LG Flatron M4210N (M4210N-B10J.A**LLH) User manual

COLOR MONITOR
SERVICE MANUAL
Website:http://biz.LGservice.com
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : LM71A
MODEL: M4210N (M4210N-B10J.A**LLH)
( ) **Same model for Service
Internal Use Only

- 2 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
1. LCD CHARACTERISTICS
Type : TFT Color LCD Module
Active Display Area :
42.02inches(1067.308mm) diagonal
Pixel Pitch : 0.227mm x 0.681m x RGB
Color Depth : 8-bit, 16,777,216 colors
Electrical Interface : LVDS
Size : 1006mm(H) x 610(V)x59(D)mm
Surface Treatment : Anti-Glare, Hard Coating(3H)
Operating Mode : Normally Black
Backlight Unit : 20-CCFL(20 lamps)
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥10
Left : -85° min., -89°(Typ.) Right : +85° min., +89°(Typ.)
Top : +85° min., +89°(Typ.) Bottom : -85° min., -89°(Typ.)
2-2. Luminance : 450cd/m2 (min), 500cd/m2 (Typ.)
2-3. Contrast Ratio : 600(min), 800(Typ.)
3. SIGNAL (Refer to the Timing Chart)
3-1. PC & Video Input
1)Signal Input : PC Signal
2)Input Form : D-SUB Analog, DVI
3)Resolution(max) : Analog - 1280 x 1024@60Hz
Digital - 1280 x 1024@60Hz
4)Resolution(Recommended) :
: Analog - 1360 x 768@60Hz
Digital - 1360 x 768@60Hz
3-2. Sync Input
Horizontal : 30 ~ 83kHz(Digital: 30~72kHz)
Vertical : 56 ~ 75Hz
Input Form : Separate, TTL, Positive/Negative
Digital
4. POWER SUPPLY
4-1. Power Adaptor
Input : AC 100~240V, 50/60Hz, 2.7A
4-2. Power Consumption
5. ENVIRONMENT
5-1. Operating Temperature : 10°C~35°C
5-2. Operating Humidity : 10%~80%
5-3. MTBF :
50,000 HRS with 90% Confidence level
Lamp Life : 50,000 Hours (min)
6. DIMENSIONS
Width : 1057mm (41.61'')
Depth : 119.1 mm (4.69'')
Height : 653 mm (25.71'')
7. WEIGHT
Net. Weight : 27.6 kg (60.86 lbs)
Gross Weight : 34.1 kg (75.19 lbs)
CONTENTS
SPECIFICATIONS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
TIMING CHART ....................................................... 7
BLOCK DIAGRAM ....................................................8
DESCRIPTION OF BLOCK DIAGRAM....................10
ADJUSTMENT ...................................................... 13
SERVICE OSD ...................................................... 15
TROUBLESHOOTING GUIDE .............................. 16
EXPLODED VIEW...................................................25
REPLACEMENT PARTS LIST ...............................27
SCHEMATIC DIAGRAM......................................... 35
MODE
POWER ON (NORMAL)
STAND-BY
SUSPEND
DPMS OFF
POWER OFF
H/V SYNC
ON/ON
OFF/ON
ON/OFF
OFF/OFF
OFF/OFF
POWER CONSUMPTION
less than 270W-With PC
less than 240W-Only MNT
less than 15W-Only MNT
less than 15W-Only MNT
less than 15W-Only MNT
less than 5W
LED COLOR
BLUE
AMBER
AMBER
AMBER
OFF
VIDEO
ACTIVE
OFF
OFF
OFF
OFF

- 3 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
•Replaceable batteries
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
ADVARSEL
Lithiumbatterí- Eksplosionsfare ved fejlagtig
hándtening.
Udskiftning mákun ske med batteri at samme
fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.

- 4 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)

- 5 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.

- 6 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.

TIMING CHART
- 7 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
VIDEO
SYNC
B
C
E
A
D
<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>
1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x 350
V(Lines) - 70.8 449 350 37 2 60
2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400
V(Lines) + 70.8 449 400 12 2 35
3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
V(Lines) - 59.94 525 480 10 2 33
4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480
V(Lines) - 75 500 480 1 3 16
5 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
V(Lines) + 60.317 628 600 1 4 23
6 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600
V(Lines) + 75.0 625 600 1 3 21
7 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624
V(Lines) +/- 74.55 667 624 1 3 39
8 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
V(Lines) - 60.0 806 768 3 6 29
9 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768
V(Lines) - 75.029 800 768 1 3 28
10 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720
V(Lines) + 59.855 748 720 3 5 20
11 H(Pixels) + 84.75 47.72 1776 1360 72 136 208 1360 x 768
V(Lines) + 59.799 798 768 3 5 22
12 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024
V(Lines) + 60.02 1066 1024 1 3 38
MODE H / V Sync
Polarity
Dot
Clock Frequency Total
Period
( E )
Video
Active
Time ( A )
Sync
Duration
( D )
Front
Porch
( C )
Blanking
Time
( B ) Resolution

- 8 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
LVDS 8Bit 2 ch annel
16.5M colors
Scaler
LCD
Module
-42”LPL
-WXGA
-(1366*768)
512Mb
SDRAM
(HY57V161610E)
Flash
Memory
(GM5862H)
ADC
TMDS-Rx LVDS-Tx
TMDS
RGB1 H/V
RGB /SOG
RGB H/V
Am p
(6dB)
Data/Address
RS232C IN
(9PIN)
RS232C OUT
(9PIN)
Tx1
Rx1
RxTx
Tx2
Rx2
Wired IR
From key control
IR receiver
IR
24C16
RS232C
Controller
(MAX232C)
IR
Switch
EEPROM
DVI-D
D-Sub1
D-Sub
Out
EEPROM
DDC
SCL/SDA1
DDC
SCL1/SDA2
HV Sync Clock
Data/Address
Data/Add res s
512Mb
SDRAM
(HY57V161610E)
Thermal
Sensor
(LM35DT)
AMP
(KA358F)
PWM0
SCL/SDA
RGB /SOG
Audio
OUT
Audio in
L/ R * 2
Pre AMP
MSP4450K
L/ R
NTP3000
5V
5V
POW ER
ST5V
6V
5V
12V
19V
12V
19V
9V
1.8V
PC DVI TMDS
SWICHING IC
MC74HC4066A
3.3V
3.3V
5V
1.5V
Regulator Regulator Regulator Regulator
AMP
BLOCK DIAGRAM(GM5862H)

JUNGFRAU BLOCK DIAGRAM
- 9 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only

DESCRIPTION OF BLOCK DIAGRAM(LV-671)-MOTHER BOARD
- 10 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
Panel Info LC420WX5-SLB1
Size 983.0 X 576.0 X 51.0mm
Resolution WXGA 1366 * 768
Number of Color 16.7M
Luminance 500 cd/ (Target)
Contrast 800 : 1
Response Time T.B.D [9ms(G to G)]
Type S-IPS
Scaler Chip GM5862H(OAK2)
Audio out SPEAKER out
Analog output Out 1
Input Interface
<PC Interface> DVI 1
Pull in Range (Analog) 30-83khz / 56-75 Hz
Pull in Range (Digital) 30-72khz / 56-75 Hz
Input signal (Analog) D-sub 1
Input signal (Digital) DVI-D X 1/PC DVI X 1-PC built in
Audio input PC input / Monitor input
Model M4210N
Basic Powerful
CPU Celeron M 430 (1.86G) T7400. Merom (2.0G)
Main Chipset Calistoga 945GM Calistoga 945PM
ICH7-M ICH7-M
Memory DDR II 667 512MB DDR II 667 512MB
Video chip Integrated 945GME ATI M64-M(X1400 or higher)
Video RAM Shared memory 512MB (16MX32 4EA)
Ethernet 10/100 MB / 1Gbit
P-ATA 2.5"
HDD (PC) 80GB
2-HDD for Raid-0(or 1)
Interface -RGB-out, Audio Line Out, SPDIF
-USB 2.0 x 4, RJ45, RS-232C x 2
Wireless LAN 802 11A/B/G compatiable
OS Open

- 11 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
FAN
SATA Signal
cable
SATA Power
cable
ODD to PATA
Heat-Pipe
CPU : T743
1.86GHz
North Bridge
945GM(Calistoga)
HDD
80GB
Wireless LAN
Intel3945 a/b/g
DDR II 667
Memory
Ethernet
Port VGA
Port
H/P
Out SPDIF
USB
Port Serial
Port

- 12 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
South Bridge
945GM
(ICH-7M)
DDR II 667
Memory
(Option)

- 13 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
ADJUSTMENT
All adjustment are thoroughly checked and corrected
when the monitor leaves the factory, but sometimes
several minor adjustment may be required.
Adjustment should be following procedure and after
warming up for a minimum of 30 minutes.
•Alignment appliances and tools.
- IBM compatible PC
- Programmable Signal Generator.
(eg. VG-819 made by Astrodesign Co.)
- Oscilloscope.
- White Balance Meter. (CA-110)
1. DDC Data Write Procedure-Analog
1) Use this procedure only when there is some
problem on Analog EDID data.
2) Run alignment program for M4200N on the IBM
compatible PC.
3) Select EEPROM → Analog EDID write command
and Enter.
4) This will write the Analog EDID data to EEPROM.
2. DDC Data Write Procedure-Digital
1) Use this procedure only when there is some
problem on Digital EDID data.
2) Run alignment program for M4200N on the IBM
compatible PC.
3) Select EEPROM → Digital EDID write command
and Enter.
4) This will write the Digital EDID data to EEPROM.
220
IBM
Compatible PC
Parallel Port
Power inlet (required)
Power LED
ST Switch
Power Select Switch
(110V/220V)
Control Line
Not used
RS232C
PARALLEL
V-SYNCPOWER
ST
VGSMONITOR
E
V-Sync On/Off Switch
(Switch must be ON.)
F
A
B
C
5V
E
F
A
B
C
15
10
5
5
69
1
1
1
14
13
25
6
5V
5V
4.7K
4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
Figure 1. Cable Connection

- 14 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys”file to
“c:\WINNT\system32\drivers”folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
e) Click Start button.
f) Click Exit button.
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update”button
c) Click “Write”button

- 15 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
SERVICE OSD
SEREVICE MENU
MENU
M4210N
2007.04.02 V.1.22
Elapsed Time 1
NVram Initial OFF
ADC Calib.-RGB To Start
White Balance
Aging Mode ON
Elapsed Time Clear
PANEL LPL42.WXGA
Prev
Engaging the `in-start' key of the remote control lets you
into the Service Menu
Description of operation
- Nvram Initial : NVRAM reset
- ADC Calib-RGB : Put the RGB ADC Calibration.(Master
1360x768@60Hz the used the 28 pattern)
- White Balance : Adjusts the white balance
- Aging Mode : Sets the aging mode
- Elapsed Time Clear : Time used for back light
- PANEL : Panel data

- 16 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
TROUBLESHOOTING GUIDE
1. NO POWER
1
Waveforms
J401-#3(ST5V), J400 #9(12V) 2IC404-#2(1.8V), IC400-#2(3.3V) 3IC102-#201
NO POWER
(POWER INDICATOR OFF)
CHECK POWER BOARD, AND
FIND OUT A SHORT POINT AS
POENING EACH POWER LINE
NO
CHECK IC404(1.8V),
IC400(3.3V) LINE
CHECK
IS IC404 PIN2(1.8V)
IC400 PIN2(3.3V)
NO
CHECK IC102
YES
YES
YES
CHECK CRYSTAL (X100)
CHECK
IC102 PIN201
PULSE
NO
1
2
3
CHECK J401 PIN3(ST5V),
J400 PIN9(12V)VOLTAGE?

- 17 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
2. NO RASTER(OSD IS NOT DISPLAYED)-LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
CHECK POWER BOARD
CHECK J401 PIN3(5V)
J400 PIN9(12V)?
NO
CHECK IC102 INVERTER
ON/OFF PORT
J401 PIN5
(INV_ON/OFF)5V?
NO
REPLACE LCD MODULE
YES
YES
YES
1. CONFIRM BRIGHTNESS
OSD CONTROL STATUS
2. CHECK SCALER DIMADJ
PORT
3. CHECK SCALER LAMPADJ
PORT
CHECK
J401 PIN7(INV_DIM)
NO
1
Waveforms
J401-#3(5V), J400 #9(12V) 2J401-#5(5V) 3
J401-#7(INV_DIM) Brightness 100
3
J401-#7(INV_DIM) Brightness 0
1
2
3

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Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
3. NO RASTER(OSD IS NOT DISPLAYED)-MAIN
NO RASTER
(OSD IS NOT DISPLAYED)
CHECK IC702(1.8V),
IC703(3.3V)
CHECK IC102 PIN7(3.3V)
PIN131(1.8V)?
NO
CHECK CONNECTION LINE
FROM D-SUB TO IC502
IC101 PIN201, 202
14.3MHZ?
NO
TROUBLE IN CABLE OR LCD
MODULE
YES
YES
YES
1. CHECK PIN201, 202
SOLDERING CONDITION
2. CHECK X501
3. TROUBLE IN IC502
CHECK IC102
PIN168(H-SYNC) AND
PIN169(V-SYNC).
IS PULSE APPEARED
AT SIGNAL PINS?
NO
1
Waveforms
IC102-#201
1

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Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
4. TROUBLE IN DPM
TROUBLE IN DPM
CHECK PC.
PC IS GOING TO THE DPM
MODE
CHECK R723 AND R272
SYNC APPEARED?
NO
CHECK IC102
PIN168,169 SYNC
PULSE
NO
TROUBLE IN IC102
YES
YES
CHECK H/V SYNC LINE
1
Waveforms
H-SYNC 2V-SYNC
1
2

- 20 -
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
5. PC
1. No power to the system at all. Power light does not illuminate, fan inside power supply does not turn
on. Indicator light on keyboard does not turn on.
Power cable is unplugged Visually in spect power cable Make sure power cable is
securely plugged in.
Defective power cable Visually in spect the cable;
try another cable Replace cable
Power supply failure
Power cable and wall socket
are OK, but system is still
dead.
Contact technical support
Faulty wall outlet; circuit
breaker or fuse blown
Plug in device known to work
in socket and test
Use different socket repair
outlet, reset circuit breaker or
replace fuse
2. System inoperative. Keyboard lights are on, power indicator lights are lit, hard drive is spinning.
Memory DIMM is partially
dislodged from the slot on the
motherboard
Turn off computer. Take cover
off system unit. Check the
DIMM to ensure it is securely
seated in the slot
Using even pressure on both
ends of the DIMM, press
down firmly until the module
enaps into place