LG 65NANO7 TP Series User manual

P/NO : MFL71796611 (2103-REV00)
CHASSIS : UB13D
MODEL : 65NANO7*TP*
65NANO75VPA
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
LED TV
SERVICE MANUAL
Copyright © 2021 LG Electronics Inc. All rights reserved. Only training and service purposes.
Any reproduction, duplication, distribution (including by way of email, facsimile or other electronic means),
publication, modification, copying or transmission of this Service Manual is STRICTLY PROHIBITED unless you
have obtained the prior written consent of the LG Electronics entity from which you received this Service Manual.
The material covered by this prohibition includes, without limitation, any text, graphics or logos in this Service
Manual.

- 2 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS.................................................................... 4
SPECIFICATION ....................................................................................... 6
SOFTWARE UPDATE .............................................................................. 9
BLOCK DIAGRAM.................................................................................. 11
EXPLODED VIEW .................................................................................. 12
ASSEMBLY / DISASSEMBLY GUIDE ................................................... 13
TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 3 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

- 4 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM, FET-
VOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-e󰀨ect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain o󰀨 any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges su󰀩cient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges su󰀩cient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip o󰀨 excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-o󰀨" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip o󰀨
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the a󰀨ected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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Only for training and service purposes.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LED TV used UB13D
chassis.
2. Requirement for Test
Each part is tested as below without special notice
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 2 °C
(2) Relative Humidity: 60 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance: LGE TV test method followed
(2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC specification
4. Model General Specification
No. Item Specication Remarks
1 Market Oceania / Asia / Middle East / Africa
2 Broadcasting system
(1) Digital TV : DVB-T/T2, DVB-C, DVB-S/S2
(2) Analogue TV : PAL B/B, PAL B/G, PAL D/K, PAL-I,
SECAM B/G, SECAM D/K, NTSC-M
Only *V* models supprot DVB-S/S2
3 Program coverage (1) ATV & DVB-T/T2 : 3,000EA
(2) DVB-S/S2 : 6,000EA Only *V* models supprot DVB-S/S2
4Maximum number of stor-
able programmes
1) DVB-S/S2 : 6,000
2) DVB-C, DVB-T/T2, Analogue TV : 3,000
4 Receiving system Analogue : Upper Heterodyne
Digital : COFDM, QAM
► DVB-T
- Guard Interval(Bitrate_Mbit/s): 1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-C
- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s
- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM
► DVB-S/S2
- Symbolrate :
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s
- viterbi :
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
5 HDMI Input
HDMI 1
PC / DTV Format
HDMI 2 Support ARC
HDMI 3 Depending on model
HDMI 4 Depending on model
6 USB Input My Media(Movie/Photo/Music List) or SVC
7 SPDIF out Optical Audio out
8 Headphone out All input * Depends on the model
9 Ethernet Connect
10 AV Input CVBS, Audio LR Only for INDIA

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Only for training and service purposes.
5. External Input Format
5.1. HDMI
(1) DTV mode
No. Resolution H-freq(kHz) V-freq(kHz) Pixel clock(MHz) Proposed Remarks
1 640*480 31.46 59.94 25.12 SDTV 480P
2 640*480 31.5 60 25.12 SDTV 480P
3 720*480 31.47 59.94 27 SDTV 480P
4 720*480 31.5 60 27.02 SDTV 480P
5 720*576 31.25 50 27 SDTV 576P
6 1280*720 44.96 59.94 74.17 HDTV 720P
7 1280*720 45 60 74.25 HDTV 720P
8 1280*720 37.5 50 74.25 HDTV 720P
9 1920*1080 28.12 50 74.25 HDTV 1080I
10 1920*1080 33.72 59.94 74.17 HDTV 1080I
11 1920*1080 33.75 60 74.25 HDTV 1080I
12 1920*1080 26.97 23.97 63.29 HDTV 1080P
13 1920*1080 27 24 63.36 HDTV 1080P
14 1920*1080 33.71 29.97 79.12 HDTV 1080P
15 1920*1080 33.75 30 79.2 HDTV 1080P
16 1920*1080 56.25 50 148.5 HDTV 1080P
17 1920*1080 67.43 59.94 148.35 HDTV 1080P
18 1920*1080 67.5 60 148.5 HDTV 1080P
19 1920*1080 112.5 100 297 UDTV 2160P
Not Support for FHD.
20 1920*1080 134.86 119.88 296.7 UDTV 2160P
21 1920*1080 135 120 297 UDTV 2160P
22 3840*2160 53.95 23.98 296.7 UDTV 2160P
23 3840*2160 54 24 297 UDTV 2160P
24 3840*2160 56.25 25 297 UDTV 2160P
25 3840*2160 61.43 29.97 296.7 UDTV 2160P
26 3840*2160 67.5 30 297 UDTV 2160P
27 3840*2160 112.5 50 594 UDTV 2160P
28 3840*2160 134.86 59.94 593.4 UDTV 2160P
29 3840*2160 135 60 594 UDTV 2160P
30 3840*2160 225 100 1188 UDTV 2160P 4K120 model (K6Hp HDMI
3,4 port, O20) or 8K model
31 3840*2160 269.73 119.88 1186.8 UDTV 2160P
32 3840*2160 270 120 1188 UDTV 2160P
33 4096*2160 53.95 23.98 296.7 UDTV 2160P
Not Support for FHD.
34 4096*2160 54 24 297 UDTV 2160P
35 4096*2160 56.25 25 297 UDTV 2160P
36 4096*2160 61.43 29.97 296.7 UDTV 2160P
37 4096*2160 67.5 30 297 UDTV 2160P
38 4096*2160 112.5 50 594 UDTV 2160P
39 4096*2160 134.86 59.94 593.4 UDTV 2160P
40 4096*2160 135 60 594 UDTV 2160P
41 4096*2160 225 100 1188 UDTV 2160P 4K120 model (K6Hp HDMI
3,4 port, O20) or 8K model
42 4096*2160 269.73 119.88 1186.8 UDTV 2160P
43 4096*2160 270 120 1188 UDTV 2160P
44 7680*4320 107.89 23.98 1188 8K
8K Model Only.
45 7680*4320 108 24 1188 8K
46 7680*4320 110 25 1188 8K
47 7680*4320 131.87 29.97 1188 8K
48 7680*4320 132 30 1188 8K
49 7680*4320 220 50 2376 8K
50 7680*4320 263.74 59.94 2376 8K
51 7680*4320 264 60 2376 8K

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Only for training and service purposes.
(2) PC mode
No. Resolution H-freq(kHz) V-freq(kHz) Pixel clock(MHz) Proposed Remarks
1 640*350 31.46 70.09 25.17 EGA
2 720*400 31.46 70.08 28.32 DOS
3 640*480 31.46 59.94 25.17 VESA(VGA)
4 800*600 37.87 60.31 40 VESA(SVGA)
5 1024*768 48.36 60 65 VESA(XGA)
6 1360*768 47.71 60.01 84.75 VESA(WXGA)
7 1152*864 54.34 60.05 80 VESA
8 1280*1024 63.98 60.02 109 SXGA Support to HDMI-PC
Not Support for FHD.
9 1920*1080 67.5 60 158.4 WUXGA
(Reduced Blanking)
10 1920*1080 134.86 119.88 296.7 UDTV 2160P
Not Support for FHD.
11 1920*1080 135 120 297 UDTV 2160P
12 3840*2160 53.95 23.98 296.7 UDTV 2160P
13 3840*2160 54 24 297 UDTV 2160P
14 3840*2160 56.25 25 297 UDTV 2160P
15 3840*2160 61.43 29.97 296.7 UDTV 2160P
16 3840*2160 67.5 30 297 UDTV 2160P
17 3840*2160 112.5 50 594 UDTV 2160P
18 3840*2160 134.86 59.94 593.4 UDTV 2160P
19 3840*2160 135 60 594 UDTV 2160P
20 4096*2160 53.95 23.98 296.7 UDTV 2160P
21 4096*2160 54 24 297 UDTV 2160P
22 4096*2160 56.25 25 297 UDTV 2160P
23 4096*2160 61.43 29.97 296.7 UDTV 2160P
24 4096*2160 67.5 30 297 UDTV 2160P
25 4096*2160 112.5 50 594 UDTV 2160P
26 4096*2160 134.86 59.94 593.4 UDTV 2160P
27 4096*2160 135 60 594 UDTV 2160P
28 2560*1440 88.78 59.95 241.5 3K
(UHD 60Hz models only), Sup-
port only when UHD DeepColor
is On
29 2560*1440 182.99 119.99 497.7 3K
(UHD, 8K 120Hz models only),
Support only when UHD Deep-
Color is On

- 9 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
SOFTWARE UPDATE
1. USB DOWNLOAD
(1) Plug in the USB to the TV
(2) If there are update-able files in the USB, the TV would ask
that the user want to process the SW upper version update.
(3) Click “Yes” button : Start Update
(4) Click “Check Now” : Go to SW Update menu for monitoring
(5) TV has been starting SW update
(6) After finishing the update, it will show a pop-up below the
picture.
(7) Click “Yes” : Tv will be turn off and on itself
2. NSU DOWNLOAD
(This Function is needed to connect to the internet.)
Case 1) Auto Update On
(1) Go to Menu → All Settings → Support → Software
Update, then check Auto update is turned on.
(2) After the update complete, the user can check a pop-up
below the picture, which indicated update is complete and
the new version will be applied after the TV turn off and on.
(3) If the user want to check the process of updating
[Menu → All Settings → Support → Software Update]
.

- 10 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
(4) If it needs to cancel the update, click “cancel update” button
(5) [“No”] : update continue
[“Yes”] : update cancel
Case 2) NOT Allow Automatic Updates
Toggle Item
(1) Go to Menu → All Settings → Support → Software Update
(2) If it found upper version SW than the TV SW version, TV
would show a pop-up like below the picture.
“The latest version of the SW is available for your TV. Do
you want to update now”
(3) [Yes] : update starts.
[No] : Close the pop-up, check out later
(4) If the user started the update, the TV shows a pop-up
below the picture.
(5) [CHECK NOW] : Just start the update
[Close] : Close the pop-up

- 11 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
Main IC
eMMC (8GB)
CI Slot
USB1 (2.0)
OCP USB2 (2.0)
HDMI3(2.0) HDMI2(ARC) HDMI1(2.0)
Air/ Cable
TUNER
(T2/C/A)
TUNER
(S,S2)
DVB-S
LNB
T2/C/S/S2 H
H
-
H
-
NIM tuner
IF (+/-)
P_TS_OUT
P_TS_IN
MICOM
IR / KEY
USB_WIFI
X_TAL
27MHz
Sub Assy
LAN
ETHERNET
SPDIF
AV/COMP CVBS/YPbPr
SPDIF OUT
H/PAMP
RS-232 MAX323
MAIN Audio AMPI2S Out
I2C 0
Vx1 51P (8 lane)
Vx1 / EPI/ CEDS
FCIC SPI/ I2C 3
Main
PMIC
IF_S
IF
GST/MCLK/GCLK/EO/I2C 6 NVRAM (256Kb)
I2C_5
I2C 1/2
EPI block
IQ (+/-), IP(+/-)
TS
EPI 60P (65”:8 lane, 55”↓:6lane), CEDS 68P
Area OPT
USB_WIFI
1.5V
DDR
0.96V
Core&CP
U
3.3V
Normal
1.0V
Eth
3.5V
ST_B
Y
1.8V
5V
Normal
Sub
PMIC
0.96V1.5V 3.3V 5V
1V 1.8V 3.5V_ST
0.95V1.5V
3.3V
13V
3.3V
5V
5V
1V
1.8V
1.8V
3.5V_ST
3.5V_ST
3.3V
3.5V_ST
3.5V_ST
13V 3.5V_ST13V
3.5V_ST
13V
3.3V 13V
13V3.3V
13V(PANEL_VCC)
13V(PANEL_VCC)
To Panel
From
Power
B/D
13V
Signal flow
SuppliedVoltage
In/output Voltage
To WIFI/BT
Combo
eMMC
CLK/DATA/STRB
48bit
DDR3 2133 x16
(512MB X 3EA)
I2C 2
BLOCK DIAGRAM

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Only for training and service purposes.
400
540
200
LV1
200A
570
120
HS1
HW1
500
800
810
810
121
LV2
820
901
902
411
HP1
AR2 A10 700
530
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

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Only for training and service purposes.
ASSEMBLY / DISASSEMBLY GUIDE (SET)
[Back Cover Disassembly Guide]
(1) Lay the set on a flat Pad. And than remove Screw.
(2) Recognize B/C Latch Points, and ready remove B/C.
B/C Assembly = Module (Holder) + B/C (Curling)
Holder
Rear Cover Curling shape
275mm 226mm
282mm
303mm
Holder 8 Points
Screw M3xL5.5 (Machine) 6 Points
Screw M4xL10 (Taptite) 6 Points
Latch 2 Points

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Only for training and service purposes.
(3) Lift the Back Cover with Stripper to make space between Back Cover and Module. Disassemble the
back cover and module while moving the stripper in the direction of the arrow. (from bottom to top)
* Stripper direction to remove : from bottom to top
(4) Lift the Back Cover with Stripper to make space between Back Cover and Module. Disassemble the
back cover and module while moving the stripper in the direction of the arrow. (from Left to Right)
* Stripper direction to remove direction : from bottom to top
Left Right
<Step1>
Up
Stripper
<Step2>
Up
Stripper
<Step1>
Up
Stripper
<Step2>
Up
Stripper
Top (Stripper direction Left → Right)
Stripper Stripper
In In
<Step1> <Step2>

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Only for training and service purposes.
<Step1> <Step2>
600~800mm
600~800mm
(5) Lift the rear Cover with Stripper to make space between rear Cover and Module. Disassemble the rear
cover and module while moving the stripper in the direction of the arrow. (from Right to Center)
* Stripper direction to remove direction : from Right to Center
Stripper
In
<Step1>
Stripper
In
Stripper
In
<Step2>
(6) Two people grasp rear Cover and remove rear Cover.
-. Grasp position : 600~800mm

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Only for training and service purposes.
(7) rear Cover handling is refer to next Page rear cover handling guide.

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Only for training and service purposes.
[Back Cover Latch assemble Guide]
(1) After put the Back Cover on the module, push latch point in Back Cover curved area. (refer. Picture)
- Push slope direction of Back cover for preventing faulty appearance
(2) Confirm Latch Assemble part (If Latch is not assemble, Gap and lifting are made.)
Gap between B/C and
Module
Direction of PUSH [ 65NANO75 ]
275mm 226mm
282mm
303mm

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Only for training and service purposes.
[Assemble Guide]
1. Attach the INSULATOR.
2. Assemble/Fix the VESA BRACKET + MODULE.
3. Assemble/Fix the STAND SUPPORTER + MODULE.
4. Assemble SPEAKER + MODULE.
(Press the edge of mark rubbing it using palm to insert Speaker Rubber)

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Only for training and service purposes.
5. Assemble/Fix the POWER / MAIN PCB + MODULE.
6. Assemble /Fix the BOTTOM REAR COVER + MODULE.
(Press and hold both end latches)
(Press and hold both end latches)

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Only for training and service purposes.
7. When Attach the tape for fixing Harness at Module, Rub the tape 2~3 times for adhering totally.
8. Assemble/Fix the REAR COVER + MODULE.
(Press the edge of mark rubbing it using palm to insert holder)
275mm 226mm
282mm
303mm