Lg 65un7000pud User manual

LED TV

SERVICE MANUAL

Chassis : K6LP

MODEL : 65UN7000PUD

CAUTION

BEFORE SERVICING THE CHASSIS,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL

Any reproduction, duplication, distribution (including by way of email, facsimile or other electronic means),

publication, modification, copying or transmission of this Service Manual is STRICTLY PROHIBITED unless you

have obtained the prior written consent of the LG Electronics entity from which you received this Service Manual.

The material covered by this prohibition includes, without limitation, any text, graphics or logos in this Service

Manual.

P/NO : MFL71744001(2006-REV00)

CONTENTS

CONTENTS…………………………..……………………...…….2

SAFETY PRECAUTIONS ……….………………………………3

SERVICING PRECAUTIONS …………..………………………5

SPECIFICATION………………………………..……………….10

MAIN IC BLOCK DIAGRAM ………..…………………………15

EXPLODED VIEW …………………………..………………….17

DISASSEMBLY PROCESS ...…………………………………19

ASSEMBLY PROCESS ………………….…………………….28

TROUBLE SHOOTING GUIDE ............................................ 37

SW Update(USB / NSU) ………………………….……………86

SAFETY PRECAUTIONS

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a

transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced

during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.Keep wires away from high

voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe

to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on

position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts

such as antenna terminals, phone jacks, etc.

If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩand 5.2 MΩ.

When the exposed metal has no return path to the chassis the reading must be infinite.

Another abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed

metallic parts.

Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not

exceed 0.75 volt RMS which is corresponds to 1.5mA

In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is

returned to the customer.

Leakage Current Hot Check circuit

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on

page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1.Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2.Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM,

etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3.Do not spray chemicals on or near this receiver or any of its assemblies.

4.Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts

with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume)

isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

5.Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6.Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are

correctly installed.

7.Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

8.Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam-age

caused by static by static electricity.

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge

on your body by touching a known earth ground. Alter- natively, obtain and wear a commercially available discharging wrist strap

device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil,

to prevent electrostatic charge buildup or expo- sure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static type solder removal device. Some sol- der removal devices not classified as “anti-static” can generate

electrical charges sufficient to damage ES devices.

5.Do not use Freon propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable

conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the

chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES

device.)

General Soldering Guidelines

1.Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range

or 500 °F to 600 °F.

2.Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3.Keep the soldering iron tip clean and well tinned.

4.Thoroughly clean the surfaces to be soldered. Use a mall wire- bristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use Freon propelled spray-on cleaners.

5.Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature. (500 °F to 600 °F)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction- type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6.Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature (500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the

solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit

foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards

using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal "Discrete Transistor

Removal/Replacement

1.Remove the defective transistor by clipping its leads as close as possible to the component body.

2.Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3.Bend into a "U" shape the replacement transistor leads.

4.Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long

nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1.Heat and remove all solder from around the transistor leads.

2.Remove the heat sink mounting screw (if so equipped).

3.Carefully remove the transistor from the heat sink of the circuit board.

4.Insert new transistor in the circuit board.

5.Solder each transistor lead, and clip off excess lead.

6.Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4.Securely crimp each connection and solder it.

5.Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if

necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1.Clip each fuse or resistor lead at top of the circuit board hollow stake.

2.Securely crimp the leads of replacement component around notch at stake top.

3.Solder the connections.

CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent

excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit

board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed when-

ever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern

side of the circuit board. (Use this technique only on IC connections).

1.Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2.carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3.Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4.Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good

copper pattern. Solder the overlapped area and clip off any excess jumper wire

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the

installation of a jumper wire on the component side of the circuit board.

1.Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2.Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly

connected to the affected copper pattern.

3.Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead

of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1.Application range

1.1This spec sheet is applied TPV JDM LCD TV

2.Requirement for Test

Each part is tested as below without special notice.

2.1Temperature : 25±5℃(77±9℉), CST : 40±2℃

2.2Relative Humidity : 60±10%

2.3Power Voltage : Standard input voltage 100~240V@ 50/60Hz for 50UM6900PUA Voltage of each product is marked by models.

2.4Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM.

2.5The receiver must be operated for about 20 minutes prior to the adjustment.

3. Test method

3.1 Performance: LGE TV test method followed.

3.2 Demanded other specification

Safety : CE, IEC specification

EMC : CE, IEC

4.Model General Specification

No Item Specification Remarks

1 Market North America

2 Broadcasting system ATSC / NTSC-M, 64 & 256 QAM

ATSC / NTSC-M, ATSC3.0 North America

3 Available Channel

VHF 2 ~ 13

North America

UHF 14 ~ 69

DTV 2 ~ 69

CATV 1 ~ 135

CADTV 1 ~ 135

4Receiving system Digital : ATSC, 64 & 256 QAM

Analog : NTSC-M North America

5 Video Input NTSC-M

Vertical

(1EA

)

Gender, Except Korea mod

6Component Input Y/Cb/Cr, Y/ Pb/Pr

Vertical

(1EA

)

Gender, Except Korea mod

7 HDMI Input UHD

HDMI 1 PC / DTV Format

Support

6Gbps

HDMI 2 PC / DTV Format

Support

6Gbps, Support ARC

HDMI 3 PC / DTV Format

Support

6Gbps

8 Audio Input(Not Use) DVI Audio

AV Audio

Vertical Gender,

Except

Korea model

and DVI use same jack

9 Audio out

SPDIF

Optical Audio out

Vertical

10 USB Input EMF, DivX HD, For SVC (download)

JPEG, MP3, DivX HD

5.Component Video Input (Y, Cb/Pb, Cr/Pr)

6. HDMI Input (DTV&PC):

Main IC Block Diagram

1.Main Circuit Block Diagram

Only training and service purposes.

400

LV1

570

800

530

HS1

120

500

540

HP1

HW1

902

901

A10

200

951

952

410

501

ARC1

AR1 700

LV2

200A

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These

parts are identified by in the EXPLODED VIEW.

It is essential that these special safety parts should be replaced with the same components as

recommended in this manual to prevent Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

Only training and service purposes.

EXPLODED VIEW(MODULE)

200R

200C 200P

1.Unlock the screws to remove the stand out of the TV

2.Unlock the screws and remove the pins to separate the back cover

DISASSEMBLY PROCESS

SET

4.Remove the pins,tapes and screws to separate the IR/WIFI/SPK board from the rear cover

3. Remove the pins,tapes and screws to separate the Main board, Power board ,VESA Supports and Stand Supports

DISASSEMBLY PROCESS

SET

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