A-MCK
A-TMODT
A-MBA1
VCC_1.5V_DDR
B-TMA8
A-MDQU6
B-MA2
A-TMDQSUB
0.1uF
C1208
A-TMDQL3
B-MA10
B-MDQL4
LGE107D (S7M Divx_Non RM)
IC101
S7M_DIVX
A_DDR3_A0/DDR2_A13
B8
A_DDR3_A1/DDR2_A8
B9
A_DDR3_A2/DDR2_A9
A8
A_DDR3_A3/DDR2_A1
C21
A_DDR3_A4/DDR2_A2
B10
A_DDR3_A5/DDR2_A10
A22
A_DDR3_A6/DDR2_A4
A10
A_DDR3_A7/DDR2_A3
B22
A_DDR3_A8/DDR2_A6
C9
A_DDR3_A9/DDR2_A12
C23
A_DDR3_A10/DDR2_RASZ
B11
A_DDR3_A11/DDR2_A11
A9
A_DDR3_A12/DDR2_A0
C10
A_DDR3_A13/DDR2_A7
B23
A_DDR3_BA0/DDR2_BA2
B21
A_DDR3_BA1/DDR2_CASZ
A11
A_DDR3_BA2/DDR2_A5
A23
A_DDR3_MCLK/DDR2_MCLK
A12
A_DDR3_MCLKZ/DDR2_MCLKZ
C11
A_DDR3_CKE/DDR2_DQ5
B12
A_DDR3_ODT/DDR2_ODT
C20
A_DDR3_RASZ/DDR2_WEZ
A20
A_DDR3_CASZ/DDR2_BA1
B20
A_DDR3_WEZ/DDR2_BA0
A21
A_DDR3_RESETB
C22
A_DDR3_DQSL/DDR2_DQS0
C16
A_DDR3_DQSLB/DDR2_DQSB0
B16
A_DDR3_DQSU/DDR2_DQSB1
A16
A_DDR3_DQSUB/DDR2_DQS1
C15
A_DDR3_DML//DDR2_DQ13
A14
A_DDR3_DMU/DDR2_DQ6
B18
A_DDR3_DQL0/DDR2_DQ3
C18
A_DDR3_DQL1/DDR2_DQ7
B13
A_DDR3_DQL2/DDR2_DQ1
A19
A_DDR3_DQL3/DDR2_DQ10
C13
A_DDR3_DQL4/DDR2_DQ4
C19
A_DDR3_DQL5/DDR2_DQ0
A13
A_DDR3_DQL6/DDR2_CKE
B19
A_DDR3_DQL7/DDR2_DQ2
C12
A_DDR3_DQU0/DDR2_DQ15
A15
A_DDR3_DQU1/DDR2_DQ9
A17
A_DDR3_DQU2/DDR2_DQ8
B14
A_DDR3_DQU3/DDR2_DQ11
C17
A_DDR3_DQU4/DDR2_DQM1
B15
A_DDR3_DQU5/DDR2_DQ12
A18
A_DDR3_DQU6/DDR2_DQM0
C14
A_DDR3_DQU7/DDR2_DQ14
B17
B_DDR3_A0/DDR2_A13 A25
B_DDR3_A1/DDR2_A8 B24
B_DDR3_A2/DDR2_A9 A24
B_DDR3_A3/DDR2_A1 P25
B_DDR3_A4/DDR2_A2 C24
B_DDR3_A5/DDR2_A10 P26
B_DDR3_A6/DDR2_A4 B26
B_DDR3_A7/DDR2_A3 R24
B_DDR3_A8/DDR2_A6 B25
B_DDR3_A9/DDR2_A12 T26
B_DDR3_A10/DDR2_RASZ D24
B_DDR3_A11/DDR2_A11 A26
B_DDR3_A12/DDR2_A0 C25
B_DDR3_A13/DDR2_A7 T25
B_DDR3_BA0/DDR2_BA2 P24
B_DDR3_BA1/DDR2_CASZ C26
B_DDR3_BA2/DDR2_A5 R26
B_DDR3_MCLK/DDR2_MCLK D26
B_DDR3_MCLKZ/DDR2_MCLKZ D25
B_DDR3_CKE/DDR2_DQ5 E24
B_DDR3_ODT/DDR2_ODT N25
B_DDR3_RASZ/DDR2_WEZ M26
B_DDR3_CASZ/DDR2_BA1 N24
B_DDR3_WEZ/DDR2_BA0 N26
B_DDR3_RESETB R25
B_DDR3_DQSL/DDR2_DQS0 J25
B_DDR3_DQSLB/DDR2_DQSB0 J24
B_DDR3_DQSU/DDR2_DQSB1 H26
B_DDR3_DQSUB/DDR2_DQS1 H25
B_DDR3_DML/DDR2_DQ13 F26
B_DDR3_DMU/DDR2_DQ6 L24
B_DDR3_DQL0/DDR2_DQ3 L25
B_DDR3_DQL1/DDR2_DQ7 F24
B_DDR3_DQL2/DDR2_DQ1 L26
B_DDR3_DQL3/DDR2_DQ10 F25
B_DDR3_DQL4/DDR2_DQ4 M25
B_DDR3_DQL5/DDR2_DQ0 E26
B_DDR3_DQL6/DDR2_CKE M24
B_DDR3_DQL7/DDR2_DQ2 E25
B_DDR3_DQU0/DDR2_DQ15 G26
B_DDR3_DQU1/DDR2_DQ9 J26
B_DDR3_DQU2/DDR2_DQ8 G24
B_DDR3_DQU3/DDR2_DQ11 K25
B_DDR3_DQU4/DDR2_DQM1 H24
B_DDR3_DQU5/DDR2_DQ12 K26
B_DDR3_DQU6/DDR2_DQM0 G25
B_DDR3_DQU7/DDR2_DQ14 K24
B-MA10
A-MDQU5
A-TMDQSL
B-MA2
A-MA11
0.1uF
C1219
B-MVREFCA
A-MDQL1
A-MDQL7
B-MDQL5
A-TMBA1
VCC_1.5V_DDR
A-MA5
B-MCKE
10
R1222
A-MDQU3
B-TMDQU4
0.1uF
C1233
A-TMRESETB
B-MA1
A-MCASB
B-MA12
B-TMWEB
B-TMDQU1
A-MDQL0
A-MDQU3
A-TMA0
0.1uF
C1231
A-MDQL5
A-TMRESETB
A-MBA0
B-MA4
A-TMDQU6
A-TMCASB
B-TMBA1
B-TMDQSU
B-MDQSL
B-MA7
A-TMDQU5
10
AR1206
A-MA8
A-MODT
B-TMDQL6
A-TMDQU2
A-TMDMU
B-TMA10
B-MCASB
0.1uF
C1232
A-MDML
0.1uF
C1235
A-TMCK 10
AR1220
B-MDQU0
A-TMDQL6
A-MDQSL
A-MVREFDQ
A-MDMU
A-MDQL7
0.1uF
C1244
B-TMCK
B-MDQU5
B-MDQSUB
10
R1206
10
AR1207
10
AR1218
A-MDQSUB
B-TMDQSUB
L1201
A-MRESETB
B-MDQU2
A-TMDQU7
0.1uF
C1212
B-MDQU5
B-TMDQL0
10uF
C1246
A-MDQSLB
B-MWEB
A-TMDQU3
B-MDQL7
A-TMCKB
B-TMCKE
A-TMA6
B-TMCK
10
R1211
A-TMA3
B-MDQL7
A-TMDQL6
A-TMWEB
A-MWEB
B-TMA2
B-TMA4
A-TMA11
A-MVREFDQ A-MA3
B-MDQL1
0.1uF
C1230
B-MBA1
0.1uF
C1207
B-TMDQSUB
A-TMBA2
A-MA11
A-MA4
A-MDQSU
VCC_1.5V_DDR
B-MA5
10uF
C1205
B-TMDQSL
B-TMDQU3
A-MA3
A-MCKE
0.1uF
C1210
B-MCKE
A-TMDQL1
10
AR1216
56
1%
R1235
A-MA12
A-MA5
A-MA6
A-TMDML
B-MVREFDQ
A-MA13
A-MDQL1
10
R1221
VCC_1.5V_DDR
B-TMDQL0
A-MA8
VCC_1.5V_DDR
10
R1219
10
AR1212
B-TMRESETB
B-MDQL4
A-TMDQU0
B-TMA13
B-MRESETB
A-TMA8
B-MA9
B-TMA11
B-MA3
B-MCKB
B-TMODT
B-MDQU4
A-TMDMU
B-TMRASB
10
AR1204
B-MDQU0
B-MDQL6
B-MDQL6
10
R1217
B-MDQU1
10
AR1211
B-MDQL3
A-MDQL4
B-MA6
B-TMDQL2
B-TMDQL3
A-MDQL5
A-MRESETB
A-TMCKE
A-TMBA2
B-TMA4
0.1uF
C1239
B-TMBA0
A-MA9
B-TMA5
A-TMCASB
0.1uF
C1227
VCC_1.5V_DDR
0.1uF
C1236
A-TMA7
A-MDQL4
B-TMDQU0
A-MDQL3
VCC_1.5V_DDR
A-TMCKE
1K 1%
R1224
A-TMDQL7
A-TMA3
A-TMDQSUB
10
AR1203
NT5CB64M16AP-CG
IC1201-*1
DDR_1333_NY
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12
N7
NC_6
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA M8
VREFDQ H1
ZQ L8
VDD_1 B2
VDD_2 D9
VDD_3 G7
VDD_4 K2
VDD_5 K8
VDD_6 N1
VDD_7 N9
VDD_8 R1
VDD_9 R9
VDDQ_1 A1
VDDQ_2 A8
VDDQ_3 C1
VDDQ_4 C9
VDDQ_5 D2
VDDQ_6 E9
VDDQ_7 F1
VDDQ_8 H2
VDDQ_9 H9
NC_1 J1
NC_2 J9
NC_3 L1
NC_4 L9
NC_7 T7
VSS_1 A9
VSS_2 B3
VSS_3 E1
VSS_4 G8
VSS_5 J2
VSS_6 J8
VSS_7 M1
VSS_8 M9
VSS_9 P1
VSS_10 P9
VSS_11 T1
VSS_12 T9
VSSQ_1 B1
VSSQ_2 B9
VSSQ_3 D1
VSSQ_4 D8
VSSQ_5 E2
VSSQ_6 E8
VSSQ_7 F9
VSSQ_8 G1
VSSQ_9 G9
NT5CB64M16AP-CG
IC1202-*1
DDR_1333_NY
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12
N7
NC_6
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA M8
VREFDQ H1
ZQ L8
VDD_1 B2
VDD_2 D9
VDD_3 G7
VDD_4 K2
VDD_5 K8
VDD_6 N1
VDD_7 N9
VDD_8 R1
VDD_9 R9
VDDQ_1 A1
VDDQ_2 A8
VDDQ_3 C1
VDDQ_4 C9
VDDQ_5 D2
VDDQ_6 E9
VDDQ_7 F1
VDDQ_8 H2
VDDQ_9 H9
NC_1 J1
NC_2 J9
NC_3 L1
NC_4 L9
NC_7 T7
VSS_1 A9
VSS_2 B3
VSS_3 E1
VSS_4 G8
VSS_5 J2
VSS_6 J8
VSS_7 M1
VSS_8 M9
VSS_9 P1
VSS_10 P9
VSS_11 T1
VSS_12 T9
VSSQ_1 B1
VSSQ_2 B9
VSSQ_3 D1
VSSQ_4 D8
VSSQ_5 E2
VSSQ_6 E8
VSSQ_7 F9
VSSQ_8 G1
VSSQ_9 G9
CLose to Saturn7M IC
Close to DDR Power Pin
CLose to Saturn7M IC
DDR3 1.5V By CAP - Place these Caps near Memory
Close to DDR Power Pin
CLose to DDR3
DDR3 1.5V By CAP - Place these Caps near Memory
CLose to DDR3
GP2_Saturn7M
14DDR_256
PStoPDF trial version. http://www.oakdoc.com

0.1uFC2928
ISDB_DEMOD
0.1uF
16V
C2912
ISDB_DEMOD
0.1uF
16V
C2916
ISDB_DEMOD
FE_TS_DATA[0]
+3.3V_DE
0.1uFC2901
ISDB_DEMOD
IF_N_EXT
0.1uFC2909 ISDB_DEMOD
0.1uFC2925
ISDB_DEMOD
1M
ISDB_OPT
R2909
IF_AGC_ISDB
0.1uF
16V
C2918
ISDB_DEMOD
15pF
50V
C2915
ISDB_DEMOD
TP2905
ISDB_DEMOD
2.2KR2904
ISDB_DEMOD
0.1uF
16V
C2922
ISDB_DEMOD
FE_TS_DATA[0]
0.1uFC2907 ISDB_DEMOD
0.1uFC2927
ISDB_DEMOD
0.1uF
16V
C2913
ISDB_DEMOD
0.1uFC2926
ISDB_DEMOD
0.1uFC2905 ISDB_DEMOD
0.1uF
16V
C2914
ISDB_DEMOD
IF_P_EXT
TP2903ISDB_DEMOD
0.1uFC2904
ISDB_DEMOD
22R2912
ISDB_DEMOD
MN884433
ISDB_DEMOD
IC2901
1
VSS_1
2
AVDD_S
3
AII_S
4
AIQ_S
5
AVSS_S
6
VRT_S
7
VRB_S
8
TCPO_S
9
VDDL_1
10
MSCL_S
11
MSDA_S
12
VSS_2
13
VSSH
14
PSEL
15
ZSEL
16
VDDL_2
17
ACKI
18
TCPO_T
19
IR_T
20
VRT_T
21
VRB_T
22
AVDD_T
23
AIN_T
24
AIP_T
25
AVSS_T
26
VSS_3
27
MSCL_T
28
MSDA_T
29
VDDH_1
30
GPO1
31
AGCI_T
32
AGCR_T
33
GPO0
34
VDDL_3
35
VSS_4
36
XO
37
XI
38
VDDH_2
39
GPI1
40
GPI0
41
TEST4
42
SHVPP
43
SHVDDH
44
NC_1
45
VSS_5
46
VDDL_4
47
TCK
48
TDI
49
NRST
50
TEST3
51 VSS_6
52 VDDL_5
53 TRST
54 TMS
55 CSEL0
56 CSEL1
57 TDO
58 SYNCA
59 ERRA
60 SYNCB
61 ERRB
62 VSS_7
63 VDDL_6
64 SADR_T
65 NC_2
66 SADR_S
67 HDVDDL0
68 VSS_8
69 SDA
70 SCL
71 VDDH_3
72 SADR
73 INTA
74 INTB
75 VSS_9
76 TEST1
77 TEST2
78 SCKA
79 GPI2
80 SDOA
81 PCKA
82 DENA
83 VDDH_4
84 VSS_10
85 HDVPP
86 RON
87 NC_3
88 HDVDDH
89 NC_4
90 HDVDDL1
91 VSS_11
92 VDDL_7
93 SCKB
94 TEST0
95 SDOB
96 PCKB
97 DENB
98 GPO2
99 VDDH_5
100 AGC_S
FE_TS_DATA[0-7]
22R2910
ISDB_DEMOD
+1.2V_DE
0.1uFC2902
ISDB_DEMOD
0.1uFC2908 ISDB_DEMOD
22R2913
ISDB_DEMOD
FE_TS_SYNC
TP2906ISDB_DEMOD
0.1uFC2903
ISDB_DEMOD
25MHz
X2901
ISDB_DEMOD
10K 1%
R2903
ISDB_DEMOD
0.1uF
16V
C2923
ISDB_DEMOD
0.1uF
C2910
ISDB_DEMOD
FE_TS_VAL_ERR
2.2K
R2914
OPT
TP2904ISDB_DEMOD
TP2907ISDB_DEMOD
DEMOD_SCL
0.1uF
16V
C2924
ISDB_DEMOD
0.1uF
16V
C2917
ISDB_DEMOD
2.2KR2905
ISDB_DEMOD
DEMOD_RESET
10K
R2906
ISDB_DEMOD
2.2K
R2915
OPT
22R2911
ISDB_DEMOD
TP2901ISDB_DEMOD
0.1uF
16V
C2921
ISDB_DEMOD
FE_TS_CLK
2.2KR2908
ISDB_DEMOD
2.2KR2907
ISDB_DEMOD
+3.3V_DE
0.1uF
16V
C2920
ISDB_DEMOD
15pF
50V
C2919
ISDB_DEMOD
DEMOD_SDA
0.1uF
16V
C2911
ISDB_DEMOD
TP2902ISDB_DEMOD
0.1uFC2906 ISDB_DEMOD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.3V_DE
BLM18PG121SN1D
L3001
ISDB_POWER
IF_AGC
TP3002
0
ISDB_DEMOD
R3001
0.1uF
C3001
ISDB_POWER
0.1uF
16V
C3005
ISDB_POWER
0.1uF
16V
C3003
ISDB_POWER
10K
R3003
ISDB_POWER
IF_AGC_SEL
5.1K
R3004
ISDB_POWER
IF_AGC_MAIN
+3.3V_Normal
0
MSTARDEMOD
R3002
SC4215ISTRT
IC3001
ISDB_POWER
3
VIN
2
EN
4
NC_2
1
NC_1
5NC_3
6VO
7ADJ
8GND
22uF
16V
C3006
ISDB_POWER
IF_AGC_ISDB
+3.3V_DE
10uF
10V
C3004
ISDB_POWER
+1.2V_DE
0.1uF
C3002
ISDB_POWER
FE_TS_DATA[1]
FE_TS_DATA[3]
FE_TS_DATA[0]
FE_TS_DATA[7]
FE_TS_DATA[2]
FE_TS_DATA[6]
FE_TS_DATA[5]
FE_TS_DATA[4]
MN884433
PANASONIC
AMP_I2C HAVE PULL-UP
(FE_TS_SERIAL)
(FE_TS_SERIAL)
(ISDB-T)
Power(3.3V,1.2V)
IF AGC SELECTION
GP2_Saturn7M
13ISDB DEMOD
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