LG 43LF5900 User manual

Printed in KoreaP/NO : MFL69272001 (1506-REV00)
CHASSIS : LT50H
MODEL : 43LF5900 43LF5900-DB
43LF590T 43LF590T-DB
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
BLOCK DIAGRAM ................................................................................. 14
EXPLODED VIEW .................................................................................. 19
SCHEMATIC CIRCUIT DIAGRAM ............................................APPENDIX
TROUBLE SHOOTING..............................................................APPENDIX

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Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This spec sheet is applied to the TV used LT50H chassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC(77±9ºF), CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Standard input voltage (100~240V@ 50/60Hz)
* Standard Voltage of each products is marked by models.
* Taiwan : 110V 60Hz
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC: CE, IEC
4. Model Specification
No Item Specication Remark
1. Market Taiwan, Colombia, Panama
2. Broadcasting system Digital : DVB-T/T2
Analog : NTSC-M / PAL-M / PAL-N
Taiwan: NTSC-M / Colombia : DVB-T/T2
3. Available Channel BAND NTSC
VHF
UHF
DTV
CATV
2 ~ 13
14 ~ 69
2 ~ 69
1 ~ 125
4. Receiving system Digital : DVB-T/T2
Analog : NTSC-M / PAL-M / PAL-N
Taiwan: NTSC-M / Colombia : DVB-T/T2
5. Video Input NTSC-M Rear 1EA (Common AV/Component)
6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear 1EA
7. RGB Input RGB-PC, Spec out
8. HDMI Input PC(HDMI version 1.3) / DTV format, Support
HDCP
Side 2EA
Support ARC only HDMI1
9. Audio Input Component / AV Audio / DVI Audio, Rear 1EA(Common Component / AV / DVI)
10 SPDIF out(1EA) Optical Audio out Rear (1EA)
11 USB Input(2EA) EMF, DivX HD, For SVC (download) Side 2EA
JPEG, MP3, DivX HD

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5. External Input Support Format
5.1. Component (Y, PB, PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.50 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.00 SDTV 480P
5. 720*576 15.625 50* 13.5 SDTV 576I
6. 720*576 31.25 50* 13.5 SDTV 576P
7. 1280*720 37.5 50* 74.25 HDTV 720P
8. 1280*720 45.00 60.00 74.25 HDTV 720P
9. 1280*720 44.96 59.94 74.176 HDTV 720P
10. 1929*1080 28.125 50* 74.25 HDTV 1080I
11. 1920*1080 33.75 60.00 74.25 HDTV 1080I
12. 1920*1080 33.72 59.94 74.176 HDTV 1080I
13. 1920*1080 56.25 50* 148.5 HDTV 1080P
14. 1920*1080 67.50 60 148.50 HDTV 1080P
15. 1920*1080 67.432 59.94 148.352 HDTV 1080P
16. 1920*1080 27.00 24.00 74.25 HDTV 1080P
17. 1920*1080 26.97 23.976 74.176 HDTV 1080P
18. 1920*1080 33.75 30.00 74.25 HDTV 1080P
19. 1920*1080 33.71 29.97 74.176 HDTV 1080P

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5.2. HDMI : EDID DATA : Refer to adjust specification
5.2.1. DTV mode
No Resolution H-freq(kHz) V-freq.(Hz) Proposed Remark
1 640 x 480 31.46 59.94 SDTV 480P
2 640 x 480 31.5 60.00 SDTV 480P
3 720 x 480 15.73 59.94 SDTV 480I Comment Only Spec. Sheet
(Spec Out)
4 720 x 480 15.75 60.00 SDTV 480I
5 720 x 576 15.62 50.00 SDTV 576I(DVB)
6 720 x 480 31.47 59.94 SDTV 480P
7 720 x 480 31.5 60.00 SDTV 480P
8 720 x 576 31.25 50.00 SDTV 576P(DVB)
9 1280 x 720 44.96 59.94 HDTV 720P
10 1280 x 720 45 60.00 HDTV 720P
11 1280 x 720 37.5 50.00 HDTV 720P(DVB)
12 1920 x 1080 28.12 50.00 HDTV 1080I(DVB)
13 1920 x 1080 33.72 59.94 HDTV 1080I
14 1920 x 1080 33.75 60.00 HDTV 1080I
15 1920 x 1080 26.97 23.97 HDTV 1080P
16 1920 x 1080 27.00 24.00 HDTV 1080P
17 1920 x 1080 33.71 29.97 HDTV 1080P
18 1920 x 1080 33.75 30.00 HDTV 1080P
19 1920 x 1080 56.25 50.00 HDTV 1080P(DVB)
20 1920 x 1080 67.43 59.94 HDTV 1080P
21 1920 x 1080 67.5 60.00 HDTV 1080P
5.2.2. PC mode
No. Resolution H-freq(kHz) V-freq.(kHz) Proposed Remarks
1 640 x 350 @70Hz 31.46 70.09 EGA
2 720 x 400 @70Hz 31.46 70.08 DOS
3 640 x 480 @60Hz 31.46 59.94 VESA(VGA)
4 800 x 600 @60Hz 37.87 60.31 VESA(SVGA)
5 1024 x 768 @60Hz 48.36 60.00 VESA(XGA)
6 1152 x 864 @60Hz 54.34 60.05 VESA
7 1280 x 1024 @60Hz 63.98 60.02 VESA(SXGA) FHD only
8 1360 x 768 @60Hz 47.71 60.01 VESA(WXGA)
9 1920 x 1080 @60Hz 67.5 60.00 WUXGA(CEA 861D) FHD only

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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied all of the LT50H TV models,
which produced in manufacture department or similar LG TV
factory
2. Notice
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order. But it is
flexible when its factory local problem occurs.
3) The adjustment must be performed in the circumstance of
25 ±5ºC of temperature and 65±10% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes.
▪ After Receive 100% Full white pattern (06CH) then process
Heat-run
(or “8. Test pattern” condition of Ez-Adjust status)
▪ How to make set white pattern
1)Press Power ON button of Service Remocon
2)Press ADJ button of Service remocon. Select “8. Test
pattern” and, after select “White” using navigation button,
and then you can see 100% Full White pattern.
* In this status you can maintain Heat-Run useless any pattern
generator
* Notice : if you maintain one picture over 20 minutes
(Especially sharp distinction black with white pattern
-13Ch, or Cross hatch pattern – 09Ch) then it can
appear image stick near black level.
3. Adjustment items
3.1. PCB Assembly Adjustment
▪ MAC Address / ESN / Widevine / HDCP1.4 / HDCP 2.0
Download
▪ EDID (The Extended Display Identification Data)/DDC
(Display Data Channel) download
* If it is necessary, it can adjustment at Manufacture Line
You can see set adjustment status at “1. ADJUST CHECK”
of the “In-start menu”
3.2. Set Assembly Adjustment
▪ Color Temperature (White Balance) Adjustment
▪ Using RS-232C
▪ PING Test
▪ Selection Factory output option
4. PCB Assembly Adjustment
4.1. MAC Address, ESN Key and Widevine
Key download
4.1.1. Equipment & Condition
1) Play file: keydownload.exe
4.1.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.1.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process
- DETECT → MAC_WRITE → ESN_WRITE → WIDEVINE_
WRITE
4) Play : START
5) Check of result: Ready, Test, OK or NG
4.1.4. Communication Port connection
1) Connect: PCBA Jig → RS-232C Port == PC → RS-232C
Port
4.1.5. Download
1) 15Y LCD TV+MAC+Widevine+ESN Key+ HDCP1.4 and
HDCP2.0
4.1.6. Inspection
- In INSTART menu, check these keys.

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4.2. LAN PORT INSPECTION(PING TEST)
4.2.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test
Program.
*IP Number : 12.12.2.2.
4.2.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) remove LAN CABLE
4.3. ADC Adjust => No need at Assembly
line because of OPT type
* OTP mode
Automatic ADC Calibration. (Internal ADC Calibration) On the
manufacture line, OTP is used
for ADC Calibration automatically.
* External mode
Manual ADC Calibration. When OTP mode is failed, ADC
calibration should be “OK” by
using External mode.
- If you want re-adjust for ADC.
■ Enter Service Mode by pushing “ADJ” key,
■ Enter Internal ADC mode by pushing “►” key at “ADC
Calibration”
■
Adjustment protocol
Order Command Set response
(1) Inter the Adjustment mode aa 00 00 a 00 OK00x
(2) Change the Source xb 00 40 b 00 OK40x (Adjust 480i Comp1 )
(Adjust 1080p Comp1)
(3) Start Adjustment ad 00 10
(4) Return the Response OKx ( Success condition )
NGx ( Failed condition )
(5) Read Adjustment data ( main)
ad 00 20
( main )
ad 00 30
(main : component1 480i)
000000000000000000000000007c007b-
006dx
(main : component1 1080p)
000000070000000000000000007c0083
0077x
(6) Conrm Adjustment ad 00 99 NG 03 00x (Failed condition)
NG 03 01x (Failed condition)
NG 03 02x (Failed condition)
OK 03 03x (Success condition)
(7) End of Adjustment ad 00 90 d 00 OK90x

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5. Factory Adjustment
5.1. EDID (The Extended Display Identification
Data)/DDC (Display Data Channel) Download
● Summary
▪ It is established in VESA, for communication between PC
and Monitor without order from user for building user
condition. It helps to make easily use realize “Plug and Play”
function. For EDID data write, we use DDC2B protocol.
● Auto Download (No need Writing EDID data in Assembly line)
▪ After Set Tool Option, then TV turn off and on finish auto
download
* EDID data for FHD, 2D, DTS, 8Bit (43/49/55LF59 Series)
(Model name = LG TV ).
- HDMI - 1 EDID table ( 0x40, 0x1B )
-. LVDS supports 8bit ( CEA Block 0x23 :80, 0x24 : 1E)
1) HDMI 1 Check sum : 0x40, 0x1B (CEA Block 0x21 :10)
2) HDMI 2 Check sum : 0x40, 0x0B (CEA Block 0x21 :20)
* EDID data for HD.2D.DTS, 8Bit (32LF59 Series) (Model
name = LG TV )
- -HDMI-1 EDID table (0x74, 0XE2)
A. If the LVDS supports 8bit (not support Deep color) , CEA
Block 0x23 :80, 0x24 : 1E)
1) HDMI 1 Check sum : 0x74, 0XE2 (CEA Block 0x21 :10)
2) HDMI 2 Check sum : 0x74, 0XD2 (CEA Block 0x21 :20)
5.2. Adjustment Color Temperature
(White balance)
● W/B Equipment condition
CA210 : CH 14, Test signal : Inner pattern (80IRE) – LED
Module
CH18, Test signal : Inner pattern (80IRE) – ALEF
Module
● Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
※The spec of color temperature and coordinate.
All
Cool
(C50) 13,000k K X=0.271 (±0.002) Y=0.270 (±0.002) <Test signal>
- Inner pattern
for W/B adjust
- External white
pattern (80IRE,
204gray)
Medium
(0) 9,300k K X=0.286 (±0.002) Y=0.289 (±0.002)
Warm
(W50) 6,500k K X=0.313 (±0.002) Y=0.329 (±0.002)
1) RS-232C Command used during auto-adj.
RS-232C COMMAND Explanation
CMD DATA ID
Wb 00 00 Begin White Balance adj.
Wb 00 ff End White Balance adj. (internal pattern
disappears )
5.2.1. Adjustment method
5.2.2. Auto WB calibration
1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
3) Connect RS-232C Cable
4) Select mode in ADJ Program and begin a adjustment.
5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.2.3. Manual adjustment
5.2.3.1 Manual adj. method
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
3) Press ADJ key à EZ adjust using adj. R/C → 11. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 206 Gray internal pattern will be
displayed.
4) Adjust Cool modes
- Fix the one of R/G/B gain to 192 (default data) and
decrease the others. (If G gain is adjusted over 172 and R
and B gain less than 192 , Adjust is O.K.)
- If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain.

- 12 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255 or
B gain is 255
5) Adjust two modes (Medium / Warm) Fix the one of R/G/B
gain to 192 (default data) and decrease the others.
6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller
5.2.4. Reference (White Balance Adj. coordinate and
color temperature)
1) Luminance: 204 Gray, 80IRE
2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
5.2.5. Reference (White Balance Adj. coordinate and
color temperature)
1) Luminance: 204 Gray
2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode Coordinate Temp △uv
X Y
Cool 0.271 0.270 13,000K 0.0000
Medium 0.286 0.289 9,300K 0.0000
Warm 0.313 0.329 6,500K 0.0000
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
Normal line in Korea (From January to February) : LGD (LF5xxx,
LF6xxx, LF7xxx Series models)
webOS Aging time
(Min)
Cool Medium Warm
X Y X Y X Y
271 270 286 289 313 329
1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346
4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
- O/S Module(AUO, INX, Sharp, CSOT, BOE)
Cool Medium Warm
xyxyxy
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
Normal line in Korea (From March to December) : LGD (LF5xxx,
LF6xxx, LF7xxx Series models)
Normal line in GLOBAL : LGD (LF5xxx, LF6xxx, LF7xxx Series
models)
webOS Aging time
(Min)
Cool Medium Warm
X Y X Y X Y
271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
5.3. HDMI ARC Function Inspection
5.3.1. Test equipment
- Optic Receiver Speaker
- MSHG-600 (SW: 1220 ↑)
- HDMI Cable (for 1.4 version)
5.3.2. Test method
1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
2) Check the sound from the TV Set
3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
* Remark: Inspect in Power Only Mode and check SW version
in a master equipment
* Caution : Don’t push The INSTOP KEY after completing the
function inspection.

- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
6. GND and HI-POT Testing
6.1. GND & HI-POT auto-check preparation
Check the connection between set and
power cord
1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
2) Connect the AV JACK Tester
3) Controller (GWS103-4) on.
4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically
6.3. Check Point
1) Test voltage
3 Poles : GND: 1.5KV/min at 100mA / SIGNAL: 3KV/min at
100mA
2) TEST time: 1 second
3) TEST POINT
3 Poles : GND Test = POWER CORD GND and SIGNAL
CABLE GND.
Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
4) LEAKAGE CURRENT: At 0.5mArms
7. Default Service option
7.1. ADC-Set
▪ R-Gain adjustment Value (default 128)
▪ G-Gain adjustment Value (default 128)
▪ B-Gain adjustment Value (default 128)
▪ R-Offset adjustment Value (default 128)
▪ G-Offset adjustment Value (default 128)
▪ B-Offset adjustment Value (default 128)
7.2. White balance. Value
CENTER (DEFAULT)
C50 0 W50
R Gain 192 192 192
G Gain 192 192 192
B Gain 192 192 192
R Cut 64 64 64
G Cut 64 64 64
B Cut 64 64 64
8. USB DOWNLOAD (*.epk file download)
1) Put the USB Stick to the USB socket
2) Press Menu key, and move General
*before 10.2 Step. Set USB Expert Mode : Enabled
IN START > System 3 > USB Expert Mode
3) Press “number key 7” Press 7 times.
4) Select download file (epk file)
5) After download is finished, remove the USB stick. ( it will be
auto-reboot )
6) Press “IN-START” key of ADJ remote control, check the
S/W version

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
BLOCK DIAGRAM
1. MTK(A5LR) Block Diagram

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
2. I2C Block Diagram

- 16 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
3. Tuner /CI Block Diagram (TDJM-K301F,B301F)

- 17 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
3-1. Tuner /CI Block Diagram (TDJM-T301F)

- 18 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.Power Block Diagram

- 19 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
200
521
400
800
540
401
120 570
571
530
500 502
900
901
LV1
A2 A10
Set + Stand

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TPO_DATA[4]
TPI_DATA[6]
TPI_DATA[7]
TPO_DATA[7]
TPI_DATA[0]
TPI_DATA[2]
TPI_DATA[5]
TPO_DATA[6]
TPO_DATA[1]
TPO_DATA[3]
TPO_DATA[2]
TPO_DATA[0]
TPI_DATA[1]
TPI_DATA[3]
TPI_DATA[4]
TPO_DATA[5]
R139
10K
NON_SCART
R131
1K
PWM1_PULL_DOWN_1K
EB_ADDR[13]
EB_DATA[4]
CI_RESET
+3.3V_TUNER
COMP1_DET
I2C_SCL4
TPI_DATA[0-7]
CI_WE#
I2C_SCL1
OPCTRL3
C101
5pF
50V
USB_DM2
TP129
TP113
EB_DATA[0]
R101
4.7K
OPT
TPO_VAL
XTAL_OUT
TPO_SYNC
+3.3V_TUNER
TP145
FE_DEMOD1_TS_DATA[5]
XTAL_IN
R123
10K
NON_L/D
TP144
+3.3V_NORMAL
TP146
TP115
C107
0.1uF
USB_DP1
I2C_SCL3
EB_DATA[2]
SC_DET
TP111
TP126
R142 0
OPT
PWM_DIM
5V_HDMI_3
SMARTCARD_RST/SD_EMMC_DATA[2]
SC_DET
AV1_CVBS_DET
EB_ADDR[12]
CI_CE1#
R126 24K
1%
TP102
DVDD18_EMMC
TPO_CLK
R143
4.7K
OPT
R114
3.3K
LED_PWM0
TP125
SMARTCARD_PWR_SEL/SD_EMMC_DATA[1]
SC_ID_SOC
I2C_SDA1
CI_CE1#
TP135
TP106
I2C_SCL2
5V_HDMI_1
TP128
EB_ADDR[0]
R144
4.7K
OPT
5V_HDMI_3
I2C_SCL1
TP199
TP100
CI_CD1#
CI_REG#
VDD3V3
EB_DATA[5]
EPHY_RDP
TP109
5V_HDMI_1
C103
4.7uF
10V
R108
10K
+3.3V_NORMAL
TP132
WIFI_DM
FE_DEMOD1_TS_DATA[3]
EB_ADDR[14]
C102
1uF
10V
EB_ADDR[5]
/TU_RESET2
FE_DEMOD1_TS_CLK
C110
0.1uF
R107
10K
OPT
R133
4.7K
OPT
CI_RESET
EB_DATA[6]
TP147
TP103
TP104
C100
5pF
50V
CI_WAIT#
/USB_OCD1
EB_DATA[7]
TP141
EMMC_CMD
I2C_SDA1
VDD3V3
+3.3V_NORMAL
TPO_DATA[0-7]
CI_CD1#
PCM_5V_CTL
TP116
EB_DATA[6]
TPI_SYNC
/USB_OCD2
R111 33
C111
0.1uF
EMMC_DATA[2]
EB_ADDR[6]
+3.3V_NORMAL
MODEL_OPT_13
+3.3V_NORMAL
EB_ADDR[9]
CI_CD2#
SOC_RX
TP136
X100
24MHz
4GND_2 1
X-TAL_1
2
GND_1 3X-TAL_2
TP150
R117
3.3K
R102
10K
OPT
WIFI_DP
EB_ADDR[9]
TPI_CLK
I2C_SDA1
R103
10K
EPHY_RDN
TP119
TPI_DATA[0-7]
EB_DATA[4]
EMMC_DATA[6]
EB_ADDR[13]
EB_DATA[0]
USB_CTL2
TP110
TP108
TPI_SYNC
CI_IREQ#
TPO_SYNC
FE_DEMOD1_TS_DATA[2]
TPI_CLK
FE_DEMOD1_TS_VAL
C108
0.1uF
EMMC_RST
TP114
TP101
EB_ADDR[4]
VDD3V3
TP142
/TU_RESET1
EB_ADDR[8]
EMMC_DATA[1]
EB_ADDR[11]
TP131
R104
4.7K
OPT
R118
3.3K
I2C_SCL3
R141
1K
L/DIM0_MOSI
CI_WAIT#
R112 33
VDD3V3
MODEL_OPT_12
AMP_RESET_N
TP127
R120 33
L/D
EB_DATA[2]
OPCTRL3
TP138
EMMC_CLK
FE_DEMOD1_TS_DATA[4]
EB_ADDR[7]
R119 33
L/D
C104
4.7uF
10V
EB_ADDR[11]
IC100
AT24C256C-SSHL-T
NVRAM_ATMEL
3
A2
2
A1
4
GND
1
A0
5SDA
6SCL
7WP
8VCC
LED_PWM1
R125 4.7K
TP148
R124
10K
NON_L/D
R140
10K
NON_JP
R100
4.7K
OPT
FE_DEMOD1_TS_SYNC
EB_DATA[3]
SMARTCARD_RST/SD_EMMC_DATA[2]
TPO_VAL
CI_CD2#
L/DIM0_VS
EB_ADDR[4]
I2C_SDA2
TP123
EB_DATA[5]
USB_DM1
CI_REG#
EB_ADDR[3]
LED_PWM1
TPI_VAL
TP130
SMARTCARD_CLK/SD_EMMC_DATA[0]
TP117
CI_IOWR#
CI_IREQ#
EB_ADDR[2]
R106
10K
PCM_5V_CTL
EB_ADDR[0] TP134
XTAL_OUT
TP139
CI_OE#
R109
1.8K
TU_M/W
CI_OE#
I2C_SCL1
EPHY_TDP
EB_ADDR[12]
EB_ADDR[1]
VDD3V3
SMARTCARD_PWR_SEL/SD_EMMC_DATA[1]
R138
10K
NON_EU
TP112
SMARTCARD_CLK/SD_EMMC_DATA[0]
USB_DP2
TP149
R110
1.8K
TU_M/W
EMMC_DATA[4]
FE_DEMOD1_TS_DATA[0]
CI_IORD#
EB_DATA[7]
TP120
EB_ADDR[3]
C109
0.1uF
FE_DEMOD1_TS_DATA[1]
XTAL_IN
SOC_TX
CI_IORD#
EB_ADDR[14]
USB_CTL1
EMMC_DATA[3]
FE_DEMOD1_TS_DATA[6]
TP198
TP137
TPO_CLK
I2C_SDA4
TP124
EB_ADDR[10]
I2C_SDA3
SMARTCARD_DATA/SD_EMMC_CLK
L/DIM0_SCLK
LED_PWM0
/TU_RESET2
EB_ADDR[7]
TP143
TP121
EMMC_DATA[7]
SMARTCARD_DET/SD_EMMC_DATA[3]
SMARTCARD_DET/SD_EMMC_DATA[3]
PWM_DIM2
I2C_SCL4
I2C_SDA3
TPI_VAL
EB_DATA[3]
TP140
SC_ID_SOC
EB_ADDR[2]
CI_IOWR#
TPO_DATA[0-7]
EB_ADDR[6]
SMARTCARD_DATA/SD_EMMC_CLK
CI_WE#
TP107
+3.3V_NORMAL
R130
4.7K
OPT
C106
1uF
10V
SMARTCARD_VCC/SD_EMMC_CMD
EB_ADDR[8]
EPHY_TDN
EMMC_DATA[0]
R122
10K
NON_L/D
SMARTCARD_VCC/SD_EMMC_CMD
EB_ADDR[5]
R134
1K
PWM2_PULL_DOWN_1K
TP133
EB_DATA[1]
+3.3V_NORMAL
R199
1K
EB_DATA[1]
EB_ADDR[1]
I2C_SDA4
TP118
EMMC_DATA[5]
R113
3.3K
EB_ADDR[10]
R121 33
L/D
TP105
R105
10K
OPT
+3.3V_NORMAL
C112
0.1uF
C105
0.1uF
16V
R137
10K
OPT
R128
22 SOC_RESET
R115
1.8K R116 1.8K
IC100-*1
BR24G256FJ-3
NVRAM_ROHM
3
A2
2
A1
4
GND
1
A0
5SDA
6SCL
7WP
8VCC
IC101
LGE5221(A5LRA0)
A5LR_A0
OSDA0
AE26
OSCL0
AH26
XTALI
B28
XTALO
B27
AVDD33_REG_STB
J22
VCC3IO_EMMC
J1
AVDD33_RGB_STB
H24
AVSS33_RGB
K21
AVDD33_PLL_STB
J23
AVDD10_LDO
U25
AVDD10_ELDO
Y26
USB_DP_P0
B12
USB_DM_P0
A12
USB_DP_P1
C13
USB_DM_P1
D13
USB_DP_P2
D14
USB_DM_P2
C14
USB_DP_P3
AD28
USB_DM_P3
AD27
AVDD33_USB
F23
U0TX T25
U0RX T24
POWE__B J2
POOE__B N7
POCE1__B M7
POCE0__B L7
PDD7 P3
PDD6 N1
PDD5 N2
PDD4 N4
PDD3 M3
PDD2 L1
PDD1 N6
PDD0 P6
PARB__B N5
PACLE L3
PAALE K3
EMMC_CLK P4
EMMC_RST P7
OPWRSB R26
ORESETB L25
OIRI L26
FSRC_WR AH27
TXVP_0 AB27
TXVN_0 AB26
RXVP_1 AC25
RXVN_1 AC26
PHYLED1 AA25
PHYLED0 AA26
REXT AB28
AVDD33_ETH AB25
IC101
LGE5221(A5LRA0)
A5LR_A0
CI_A0
D2
CI_A1
D1
CI_A2
C3
CI_A3
C1
CI_A4
C2
CI_A5
B1
CI_A6
A1
CI_A7
A2
CI_A8
C5
CI_A9
B5
CI_A10
D6
CI_A11
A5
CI_A12
A3
CI_A13
D5
CI_A14
E4
CI_MCLKI
B4
CI_MIVAL
H5
CI_MISTRT
D4
CI_MDI0
D3
CI_MDI1
E5
CI_MDI2
F5
CI_MDI3
H6
CI_MDI4
H4
CI_MDI5
A4
CI_MDI6
B3
CI_MDI7
C4
CI_D0
E1
CI_D1
E2
CI_D2
G3
CI_D3
D9
CI_D4
B9
CI_D5
B8
CI_D6
B7
CI_D7
D7
CI_MDO0
E3
CI_MDO1
F3
CI_MDO2
G2
CI_MDO3
A9
CI_MDO4
A8
CI_MDO5
A7
CI_MDO6
C7
CI_MDO7
C6
OPCTRL0
P26
OPCTRL1
P25
OPCTRL2
P24
OPCTRL3
N24
OPCTRL4
M24
OPCTRL5
M23
OPCTRL6
M22
OPCTRL7
K23
OPCTRL8
L23
OPCTRL9
E20
OPCTRL10
D20
OPCTRL11
G18
OPCTRL12
F18
DEMOD_RST E13
DEMOD_TSCLK F13
DEMOD_TSDATA0 F12
DEMOD_TSSYNC F11
DEMOD_TSVAL G13
CI_INT D10
CI_TSCLK D12
CI_TSDATA0 E11
CI_TSSYNC F4
CI_TSVAL E12
CI_RST B2
PVR_TSCLK E10
PVR_TSVAL A11
PVR_TSSYNC F10
PVR_TSDATA0 B11
PVR_TSDATA1 C9
SPI_CLK1 G1
SPI_CLK C11
SPI_DATA D11
SPI_CLE C10
OPWM2 AE25
OPWM1 AG26
OPWM0 AF26
SD_D0 K4
SD_D1 L5
SD_D2 L4
SD_D3 L6
SD_CMD K5
SD_CLK H1
VCC3IO_SD H2
LED_PWM0 R22
LED_PWM1 R24
GPIO42 J6
GPIO43 J7
GPIO44 G11
GPIO45 H11
GPIO46 H12
GPIO47 G12
ADIN0_SRV K24
ADIN1_SRV L24
ADIN2_SRV J24
ADIN3_SRV E28
ADIN4_SRV F25
ADIN5_SRV F26
ADIN6_SRV H25
ADIN7_SRV H26
IC101-*1
LGE5222(A5LRB0)
A5LR_B0
OSDA0
AE26
OSCL0
AH26
XTALI
B28
XTALO
B27
AVDD33_REG_STB
J22
VCC3IO_EMMC
J1
AVDD33_RGB_STB
H24
AVSS33_RGB
K21
AVDD33_PLL_STB
J23
AVDD10_LDO
U25
AVDD10_ELDO
Y26
USB_DP_P0
B12
USB_DM_P0
A12
USB_DP_P1
C13
USB_DM_P1
D13
USB_DP_P2
D14
USB_DM_P2
C14
USB_DP_P3
AD28
USB_DM_P3
AD27
AVDD33_USB
F23
U0TX T25
U0RX T24
POWE__B J2
POOE__B N7
POCE1__B M7
POCE0__B L7
PDD7 P3
PDD6 N1
PDD5 N2
PDD4 N4
PDD3 M3
PDD2 L1
PDD1 N6
PDD0 P6
PARB__B N5
PACLE L3
PAALE K3
EMMC_CLK P4
EMMC_RST P7
OPWRSB R26
ORESETB L25
OIRI L26
FSRC_WR AH27
TXVP_0 AB27
TXVN_0 AB26
RXVP_1 AC25
RXVN_1 AC26
PHYLED1 AA25
PHYLED0 AA26
REXT AB28
AVDD33_ETH AB25
IC101-*1
LGE5222(A5LRB0)
A5LR_B0
CI_A0
D2
CI_A1
D1
CI_A2
C3
CI_A3
C1
CI_A4
C2
CI_A5
B1
CI_A6
A1
CI_A7
A2
CI_A8
C5
CI_A9
B5
CI_A10
D6
CI_A11
A5
CI_A12
A3
CI_A13
D5
CI_A14
E4
CI_MCLKI
B4
CI_MIVAL
H5
CI_MISTRT
D4
CI_MDI0
D3
CI_MDI1
E5
CI_MDI2
F5
CI_MDI3
H6
CI_MDI4
H4
CI_MDI5
A4
CI_MDI6
B3
CI_MDI7
C4
CI_D0
E1
CI_D1
E2
CI_D2
G3
CI_D3
D9
CI_D4
B9
CI_D5
B8
CI_D6
B7
CI_D7
D7
CI_MDO0
E3
CI_MDO1
F3
CI_MDO2
G2
CI_MDO3
A9
CI_MDO4
A8
CI_MDO5
A7
CI_MDO6
C7
CI_MDO7
C6
OPCTRL0
P26
OPCTRL1
P25
OPCTRL2
P24
OPCTRL3
N24
OPCTRL4
M24
OPCTRL5
M23
OPCTRL6
M22
OPCTRL7
K23
OPCTRL8
L23
OPCTRL9
E20
OPCTRL10
D20
OPCTRL11
G18
OPCTRL12
F18
DEMOD_RST E13
DEMOD_TSCLK F13
DEMOD_TSDATA0 F12
DEMOD_TSSYNC F11
DEMOD_TSVAL G13
CI_INT D10
CI_TSCLK D12
CI_TSDATA0 E11
CI_TSSYNC F4
CI_TSVAL E12
CI_RST B2
PVR_TSCLK E10
PVR_TSVAL A11
PVR_TSSYNC F10
PVR_TSDATA0 B11
PVR_TSDATA1 C9
SPI_CLK1 G1
SPI_CLK C11
SPI_DATA D11
SPI_CLE C10
OPWM2 AE25
OPWM1 AG26
OPWM0 AF26
SD_D0 K4
SD_D1 L5
SD_D2 L4
SD_D3 L6
SD_CMD K5
SD_CLK H1
VCC3IO_SD H2
LED_PWM0 R22
LED_PWM1 R24
GPIO42 J6
GPIO43 J7
GPIO44 G11
GPIO45 H11
GPIO46 H12
GPIO47 G12
ADIN0_SRV K24
ADIN1_SRV L24
ADIN2_SRV J24
ADIN3_SRV E28
ADIN4_SRV F25
ADIN5_SRV F26
ADIN6_SRV H25
ADIN7_SRV H26
R136
100
PWM_DIM2
R135
100
2014.11.01
1
MAIN1
A5LR_Bring_Up
Near SoC
0
0ICE mode + 24M + serial boot
Near SoC
OPCTRL3
0
NVRAM
I2C_1 : AMP, L/D, NVM, TCON
I2C_2 : TUNER
I2C_3 : MICOM
I2C_4 : S/Demod,T2/Demod, LNB
1
ICE moce + 24M + ROM to 60bit ECC Nand boot
CI_VS1#
Write Protection
- Low : Normal Operation
- High : Write Protection
0
LED_PWM0
0
1
0
X-TAL
I2C
ICE moce + 24M + ROM to eMMC boot from
eMMC pins(share pins w/s NAND)
STRAPPING
0
LED_PWM1
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