LG 43LF5900-CB User manual

Printed in KoreaP/NO : MFL69285102 (1508-REV00)
CHASSIS : LC50H
MODEL : 43LF5900 43LF5900-CB
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

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CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 9
BLOCK DIAGRAM ................................................................................. 15
EXPLODED VIEW .................................................................................. 19
SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX
TROUBLE SHOOTING GUIDE ................................................ APPENDIX

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Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LED TV used LC50H
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance: LGE TV test method followed
(2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
No. Item Specication Remarks
1 Market China (PAL/DTMB Market) / Hong Kong DTV & Analog
2 Broadcasting system
1) PAL-I
2) PAL-DK
3) NTSC-M
4) DTMB
5) DVB-C(CHINA Only)
DTMB : DMB-T (Multi Carrier) + ADTB-T
(Single Carrier)
3 Program coverage
1) PAL-DK: VHF/UHF 1~69, Cable:1~47
2) PAL-I: VHF/UHF 1~69, Cable:1~47
3) NTSC M: VHF/UHF 2~78, Cable:1~71
4) DTMB:21~69
FOR Hong Kong
4 Receiving system Analog : Upper Heterodyne
Digital : COFDM, QAM
► DTMB
(Carrier, Code Rate, Constellation, Frame
Header, Interleaving)
* Hong Kong
- 3780, 0.4/0.6, 4/16/64QAM, PN945, 720
► DVB-C
- Symbolrate
: 4.0Msymbols/s to 7.2Msymbols/s
- Modulation : 16QAM, 32-QAM, 64-QAM,
128-QAM and 256-QAM
5 Video Input (1EA) PAL, NTSC Rear (Component common use)
6 Component Input (1EA) Y/Cb/Cr, Y/Pb/Pr Rear
7 HDMI Input (3EA) HDMI1-DTV,HDMI2-DTV
HDMI3-DTV
PC(HDMI Ver. 1.4)
Support HDCP
8 Audio Input (1EA) Component, AV, DVI Rear
Component, AV and DVI use same jack.
9 SPDIF out (1EA) Optical Audio out Rear
10 Analog audio out (1EA) Headphone and External speaker out Rear
11 USB Input(3EA) For My Media(Movie/Photo/Music List) or For SVC
12 Ethernet Lan Jack

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5. External Input Support Format (2D)
5.1. CVBS input
5.2. Component (Y, Pb, Pr)
No. Resolution H-freq.(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks
1. 720*480i 15.73 59.94 13.50 SDTV, DVD 480I(525I) NTSC-M
2. 720*480i 15.73 60.00 13.51 SDTV, DVD 480I(525I) NTSC-M
3. 720*576i 15.63 50.00 13.50 SDTV, DVD 576I(625I) 50Hz PAL-DK/I
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock Proposed
1. 720*480i 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2. 720*480i 15.73 60.00 13.514 SDTV, DVD 480I(525I)
3. 720*576i 15.62 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480p 31.47 59.94 27.000 SDTV 480P
5. 720*480p 31.50 60.00 27.027 SDTV 480P
6. 720*576p 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280*720 44.96 59.94 74.176 HDTV 720P
8. 1280*720 45.00 60.00 74.250 HDTV 720P
9. 1280*720 45.00 50.00 74.25 HDTV 720P 50Hz
10. 1920*1080 28.12 50.00 74.25 HDTV 1080I 50Hz,
11. 1920*1080 33.72 59.94 74.18 HDTV 1080I
12. 1920*1080 33.75 60.00 74.25 HDTV 1080I
13. 1920*1080 56.25 50.00 148.50 HDTV 1080P
14. 1920*1080 67.43 59.94 148.50 HDTV 1080P
15 1920*1080 67.50 60.00 148.50 HDTV 1080P

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(2) PC mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 640*350 31.46 70.09 25.17 EGA
2 720*400 31.46 70.08 28.32 DOS
3 640*480 31.46 59.94 25.17 VESA(VGA)
4 800*600 37.87 60.31 40.00 VESA(SVGA)
5 1024*768 48.36 60.00 65.00 VESA(XGA)
6 1360*768 47.71 60.01 84.75 VESA(WXGA)
7 1152*864 54.34 60.05 80.00 VESA
8 1280*1024 63.98 60.02 109.00 SXGA
9 1920*1080 67.50 60.00 158.40 WUXGA(Reduced Blanking)
5.3. HDMI : EDID DATA : Refer to adjust specification.
(1) DTV mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks
1. 640*480 31.46 59.94 25.13 SDTV 480P
2. 640*480 31.50 60.00 25.13 SDTV 480P
3. 720*480 15.73 59.94 13.50 SDTV, DVD 480I(525I)
Spec. out but
display
4. 720*480 15.75 60.00 13.51 SDTV, DVD 480I(525I)
5. 720*576 15.62 50.00 13.50 SDTV, DVD 576I(625I) 50Hz
6. 720*480 31.47 59.94 27.00 SDTV 480P
7. 720*480 31.50 60.00 27.03 SDTV 480P
8. 720*576 31.25 50.00 27.00 SDTV 576P
9. 1280*720 44.96 59.94 74.18 HDTV 720P
10. 1280*720 45.00 60.00 74.25 HDTV 720P
11. 1280*720 37.50 50.00 74.25 HDTV 720P
12. 1920*1080 28.12 50.00 74.25 HDTV 1080I
13. 1920*1080 33.72 59.94 74.18 HDTV 1080I
14. 1920*1080 33.75 60.00 74.25 HDTV 1080I
15. 1920*1080 26.97 23.97 63.30 HDTV 1080P
16. 1920*1080 27.00 24.00 63.36 HDTV 1080P
17. 1920*1080 33.71 29.97 79.12 HDTV 1080P
18. 1920*1080 33.75 30.00 79.20 HDTV 1080P
19. 1920*1080 56.25 50.00 148.50 HDTV 1080P
20. 1920*1080 67.43 59.94 148.35 HDTV 1080P
21. 1920*1080 67.50 60.00 148.50 HDTV 1080P

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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with
LC50H chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15 °C.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours.
In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above 15
°C for 3 hours.
[Caution]
When still image is displayed for a period of 20 minutes or
longer (Especially where W/B scale is strong. Digital pattern
13ch and/or Cross hatch pattern 09ch), there can some
afterimage in the black level area.
3. Automatic Adjustment
3.1. MAC address D/L, Widevine key D/L,
ESN D/L, HDCP14/20 D/L
Connect: USB port
Communication Prot connection
▪ Com 1,2,3,4 and 115200(Baudrate)
Mode check: Online Only
▪ Check the test process: DETECT → MAC → ESN→
Widevine → HDCP14 → HDCP20
▪ Play: Press Enter key
▪ Result: Ready, Test, OK or NG
▪ Printer Out (MAC Address Label)
3.2. LAN Inspection
3.2.1. Equipment & Condition
▪ Each other connection to LAN Port of IP Hub and Jig
3.2.2. LAN inspection solution
▪ LAN Port connection with PCB
▪Network setting at MENU Mode of TV
▪ Setting automatic IP
▪ If automatic setting is finished, you confirm IP and MAC
Address.
3.2.3. WIDEVINE key Inspection
- Confirm key input data at the "IN START" MENU Mode.


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3.3. LAN PORT INSPECTION(PING TEST)
Connect SET → LAN port == PC → LAN Port
3.3.1. Equipment setting
(1) Play the LAN Port Test PROGRAM.
(2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
3.3.2. LAN PORT inspection(PING TEST)
(1) Play the LAN Port Test Program.
(2) Connect each other LAN Port Jack.
(3) Play Test (F9) button and confirm OK Message.
(4) Remove LAN cable.
3.4. Model name & Serial number Download
3.4.1. Model name & Serial number D/L
▪Press "P-ONLY" key of service remote control.
(Baud rate : 115200 bps)
▪Connect RS-232C Signal to USB Cable to USB.
▪Write Serial number by use USB port.
▪Must check the serial number at Instart menu.
3.4.2. Method & notice
(1) Serial number D/L is using of scan equipment.
(2) Setting of scan equipment operated by Manufacturing
Technology Group.
(3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0.
* Manual Download (Model Name and Serial Number)
If the TV set is downloaded by OTA or service man, sometimes
model name or serial number is initialized.(Not always)
It is impossible to download by bar code scan, so It need
Manual download.
1) Press the "Instart" key of Adjustment remote control.
2) Go to the menu "7.Model Number D/L" like below photo.
3) Input the Factory model name(ex 47LB650V-ZA) or Serial
number like photo.
4) Check the model name Instart menu. → Factory name
displayed. (ex 47LB650V-ZA)
5) Check the Diagnostics.(DTV country only) → Buyer
model displayed. (ex 47LB650V-ZA)
3.5. WIFI MAC ADDRESS CHECK
(1) Using RS232 Command
Command Set ACK
Transmission [A][I][][Set ID][][20][Cr] [O][K][X] or [NG]
(2) Check the menu on in-start
4. Manual Adjustment
* ADC adjustment is not needed because of OTP(Auto ADC
adjustment)
4.1. EDID DATA
4.1.1. 2D EDID
▪ Reference
- HDMI1 ~ HDMI2
- In the data of EDID, bellows may be different by S/W or
Input mode.
ⓐProduct ID
HEX EDID Table DDC Function
0001 0100 Analog / Digital
ⓑSerial No: Controlled on production line.
ⓒMonth, Year: Controlled on production line:
ex) Monthly : ‘01’ → ‘01’
Year : ‘2015’ → ‘19’
ⓓModel Name(Hex): LGTV
Chassis MODEL NAME(HEX)
LC50H 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
ⓔChecksum(LG TV): Changeable by total EDID data.
ⓔ1ⓔ2ⓔ2
10bit /none XvYcc 8bit /none XvYcc
HDMI1 40 D4 1B
HDMI2 40 C4 B
ⓕVendor Specific(HDMI)
None deep color (module 8bit)
INPUT MODEL NAME(HEX)
HDMI1 67 03 0C 00 10 00 80 1E
HDMI2 67 03 0C 00 20 00 80 1E
SET PC

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4.2. White Balance Adjustment
4.2.1. Overview
▪ W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel's W/B deviation
(2) How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one
of R/G/B is fixed at 192, and the other two is lowered to
find the desired value.
(3) Adjustment condition : normal temperature
1) Surrounding Temperature : 25 °C ± 5 °C
2) Warm-up time: About 5 Min
3) Surrounding Humidity : 20 % ~ 80 %
4) Before White balance adjustment, Keep power on
status, don’t power off
4.2.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux., Try to isolate adj. area into dark
surrounding
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10 cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.
4.2.3. Equipment
(1) Color Analyzer
: CA-210 (NCG: CH 9 / WCG: CH12 / LED: CH14)
(2) Adjustment Computer(During auto adj., RS-232C protocol
is needed)
(3) Adjustment Remote control
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
→ Only when internal pattern is not available
▪ Color Analyzer Matrix should be calibrated using CS-1000.
4.2.4. Equipment connection MAP
4.2.5. Adj. Command (Protocol)
<Command Format>
- LEN: Number of Data Byte to be sent
- CMD: Command
- VAL: FOS Data value
- CS: Checksum of sent data
- A: Acknowledge
Ex) [Send: JA_00_DD] / [Ack: A_00_okDDX]
▪ RS-232C Command used during auto-adjustment.
RS-232C COMMAND
[CMD ID DATA] Explanation
wb 00 00 Begin White Balance adjustment
wb 00 10 Gain adjustment(internal white pattern)
wb 00 1f Gain adjustment completed
wb 00 20 Offset adjustment(internal white pattern)
wb 00 2f Offset adjustment completed
wb 00 ff End White Balance adjustment
(internal pattern disappears )
Ex) wb 00 00 → Begin white balance auto-adj.
wb 00 10 → Gain adj.
ja 00 ff → Adj. data
jb 00 c0
...
...
wb 00 1f → Gain adj. completed
*(wb 00 20(Start), wb 00 2f(end)) → Off-set adj.
wb 00 ff → End white balance auto-adj.
▪ Adj. Map
Applied Model : LC50H Chassis ALL MODELS
Adj. item Command
(lower caseASCII)
Data Range
(Hex.)
Default
(Decimal)
CMD1 CMD2 MIN MAX
Cool
R Gain j g 00 C0
G Gain j h 00 C0
B Gain j i 00 C0
R Cut
G Cut
B Cut
Medium
R Gain j a 00 C0
G Gain j b 00 C0
B Gain j c 00 C0
R Cut
G Cut
B Cut
Warm
R Gain j d 00 C0
G Gain j e 00 C0
B Gain j f 00 C0
R Cut
G Cut
B Gain
4.2.6. Adj. method
(1) Auto adj. method
1) Set TV in adj. mode using P-Only key(or POWER ON key)
2) Zero calibrate probe then place it on the center of the
Display
3) Connect Cable (RS-232C to USB).
4) Select mode in adj. Program and begin a adjustment.
5) When adj. is complete (OK Sign), check adj. status pre
mode. (Cool, Medium, Warm)
6) Remove probe and RS-232C cable to complete adj.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
START 6E A 50 A LEN A 03 A CMD A 00 A VAL A CS STOP
Color Analyzer
Computer
* Pattern Generator
RS-232C
USB to RS-232C RS-232C
Probe
Signal Source
* If TV internal pattern is used, not needed

- 12 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
(2) Manual adjustment. method
1) Set TV in Adj. mode using POWER On.
2) Zero Calibrate the probe of Color Analyzer, then place it
on the center of LCD module within 10 cm of the surface.
3) Press ADJ key → EZ adjust using adj. R/C → 7. White-
Balance then press the cursor to the right(key ►).
(When right key(►) is pressed 216 Gray internal pattern
will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
5) Adjustment is performed in COOL, MEDIUM, WARM 3
modes of color temperature.
** G-fix adjustment
Adjust modes (Cool), Fix the G gain to 172 (default data)
and change the others (G/B Gain).
Adjust two modes(Medium / Warm), Fix the one of R/G/B
gain to 192 (default data) and decrease the others.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 7.White Balance, you can select one of 2 Test-
pattern: ON, OFF. Default is inner(ON). By selecting OFF,
you can adjust using RF signal in 216 Gray pattern.
▪ Adjustment condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
: Color Analyzer(CA-210) probe should be within 10 cm
and perpendicular of the module surface (80° ~ 100°)
4.2.7. Reference (White balance Adj. coordinate and
color temperature)
▪ Luminance : 206 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode Coordinate Temp ∆uv
x y
Cool 0.271 0.270 13000 K 0.0000
Medium 0.286 0.289 9300 K 0.0000
Warm 0.313 0.329 6500 K 0.0000
▪ Standard color coordinate and temperature using CA-210(CH 14)
Mode Coordinate Temp ∆uv
x y
Cool 0.271 ± 0.002 0.270 ± 0.002 13000 K 0.0000
Medium 0.286 ± 0.002 0.289 ± 0.002 9300 K 0.0000
Warm 0.313 ± 0.002 0.329 ± 0.002 6500K 0.0000
4.2.8. White balance table
- EDGE LED module change color coordinate because of
aging time.
- Apply under the color coordinate table, for compensated
aging time.
Only march to December & Global
Model: (normal line)LGD
Aging
time
(Min)
Cool Medium Warm
x y x y x y
271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 333
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
Only January to Febuary & Global
Model: (normal line)LGD (LF5xxx, LF6xxx, LF7xxx, LF8xxx)
Aging
time
(Min)
Cool Medium Warm
x y x y x y
271 270 286 289 313 329
1 0-5 286 295 301 314 328 354
2 6-10 284 290 299 309 326 349
3 11-20 282 287 297 306 324 346
4 21-30 279 283 294 302 321 342
5 31-40 276 278 291 297 318 337
6 41-50 274 275 289 294 316 334
7 51-80 273 272 288 291 315 331
8 81-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
OS Module(AUO, INX, Sharp, CSOT, BOE) (Cool : 13000 K)
Cool Medium Warm
xyxyxy
spec 271 270 286 289 313 329
target 278 280 293 299 320 339

- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.3. HDMI ARC Function Inspection
(1) Test equipment
- Optic Receiver Speaker
- MSHG-600 (SW: 1220 ↑)
- HDMI Cable (for 1.4 version)
(2) Test method
1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
2) Check the sound from the TV Set
3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
* Remark: Inspect in Power Only Mode and check SW
version in a master equipment
4.4. EYE-Q Green Function Inspection
Step 1) Turn on the TV.
Step 2) Press 'EYE button' on the adjustment remote-control.
Step 3) Cover 'Eye Q sensor' on the front of set with your
hands, hold it for 6 seconds.
Step 4) Check "the Sensor Data" on the screen, make certain
that Data is below 10. If Data isn’t below 10 in 6
seconds, Eye Q sensor would be bad. You should
change Eye Q sensor.
Step 5) Uncover your hands from Eye Q sensor, hold it for 6
seconds.
Step 6) Check "Back Light(xxx)" on the screen, check data
increase .You should change Eye Q sensor.
5. Tool Option selection
▪ Method : Press "ADJ" key on the Adjustment remote control,
then select Tool option.
6. Ship-out mode check(In-stop)
▪ After final inspection, press "IN-STOP" key of the Adjustment
remote control and check that the unit goes to Stand-by
mode.

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
7. GND and Internal Pressure check
7.1. Method
(1) GND & Internal Pressure auto-check preparation
- Check that Power cord is fully inserted to the SET.
(If loose, re-insert)
(2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V
arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX.)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
7.2. Checkpoint
▪ TEST voltage
- GND: 1.5 KV / min at 100 mA
- SIGNAL: 3 KV / min at 100 mA
▪ TEST time: 1 sec
▪ TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &
NEUTRAL
▪ LEAKAGE CURRENT: At 0.5 mArms
8. Audio
Measurement condition:
(1) RF input: Mono, 1 KHz sine wave signal, 100 % Modulation
(2) CVBS, Component: 1 KHz sine wave signal 0.5 Vrms
9. USB S/W Download(Service only)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is older,
it didn’t work. But your downloaded version is newer, USB
data is automatically detecting. (Download Version new &
Power only mode, Set is automatically Download)
(3) Show the message “Copying files from memory”.
(4) Updating is starting.
(5) Updating completed, the TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more new than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
No. Item Min Typ Max Unit Remark
1.
Audio practical max
Output, L/R (Distortion
= 10 % max Output)
4.5 5 6 W EQ Off
AVL Off
Clear Voice Off
5.5 6 Vrms
2. Speaker
(6 Ω Impedance) 4.5 5 6 W
EQ On
AVL On
Clear Voice On

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
IC101 A5LR
I2C_1 Audio AMP
Digital Demod
IF (+/-)
Analog Demod
Tuner : I2C_2
Sub Micom
(R5F100GEAFB)
I2C 3
IR / KEY
IR
KEY I2C
HDMI MUX
LVDS
USB
SPDIF OUT
ETHERNET
USB1
USB2
OCP 1.5A
OCP 1.5A
S I D E
HDMI1 HDMI2
(ARC)
SIDE
R E A R
OPTIC
LAN
SYSTEM EEPROM
(256Kb)
51P
eMMC 5.0 (4GB) DDR3 1600 X 16 (512MB X 1EA, 256MBx1EA)
I2C 1
X_TAL 24MHz
WIFI
SUB ASS
Y
USB_WIFI
CI slot
P_TS P_TS
Rear
Tuner
S
P
D
I
F
O
U
T
(
A
R
C
)
O
P
T
I
C
BLOCK DIAGRAM
1. MTK(A5LR)

- 16 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
33Ω
+3.3V_NORMAL
3.3KΩ
TUNER
3.3 KΩ
+3.3V_NORMAL
I2C_SDA2
I2C_SCL2
I2C_SDA3
I2C_SCL3
33 Ω
+3.3V_NORMAL
3.3 KΩ
IC5600 NTP7515(AMP)
I2C_SDA1
I2C_SCL1
100 Ω
I2C_SDA4
I2C_SCL4 TUNER (Demod)
3.3 KΩ
+3.3V_NORMAL
33 Ω
IC101
A5LR
IC3000 R5F100GEAFB MICOM
IC100 NVRAM 33 Ω
33 Ω IC6900
LNB
IR / KEY/EYE
100Ω
3.3KΩ
EYE_I2C_SDA
EYE_I2C_SCL
+3.5V_ST
2. I2C

- 17 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
MTK
A5LR
F13 [DEMOD_TSCLK] F11 [DEMOD_TSSYNC] G13 [DEMOD_TSVAL]
LNB
IC6900
DT1803
10 [TONECTRL] 2 [LNB] 7 [SCL] 8 [SDA]
G18[OPCTRL11] F18[OPCTRL12]
D27 [ADCINP_DEMOD] D28 [ADCINN_DEMOD] G26[CVBS0P]
CI_MDI[0-7]
CI Slot
CI_MDO[0-7]
EB_DATA[0-7] CI_DATA[0-7] EB_ADDR[0-14] CI_ADDR[0-14]
/CI_CD1# /CI_CD2#
CI 5V
Power detect
PCM_5V_CTL +5V_CI_ON
CI_TS_SYNC
CI_TS_VAL
CI_TS_CLK
TPI_SOP
TPI_VAL TPI_CLK
CI_MDI[0-7]
E3-C6
TPI_DATA[0-7] CI_MDO[0-7]
/CI_CD1# /CI_CD2#
G1[SPI_CLK1]
CI_MCLKI CI_MIVAL CI_MISTRT
D12[CI_TSCLK] CI_CE1#
10K Ω
D11[SPI_DATA]
C10[SPI_CLE]
/CI_IOWR# /CI_IORD#
D2-E4
D1-D7
CI_ADDR[0-14] CI_DATA[0-7]
B2[CI_RST]
C9[PVR_TSDATA1]
B11[PVR_TSDATA0]
E12[CI_TSVAL]
F4[CI_TSSYNC]
F10[PVR_TSSYNC]
E10[PVR_TSCLK]
E11[CI_TSDATA0]
CI_MCLKO
CI_MOVAL
CI_MOSTRT
CI_RESET /CI_WAIT#
/CI_IREQ#
/CI_OE# /CI_WE# VCC
M22[OPCTRL6]
+3.3V_NORMAL
TDJM- G301D
[FE_DEMOD1_TS_ERROR_TU] 12
[FE_DEMOD1_1_TS_CLK] 14
[FE_DEMOD1_TS_SYNC] 15
[FE_DEMOD1_TS_VAL] 16
FE_DEMOD1_TS_DATA[0] 17 FE_DEMOD1_TS_DATA[1] 18 FE_DEMOD1_TS_DATA[2] 19 FE_DEMOD1_TS_DATA[3] 20 FE_DEMOD1_TS_DATA[4] 21 FE_DEMOD1_TS_DATA[5] 22 FE_DEMOD1_TS_DATA[6] 23 FE_DEMOD1_TS_DATA[7] 24
+1.2V_Demod_Core
[+3.3V_LNA_TU] 1
[LNB_TX] 29
[LNB_OUT] 31
[I2C_SCL4_TU] 27
[I2C_SDA4_TU] 30
+3.3V_NORMAL
[I2C_SCL2_TU] 4
[I2C_SDA2_TU] 5
[TU_SIF_TU] 8
[TU_CVBS_TU] 9
[IF_AGC_TU] 3
[/TU_RESET1_TU] 25
FILTER
FE_DEMOD1_TS_CLK FE_DEMOD1_TS_SYNC FE_DEMOD1_TS_VAL
FE_DEMOD1_TS_DATA [0-7]
LNB_TX
I2C_SCL4
I2C_SDA4 33Ω
33 Ω
LNB_OUT
IF_P
IF_N
TUNER_SIF
TU_CVBS
IF_AGC
ADCN_P_DEMOD
ADCN_N_DEMOD
I2C_SCL2
I2C_SDA2 33 Ω
/TU_RESET1
E15[OSCL1] D15[OSDA1]
E13 [DEMOD_RST]
G28[CVBS1P]
F15[IF_AGC]
CAM_CD1_N
TPI_DATA[0-7]
+3.3V_NORMAL
3.3KΩ
FE_DEMOD1_TS_ERROR
B4[CI_MCLKI]
H5[CI_MIVAL]
D4[CI_MISTRT]
[+3.3V_TUNER] 11
[3.3V_Demod_TU] 26
[1.2V_D_Demod_Core] 28
[IF_P] 6
[IF_N] 7
F12 [DEMOD_TSDATA0] J6 [GPIO42] J7 [GPIO43] G11 [GPIO44] H11 [GPIO45] H12 [GPIO46] G12 [GPIO47] E14 [RF_AGC]
C11[SPI_CLK]
CI_IOWR# /CI_IOWR#
CI_IORD# /CI_IORD#
/CI_WAIT#CI_WAIT#
D10[CI_INT] /CI_REG#
CI_REG# /CI_REG#
47 Ω
/CI_OE#CI_OE# /CI_WE#CI_WE# /CI_IREQ#
CI_RESET
TPO_DATA[0-7]
D3-C4
TPO_DATA[0-7]
+5V_CI_ON
3. TUNER / CI

- 18 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
13.2V
PSU
AMP
3.4V_Normal
Switch circuit
(TR+FET)
TPS56428
(4A)
WIFI
TPS65282REGR
(4A)
USB1
USB2
BD86106EFJ
(6A) A5LR_Core
Panel Vcc Switch circuit (TR+FET) Panel
AZ1117EH_ADJ
(1A)
TJ2132
(2A)
EmmC
TUNER
D_Demod_Core
IR/KEY
Micom
A5LR
Tuner
AMP
Earphone
AMP
NVRAM
OPTIC
JACK
SCART OPAMP
EmmC
Scart Out
Buffer IC
DC DC Converter
LDO
3.4V
3.4V
1.2V
13V
OCP_AP2191WG
(1.6A)
1.8V
1.2V
TJ2132
(2A)
DDR
1.5V
0.6A
0.3A
1A
0.5A
2.4A 0.72A 1.8A
0.63A
2.86A
0.3A
1.5A 1.5A
1.56A
Other Device
4. POWER

- 19 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
502
500
900
901
521
400
800
540
401
571 570
120
530
LV1
A2 A10
Set + Stand
200

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TPO_DATA[4]
TPI_DATA[6]
TPI_DATA[7]
TPO_DATA[7]
TPI_DATA[0]
TPI_DATA[2]
TPI_DATA[5]
TPO_DATA[6]
TPO_DATA[1]
TPO_DATA[3]
TPO_DATA[2]
TPO_DATA[0]
TPI_DATA[1]
TPI_DATA[3]
TPI_DATA[4]
TPO_DATA[5]
R139
10K
NON_EU
R131
1K
PWM1_PULL_DOWN_1K
EB_ADDR[13]
EB_DATA[4]
CI_RESET
+3.3V_TUNER
COMP1_DET
I2C_SCL4
TPI_DATA[0-7]
CI_WE#
I2C_SCL1
OPCTRL3
C101
5pF
50V
USB_DM2
TP129
TP113
EB_DATA[0]
R101
4.7K
OPT
TPO_VAL
XTAL_OUT
TPO_SYNC
+3.3V_TUNER
TP145
FE_DEMOD1_TS_DATA[5]
XTAL_IN
R123
10K
NON_L/D
TP144
+3.3V_NORMAL
TP146
TP115
C107
0.1uF
USB_DP1
I2C_SCL3
EB_DATA[2]
SC_DET
TP111
TP126
R142 0
OPT
PWM_DIM
5V_HDMI_3
SMARTCARD_RST/SD_EMMC_DATA[2]
SC_DET
AV1_CVBS_DET
EB_ADDR[12]
CI_CE1#
R126 24K
1%
TP102
DVDD18_EMMC
TPO_CLK
R143
4.7K
OPT
R114
3.3K
LED_PWM0
TP125
SMARTCARD_PWR_SEL/SD_EMMC_DATA[1]
SC_ID_SOC
I2C_SDA1
CI_CE1#
TP135
TP106
I2C_SCL2
5V_HDMI_1
TP128
EB_ADDR[0]
R144
4.7K
OPT
5V_HDMI_3
I2C_SCL1
TP199
TP100
CI_CD1#
CI_REG#
VDD3V3
EB_DATA[5]
EPHY_RDP
TP109
5V_HDMI_1
C103
4.7uF
10V
R108
10K
+3.3V_NORMAL
TP132
WIFI_DM
FE_DEMOD1_TS_DATA[3]
EB_ADDR[14]
C102
1uF
10V
EB_ADDR[5]
/TU_RESET2
FE_DEMOD1_TS_CLK
C110
0.1uF
R107
10K
OPT
R133
4.7K
OPT
CI_RESET
EB_DATA[6]
TP147
TP103
TP104
C100
5pF
50V
CI_WAIT#
/USB_OCD1
EB_DATA[7]
TP141
EMMC_CMD
I2C_SDA1
VDD3V3
+3.3V_NORMAL
TPO_DATA[0-7]
CI_CD1#
PCM_5V_CTL
TP116
EB_DATA[6]
TPI_SYNC
/USB_OCD2
R111 33
C111
0.1uF
EMMC_DATA[2]
EB_ADDR[6]
+3.3V_NORMAL
MODEL_OPT_13
+3.3V_NORMAL
EB_ADDR[9]
CI_CD2#
SOC_RX
TP136
X100
24MHz
4GND_2 1
X-TAL_1
2
GND_1 3X-TAL_2
TP150
R117
3.3K
R102
10K
OPT
WIFI_DP
EB_ADDR[9]
TPI_CLK
I2C_SDA1
R103
10K
EPHY_RDN
TP119
TPI_DATA[0-7]
EB_DATA[4]
EMMC_DATA[6]
EB_ADDR[13]
EB_DATA[0]
USB_CTL2
TP110
TP108
TPI_SYNC
CI_IREQ#
TPO_SYNC
FE_DEMOD1_TS_DATA[2]
TPI_CLK
FE_DEMOD1_TS_VAL
C108
0.1uF
EMMC_RST
TP114
TP101
EB_ADDR[4]
VDD3V3
TP142
/TU_RESET1
EB_ADDR[8]
EMMC_DATA[1]
EB_ADDR[11]
TP131
R104
4.7K
OPT
R118
3.3K
I2C_SCL3
R141
1K
L/DIM0_MOSI
CI_WAIT#
R112 33
VDD3V3
MODEL_OPT_12
AMP_RESET_N
TP127
R120 33
L/D
EB_DATA[2]
OPCTRL3
TP138
EMMC_CLK
FE_DEMOD1_TS_DATA[4]
EB_ADDR[7]
R119 33
L/D
C104
4.7uF
10V
EB_ADDR[11]
IC100
AT24C256C-SSHL-T
NVRAM_ATMEL
3
A2
2
A1
4
GND
1
A0
5SDA
6SCL
7WP
8VCC
LED_PWM1
R125 4.7K
TP148
R124
10K
NON_L/D
R140
10K
NON_JP
R100
4.7K
OPT
FE_DEMOD1_TS_SYNC
EB_DATA[3]
SMARTCARD_RST/SD_EMMC_DATA[2]
TPO_VAL
CI_CD2#
L/DIM0_VS
EB_ADDR[4]
I2C_SDA2
TP123
EB_DATA[5]
USB_DM1
CI_REG#
EB_ADDR[3]
LED_PWM1
TPI_VAL
TP130
SMARTCARD_CLK/SD_EMMC_DATA[0]
TP117
CI_IOWR#
CI_IREQ#
EB_ADDR[2]
R106
10K
PCM_5V_CTL
EB_ADDR[0] TP134
XTAL_OUT
TP139
CI_OE#
R109
1.8K
TU_M/W
CI_OE#
I2C_SCL1
EPHY_TDP
EB_ADDR[12]
EB_ADDR[1]
VDD3V3
SMARTCARD_PWR_SEL/SD_EMMC_DATA[1]
R138
10K
NON_EU
TP112
SMARTCARD_CLK/SD_EMMC_DATA[0]
USB_DP2
TP149
R110
1.8K
TU_M/W
EMMC_DATA[4]
FE_DEMOD1_TS_DATA[0]
CI_IORD#
EB_DATA[7]
TP120
EB_ADDR[3]
C109
0.1uF
FE_DEMOD1_TS_DATA[1]
XTAL_IN
SOC_TX
CI_IORD#
EB_ADDR[14]
USB_CTL1
EMMC_DATA[3]
FE_DEMOD1_TS_DATA[6]
TP198
TP137
TPO_CLK
I2C_SDA4
TP124
EB_ADDR[10]
I2C_SDA3
SMARTCARD_DATA/SD_EMMC_CLK
L/DIM0_SCLK
LED_PWM0
/TU_RESET2
EB_ADDR[7]
TP143
TP121
EMMC_DATA[7]
SMARTCARD_DET/SD_EMMC_DATA[3]
R136 PWM_DIM2
22
SMARTCARD_DET/SD_EMMC_DATA[3]
R135 22
PWM_DIM2
I2C_SCL4
I2C_SDA3
TPI_VAL
EB_DATA[3]
TP140
SC_ID_SOC
EB_ADDR[2]
CI_IOWR#
TPO_DATA[0-7]
EB_ADDR[6]
SMARTCARD_DATA/SD_EMMC_CLK
CI_WE#
TP107
+3.3V_NORMAL
R130
4.7K
OPT
C106
1uF
10V
SMARTCARD_VCC/SD_EMMC_CMD
EB_ADDR[8]
EPHY_TDN
EMMC_DATA[0]
R122
10K
NON_L/D
SMARTCARD_VCC/SD_EMMC_CMD
EB_ADDR[5]
R134
1K
PWM2_PULL_DOWN_1K
TP133
EB_DATA[1]
+3.3V_NORMAL
R199
1K
EB_DATA[1]
EB_ADDR[1]
I2C_SDA4
TP118
EMMC_DATA[5]
R113
3.3K
EB_ADDR[10]
R121 33
L/D
TP105
R105
10K
OPT
+3.3V_NORMAL
C112
0.1uF
C105
0.1uF
16V
R137
10K
OPT
R128
22 SOC_RESET
R115
1.8K R116 1.8K
IC100-*1
BR24G256FJ-3
NVRAM_ROHM
3
A2
2
A1
4
GND
1
A0
5SDA
6SCL
7WP
8VCC
IC101
LGE5221(A5LRA0)
DEV
OSDA0
AE26
OSCL0
AH26
XTALI
B28
XTALO
B27
AVDD33_REG_STB
J22
VCC3IO_EMMC
J1
AVDD33_RGB_STB
H24
AVSS33_RGB
K21
AVDD33_PLL_STB
J23
AVDD10_LDO
U25
AVDD10_ELDO
Y26
USB_DP_P0
B12
USB_DM_P0
A12
USB_DP_P1
C13
USB_DM_P1
D13
USB_DP_P2
D14
USB_DM_P2
C14
USB_DP_P3
AD28
USB_DM_P3
AD27
AVDD33_USB
F23
U0TX T25
U0RX T24
POWE__B J2
POOE__B N7
POCE1__B M7
POCE0__B L7
PDD7 P3
PDD6 N1
PDD5 N2
PDD4 N4
PDD3 M3
PDD2 L1
PDD1 N6
PDD0 P6
PARB__B N5
PACLE L3
PAALE K3
EMMC_CLK P4
EMMC_RST P7
OPWRSB R26
ORESETB L25
OIRI L26
FSRC_WR AH27
TXVP_0 AB27
TXVN_0 AB26
RXVP_1 AC25
RXVN_1 AC26
PHYLED1 AA25
PHYLED0 AA26
REXT AB28
AVDD33_ETH AB25
IC101
LGE5221(A5LRA0)
DEV
CI_A0
D2
CI_A1
D1
CI_A2
C3
CI_A3
C1
CI_A4
C2
CI_A5
B1
CI_A6
A1
CI_A7
A2
CI_A8
C5
CI_A9
B5
CI_A10
D6
CI_A11
A5
CI_A12
A3
CI_A13
D5
CI_A14
E4
CI_MCLKI
B4
CI_MIVAL
H5
CI_MISTRT
D4
CI_MDI0
D3
CI_MDI1
E5
CI_MDI2
F5
CI_MDI3
H6
CI_MDI4
H4
CI_MDI5
A4
CI_MDI6
B3
CI_MDI7
C4
CI_D0
E1
CI_D1
E2
CI_D2
G3
CI_D3
D9
CI_D4
B9
CI_D5
B8
CI_D6
B7
CI_D7
D7
CI_MDO0
E3
CI_MDO1
F3
CI_MDO2
G2
CI_MDO3
A9
CI_MDO4
A8
CI_MDO5
A7
CI_MDO6
C7
CI_MDO7
C6
OPCTRL0
P26
OPCTRL1
P25
OPCTRL2
P24
OPCTRL3
N24
OPCTRL4
M24
OPCTRL5
M23
OPCTRL6
M22
OPCTRL7
K23
OPCTRL8
L23
OPCTRL9
E20
OPCTRL10
D20
OPCTRL11
G18
OPCTRL12
F18
DEMOD_RST E13
DEMOD_TSCLK F13
DEMOD_TSDATA0 F12
DEMOD_TSSYNC F11
DEMOD_TSVAL G13
CI_INT D10
CI_TSCLK D12
CI_TSDATA0 E11
CI_TSSYNC F4
CI_TSVAL E12
CI_RST B2
PVR_TSCLK E10
PVR_TSVAL A11
PVR_TSSYNC F10
PVR_TSDATA0 B11
PVR_TSDATA1 C9
SPI_CLK1 G1
SPI_CLK C11
SPI_DATA D11
SPI_CLE C10
OPWM2 AE25
OPWM1 AG26
OPWM0 AF26
SD_D0 K4
SD_D1 L5
SD_D2 L4
SD_D3 L6
SD_CMD K5
SD_CLK H1
VCC3IO_SD H2
LED_PWM0 R22
LED_PWM1 R24
GPIO42 J6
GPIO43 J7
GPIO44 G11
GPIO45 H11
GPIO46 H12
GPIO47 G12
ADIN0_SRV K24
ADIN1_SRV L24
ADIN2_SRV J24
ADIN3_SRV E28
ADIN4_SRV F25
ADIN5_SRV F26
ADIN6_SRV H25
ADIN7_SRV H26
2014.11.01
1
MAIN1
A5LR_Bring_Up
Near SoC
0
0ICE mode + 24M + serial boot
Near SoC
OPCTRL3
0
NVRAM
I2C_1 : AMP, L/D, NVM, TCON
I2C_2 : TUNER
I2C_3 : MICOM
I2C_4 : S/Demod,T2/Demod, LNB
1
ICE moce + 24M + ROM to 60bit ECC Nand boot
CI_VS1#
Write Protection
- Low : Normal Operation
- High : Write Protection
0
LED_PWM0
0
1
0
X-TAL
I2C
ICE moce + 24M + ROM to eMMC boot from
eMMC pins(share pins w/s NAND)
STRAPPING
0
LED_PWM1
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only