LG 42WS10-BAAL User manual

MONITOR SIGNAGE
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : LWB1A
MODEL : 42WS10 42WS10-BAAL
North/Latin A erica http://aic.lgservice.co
Europe/Africa http://eic.lgservice.co
Asia/Oceania http://biz.lgservice.co
Internal Use Only
P/NO : MFL63279923(1112-REV01) Printed in Korea

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTIONS .........................................................................................3
SERVICING PRECAUTIONS.....................................................................4
SPECIFICATION ........................................................................................7
TIMING CHART .........................................................................................8
ADJUSTMENT INSTRUCTION ...............................................................10
BLOCK DIAGRAM...................................................................................15
DESCRIPION OF BLOCK DIAGRAM .....................................................1
TROUBLE SHOOTING ............................................................................17
EXPLODED VIEW .................................................................................. 29
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
WARNING FOR THE SAFETY-RELATED COMPONENT.
• here are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer’s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• he module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELEC RIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
•Replaceable batteries
* CAU ION
RISK OF EXPLOSION IF BA ERY IS REPLACED BY
AN INCORREC YPE.
DISPOSE OF USED BA ERIES ACCORDING O
HE INS RUC IONS.
REPLACE ONLY WI H HE SAME OR EQUIVALEN
YPE.
- 3 -
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
o Instrument's
exposed
ME ALLIC PAR S
Good Earth Ground
such as WA ER PIPE,
CONDUI etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
Ω

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUT ONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. est high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FE VOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: his is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. he following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. hese can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500ºF to 600ºF.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. horoughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. he following guidelines and
procedures should be followed whenever this condition is
encountered.
At C Connections
o repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. his technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. race along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 7 -
SPECIFICATION
NO E : Specifications and others are subject to change without notice for improvement .
1. Application Range.
his spec sheet is applied to the 107 cm (42 inch) Monitor
Signage used LWB1A chassis.
2. Specification
Each part is tested as below without special appointment
2.1 emperature : 25 °C ± 5 °C (77 °F ± 9 °F),
CS : 40 °C ± 5° C
2.2 Relative Humidity : 65 % ±10 %
2.3 Power Voltage : Standard input voltage
(100 V - 240 V ~, 50 / 60 Hz)
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
2.5 he receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
3.1 Performance : LGE V test method followed.
3.2 Demanded other specification
Safety : CE, IEC specification
EMC : CE, IEC
4. General Specification
No. Contents Description Remark
1 Customer BRAND
2 User Model Name 42WS10
3 Sale region Worldwide
4 Feature 107 cm(42 inch) LCD Monitor Signage
5 Chassis Name LWB1A
6 General Extenrnal SW Input, Menu,
E, D, F, G ,Auto/ Set, Power
Scope & Adj.
Function RGB In/Out, DVI In/Out, HDMI In, DP In, RS-232C In/Out, 8Keys
AV In, Component In, Speaker Out, RJ-45,
USB Play back(HD), PIP/PBP, Smart Energy Saving
7 Power Cord Length : 1.87 m ± 0.04 m
Shape : Wall-out P/No
Color : Black(Gray) “Changeable by Suffix”
8 Cable Signalk Length : 1.5 m ± 0.03 m
Signal(D-SUB) Shape : Detachable ype
Color : Black P/No
Pin : riple Row, 15-Position Sub-miniature D (EAD57734003)
9 Maker LGD
ype F Color LCD Module
Active Display Area 1067.31 mm(42.02 inch)
LCD Module Feature Pixel Pitch [ mm ] 0.4845 x 0.4845 P/No: EAJ61930601
Electrical Interface LVDS x 4CH (LD420EUD-SDA1)
Color Depth 10-bit(D), 1.06 B colors
Size [ mm ] 968.4(H) x 564.0(V) x 18.3(D)
Surface reatment Anti-Glare (Haze 10%),
Hard coating(3H)
Operating Mode Normally
Black
Response ime yp 12m

TIMING CHART
- 8 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. PC Mode(RGB Input)
MODE SEC ION POLA DO CLOCK Frequency O AL Display Front Sync. Back RESOLU ION
RI Y [MHz] [kHz]/[Hz] CYCLE (E) [A] Porch[B] [D] Porch[F]
1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x350
V(Lines) - 70.8 449 350 37 2 60
2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X400
V(Lines) + 70.8 449 400 12 2 35
3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x480
V(Lines) - 59.94 525 480 10 2 33
4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x480
V(Lines] - 75 500 480 1 3 16
5 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x600
V(Lines) + 60.317 628 600 1 4 23
6 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x600
V(Lines) + 75.0 625 600 1 3 21
7 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x624
V(Lines) +/- 74.55 667 624 1 3 39
8 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x768
V(Lines) - 60.0 806 768 3 6 29
9 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x768
V(Lines) - 75.029 800 768 1 3 28
10 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x720
V(Lines) + 59.855 748 720 3 5 20
11 H(Pixels) - 85.86 47.7 1800 1366 72 144 216 1366 x768
V(Lines) - 60 795 768 1 3 23
12 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x1024
V(Lines) + 60.02 1066 1024 1 3 38
13 H(Pixels) + 135.00 79.98 1688 1280 16 144 248 1280 x1024
V(Lines) + 75.02 1066 1024 1 3 38
14 H(Pixels) - 146.25 65.290 2240 1680 104 176 280 1680 x1050
V(Lines) + 59.954 1089 1050 3 6 30
15 H(Pixels) + 148.50 67.5 2200 19220 88 44 88 1920 x 1080
V(Lines) + 60 1125 1080 4 5 46

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 9 -
2. PC Mode(HDMI/DVI Input)
MODE SEC ION POLA DO CLOCK Frequency O AL Display Front Sync. Back RESOLU ION
RI Y [MHz] [kHz]/[Hz] CYCLE (E) [A] Porch[B] [D] Porch[F]
1 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x480
V(Lines) - 59.94 525 480 10 2 33
2 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x600
V(Lines) + 60.317 628 600 1 4 23
3 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x768
V(Lines) - 60.0 806 768 3 6 29
4 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x720
V(Lines) + 59.855 748 720 3 5 20
5 H(Pixels) - 85.86 47.7 1800 1366 72 144 216 1366 x768
V(Lines) - 60 795 768 1 3 23
6 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x1024
V(Lines) + 60.02 1066 1024 1 3 38
7 H(Pixels) - 146.25 65.290 2240 1680 104 176 280 1680 x1050
V(Lines) + 59.954 1089 1050 3 6 30
8 H(Pixels) + 148.50 67.5 2200 1920 88 44 88 1920 x1080
V(Lines) + 60 1125 1080 4 5 46
3. COMPONENT INPUT(Y/Pb/Pr)
4 HDMI/Display Port-DTV
NO Resolution H-freq(kHz) V-freq(Hz)
1. 720*480 15.63 59.94 SD V, DVD 480i
2. 720*483 31.47 59.94 ED V 480p
3. 720*576 15.625 50.00 SD V, DVD 576i
4. 720*576 31.25 50.00 HD V 576p
5. 1280*720 45.00 60.00 HD V 720p
6. 1280*720 37.5 50 HD V 720p
7. 1280*720 44.96 59.94 HD V 720p
8. 1920*1080 31.25 50.00 HD V 1080i 50Hz (only AU)
9. 1920*1080 33.75 60.00 HD V 1080i 60Hz (A SC)
10. 1920*1080 33.72 59.94 HD V 1080i 59.94Hz
11. 1920*1080 56.25 50.00 HD V 1080p 50Hz
12. 1920*1080 67.5 60 HD V 1080p 60Hz
NO Resolution H-freq(kHz) V-freq(Hz)
1. 480/60P 31.5 60 ED V 480p
2. 576/50P 31.25 50 ED V 576p
3. 720/50P 37.5 50 HD V 720p
4. 720/60P 45 60 HD V 720p
5. 1080/50i 28.1 50 HD V 1080i 50Hz (For Australian)
6. 1080/50P 56.25 50 HD V 1080P 50Hz
7. 1080/60i 33.75 60 HD V 1080i 60Hz
8. 1080/60P 67.5 60 HD V 1080P 60Hz

ADJUSTMENT INSTRUCTION
- 10 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Application
his spec sheet is applied all of the Digital Signage Product
with LWB1A chassis.
Ex. ) LW01A :47WV30
2. Designation
1) he adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 5 Minutes (Heat Run)
emperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz
6) Color Analyzer (CA-210 or CA-110), DDC Adjustment Jig
equipment, SVC remote controller.
7) Push he “IN S OP KEY” - For memory initialization.
Case1 : Software version up
1. After downloading S/W by USB , Multi-vision set will
reboot automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When V set is entering on the assembly line, Push
“In-stop” key at first.
2. Push “Power on” key for turning it on.
--> If you push “Power on” key, V set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
3. Main PCB c eck process
3.1. ADC Process
3.1.1 ADC
· Enter Service Mode by pushing “ADJ” key,
· Enter Internal ADC mode by pushing “G” key at “ADC
Calibration”
--> Caution: Using ‘power on’ button of the Adjustment R/C ,
power on Multi-vision.
* ADC Calibration Protocol (RS232)
Adjust Sequence
*aa 00 00 [Enter Adjust Mode]
*xb 00 40 [Component1 Input (480i)]
*ad 00 10 [Adjust 480i Comp1]
*xb 00 60 [RGB Input (1024*768)]
*ad 00 10 [Adjust 1024*768 RGB]
*aa 00 90 End Adjust mode
*Required equipment : Adjustment R/C.
3.2. DDC EDID Download
- Auto Download
· After enter Service Mode by pushing “ADJ” key,
· Enter EDID D/L mode.
· Enter “S AR ” by pushing “OK” key.
--> Caution: Never connect HDMI & D-sub Cable when EDID
downloaded.
* Edid data and Model option download (RS232)
3.2.1. DDC EDID Write (RGB 128Byte )
· Connect D-sub Signal Cable to D-Sub Jack.
· Write EDID DA A to EEPROM (24C02) by using DDC2B
protocol.
· Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
NO. Item CMD 1 CMD 2 Data 0
Enter Adjust ‘Mode In’ A A 0 0 When transfer the ‘Mode In’
Adjust MODE Carry the command.
ADC adjust ADC Adjust A D 1 0 Automatically adjustment
( he use of a internal pattern)
NO. Item CMD 1 CMD 2 Data 0
Enter Download A A 0 0 When transfer the ‘Mode In’
download MODE ‘Mode In’ Carry the command.
EDID data and Download A E 00 10 Automatically adjustment
Model option ( he use of a internal pattern)

- 11 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- Manual Download
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
1.RGB EDID data
2.DVI EDID data
3.HDMI EDID data
4.DP EDID data
3.3. Function C eck
3.3.1. C eck display and sound
* Check Input and Signal items. (cf. work instructions)
1) RGB (PC : 1920 x 1080 @ 60hz)
2) COMPONEN (480i)/AV with D-sub to RCA cable
3) DVI
4) PC Audio In with Phone and RCA to Phone cable
5) HDMI
6) DP
7) USB
8) LAN
9) Speaker Out* Display and Sound check is executed by
Remote controller.
--> Caution : Not to push the INS OP KEY after completion if the
function inspection.

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Only for training and service purposes
4. Total Assembly line process
4.1. Adjustment Preparation
· W/B Equipment condition
CA210 : CH 9, est signal : Inner pattern (85IRE)
· Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
*Edge LED W/B able in process of time (Only LGD except
AUO)
* Connecting picture of the measuring instrument (On
Automatic control)
Inside PA ERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER-ON Enter
the mode of White-Balance, the pattern will come out.
- Auto-control interface and directions
1. Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 100Lux).
2. Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3. Aging time
-. After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
-. Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
* Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DA A ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
** Caution **
Color emperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0. (when R/G/B Gain are all C0,
it is the FULL Dynamic Range of Module)
*Manual W/B process using adjusts Remote control.
·After enter Service Mode by pushing “ADJ” key,
·Enter White Balance by pushing “G” key at “White Balance”.
* After You finish all adjustments, Press “In-start” button and
compare ool option and Area option value with its BOM, if it
is correctly same then unplug the AC cable. If it is not same,
then correct it same with BOM and unplug AC cable. For
correct it to the model’s module from factory JIG model.
* Push he “IN S OP KEY” after completing the function
inspection. And Mechanical Power Switch must be set “ON”.
42/47/55WS10

4.2. DPM operation confirmation
Check if Power LED Color and Power Consumption operate
as standard for RGB/HDMI/DP/DVI Input
· Set Input to RGB/HDMI/DP/DVI and connect D-
sub/HDMI/DP/DVI cable to set
· Measurement Condition: (100~240V@ 50/60Hz)
· Confirm DPM operation at the state of screen without Signal
4.3. Model name & Serial number
Download
4.3.1. Model name & Serial number D/L
· Press “Power on” key of service remocon.(Baud rate :
115200 bps)
· Connect RS232 Signal Cable to RS-232 Jack.
· Write Serial number by use RS-232.
4.3.2. Signal TABLE
CMD : A0h
LENG H : 85~94h (1~16 bytes)
ADH: EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENG H + ADH + ADL + Data_1 + ⋯+ Data_n
Delay : 20ms
4.3.3. Command Set
* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write : Model Name and Serial Number write in
EEPROM,.
4.3.4. Method & notice
A. Serial number D/L is using of scan equipment.
B. Setting of scan equipment operated by Manufacturing
echnology Group.
C. Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
* Manual Download (Model Name and Serial Number)
If the V set is downloaded By O A or Service man,
Sometimes model name or serial number is initialized.(
Not always)
here is impossible to download by bar code scan, so It
need Manual download.
a. Press the ‘instart’key of ADJ remote controller.
b. Go to the menu ‘Model Number D/L’like below photo.
c. Input the Factory model name(ex 42LD450-ZA) or Serial
number like photo.
d. Check the model name Instart menu ? Factory name
displayed (ex 42LD450-ZA)
4.4 Bright sensor check
- check Green Eye-check with pushing EYE button and
confirm sensor Data
- If Bright sensor is covered by hands and sensor data is
under 20, OK message appears in 1 sec on
4.5. LAN PING TEST
- check LAN Port with Ping test Program
4. . USB/PIP check
When PIP hot key use, Should change the USB files name as
“pip_test.jpg”.
1)Press the PIP hot key of Remocon.
2)Screen Inspection (When PIP key is pressed, picture will be
changed (1 -> 2 -> 3 -> 4 )
- 13 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 14 -
- Boot file Download
1. Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
2. Set as below, and then click "Auto Detect" and check "OK"
message.
If display "Error", Check connect computer, jig, and set.
3. Click "Connect" tab.
If display "Can’t ", Check connect computer, jig, and set.
4. Click "Read" tab, and then load download file(XXXX.bin) by
clicking "Read"
5. Click "Auto" tab and set as below
6. Click "Run".
7. After downloading, check "OK" message.
- DOWNLOAD USB
1. Put the USB Stick to the USB socket
2. Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low, it
didn’t work.
But your downloaded version is High, USB data is
automatically detecting
3. Show the message “Copying files from memory”
4. Updating is staring.
5. Updating Completed, he V will restart automatically.
6. If your V is turned on, check your updated version and
ool option. (explain the ool option, next stage)
!
(1) (3)
(2) OK
Please Check the Speed :
To use speed between
from 2 KHz to 4 KHz
(4)
filexxx.bin
filexxx.bin
(7)
(5)
(8) ……….OK
(6)

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
BLOCK DIAGRAM

DESCRIPTION OF BLOCK DIAGRAM
- 16 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. VIDEO SIGNAL PROCESSOR
- his section is composed of Mstar LGE107DC-R [S7MR DIVX/MS10]and peripheral devices.
- his IC includes internal Micom block and Memory interface.
- his IC includes A/D Converter, PLL Circui,t X101 24Mhz, Video decoder and De-interlacer.
- his IC includes MDS Receiver and LVDS ransmitter.
- his IC also includes Sound Processor.
2. Sub MICOM
- sub Micom W 61P804’ role is DPM Control and on/off control and composed with EEPROM and X102 12Mhz Clock
- Sub MICOM detect H/V Sink and change DPM mode for RGB input and DPM mode change through IIC communication with
HDMI Switch for Digital INPU
3. RS-232C IN/OUT CIRCUIT
- his section is composed of RS-232C IC(MAX3232), and peripheral devices.
4. HDMI/DP, DVI IN/DVI CIRCUIT
- HDMI/DP/DVI Digital Signal is connected to HDMI switch SII9489C to realize Digital DPM for Dital all input
- DP PS161 convert DP signal to HDMI signal simply and deliver SII9489C
- SII9489C also have DVI in/out function and only DVI input signal is delivered to Output Jack
5. RGB/Component/AV IN/OUT CIRCUIT
- his section is composed of RGB Input Output Jack, Schmitt trigger inverter IC, OP-AMPs, and peripheral devices.
- RGB input signal path is connected from input jack to scaler directly.
- RGB output signal is made by OP-Amps ICs. And this sends output signal to RGB output jack.
- signal matching is Y-->G, Pb--> B, Pr--> R for Component, AV--> G for AV and RCA to 15P D-sub cable is recommended for
AV/Component.
. Analog Audio input
- RGB/DVI/Component/AV audio input is connected to Mstar Scaler block and delivered to Digital AMP N P-7400L
7. USB
- USB +/- signal is connected to scaler directly and supports USB Playback.
8. LAN Control Block
- LAN7500 compose LAN Control circuit by processing the control input from RJ-45 with X602 25Mhz
- this input’ purpose is Just only control of MN like a RS-232C, can not receive any Video streaming
9.AUDIO AMPLIFIER
- his section is composed of NP 7400AL and peripheral devices.
- Audio amplifier’s function is amplification of sound signal received from sound processor.

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
TROUBLESHOOTING GUIDE
1. NO POWER

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Only for training and service purposes
- 18 -
2. NO RASTER(OSD IS NOT DISPLAYED)-MAIN

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Only for training and service purposes
- 19 -
3. NO RASTER STATE ON RGB INPUT

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Only for training and service purposes
- 20 -
4. NO RASTER STATE ON AV INPUT