LG 65UJ67 V Series User manual

P/NO : MFL69832202 (1801-REV02)
CHASSIS : UD74Q
MODEL : 65UJ67*V 65UJ67*V-ZC/ZD
65UJ655V 65UJ655V-ZC
65UJ701V 65UJ701V-ZC
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
CONFIDENTIAL
Copyright © 2017 LG Electronics Inc. All rights reserved. Only training and service purposes.

- 2 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS.................................................................... 4
SPECIFICATION ....................................................................................... 6
SOFTWARE UPDATE.............................................................................. 11
BLOCK DIAGRAM ..................................................................................12
EXPLODED VIEW .................................................................................. 25
DISASSEMBLY GUIDE .......................................................................... 26
TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 3 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

- 4 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LED TV with UD74Q
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100~240 V, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance: LGE TV test method followed
(2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC specification
- Wireless : Wireless HD Specification (Option)
4. Model General Specification
No. Item Specication Remarks
1 Market EU/CIS(PAL Market-37Countries)
DTV & Analog (Total 37 countries)
DTV (MPEG2/4, DVB-T) : 26 countrie
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
France, Spain, , Belgium, Luxemburg, Greece, Czech, Turkey, Morocco,
Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania,
Bosnia, Slovakia, Belarus
DTV (MPEG2/4, DVB-T2) :11 countries
UK(Ireland), Sweden, Denmark, Finland, Norway, Ukraine, Kazakhstan,
Russia, Italy, Croatia, Serbia
DTV (MPEG2/4, DVB-C) : 37 countries
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
France, Spain, Italy, Belgium, Russia, Luxemburg, Greece, Czech, Croa-
tia, Turkey, Morocco, Ireland, Latvia, Estonia, Lithuania, Poland, Portugal,
Romania, Albania, Bosnia, Serbia, Slovakia, Belarus, UK, Sweden, Den-
mark, Finland, Norway, Ukraine, Kazakhstan
DTV (MPEG2/4,DVB-S) : 37 countries
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
France, Spain,Belgium, Luxemburg, Greece, Czech, Turkey, Morocco,
Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania,
Bosnia, Slovakia, Belarus, UK(Ireland), Sweden, Denmark, Finland, Nor-
way, Ukraine, Kazakhstan,Russia, Italy, Croatia, Serbia
Supported satellite : 35 satellites
ABS1 75.0E , AMOS 4.0W , ASIASAT3S 105.5E , ASTRA 19.2E , ASTRA
23.5E , ASTRA 28.2E , ASTRA 4.8E, ATLANTIC BIRD2 8.0W , ATLANTIC
BIRD3 5.0W , BADR 26.0E , DIRECTV-1R 56.0E , EUROBIRD 9A 9.0E ,
EUROBIRD3 33.0E , EUTELSAT 36 A/B 36.0E ,
EUTELSAT W2A 10.0E , EUTELSAT W3A 7.0E , EUTELSAT7WA 7.3W

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Only for training and service purposes.
No. Item Specication Remarks
2 Broadcasting system
1)PAL/SECAM B/G/I/D/K
SECAM L/L’
2)DVB-T/T2, C, S/S2
3 Program coverage
1 ) Digital TV
-VHF, UHF
-C-Band, Ku-Band
2) Analogue TV
-VHF : E2 to E12
-UHF : E21 to E69
-CATV : S1 to S20
-HYPER : S21 to S47
4 Receiving system Analog : Upper Heterodyne
Digital : COFDM, QAM
► DVB-T
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-C
- Symbolrate :
4.0Msymbols/s to 7.2Msymbols/s
- Modulation :
16QAM, 64-QAM, 128-QAM and 256-QAM
► DVB-S/S2
- Symbolrate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s
- 9 iterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
5 Input Voltage AC 100 ~ 240V 50/60Hz

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Only for training and service purposes.
5. External Input Format
5.1. 2D Mode
5.1.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1 720*480 15.73 59.94 13.50 SDTV ,DVD 480i
2 720*480 15.75 60.00 13.5135 SDTV ,DVD 480i
3 720*576 15.62 50.00 13.50 SDTV 576i
4 720*480 31.47 59.94 27.00 SDTV 480p
5 720*480 31.50 60.00 27.027 SDTV 480p
6 720*576 31.25 50.00 27.00 SDTV 576p
7 1280*720 44.96 59.94 74.175 HDTV 720p
8 1280*720 45.00 60.00 74.250 HDTV 720p
9 1280*720 37.50 50.00 74.250 HDTV 720p
10 1920*1080 28.12 50.00 74.250 HDTV 1080i
11 1920*1080 33.72 59.94 74.175 HDTV 1080i
12 1920*1080 33.75 60.00 74.250 HDTV 1080i
13 1920*1080 56.25 50.00 148.50 HDTV 1080p
14 1920*1080 67.43 59.94 148.350 HDTV 1080p
15 1920*1080 67.50 60.00 148.50 HDTV 1080p
5.1.2. HDMI Input (PC)
No Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed Remarks
1 640*350 31.46 70.09 25.17 EGA
2 720*400 31.46 70.08 28.32 DOS
3 640*480 31.46 59.94 25.17 VESA(VGA)
4 800*600 37.87 60.31 40.00 VESA(SVGA)
5 1024*768 48.36 60.00 65.00 VESA(XGA)
6 1152*864 54.34 60.05 80.00 VESA
7 1360*768 47.71 60.01 85.00 VESA(WXGA)
8 1280*1024 63.98 60.02 109.00 VESA(SXGA) FHD, UHD only
9 1920*1080 67.50 60.00 158.40 WUXGA(CEA 861D) FHD, UHD only
10 3840*2160 54.00 24.00 297.00 UDTV 2160P UHD only
11 3840*2160 56.25 25.00 297.00 UDTV 2160P UHD only
12 3840*2160 67.50 30.00 297.00 UDTV 2160P UHD only
13 4096*2160 53.95 23.97 296.703 UDTV 2160P UHD only
14 4096*2160 54.00 24.00 297.00 UDTV 2160P UHD only

- 9 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
5.1.3. HDMI Input (DTV)
No Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed Remarks
1 640*480 31.46 59.94 25.13 SDTV 480P
2 640*480 31.50 60.00 25.13 SDTV 480P
3 720*480 15.73 59.94 13.50 SDTV, DVD 480I(525I)
Spec. out but display4 720*480 15.75 60.00 13.51 SDTV, DVD 480I(525I)
5 720*576 15.62 50.00 13.50 SDTV, DVD 576I(625I) 50Hz
6 720*480 31.47 59.94 27.00 SDTV 480P
7 720*480 31.50 60.00 27.03 SDTV 480P
8 720*576 31.25 50.00 27.00 SDTV 576P
9 1280*720 44.96 59.94 74.18 HDTV 720P
10 1280*720 45.00 60.00 74.25 HDTV 720P
11 1280*720 37.50 50.00 74.25 HDTV 720P
12 1920*1080 28.12 50.00 74.25 HDTV 1080I
13 1920*1080 33.72 59.94 74.18 HDTV 1080I
14 1920*1080 33.75 60.00 74.25 HDTV 1080I
15 1920*1080 26.97 23.97 63.30 HDTV 1080P
16 1920*1080 27.00 24.00 63.36 HDTV 1080P
17 1920*1080 33.71 29.97 79.12 HDTV 1080P
18 1920*1080 33.75 30.00 79.20 HDTV 1080P
19 1920*1080 56.25 50.00 148.50 HDTV 1080P
20 1920*1080 67.43 59.94 148.35 HDTV 1080P
21 1920*1080 67.50 60.00 148.50 HDTV 1080P
22 3840*2160 53.95 23.98 297.00 UDTV 2160P UHD only
23 3840*2160 54.00 24.00 297.00 UDTV 2160P UHD only
24 3840*2160 56.25 25.00 297.00 UDTV 2160P UHD only
25 3840*2160 61.43 29.97 297.00 UDTV 2160P UHD only
26 3840*2160 67.50 30.00 297.00 UDTV 2160P UHD only
27 3840*2160 112.50 50.00 594.00 UDTV 2160P(DVB) UHD only
28 3840*2160 134.86 59.94 593.41 UDTV 2160P UHD only
29 3840*2160 135.00 60.00 594.00 UDTV 2160P UHD only
30 4096*2160 53.95 23.98 297.00 UDTV 2160P UHD only
31 4096*2160 54.00 24.00 297.00 UDTV 2160P UHD only
32 4096*2160 56.25 25.00 297.00 UDTV 2160P UHD only
33 4096*2160 61.43 29.97 297.00 UDTV 2160P UHD only
34 4096*2160 67.50 30.00 297.00 UDTV 2160P UHD only
35 4096*2160 112.50 50.00 594.00 UDTV 2160P(DVB) UHD only
36 4096*2160 134.86 59.94 593.41 UDTV 2160P UHD only
37 4096*2160 135.00 60.00 594.00 UDTV 2160P UHD only

- 10 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
5.2. 3D Mode - DTV/HDMI/USB
5.2.1. RF Input
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed 3D input proposed mode
1 1280*720 37.50 50 74.25 HDTV 720P 2D to 3D, Side by Side,
Top & Bottom
2 1920*1080 28.13 50 74.25 HDTV 1080I 2D to 3D, Side by Side,
Top & Bottom

- 11 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
1. USB
(1) Insert the USB memory Stick to the USB port.
(2) Automatically detect the SW Version and show the below
message
(3) Click [YES]: initiate the download and install of the update.
(4) Click [Check Now]: move to “About This TV” page for
update.
(5) TV is updating.
(6) After finished the update, below Pop-up appear.
(7) Click [Yes] : TV will be DC OFF -> ON
(8) After TV turned on, Check the updated SW Version and
Tool Option.
2. NSU
(1) Menu -> All Settings -> General -> About This TV
(2) Click [CHEK FOR UPDATES] : system check newest
version
(3) Click [DOWNLOAD AND INSTALL]
(4) TV is updating
(5) After finished the update, below Pop-up appear
(6) Turn OFF the TV and On. Check the updated SW Version
and Tool Option
SOFTWARE UPDATE

- 12 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
Realtek
K3Lp
DDR3 2133 X 32
(512MB X 2EA)
Hynix 20nm
DDR3 2133 X 32
(512MB X 2EA)
eMMC (4GB) Toshiba 15nm
CI Slot
B-CAS (JAPAN)
B-CAS controller
SMARTCARD_I/F
USB2 (2.0)
OCP USB3 (2.0)
HDMI3 HDMI2(ARC)
HDMI1
Air/ Cable
DVB-S
LNB
(DT1805)
REAR(H)
P_TS_OUT
P_TS_IN
Sub Micom (RENESAS R5F100GEAFB)
X_TAL 32.768KHz
I2C 1
USB_WIFI
X_TAL 27MHz
Sub Assy
LAN
ETHERNET
SPDIF
A
V/COMP CVBS/YPbPr
SPDIF OUT
H/P AMP
RS-232
MAX323
MAIN Audio AMP
(DTA2010M)
I2S Out I2C 4
Vx1 51P (8 lane) : LGD 60/65/70/75
Vx1 / EPI
I2C 6
EPI PMIC (SW50B3A)
Level shifter
M0M1
B-CAS
I2C 6 NVRAM (256Kb)
I2C 4
I2C 2
EPI block
HDMI4 (EEPROM)
K3L only. (K3Lp 256MB x 2ea SoC �엲 󱏕嬥)
USB1 (3.0)
OCP
K3L only
IR / KEY(1Key) LOGO LIGHT(Ready)
WIFI/BT Combo MTK IC
HDMI 6G 4
EPI 60Px2 (3G, 6 lane) : LGD 43/49/55 CEDS 68Px2 (1.5G, 12 lane) : BOE
T2/C/S2 NIM tuner
TS
TS
RF IC
Demode
(T/C/S/T2/S2)
BLOCK DIAGRAM
1. K3Lp Block Diagram (External)

- 13 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
2. K3Lp Block Diagram (Internal)

- 14 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
K3L
I2C_SCL6/SDA6
Vx1 8Lane 51P
2
2
C
S
CL
6
/
S
D
A
2
C
S
CL
6
/
S
D
A
HTPDAn
Panel
3840x2160@120p
[EPI_TX0~EPI_TX15]
BIT[2/1/0] UD_V x 1 Lane
0/0/0 4K@120P(16Lanes)
0/0/1 4K@60P(8Lanes)
0/1/0 5K@120P(20Lanes)
0/1/1 OLED ULTRA HD 1/0/0 FHD@120 (4Lane)
1/0/1 FHD@60 (4Lane)
1/1/0 Reserved
1/1/1 Reserved
H
T
P
D
A
LOCKAn
I
2
C_
S
CL
6
/
S
D
A
6
DATA_FORMAT_0/1
[GPIO08_DATA_FORMAT_0]
Vx1 8Lane 41P
HW Option TBD
[EPI_TX0~EPI_TX15]
[GPIO_2_TCON_SCL/TCON_9]
[GPIO_1_TCON_SDA/TCON_ 5]
[GPIO_5_VBY_LOCK/EPLOCK]
[GPIO_4_VBY_HTPD/TCON_14]
[GPIO09_DATA_FORMAT_1]
AGP_CTL
A
G
P
C
T
L
VX1_MSE
H
3.Vx1 Block Diagram

- 15 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
17Y Tuner
K3Lp
RTK
[B1_+3.3V_RF] 3
[+3.3V_DEMOD_TU] 11
[B3_+1.2V_DEMOD] 13
[IF_P_TU] 8
[IF_N_TU] 7
[TU_SIF] 6
[TU_CVBS_TU] 4
[IF_AGC_TU] 5
[M_ERROR] 14
[M_MCLK] 15
[M_SYNC] 16
[M_VALID] 17
AB5 / AB2 [GPIO57_TP0_CLK]
AB6 / AA3 [GPIO56_TP0_SYC]
AB4 / AC2 [GPIO58_TP0_VAL]
FE_DEMOD1_TS_ERROR FE_DEMOD1_TS_CLK
FE_DEMOD1_TS_SYNC
FE_DEMOD1_TS_VAL
FE_DEMOD1_TS_DATA[0-7] 18-25 FE_DEMOD1_TS_DATA [0-7] [GPIO59~66_TP0_D0~TP0_D7]
[B4_+2.5V_DEMOD] 29
+2.5V_Normal
[/TU_RESET1_TU] 10 /TU_RESET1 AB2 / L1 [VINRP_TUNER0_REST]
[LNB_TX1] 12
[LNB] 26(Full NIM) / [LNB] 26(Half NIM)
[SCL_RF] 1
[SDA_RF] 2
I2C_SCL2 I2C_SDA2
+3.3V_NORMAL
+3.3V_NORMAL
IF_P IF_N
TUNER_SIF (OPT : TU_EXT_ATV)
TU_CVBS (OPT : TU_EXT_ATV)
IF_AGC
AE1 / U2 [IF_P] AE2 / U3 [IF_N] AE3 / V2 [SIF] Y5 / R5 [VIN10P] Y4 / W4 [GPIO55_RF_IF_AGC1]
[SCL_DEMOD] 36
[SDA_DEMOD] 35
+ DEMOD_CORE
LNB
IC7001
DT1805
LNB_TX
LNB_OUT
1.8K ȳ
5 [SCL] 6 [SDA] 8 [TONECTRL] 2 [LNB]
33 ȳ
[/TU_RESET2_TU] 34 /TU_RESET2 AA3 / M2 [VINGP_DEMOD_RESET]
33 ȳ
33 ȳ
TU_JP
AA5 / Y4 [GPIO52_TUNER0_SCL] AA6 / AA4 [GPIO51_TUNER0_SDA]
[S_ERROR] 28
[S_MCLK] 33
[S_SYNC]30
[S_VAL] 31
[S_DATA]32
TU_JAPAN
AF4 [GPIO54_TUNER1_SCL] AF5 [GPIO53_TUNER1_SDA] Reserved for Dual Tuner_only K3L
A
F
4
[
G
P
I
O
5
4
_T
U
N
E
R
1
_
S
C
L
]
A
F
5
[
G
P
I
O
5
3
_
T
U
N
E
R
1
_
S
D
A
]
A
A
R
e
s
e
r
v
r
r
e
d
f
o
r
D
u
a
l
T
un
e
r
_
o
n
n
l
y
l
K
3
L
AF3 / W2 [IP_1] AG1 / W3 [IN_1]
AG2 / Y2 [QP_2]
AG3 / Y3 [QN_2]
IF_S_IP IF_S_IN IF_S_QP IF_S_QN
[IF_S_IP_MAIN] 59
[IF_S_IN_MAIN] 60
[IF_S_QP_MAIN] 62
[IF_S_QN_MAIN] 61
JAPAN_OPT
FE_DEMOD1_TS_1_DATA[1]
FE_DEMOD1_TS_1_DATA[4] FE_DEMOD1_TS_1_DATA[3] FE_DEMOD1_TS_1_DATA[2]
FE_DEMOD2_TS_ERROR
4. Tuner

- 16 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
HDMI_ARC
ST_GPIO_23_H0_ARC[AG13]
[V2] SIF
I2C_SDA/SCL_AMP
AUD_SCK
AMP_RESET_N
HP_L/ROUT H/P Jack
SIDE_HP_MUTE
GPIO021_SCLK[C2]
GPO_0_I2S_WCLK/SPDIF_OUT_1[D13]
GPIO15_D0 [B3]
GPIO_35_HPOL [N5]
GPIO_36_HPOR [N4]
TU_SIF
AI2R_AMP_SDA [G4]
AI3L_AMP_SCL [G5]
H/P AMP
TPA6138A2
(IC6300)
LPF
AI2L_AMP_RESET_N [F5]
SPDIF_OUT
AV1_CVBS_DET COMP1/AV1/DVI_L_IN COMP1/AV1/DVI_R_IN
[H5] AIO1L_AV1_CVBS_DET [M5] AI1L [M4] AI1R
HP_LOUT_AMP HP_ROUT_AMP
LPF
LPF
Realtek
K3Lp
Tuner
GPIO_6_SPDIF_OUT_0 [E3]
AUD_LRCH
AUD_LRCK
AMP_MUTE
SPK_R+ / R-
SPK_L+ / L-
MAIN AMP
DTA2010M
(IC5800)
MICOM
SPK L
SPK R
22 26
[38] CLK_I [8] WCK [7] SDATA [10,11] [36] [12]
[30, 33]
[18, 21]
AV/COMP
HDMI2
SPDIF
HP_DET
AIO2L_HP_DET[J5]
COMP1_Pb COMP1_Pr COMP1_Y/CVBS
COMP1_DET
[N3] VIN 3P [P3] VIN 5P [P2] VIN 4P [H4] AI3R_COMP1_DET
5. Video & Audio IN/OUT

- 17 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
REALTEK
K3Lp
HDMI2.0_1_HPD
TMDS1 - D0/D1/D2/CLK
ST_GPIO_19_5V_DET_HDMI_0
ST_GPIO_18_H0_HPD
ST_GPIO_21_H0_SCL
ST_GPIO_20_H0_SDA
P0_CKN/P_RGB_N/P
DDC_SCL1 / DDC_SDA1
MICOM
R5F100GEAFB
(IC3000)
HDMI2.0_1_5V_DET
HDMI2.0_2_HPD
TMDS2 - D0/D1/D2/CLK
ST_GPIO_15_5V_DET_HDMI_1
ST_GPIO_14_H1_HPD
ST_GPIO_17_H1_SCL
ST_GPIO_16_H1_SDA
ST_GPIO_23_H0_ARC
P1_CKN/P_RGB_N/P
DDC_SCL2 / DDC_SDA2
HDMI2.0_2_5V_DET
HDMI2.0_3_HPD
TMDS3 - D0/D1/D2/CLK
ST_GPIO_10_5V_DET_HDMI_2
ST_GPIO_11_H2_HPD
ST_GPIO_13_H2_SCL
ST_GPIO_12_H2_SDA
P2_CKN/P_RGB_N/P
DDC_SCL3 / DDC_SDA3
HDMI2.0_3_5V_DET
HDMI2.0_4_HPD
TMDS4 - D0/D1/D2/CLK
ST_GPIO_07_5V_DET_HDMI_3
ST_GPIO_06_H3_HPD
ST_GPIO_09_H3_SCL
ST_GPIO_08_H3_SDA
P3_CKN/P_RGB_N/P
DDC_SCL4 / DDC_SDA4
HDMI2.0_4_5V_DET
HDMI2 with ARC
HDMI1 HDMI3 HDMI4
HDMI_CEC
HDMI_ARC
HDMI_CEC
HDMI_CEC
6. HDMI 2.0 Block

- 18 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
RS232C
(IC7200)
WIFI_DM / DP
SOC_RX / TX
USB2.0_2_DM / DP
USB2
DEBUG_RX / TX
Realtek
K3Lp
HSDM1[AM24]
HSDP1[AL24]
HSDM2[AM25]
HSDP2[AL25]
HSDM0 [G1]
HSDP0 [G2]
USB1
USB2.0_3_DM / DP
MICOM
R5F100GEAFB
(IC3000)
[AH5] ST_GPIO_02_VGA_SDA
[AG5] ST_GPIO_01_VGA_SCL
ST_GPIO_25_UART0/1[AH13]
ST_GPIO_24_UART0/1[AG14]
Wafer
(P200)
Wafer
(P4000)
DEBUG UART
Wafer
(P201)
5 7 9
10 19 20 23 24
SOC_RX / TX
DCDC OCP
BD2242G
(IC4501)
USB_OCD2 [AJ18]
USB_CTL2 [AG20]
+5V_USB2.0_2
+5V_USB2.0_3
WOL/WIFI_POWER_ON BT_RESET BT_WAKEUP_DEVICE
BT_WAKEUP_HOST
IR LED_R KEY2 KEY1
DCDC OCP
BD2242G
(IC4700)
USB_OCD3 [AG22]
USB_CTL3 [AH19]
DOUT1
RIN1
PHONE JACK
7. USB / WIFI / M-REMOTE / UART(Debug)

- 19 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
[GPIO_2_TCON_SCL/TC ON_9]
I2C_SDA6
SW50B3A(LGD)
SW5253A(BOE)
EPI PMIC
I2C_SCL6
1.8k ȳ
[ST_GPIO_26_MICRO_SDA] [ST_GPIO_27_MICRO_SCL]
I2C_SDA_1
I2C_SCL_1
K3Lp
[GPIO_1_TCON_SDA/TC ON_5]
1.8k ȳ
+3.3V_NOR
1.8k ȳ
1.8k ȳ
+3.5V_ST
R5F100GEAFB#30
MICOM
[AI3L_AMP_SCL]
[AI2R_AMP_SDA] I2C_SDA4
I2C_SCL4
FT24C256A-ESR-T
NVRAM
DTA2010M
AMP
[GPIO_51_TUNER0_SDA]
[GPIO_52_TUNER0_SCL] I2C_SDA2
I2C_SCL2 DT1805
LNB
TDJN-G501D
TUNER
1.8 k ȳ
1.8 k ȳ
+3.3V_NOR
1.8k ȳ
1.8k ȳ
+3.3V_NOR
33 ȳ33 ȳ
33 ȳ
33 ȳ
100ȳ
33 ȳ
EPI / CEDS only
8. K3Lp I2C Map

- 20 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
[ST_GPIO_05_IR_RX] [ST_GPIO_00_WOL_WAKE_UP]
WOL/ETH_POWER_ON
USB_CTL2
K3Lp
MICOM
USB2_2.0 OCP USB2
[RTC_XO_USBOCD0]
[GPIO_79_USB_PWR0_SD_WP]
INSTANT_BOOT
/USB_OCD2
USB_CTL3
USB3_2.0 OCP USB3
[RTC_XI_USBOCD1]
[GPIO_78_USB_PWR1_SD_CD]
/USB_OCD3
[RST]
SOC_RESET
[AH16,AH17,AG16,AG17,AJ16]
BIT0~4
HW option
ADC 1~5
[GPIO_119_PC_RST]
PCM_RESET
CI_SLOT CI power
enable control [AIO2R_CMD_VCC_SC]
PCM_5V_CTL
Panel
[GPIO_4_VBY_HTPD/TCON_14]
EPI_MCLK
[GPIO_5_VBY_LOCK/EPLOCK]
LOCKAn
[GPIO7_PMIC_RESET]
PMIC_RESET
PMIC
[GPO011_PWM_DIM_1] [GPIO010_PWM_DIM_0]
PWM_DIM2
POWER
PWM_DIM
[GPO012_LD_SPI1_SCK]
L/DIM_M0_SCLK
[GPO013_LD_SPI1_SDO]
L/DIM_M0_MOSI
[GPO014_LD_SPI1_SYNC]
L/DIM_M0_VS
EPI_GCLK [GPO_1_TCON_I2C_EN/TCON_2]
[VINBN_VIDCORE] VID_CORE CORE DCDC
[VINRP_TUNER0_REST] /TU_RESET1
Tuner
/TU_RESET2
[VINGP_DEMOD_RESET]
[AI2L_AMP_RESET_N] AMP_RESET_N Audio AMP
[AI3R_COMP1_DET] COMP1_DET Component/AV Jack
[AIO1L_AV1_CVBS_DET] AV1_CVBS_DET
[VDBSOUT_SC_PWR_SEL] SMARTCARD_PWR_SEL Japan B-CAS
[AIO2L_HP_DET] HP_DET H/P Jack
9. GPIO(K3Lp)