LG 42LN5460 User manual

Printed in KoreaP/NO : MFL67711911 (1309-REV00)
CHASSIS : LJ36B
MODEL : 42LN5460 42LN5460-SM
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION .............................................................. 10
BLOCK DIAGRAM.................................................................................. 19
EXPLODED VIEW .................................................................................. 20
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This spec sheet is applied all of the 32”, 42”, 47”, 50” LED TV
with LJ31B/LJ36B chassis.
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Standard input voltage (100~240V@ 50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC: CE, IEC
4. General Specification
No Item Specication Measurement Result Remark
1. Receiving System 1) SBTVD / NTSC / PAL-M / PAL-N
2. Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) CATV : 01~135
3. Input Voltage 1) AC 100 ~ 240V 50/60Hz
4. Market Central and South AMERICA
5. Screen Size 32 inch Wide (1366 × 768) 32LN540B-SH/SA
32LA613B-SB
32LN520B-SA
32LN536B-SI
32LN546B-SM
32 inch Wide (1920 × 1080) 32LN5400-SB/SA
39 inch Wide (1920 × 1080) 39LN5400-SB/SA
42 inch Wide (1920 × 1080) 42LN5400-SB/SA
42LA6130-SB
42LN5200-SA
42LN5460-SM
47 inch Wide (1920 × 1080) 47LN5400-SB/SA
47LA6130-SB
47LM5460-SM
50 inch Wide (1920 × 1080) 50LN5400-SB/SA
50 inch Wide (1920 × 1080) 55LN5400-SB/SA
6. Aspect Ratio 16:9
7. Tuning System FS

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No Item Specication Measurement Result Remark
8. Module LC320DXE-SFR5 HD, 60Hz LGD 32LN520B-SA
HC320DXN-SLFG1 HD, 60Hz LGD 32LN536B-SI
HC320DXN-SLFA1 HD, 60Hz LGD 32LN546B-SM
LC320DXE-SFR1 HD, 60Hz LGD 32LN540B-SH/SA
LC320DUE-SFR1 FHD, 60Hz LGD 32LN5400-SB/SA
HC390DUN-VCFP1 FHD, 60Hz CMI 39LN5400-SB/SA
T390HVN02.2 FHD, 60Hz AUO 39LN5400-SB/SA
LC420DUE-SFR5 FHD, 60Hz LGD 42LN5200-SA
HC420DUN-SLFA1 FHD, 60Hz LGD 42LN5460-SM
LC420DUE-SFR1 FHD, 60Hz LGD 42LN5400-SB/SA
T420HVN05.0 FHD, 60Hz AUO 42LN5400-SB/SA
LC470DUE-SFR1 FHD, 60Hz LGD 47LN5400-SB/SA
FHD, 60Hz LGD 47LN5460-SM
LC500DUE-SFR2 FHD, 60Hz LGD 50LN5400-SB/SA
LC550DUJ-SEE1 FHD, 60Hz LGD 55LN5400-SB/SA
LC320DXE-SFU2 HD, 60Hz LGD 32LA613B-SB
LC420DUE-SFU2 FHD, 60Hz LGD 42LA6130-SB
LC470DUE-SFU2 FHD, 60Hz LGD 47LA6130-SB
9. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %

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5. External Input Support Format
5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*576 15.625 50.000 13.5 SDTV 576I
2. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
3. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
4. 720*480 31.50 60 27.027 SDTV 480P
5. 720*480 31.47 59.94 27.0 SDTV 480P
6. 720*576 31.250 50.000 27.000 SDTV 576P
7. 1280*720 37.500 50.000 74.25 HDTV 720P
8. 1280*720 45.00 60.00 74.25 HDTV 720P
9. 1280*720 44.96 59.94 74.176 HDTV 720P
10. 1920*1080 28.125 50.00 74.250 HDTV 1080I
11. 1920*1080 33.75 60.00 74.25 HDTV 1080I
12. 1920*1080 33.72 59.94 74.176 HDTV 1080I
13. 1920*1080 56.250 50.00 148.50 HDTV 1080P
14. 1920*1080 67.500 60.00 148.50 HDTV 1080P
15. 1920*1080 67.432 59.939 148.352 HDTV 1080P
16. 1920*1080 27.000 24.000 74.25 HDTV 1080P
17. 1920*1080 26.97 23.976 74.176 HDTV 1080P
18. 1920*1080 33.75 30.000 74.25 HDTV 1080P
19. 1920*1080 33.71 29.97 74.176 HDTV 1080P

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5.2. HDMI Input (PC/DTV)
*HDMI PC support only Rear HDMI Input
*If use DVI to HDMI cable for PC, you have to use external SPK for PC audio sound.
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC DDC
1. 640*350 31.468 70.09 25.17 EGA X
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4. 800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1152*864 54.348 60.053 80.00 VESA O
7. 1360*768 47.712 60.015 85.50 VESA (WXGA) O
8. 1280*1024(FHD Only) 63.981 60.02 108.00 VESA (SXGA) O
9. 1920*1080(FHD Only) 67.5 60 148.5 HDTV 1080P O
DTV
1. 720*480 31.469 59.940 27.000 SDTV 480P
2. 720*480 31.500 60.000 27.027 SDTV 480P
3. 720*576 31.250 50.000 27.000 SDTV 576P
4. 1280*720 37.500 50.000 74.25 HDTV 720P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 28.125 50.000 74.25 HDTV 1080I
8. 1920*1080 33.75 60.00 74.25 HDTV 1080I
9. 1920*1080 33.72 59.94 74.176 HDTV 1080I
10. 1920*1080 56.250 50.000 148.50 HDTV 1080P
11. 1920*1080 67.500 60.00 148.50 HDTV 1080P
12. 1920*1080 67.432 59.94 148.352 HDTV 1080P
13. 1920*1080 27.000 24.000 74.25 HDTV 1080P
14. 1920*1080 26.97 23.976 74.176 HDTV 1080P
15. 1920*1080 33.75 30.00 74.25 HDTV 1080P
16. 1920*1080 33.71 29.97 74.176 HDTV 1080P
※ HDMI Monitor Range Limits
Min Vertical Freq - 58 Hz
Max Vertical Freq - 62 Hz
Min Horiz. Freq - 30 kHz
Max Horiz. Freq - 83 kHz
Pixel Clock - 160 MHz

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Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application
This spec sheet is applied all of the LCD TV with LJ31B,
LJ36B, LJ36M chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan whic al Unit: Product Specification Standard.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run).
Temperature : at 25 ºC ±5 ºC
Relative humidity : 65 ± 10%
Input voltage : 100~220V, 50/60Hz
(6) Adjustment equipments : Color Analyzer (CA-210 or
CA-110), SVC remote controller
(7) Push The “IN STOP KEY” – For memory initialization.
3. Main PCB check process
* APC – After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message.
If “Error” is displayed, Check connection between
computer, jig, and set.
(3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
(4) Click “Connect” tab. If “Can’t ” is displayed, Check
connection between computer, jig, and set.
(5) Click “Auto” tab and set as below.
(6) Click “Run”.
(7) After downloading, check “OK” message.
(1)
filexxx.bin
(2
Please Check the Speed
To use speed between
from 200KHz to 400KHz
(4)
(5)
(6)
(7)...........OK
filexxx.bin
Case1 : Software version up
1) After downloading S/W by USB , TV set will reboot
automatically
2) Push “In-stop” key
3) Push “Power on” key
4) Function inspection
5) After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1) When TV set is entering on the assembly line, Push
“In-stop” key at first.
2) Push “Power on” key for turning it on.
=> If you push “Power on” key, TV set will recover channel
information by itself.
3).After function inspection, Push “In-stop” key.

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Only for training and service purposes
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In this case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool
Option again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push "OK" button.
(3) Punch in the number. (Each model has their number.)
(4) Completed selecting Tool option.
Model Module Tool
option1
Tool
option2
Tool
option3
Tool
option4
Tool
option5
Tool
option6
32LA613B-
SB LGD 84 2440 32669 46344 47108 97
42LA6130-
SB LGD 87 2440 32669 46344 47108 97
47LA6130-
SB LGD 88 2440 32669 46344 47108 97
32LN540B-
SH/SA LGD 20 2440 16281 13576 43012 17
32LN5400-
SB/SA LGD 20 2440 16281 13576 43012 17
39LN5400-
SB/SA CMI 2070 2440 16153 13576 43012 17
39LN5400-
SB/SA AUO 4118 2440 16153 13576 43012 17
42LN5400-
SB/SA LGD 23 2440 16281 13576 43012 17
42LN5400-
SB/SA AUO 4119 2440 16153 13576 43012 17
47LN5400-
SB/SA LGD 24 2440 16281 13576 43012 17
50LN5400-
SB/SA LGD 25 2440 16281 13576 43012 17
55LN5400-
SB/SA LGD 26 2440 16153 13576 59396 17
32LN536B-SI LGD
32LN520B-
SA LGD
42LN5200-
SA LGD
32LN546B-
SM LGD 132 426 16153 13576 10244 273
42LN5460-
SM LGD
47LN5460-
SM LGD POLA
* RS-232C Connection Method
Connection : PCBA (USB Port) -> USB to Serial Adapter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
▪ Product name of USB to Serial Adapter is UC-232A.
※Caution: LJ31* chassis support only UC-232A driver. (only use
this one. )

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4. Total Assembly line process
4.1. Adjustment Preparation
■ W/B Equipment condition
CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of
LED back light
■ Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
► The spec of color temperature and coordinate
Model Mode Color Temp Color coordinate Remark
All
Cool (C50) 13,000k x = 0.271 (±0.002)
y = 0.270 (±0.002) ※Test signal
- Inner pattern for W/B adjust
- External white pattern
(80IRE, 204gray)
Medium (0) 9,300k x = 0.286 (±0.002)
y = 0.289 (±0.002)
Warm (W50) 6,500k x = 0.313 (±0.002)
y = 0.329 (±0.002)
► CA210 : CH 14, Test signal : Inner pattern (80IRE)
- Standard color coordinate and temperature using CA-1000 (by
H/R time)
▪ Normal line
model: (normal line)LN5xxx, LA6xxx, LA7xxx, LA8xxx
H/R Time(Min)
Cool Medium Warm
x y x x y x
271 270 286 289 313 329
1 0-2 283 287 298 306 322 342
2 3-5 282 285 297 304 321 340
3 6-9 281 284 296 303 320 339
4 10-19 279 281 294 300 318 336
5 20-35 277 277 292 296 316 332
6 36-49 275 274 290 293 314 329
7 50-79 273 272 288 291 312 327
8 80-119 272 271 287 290 311 326
9 Over 120 271 270 286 289 310 325
▪ Aging chamber line
model: (aging chamber)LN5xxx, LA6xxx, LA7xxx, LA8xxx
H/R Time(Min)
Cool Medium Warm
x y x x y x
271 270 286 289 313 329
1 0-5 282 285 297 304 321 340
2 6-10 278 280 293 299 317 335
3 11-20 275 275 290 294 314 330
4 21-30 272 272 287 291 311 327
5 31-40 269 269 284 288 308 324
6 41-50 268 267 283 286 307 322
7 51-80 267 266 282 285 306 321
8 81-119 266 264 281 283 305 319
9 Over 120 265 263 280 282 304 318
※Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER-ON -> Enter
the mode of White-Balance, the pattern will come out.
●Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
● Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA] MIN
CENTER
(DEFAULT) MAX
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128

- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
*Manual W/B process using adjusts Remote control.(TBD)
■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■Enter White Balance by pushing “►” key at “8. White Balance”.
■ For manual adjustment, it is also possible by the following
sequence.
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface
(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 206 Gray internal pattern will be displayed.
(4) Adjust Cool modes
(i). Fix the one of R/G/B gain to 192 (default data) and decrease
the others
(If G gain is adjusted over 172 and R and B gain less than
192, increase G gain to 192 and increase R gain and B gain
same amount of increasing G gain.)
(ii). If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain.
(iii). If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255 or B
gain is 255
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu
8. White Balance, you can select one of 2 Test-pattern: ON,
OFF. Default is inner (ON). By selecting OFF, you can adjust
using RF signal in 206 Gray pattern.
※CASE Cool
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
How to adjust
(1) If G gain is adjusted over 172 and R gain and B gain less
than 192 , Adjust is O.K.
(2) If G gain is less than 172 , increase G gain by up to 172,
and then increase R gain and B gain same amount of increasing
G gain.
(3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
※CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
▪ After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is
correctly same then unplug the AC cable. If it is not same, then
correct it same with BOM and unplug AC cable. For correct it to
the model’s module from factory JIG model.
▪ Push the “IN STOP KEY” after completing the function
inspection.

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.2. DPM operation confirmation
(Only Apply for MNT Model)
Check if Power LED Color and Power Consumption operate
as standard.
■ Set Input to RGB and connect D-sub cable to set
■ Measurement Condition: (100~240V@ 50/60Hz)
■ Confirm DPM operation at the state of screen without Signal
4.3. DDC EDID Write (HDMI 256Byte)
■ Connect HDMI Signal Cable to HDMI Jack.
■ Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
■ Check whether written EDID data is correct or not.
* For SVC Ass’y, EDID have to be downloaded.
4.4. EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
- Auto Download
■ After enter Service Mode by pushing “ADJ” key,
■ Enter EDID D/L mode.
■ Enter “START” by pushing “OK” key.
※Edid data and Model option download (RS232C)
NO Item CMD 1 CMD 2 Data 0
Enter
download
MODE
Download
‘Mode In’ A A 0 0
When transfer
the ‘Mode In’,
Carry the com-
mand
Edid data
and Model
option
download
Download A E 00 10
Automatically
download
(The use of a
internal Data)
※Caution
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
=> Caution
- Never connect HDMI & D-sub Cable at the same time.
- Use the proper cables below for EDID Writing.
- Download HDMI1, HDMI2 separately because HDMI1 is
different from HDMI2.
For Analog EDID For HDMI EDID
D-sub to D-sub DVI-D to HDMI or HDMI to HDMI
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
●EDID DATA
(1) HD 2D EDID Data
CheckSum Physical Address (0x9E)
HDMI 1 A3/5B 10
HDMI 2 A3/4B 20

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
(2) FHD 2D EDID Data (Support Deep Color – 10bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/DE 10
HDMI 2 42/CE 20
(3) FHD 2D EDID Data (Not Support Deep Color – 8bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/25 10
HDMI 2 42/15 20
(4) HD 3D EDID Data
CheckSum Physical Address (0x9E)
HDMI 1 A3/59 10
HDMI 2 A3/49 20
- HDMI
(5) FHD 3D EDID Data (Not Support Deep Color – 8bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/23 10
HDMI 2 42/13 20
- HDMI

- 16 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
(6) FHD 3D EDID Data (Support Deep Color – 10bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/DC 10
HDMI 2 42/CC 20
(7) HD 3D DTS EDID Data
CheckSum Physical Address (0x9E)
HDMI 1 A3/C0 10
HDMI 2 A3/B0 20
(8) FHD 3D DTS EDID Data (Not Support Deep Color – 8bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/8A 10
HDMI 2 42/7A 20
- HDMI
(9) HD 2D DTS EDID Data
CheckSum Physical Address (0x9E)
HDMI 1 A3/C2 10
HDMI 2 A3/B2 20
- HDMI

- 17 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
(10) FHD 2D DTS EDID Data (Not Support Deep Color – 8bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/8C 10
HDMI 2 42/7C 20
- HDMI
4.5. Outgoing condition Configuration
■ When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.6. GND & Hi-pot test
4.6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
4.6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
4.6.3. Checkpoint
(1) Test voltage
①3 Poles
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
②2 Poles
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
①3 Poles
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
②2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
5. Local Dimming Function Check
Step1) Turn on TV.
Step2) Press “P-only” key, enter to power only mode and
escape the “P-only” Mode by pressing “Exit” key
Step3) Press “Tilt” key, entrance to Local Dimming mode.
Step4) At the Local Dimming mode, module Edge Backlight
moving Top to bottom Back light of module moving
Step5) confirm the Local Dimming mode
Step6) Press “Exit” key

- 18 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
6. 3D Function Test (Only 3D Model)
(Pattern Generator MSHG-600, MSPG-6100 [SUPPORT
HDMI1.4])
* HDMI mode NO. 872 , pattern No.83
1) Please input 3D test pattern like below (HDMI mode NO.
872 , pattern No.83)
2) When 3D OSD appear automatically , then select OK
button.
3) Don’t wear a 3D Glasses, Check the picture like below

- 19 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
BLOCK DIAGRAM
(P1101)
30P HD LVDS wafer
51P FHD LVDS wafer
(P1100) (P1101)
30P HD LVDS wafer
51P FHD LVDS wafer
(P1100)
SIDE
USB
(JK700)
HDMI2(MHL)
(JK803)
CK+/-, D0+/-, D1+/-, D2+/-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC
SIDE_USB_DM/DP
USB1_OCD/CTL
OCP IC : TPS65281
(IC401)
+5V_USB
SIDE
USB
(JK700)
HDMI2(MHL)
(JK803)
CK+/-, D0+/-, D1+/-, D2+/-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC
SIDE_USB_DM/DP
USB1_OCD/CTL
OCP IC : TPS65281
(IC401)
+5V_USB
COMP2_L/R_IN
COMP2_Y+/AV_CVBS_IN, COMP2_Pb+/Pr+
AV2_L/R_IN
AV2_CVBS_IN
CK+/-, D0+/-, D1+/-, D2+/-_HDMI2
DDC_SCL/SDA_2, HDMI_CEC
Serial Flash
(8Mbit)
IC1300
SPI_SCK/SDI/SDO/CS
Serial Flash
(8Mbit)
IC1300
Serial Flash
(8Mbit)
IC1300
SPI_SCK/SDI/SDO/CS
System EEPROM
(256Kbit)
IC104
I2C_SCL/SDA
System EEPROM
(256Kbit)
IC104
System EEPROM
(256Kbit)
IC104
I2C_SCL/SDA
NAND FLASH
(2Gbit)
IC102
PCM_A[0-7],…
NAND FLASH
(2Gbit)
IC102
NAND FLASH
(2Gbit)
IC102
PCM_A[0-7],…
DDR3 SDRAM
(2Gbit)
IC1201
A-MDQL[0-7], A-MDQU[0-7],…
DDR3 SDRAM
(2Gbit)
IC1201
DDR3 SDRAM
(2Gbit)
IC1201
A-MDQL[0-7], A-MDQU[0-7],…
RXA0+/-~RXA4+/-, RXACK+/- RXB0+/-~RXB4+/-, RXBCK+/-
SPK_R
SPK_L
AMP_SCL/SDA
AUD_MASTER_CLK,
AUD_LRCH,
AUD_LRCK, AUD_SCK
STA380BW
(IC3401)
Main SOC
M1(MSD804KKX)
(IC101)
Connector
(P600)
KEY1/2, LED_R, IR
REAR
HDMI1
(JK801)
DDR3 SDRAM
(1Gbit)
IC1202
B-MDQL[0-7], B-MDQU[0-7],…
DDR3 SDRAM
(1Gbit)
IC1202
DDR3 SDRAM
(1Gbit)
IC1202
B-MDQL[0-7], B-MDQU[0-7],…
TU_SCL / SDA
SIF
TDSN-B601F
FULL NIM
FE_TS_DATA[8]
CVBS
TU_SCL / SDA
SIF
TDSN-B601F
FULL NIM
FE_TS_DATA[8]
CVBS
AV2
Comp1 & AV1
(JK1701)
MHL_CD_SENSE
OCP IC : BD82020FVJ
(IC802)
AVDD5V_MHL, VBUS_EN MHL_OPC
SPDIF_OUT
SPDIF(Optic)
(JK1001)
HP_L/ROUT, SIDE_HP_MUTE
Headphone
(JK1500)

- 20 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
A2 A10
900
200
400
540
521
530
301
200T
910
120
300
510
121
Set + Stand
LV1
A31