LG 29UM68 User manual

P/NO : MFL68962210(1601-REV00) Printed in China
COLOR MONITOR
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : LM55I
MODEL: 29UM68
Internal Use Only

- 2 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION............................................................................................3
SERVICING PRECAUTIONS.....................................................................4
SPECIFICATIONS......................................................................................6
TIMING CHART .......................................................................................11
ADJUSTMENT .........................................................................................14
BLOCK DIAGRAM...................................................................................18
TROUBLE SHOOTING ............................................................................19
EXPLODED VIEW .................................................................................. 22
SVC. SHEET ...............................................................................................

- 3 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD monitor that
are important for safety. These parts are marked on the
schematic diagram and the Exploded View. It is essential
that these critical parts should be replaced with the
manufacturer’s specified parts to prevent electric shock, fire or
other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the original parts
and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE WITH
BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged in four
corners.
• Do not press on the panel, edge of the frame strongly or electric
shock as this will result in damage to the screen.
• Do not scratch or press on the panel with any sharp objects,
such as pencil or pen as this may result in damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are grounded
through wrist band.
• Do not leave the module in high temperature and in areas of
high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within the
module.
• If the surface of panel become dirty, please wipe it off with a
softmaterial. (Cleaning with a dirty or rough cloth may damage
the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or LIPS
part, must disconnect the AC power because high voltage
appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter circuit. If
the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
Ω
0.15uF

- 4 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or re-connecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright © 2010 LG Electronics. Inc. All right reserved. - 6 - LGE Internal Use Only
Only for training and service purposes
SPECIFICATIONS
1. General Specification
1 Customer BRAND
2 User Model Name 29UM68
3 Sale region Refer to Suffix standard
4 Feature 29” Wide LCD MONITOR(WFHD)
5 Chassis Name LM55I
6
General
Scope External SW &Adj. ◀, ▶,▲,▼,⊙(push) 5-way joystick switch
Function Picture Mode Ratio, Super Energy Saving, Six Color,
Audio Volume(Speaker)
7
Power Cord Length : 1.0±0.05 M
Shape : Wall-out
Color : Black
Weight :
Refer to Suffix
standard and power
cord table
8 Cable
DVI
(68509J0003F)
Length : 1.5m
Shape :
Color : Black
Pin :
Refer to Suffix
standard
HDMI
(EAD00926125)
Length : 1.5m
Shape : Detachable Type
Color : Black
Weight:
Pin :19 pin
Refer to Suffix
standard
DISPLAYPORT
(EAD62111306)
Length : 1.8m
Shape : Detachable Type
Color : Black
Weight:
Pin :20 pin
Refer to Suffix
standard
USB
(EAD61273143)
Length : 1.5m
Shape :
Color : Black Do not Support
Audio
Length :
Shape :
Color:
Weight :
Do not Support
9 Power
Input: AC100~240V 50~60Hz,1.5AMax
Output: DC 19V /2.53A(EAY62933001)
48W Adapter
Weight :
Manual:19V 2.4A
Refer to Suffix
standard
10 Applying module list
P/No Specification
LM290WW2
EAJ62987701 LM290WW2-SSA1
11 Etc (accessory) Manual CD
Weight : 85g - Support

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
3. Optical Character
2. Mechanical specification
Pattern Coordinate
Minimum Normal Maximum Luminance
(cd/m2) Contrast Ratio
White Wx Typ-0.030 0.365 Typ+0.030 Reader
Wy 0.360
1
Product
Dimension
Width (W) Length (D) Height (H)
Before Packing 702.5 204.7 414.0 mm, With Stand
702.5 63.8 328.4 mm, Without Stand
After Packing 780 143 412 mm
2
Product
Weight
Only SET 5.4kg/4.8kg With Stand / Without Stand
With BOX 7.5kg
Only Stand / Accessory 0.2kg/0.4kg
3 Container
Loading
Quantity
Individual or
Palletizing
20ft 40ft
EA
Indi. Pallet Indi. Pallet
560 560 1200 1200
4
Stand
Assy
Type Base detachable
Size (W x D x H) 419.8*204.7*31.7 mm
Tilt Degree -5~20 degree
Tilt force 1.0~1.6 kgf
Folding Degree N/A
Height length mm
5 Appearance General
Middle Cabinet : Black Glossy
Back cover : Black Glossy
Stand Body : Black hairline and Glossy Stand
Base : Black hairline and Glossy

- 8-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
No Item Criteria Remark
1 Viewing Angle
<CR≥10> Horizontal(R/L) : +89º/-89º ( (Typ.)
Vertical(Top/Bottom) : +89º/-89º (Typ.)
2 Luminance(휘도) Average Luminance
(cd/m2) 200(min),250 (Typ.)
(Full white pattern, 0.7V) Warm (6500K)
Average Luminance
(cd/m2) 170(min)
(Full white pattern, 0.7V) Medium (8000K)
Average Luminance
(cd/m2) 150(min)
(Full white pattern, 0.7V) Cool (9300K)
Super Energy
Saving On Max 25% down from S-Energy Saving Off.
Luminance
Uniformity 75%(min),
3 Contrast Ratio(명암비) 700(MIN), 1000(TYP),
DFCÆ1,000,000:1(min), 5,000,000:1(Typ.)
DFC
condition :
Super
energy
saving off
4 Response Time TGTG(Gray to Gray): 14ms(Typ.), 28ms(Max)

-9 -
Copyright©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
4. Engineering Specification
2 Operating Frequency
HDMI
Horizontal 30 ∼90kHz
Vertical (AV)25~60 Hz,
(PC)56~75 Hz
DP Horizontal 30 ∼90kHz
Vertical 56∼75 Hz
DVI Horizontal 30 ∼90kHz
Vertical 56 ∼75 Hz
3 Resolution
HDMI Max. 2560×1080 @ 60Hz
Recommend 2560×1080 @ 60Hz
DP Max. 2560×1080 @ 60Hz
Recommend 2560×1080 @ 60Hz
DVI Max. 2560×1080 @ 60Hz
Recommend 2560×1080 @ 60Hz
4 Input Voltage Voltage :100 – 240 Vac, 50 or 60Hz, 1.0A
5 Inrush Current Cold Start : 50 A Hot : 120 A
6
Operating Condition Sync
(H/V) Video LED Wattage
On Mode On/O
n Active
White 48W (Max.) Test condition
1.2560x1080@60Hz
2. burst pattern
3. 100~240V
4. After aging 30min
White 56.5W (Typ.)
EPA6.0 On/O
n Active White 31W
Adjust brightness
controls until the
luminance of the
screen is 200(cd/m2).

- 10 -
Copyright©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
Sleep Mode
Off/O
n
On/O
ff
Off/O
ff
Off Blinking
white ≤0.5W
Off Mode
(Power switch off) - - Off ≤0.3W
Superenergysaving Off/lo w/hig
h
Low
High 15%±5%
25%±5%
-Test Condition
(1)
7
MTBF 30,000 HRS with 90%
Confidence level
Lamp Life : 30,000 Hours(Min)
8
Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)
9
Environm
ent
Condition
operating Temperature 0°C ~ 40°C
Humidity Less than 80%
Storage Temperature -20 °C ~ 60 °C
Humidity Less than 85%
MENU
(AV/TV
block)
CHANNEL
CHANNEL
2~69(AIR) / 1 ~ 125(CABLE)
Function Support:
No
ADD/DEL CH ADD/DELETE
AUTO CHANNEL ON/OFF
SELECT AIR/CABLE
FINETUNE 0~100
ADJUSTME
NT
CONTRAST 0~100
Function Support:
No
BRIGHTNES
S 0~100
SHARPNESS 0~100
COLOR 0~100
TINT 0~100
AUDIO
VOLUME 0~100
Function Support:
No
BASS N/A
TREBLE N/A
MUTE ON/OFF
SOUND
MONO/STEREO
SETUP
LANGUAGE▶
English/German/French/Esperanto
Italian/Korean… Function Support:
No
IMAGE SIZE ▶FULL/1:1
OSD POSITION
TRANSPAREN
CY 0~100
OSD
MENU Quick Settings
Brightness 0 - 100
Contrast 0 - 100
Volume 0 – 100, Mute

-11-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
Input HDMI1, HDMI2,
DP
Ratio Wide, Original,C inema1, Cinem
a2, 1:1
PBP
Sub HDMI1,HDMI
2,DP, OFF
Sound Out Main
Sub
Swap
Sub Full
Ratio Main Wide, Original
Sub Wide, Original
Picture
Picture Mode
Custom, Reader
, Photo, Cinema
, Color \Weakne
ss,FPS Game1,
FPS Game2, R
TS, Game, Cus
tom(Game)
Picture Adjust Sharpness 0 -100
Black Level High, Low
DFC On, Off
Game
Adjust
Black
Stabilizer 0 - 100
FreeSync Off, On
Response
Time High, Middle, Low, Off
Color
Adjust
Gamma Gamma 0, Gamma 1,
Gamma 2 , Off
Color Temp Warm, Medium,
Cool, Custom
Red/Green/Bl
ue 0 - 100
Six Color
(Red, Green,
Blue, Cyan,
Magenta,
Yellow)
0 – 100 (All Hue
& Saturation)
Reset Reset, Cancel
Sound
MaxxAudio ON,OFF
MaxxAudio
Settings MaxxBass -3~+3
MaxxTreble -3~+3
MaxxDialog -3~+3
Maxx3D -3~+3

Reset Reset,Cancel
Midnight
Mode OFF,ON
General
Language English –
Korean (16
Languages)
16 Language:
English, Germanic
French, Spanish
Italian, Swedish
Finnish, Portuguese
BrazilianPortuguese
Polish, Russian
Greek, Ukrainian
Chinese, Japanese
Korean,
SMART
ENERGY
SAVING High, Low, Off
Power LED On, Off
Automatic
Standby 8H, 6H, 4H, Off
Buzzer OFF,ON
OSD Lock On, Off
Reset Reset, Cancel
-11-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only

- 12-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
(1) Standard Measurement Condition
• Ambient Luminance Level : dark ( < 10 lux)
• Ambient Temperature : Normal Temperature(10ºC ~ 25ºC)
• warm-up Time : More than 30 min (at Full White Pattern)
• Input Signal : VESA 1920 X 1080 @ 60 Hz
• Contrast : 70 (But, the contrast is 100 when we check response time)
• Brightness : Max. 100
• Color Temp : CUSTOM
• Clock/Clock Phase : The Best Setting
(2) Another Spec.: Product Specification Standard( LG(55)G1-1034 )
(3) Cosmetic Spec. : LCD Module IIS Spec.
C
5.1 Display Area Activearea
A
1) Active Display Area of the LCD Monitor Should be within Cabinet’s Bezel.
2) Distance Difference between Active Area and Bezel A A B
| A-B|<1.0 mm , | C-D|<1.0 mm
A: The Distance from The Left of Active Area to the Bezel
Bezel
B: The Distance from The Right of Active Area to the Bezel
C: The Distance from The Top of Active Area to the Bezel
D: The Distance from The Bottom of Active Area to the Bezel D
5. Applying module Character
1 LCD Module
Feature
Maker LGD
Type IPS
Active DisplayArea 29 inches(73.025cm) diagonal (21:9)
Pixel Pitch [mm] 0.2628(H)mm x 0.2628(V)mm
Electrical Interface 2ch-LVDS(41P) X 1, 2ch-LVDS(51P) X 1
Color Depth 6-bit + A-FRC, 16.7M colors
Size (Outline) [mm] 693.6(H) x 308.9(V) x17(D)mm(Typ.)
Surface Treatment Hard coating (3H) & Anti-Glare treatment of
the front polarizer
Operating Mode Transmissivemode, normally Black
Back light Unit White LED
R/T Typical 14ms
Max. 28ms
No Item Content Remark
6
CIE
Color
Coordin
ates
(색좌표)
Minimum Normal Maximum
White
WX Typ-0.03
0.313 Typ+0.03 Warm
(6500K)
WY0.329
White
WX Typ-0.03 0.295 Typ+0.03 Medium
(8000K)
WY 0.305
White
WX Typ-0.03 0.283 Typ+0.03 Cool
(9300K)
WY0.298
RED RX
Typ-0.03
0.660
Typ+0.03 Warm
(6500K)
RY0.331
GREEN GX0.306
GY0.609
BLUE BX0.149
BY0.062

- 13-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
6. EDID
6.1 2
6.2
** Protocol : DDC 2AB
3.1.2.2EDID Ver. 1.3 FOR HDMI 1 (256Byte)
1 Manufacturer ID GSM 1E 6D
2 Product ID (Digital)
(HDMI)
(DisplayPort)
23024 (59 F0)
23025 (59 F1)
23026 (59 F2)
3 Year 2015
4 Version 1 01
5 Revision HDMI : 3
DP : 4 03 04
6 Serial Number * *
7 Week ** **
8 Model Name LG ULTRAWIDE --
9 Check Sum **** ****
10 Special Item Need to Input Serial Number(HDMI 1)

- 14-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
3.1.2.3EDID Ver. 1.3 FOR HDMI 2 (256Byte)
3.1.2.4EDID Ver. 1.4 FOR Display Port (256Byte)Freesync OFF

- 15-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
3.1.2.5 EDID Ver. 1.4 FOR Display Port (256Byte)Freesync ON
3.1.3PBP EDID Data ( 128 Bytes )
- DTD1: 1280 X 1080@60Hz
- DTD2: 2560 X 1080@60Hz
3.1.3.1 EDID Ver. 1.3 FOR HDMI 1 (256Byte)

- 16-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
3.1.3.2 EDID Ver. 1.3 FOR HDMI 2 (256Byte)
3.1.3.3 EDID Ver. 1.4 FOR Display Port (256Byte)

- 18-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
TIMING CHART
(1) Signal(Video & Sync)
Video
B
C
Sync
DEF
A
(2) H/V Timing
zHDMI support timing ：mode2.4.6.9.10.12.13.14.15
mode section polar
ity
DOT
CLOCK
[MHz]
Frequency
[kHz]/[Hz]
Tot al
Period
(E)
Display
(A)
Front
Porch
(D)
Sync.
(C)
Back
Porch
(B)
Resolution
1 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400
V(Lines) +70.08 449 400 12 235
2 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
V(Lines) -59.94 525 480 10 233
3 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480
V(Lines) -75 500 480 1316
4 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
V(Lines) +60.317 628 600 1423
5 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600
V(Lines) +75.0 625 600 1321
6 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
V(Lines) -60.0 806 768 3629
7 H(Pixels) + 78.75 60.123 1312 1024 16 96 176 1024 x 768
V(Lines) +75.029 800 768 1328
8 H(Pixels) + 108 67.5 1600 1152 64 128 256 1152 x 864
V(Lines) [phone]
9 H(Pixels) + 74.25 45 1650 1280 110 40 220 1280x720
V(Lines) + 60 750 720 5 5 20
10 H(Pixels) + 108 63.981 1688 1280 48 112 248 1280 x1024
V(Lines) +60.02 1066 1024 1338
11 H(Pixels) + 135 79.976 1688 1280 16 144 248 1280 x
1024
V(Lines) +75.025 1066 1024 1338
12 H(Pixels) + 108.0 60.00 1800 1600 24 80 96 1600 x 900
V(Lines) + 60.00 1000 900 1 3 96
13 H(Pixels) - 146.25 65.29 2240 1680 104 176 280 1680 x
1050
V(Lines) +59.954 1089 1050 3630
14 H(Pixels) + 148.50 67.50 2200 1920 88 44 148 1920 x
1080
V(Lines) -60 1125 1080 4536
15 H(Pixels) - 185.58 66.7 2784 2560 64 64 96 2560 x
1080
V(Lines) + 60 1111 1080 3 10 18
16 H(Pixels) - 105.3 67.5 1560 1280 88 44 148 1280 x 1080
(PBP only)
V(Lines) + 60 1125 1080 4 5 36

- 19-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
HDMI Video input
Factory support
mode Horizontal frequency Vertical frequency
(Preset Mode) (KHz) (Hz)
1 480P 31.5 60
2 576P 31.25 50
3 720P 37.5 50
4 720P 45 60
5 1080P 56.25 50
6 1080P 67.5 60

ADJUSTMENT
1. Application
1.1 This document is applied to LM55B chassis LCD Monitor which is manufactured in Monitor Factory or is
produced on the basis of this data.
1.2 Manufacturing Type : Set
2. Designation
2.1 The adjustment is according to the order which is designated and which must be followed, according to the
plan which can be changed only on agreeing.
2.2. Power Adjustment: Free Voltage ( 100 ~ 240Vac)
2.3. Magnetic Field Condition: Nil.
2.4. Input signal Unit: Product Specification Standard
2.5. Reserve after operation: Above 5 Minutes (Heat Run)
Temperature: at 25°C±5°C
Relative humidity : 65 ±10%
Input voltage : 100 ~ 240V, 50/60Hz
2.6. Adjustment equipments: Color Analyzer (CA-210 or CA-110), DDC Adjustment Jig equipment,
3. Main PCB check process
* APC -After Manual-Insult, executing APC
3.1 ADC Process
1) 34UM67 doesn’t need ADC processbecause it has only digital input like DisplayPort, Dual-link DVI and HDMI.
3.2 EDID Process
3.2.1 EDID Download
F/W includes default EDID for All input ports, aging on Mode If AC ON, default EDID is automatically loaded to
EEPROM.
Use HDMI 1 port to update serial number in EDID and gamma adjust WB adjust .
Caution: Never connect HDMI Cable when execute NVRAM Init and AC On at first for downloading
HDMI EDID and AC On at first for downloading HDMI EDID automatically
3.3 Function Check
3.3.1 Check Screen
■Check input and signal items. (cf. work instructions)
1. DisplayPort1.2 (2560 x 1080 @60Hz)
2. Dual-link DVI (2560 x 1080 @60Hz)
3. HDMI1/2 (2560 x 1080 @60Hz)
Copyright©2010 LG Electronics. Inc. All right reserved. - 20 -LGE Internal Use Only
Only for training and service purposes