LG 86UH5C User manual

Internal Use Only
P/NO :
CHASSIS :
MODEL :
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
SERVICE MANUAL
MFL67237484 (1604-REV00)
86UH5C 86UH5C-BF
LW68E
LG Digital Signage

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION........................................................................................... 3
SERVICING PRECAUTIONS.................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION .............................................................. 10
BLOCK DIAGRAM.................................................................................. 18
EXPLODED VIEW .................................................................................. 19
TROUBLE SHOOTING GUIDE ................................................ APPENDIX

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
zmonitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer' s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly or
electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person' s body are grounded
through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight or inverter
circuit, must disconnect the AC adapter because high
voltage appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
• Replaceable batteries
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS.
REPLACE ONLY WITH THE SAME OR EQUIVALENT
TYPE.
PRECAUTION
1.5 Kohm/10W
0.15µF
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
ADVARSEL
Lithiumbatteri - Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri af samme
fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
SPECIFICATION
1. Application range
This specication is applied to the LW68E chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F),
CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specication and performance of each parts are followed
each drawing and specication by part number in accord-
ance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
No. Item Specication Remarks
1Supported Sync. Type Digital
2 Operating Frequency Horizontal 30 ~ 83 kHz
Vertical 23 ~ 71 Hz
3Resolution
Max.
HDMI1/2: 3840×2160 @ 60Hz
HDMI3/DP: 3840×2160 @ 30Hz
OPS/DVI: 1920×1080 @ 60Hz
Recommend
HDMI1/2: 3840×2160 @ 60Hz
HDMI3/DP: 3840×2160 @ 30Hz
OPS/DVI: 1920×1080 @ 60Hz
3.1. DVI-D, HDMI, Diplay Port, OPS Specication
3. General Specication

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
3.2. General Specication
No. Item Content Remark
1 Input HDMI 2 HDMI1, HDMI2:
3840x2160@60Hz(4K@60Hz)
HDCP2.2
Supporting color format
1) 4K@50/60Hz
- RGB444/YCbCr444 8bits
- YCbCr422
2) 4K@25/30Hz
- RGB444/YCbCr444 8/10/12bits
- YCbCr422
1 HDMI3 :
3840x2160@30Hz(4K@30Hz)
HDCP1.4
Supporting color format (8 bits)
- RGB444
- YCbCr444, YCbCr422
(Not Support 75UM3C)
DP 1 3840x2160@30Hz, DP1.2a HDCP1.4
Supporting color format (8 bits)
- RGB444
- YCbCr444
DVI 1 DVI-D Supporting color format (8 bits)
- RGB444
OPS 1 Supporting color format (8 bits)
- RGB444
SD CARD 1 Spec. version: 2.0
USB 1 EMF, DVIX HD, For SVC(Download) USB3.0, Device: Memory stick, Mouse, Key-
board
Audio In 1 DVI Audio In(L/R), Stereo 3P, 3.5mm Phone Jack
2 Output DP 1 SST Support HDMI1.4
Audio Out 1 SE, Stereo L/R, 0.5Vrms 3P, 3.5mm Phone Jack
3 External
Control
RS232C IN/OUT 1/1 UART Comm. w/ IR Daisy Chain 4P, 3.5mm Phone Jack
IR & Light Sen-
sor
1 External box type 5P, 3.5mm Phone Jack
LAN 1 RJ45, 100Base-T SuperSign W/C/N (Ver. 3.7)
4 Special
Feature
Temp. Sensor 1 Built-in
Pixel Sensor 1 Optional(KT-SP0)
Wi-Fi 1 802.11n Built-in
Media Player
Compatibility
OPS Ready
External Media player Attachable
Logo Detachable Yes
5 Remote control Wireless Remote Control LG Code
6 Local Key Tact Key(INPUT, MENU, ˄, ˅, <, >, SET,
Φ/I)
8 keys
7 Set Installation Wall Mount
8 PIP/PBP Mode O/O(2 /3 /4)
9 Split Screen Mode X

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LGE Internal Use Only
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4. Signal Timing (Supporting Resolution)
4.1. DVI/HDMI/DP/OPS (PC Mode)
No. Section Pol. Dot
Clock
[MHz]
Frequency
[kHz]/[Hz]
Total
Cycle
(E)
Display
(A)
Front
Porch(B)
Sync.
(D)
Back
Porch(F)
Resolution Support
1 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600 O
V(Lines) + 60.317 628 600 1 4 23
2 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768 O
V(Lines) - 60.0 806 768 3 6 29
3 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720 O
V(Lines) + 59.855 748 720 3 5 20
4 H(Pixels) - 85.50 47.712 1792 1366 70 143 213 1366 x 768 O
V(Lines) - 60 798 768 3 3 24
5 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024 O
V(Lines) + 60.02 1066 1024 1 3 38
6 H(Pixels) + 148.50 67.5 2200 1920 88 44 88 1920 x 1080 O
V(Lines) + 60 1125 1080 4 5 46
7 H(Pixels) + 297.0 67.5 4400 3840 176 88 296 3840 x 2160 HDMI1/2/3,DP
V(Lines) + 30 2250 2160 8 10 72
8 H(Pixels) + 594.0 135 4400 3840 176 88 296 3840 x 2160 HDMI1/2
V(Lines) + 60 2250 2160 8 10 72
4.2. HDMI/DP/OPS (DTV Mode)
No. Resolution H-freq(kHz) V-freq(Hz) Proposed Remark
1 480/60P 31.5 60 EDTV 480p O
2 576/50P 31.25 50 EDTV 576p O
3 720/50P 37.5 50 HDTV 720p O
4 720/60P 45 60 HDTV 720p O
5 1080/50i 28.1 50 HDTV 1080i 50Hz
(For Australian)
O
6 1080/60i 33.75 60 HDTV 1080i 60Hz O
7 1080/50P 56.25 50 HDTV 1080P 50Hz O
8 1080/60P 67.432 59.94 HDTV 1080P 60Hz O
9 1080/60P 67.5 60 HDTV 1080P 60Hz O
10 2160/30P 67.5 30 UD 2160P 30Hz HDMI1/2/3, DisplayPort
11 2160/50P 112.5 50 UD 2160P 50Hz HDMI1/2
12 2160/60P 135 60 UD 2160P 60Hz HDMI1/2

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.3. Multi Screen Support Resolution
4.3.1. DVI/HDMI/DP/OPS (PC Mode)
4.3.2. HDMI/DP/OPS (DTV Mode)
No. Resolution H-freq(kHz) V-freq(Hz) Remark Support
1 720/50P 37.5 50 HDTV 720p O
2 720/60P 45 60 HDTV 720p O
3 1080/50P 56.25 50 HDTV 1080P 50Hz O
4 1080/60P 67.5 60 HDTV 1080P 60Hz O
5 2160/30P 67.5 30 UD 2160P 30Hz HDMI1/2/3, DisplayPort
PIP (Main)
No. Section Pol. Dot
Clock
[MHz]
Frequency
[kHz]/[Hz]
Total
Cycle
(E)
Display
(A)
Front
Porch(B)
Sync.
(D)
Back
Porch(F)
Resolu-
tion
Remarks
1 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x
720
O
V(Lines) + 59.855 748 720 3 5 20
2 H(Pixels) + 148.50 67.5 2200 1920 88 44 88 1920 x
1080
O
V(Lines) + 60 1125 1080 4 5 46
3 H(Pixels) + 297.0 67.5 4400 3840 176 88 296 3840 x
2160
HDMI1/2/3, Display-
Port PIP (Main)
V(Lines) + 30 2250 2160 8 10 72

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range
This spec. sheet applies to LW68E Chassis applied all of Sig-
nage Monitors manufactured in SIGNAGE SET factory.
2. Specication
1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specic designation.
4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz.
5) At rst Worker must turn on the SET by using Power Only
key.
6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours.
In case of keeping module is in the circumstance of below -20
°C, it should be placed in the circumstance of above 15 °C for
3 hours.
Caution) When still image is displayed for a period of 20 min-
utes or longer (especially where W/B scale is strong. Digital
pattern 13ch and/or Cross hatch pattern 09ch), there can
some afterimage in the black level area
3. Adjustment items
3.1. Main PCB check process
▪ Adjust RGB (ADC)
▪ EDID/DDC download
▪ MAC Address Download
- Above adjustment items can be also performed in Final
Assembly if needed. Both Board-level and Final assembly
adjustment items can be check using In-Star Menu 1.AD-
JUST CHECK.
3.2. Final Assembly adjustment
▪ White Balance adjustment
▪ RS-232C functionality check
▪ PING Test
▪ Factory Option setting per destination
▪ Ship-out mode setting (In-Stop)
3.3. Etc.
▪ Ship-out mode
▪ Service Option Default
▪ Tool option menu, USB Download(S/W Update, Option,
Service only)
▪ ISP Download(Option)
4. Automatic Adjustment
4.1. MAC address & HDCP2.2 D/L
4.1.1. Equipment & Condition
1) Play le: keydownload.exe
4.1.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.1.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process : DETECT -> MAC -> HDCP2.2
4) Play: Press Enter key
5) Check of result: Ready, Test, OK or NG
4.1.4. Communication Port Connection
1) Connect: PCBA Jig → RS-232C Port == PC → RS-232C
Port
4.1.5. Key Download
4.3. LAN Inspection
4.3.1. Equipment & Condition
▪ Each other connection to LAN Port of IP Hub and Jig

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.3.2. LAN inspection solution
1) LAN Port connection with PCB
2) Network setting at MENU Mode of SET (Installer Menu →
119 → 253 → Menu)
3) Setting automatic IP
4) Setting state conrmation
→ If automatic setting is nished, you conrm IP and MAC
Address.
4.3.3 LAN PORT INSPECTION(PING TEST)
4.3.3.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
4.3.3.2. LAN PORT inspection(PING TEST)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and conrm OK Message.
4) remove LAN CABLE
4.4. Serial number download
Connect Bar Code scan equipment and set by RS-232C
cable.
1) E2PROM Data Write
2) E2PROM Data Read
4.5. WIFI MAC ADDRESS CHECK
4.5.1. Using RS232 Command
Command Set ACK
Transmission [A][l][][Set ID][][20][Cr] [O][K][x] or [N][G]
- check the menu on in-start
5. Manual Adjustment
5.1. EDID / DDC Download(EDID PCM)
5.1.1. Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any necessity
of user input. It is a realization of “Plug and Play”.
5.1.2. Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust remocon

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.1.3. Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L (PCM) menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
For Analog
EDID
For DVI EDID For HDMI EDID
D-sub to D-
sub
DVI to DVI DVI-D to HDMI
or HDMI to HDMI
* Caution) When EDID Download, must remove HDMI / D-sub
Cable.
5.1.4. RS232 IN / OUT INSPECTION
1) Connect RS232 In/Out cable with daisy chain.
* Use RS232C Direct Type Cable when connecting “RS232C
Out” for Inspection.
- Applied Model : 2015” Brand Signage Model features
RS232C In/Out Phone jack Type ( As of 2015)
- Phone to RS232C Gender(EAD62707902, Accessory Cable)
You can control several products at one time by connecting
them to a single PC.
2) Check the RS232 command.
i) RS232S Out Setting to PC
- Set device port “COM” ( check control panel on PC)
- Set Baud Rate “115200”
ii) Run RS232C Command program (ex. W/B adjust Program)
and Comm Test Program for RS232C Out Check.
iii) After Running Rs232C Command (ex. W/B adjust), Check
Data from RS232C out on Comm Test Program Window
5.1.5. EDID DATA
▪ Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by Input mode
ⓐProduct ID
ⓑSerial No: Controlled on production line.
ⓒMonth, Year: Controlled on production line:
ex) Monthly : ‘01’ -> ‘01’
Year : ‘2015’ -> ‘19
ⓓModel Name(Hex): LGTV
ⓔChecksum(LG TV): Changeable by total EDID data.
ⓕ Vendor Specific(HDMI)
* Checksum(HDMI1/HDMI2/HDMI3/OPS/DVI/Displayport)
Input CheckSum
HDMI1 0x4A, 0x46(HDMI2.0)
0xDB, 0x2E(HDMI1.4)
HDMI2 0x49, 0x36(HDMI2.0)
0xDA, 0x1E(HDMI1.4)
HDMI3 0xD9,0x0E
OPS 0x69, 0x82
DVI 0x65
DisplayPort 0xBE, 0xD2

- 13 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
1) HDMI1 (Check Sum : 0x4A, 0x46) (HDMI 2.0)
2) HDMI1 (Check Sum : 0xDB, 0x2E) (HDMI 1.4,PIP Main)
3) HDMI1(Check Sum : 0xB0, 0x1E) (PIP sub, PBP)
4) HDMI2 (Check Sum : 0x49, 0x36) (HDMI 2.0)
5) HDMI2 (Check Sum : 0xDA, 0x1E) (HDMI 1.4, PIP Main)
6) HDMI2 (Check Sum : 0xAF, 0x0E) (PIP sub, PBP)

- 14 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
7) HDMI3 (Check Sum : 0xD9, 0x0E) (HDMI1.4, PIP Main)
8) HDMI3 (Check Sum : 0xAE, 0xFE) (PIP sub, PBP)
9) OPS (Check Sum : 0x69, 0x82)
10) DVI (Check Sum : 0x65)
11) DP (Check Sum : 0xBE, 0xD2) (PIP main)
12) DP (Check Sum : 0x97, 0xB5) (PIP sub, PBP)

- 15 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.2. White Balance Adjustment
5.2.1. Overview
▪ W/B adj. Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works: R/G/B gain in the OSD are the default value
for adjustment and differ as to color tem-
perature. Commonly G gain x and R/B gain
upward adjustment for Cool mode, one x
of R/G/B gain and downward adjustment for
Medium/Warm mode are applied
- Adj. condition: normal temperature
1) Surrounding Temperature: 25 ± 5 °C
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20 % ~ 80 %
4) Before White balance adjustment, Keep power on status,
don’t power off
5.2.1.1. Adj. condition and cautionary items
1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
2) Probe location: Color Analyzer (CA-210) probe should
be within 10cm perpendicular of the module surface (80°
~100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes
- In case of LCD Back-Light on should be checked us-
ing no signal or Full-White pattern
5.2.2. Equipment
1) Color Analyzer: CA-210 (LED Module : CH 14)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/204-
Gray(Model:217, Pattern:49)
→ Only when internal pattern is not available
5.2.3. Equipment connection MAP
5.2.4. Adj. Command (Protocol)
▪ RS-232C Command used during auto-adjustment.
RS-232C COMMAND
[CMD ID DATA] Explantion
wb 00 00 Begin White Balance adj.
wb 00 10 Gain adj.(internal white pattern)
wb 00 1f Gain adj. completed
wb 00 20 Offset adj.(internal white pattern)
wb 00 2f Offset adj. completed
wb 00 ff End White Balance adj.
(internal pattern disappears )
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f → Gain adj. completed
*(wb 00 20(Start), wb 00 2f(end)) → Off-set adj.
wb 00 ff → End white balance auto-adj.
▪ Adj. Map
Adj. item Command
(lower caseASCII)
Data Range
(Hex.)
Default
(Decimal)
CMD1 CMD2 MIN MAX
Cool
R Gain j g 00 C0 TBD
G Gain j h 00 C0 TBD
B Gain j i 00 C0 TBD
R Cut TBD
G Cut TBD
B Cut TBD
Medium
R Gain j a 00 C0 TBD
G Gain j b 00 C0 TBD
B Gain j c 00 C0 TBD
R Cut TBD
G Cut TBD
B Cut TBD
Warm
R Gain j d 00 C0 TBD
G Gain j e 00 C0 TBD
B Gain j f 00 C0 TBD
R Cut TBD
G Cut TBD
B Cut TBD
Color Analyzer
Computer
Pattern Generator
※
※If Signage internal pattern is used, not needed
Signal Source
Probe
RS-232C
RS-232C
RS-232C

- 16 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.2.5. Adj. method
5.2.5.1. Auto WB calibration
1) Set in ADJ mode using P-ONLY key (or POWER ON key)
2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration
before adjustment.
3) Connect RS-232C Cable
4) Select mode in ADJ Program and begin a adjustment.
5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
6) Remove probe and RS-232C cable.
 ▪W/BAdj.mustbeginasstartcommand“wb0000”,
andnishasendcommand“wb00ff”,andAdj.offset
if need
5.2.5.2. Manual adjustment Method.
1) Set in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place it on
thecenterofLCDmodulewithin10cmofthesurface..
3)PressADJkey→EZadjustusingadj.R/C→White-Bal-
ancethenpressthecursortotheright(KEY►).WhenKEY
(►)ispressed204Gray(80IRE)internalpatternswillbe
displayed.
4)OneofRGain/GGain/BGainshouldbexedat192,
and the rest will be lowered to meet the desired value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪Ifinternalpatternisnotavailable,useRFinput.InEZAdj.
menu 7.White Balance, you can select one of 2 Test-pattern:
ON,OFF.Defaultisinner(ON).ByselectingOFF,youcan
adjustusingRFsignalin204Graypattern.
5.2.5.3. Adj. condition and cautionary items
1) Lighting condition in surrounding area Surrounding lighting
shouldbelower10lux.Trytoisolateadj.areaintodark
surrounding.
2) Probe location
-LCD:ColorAnalyzer(CA-210)probeshouldbewithin10cm
andperpendicularofthemodulesurface(80°~100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5 Min-
utes.
- In case of LCD, Back-light on should be checked using no
signalorFull-whitepattern.
5.2.6. Reference (White balance Adj. coordinate and
color temperature)
▪Luminance:204Gray
▪StandardcolorcoordinateandtemperatureusingCS-1000
(over 26 inch) [applied only LGD Module]
Mode Coordinate Temp ∆uv
xy
Cool 0.271 0.270 13000K 0.0000
Medium 0.283 0.289 9300K 0.0000
Warm 0.313 0.329 6500K 0.0000
▪StandardcolorcoordinateandtemperatureusingCA-
210(CH14)[appliedonlyLGDModule]
Mode Coordinate Temp ∆uv
xy
Cool 0.271±0.002 0.270±0.002 13000K 0.0000
Medium 0.286±0.002 0.289±0.002 9300K 0.0000
Warm 0.313±0.002 0.329±0.002 6500K 5.3
5.2.7. Color coordination according to aging time
1)ROWDirectLED(32”)&EDGELED(43/49/55/65”)models
(applied only LGD Module) in LGEKR (GUMI) and LGERS
▪Luminance:204Gray,80IRE
▪StandardcolorcoordinateandtemperatureusingCA-
210(CH-14)–byagingtime
Model : (normal line )
Cool Medium Warm
Aging time
(Min) X Y X Y X Y
Target 271 270 286 289 313 329
10-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
36-9 279 284 294 303 321 343
410-19 277 280 292 299 319 339
520-35 275 277 290 296 317 336
636-49 274 274 289 293 316 333
750-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over120 271 270 286 289 313 329
▪ Method [Pixel Sensor Port Inspection]
Thisisthemethodofinspectingpixelsensor.Inspectiontime
is about 4sec ( included in the time inserting and separating
cable)
Step1)PreparepixelsensorJig[PowerOn]
- Checking if the red lamp is turned on.
Step2)Insertthe5PinCable&IR+BrightnessCableofJigto
Set.
Step 3) Turn on the set
Step 4) Press 'EYE button' on the adjustment remote control.
Step 5) Checking if displaying OK in OSD (RGB Sensor
Check)
 If“NG”isdisplayed,pleaserunitagain.If“NG”is
repeated,ChangethePixelsensororphonejack[5p]of
Main PCB’A.
5.3. Ship-out mode check (In-stop)
▪Afternalinspection,pressIn-StopkeyoftheAdj.R/Cand
check that the unit goes to Stand-by mode.

- 17 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
6. GND and HI-POT Test
6.1 Method
1)GND&HI-POTauto-checkpreparation
- Check the Power Cable and Signal Cable insertion condi-
tion.
2)GND&HI-POTauto-check
a.Palletmovesinthestation.(POWERCORD/AVCORDis
tightly inserted)
b.ConnecttheAVJACKTester.
c.Controller(GWS103-4)on.
d. GND Test (Auto)
- If Test is failed, Buzzer operates.
-IfTestispassed,executenextprocess(Hi-pottest).(Re-
moveA/VCORDfromA/VJACKBOX)
e.HI-POTtest(Auto)
- If Test is failed, Buzzer operates.
-IfTestispassed,GOODLamponandmovetonextprocess
automatically
6.2 Check Point
1) Test voltage
-GND:1.5KV/minat100mA
-SIGNAL:3KV/minat100mA
2) TEST time: 1 second
3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
-Hi-potTest=POWERCORDGNDandLIVE&NEUTRAL.
4)LEAKAGECURRENT:At0.5mArms
7. Audio Output Check
No. Item Min Typ Max Unit
1
Audio practi-
calmax
Output,L/R
(Distor-
tion=10%
maxOutput)
9 10 12 W
EQ Off
AVLOff
ClearVoiceOff
7.3 7.7 8.5 rms
2
Speaker
(6ΩImped-
ance)
9 10 12 W
EQ On
AVLOn
ClearVoiceOn
8. USB S/W Download (option, Ser-
vice only)
1) Put the USB Stick to the USB socket
2)AutomaticallydetectingupdateleinUSBStick
- If your downloaded program version in USB Stick is Lower,
itdidn’twork.ButyourdownloadedversionisHigher,USB
dataisautomaticallydetecting(DownloadVersionHigh&
Power only mode, Set is automatically Download)
3)Showthemessage“Copyinglesfrommemory”
4) Updating is starting.
5) Updating Completed, The Signage Set will restart automati-
cally
6) If your SIGNAGE SET is turned on, check your updated
versionandTooloption.(explaintheTooloption,next
stage)
* If downloading version is more high than your SIGNAGE
SET have, SIGNAGE SET can lost all channel data. In this
case, you have to channel recover. if all channel data is
cleared,youdidn’thaveaDTV/ATVtestonproductionline.
* After downloading, have to adjust TOOL OPTION
again.
1) Push "IN-START" key in service remote control.
2)Select"ToolOption1"andPush“OK”button.
3) Punch in the number. (Each model has their number.)
9. Optional adjustments
9.1. Manual White balance Adjustment
9.1.1. Adj. condition and cautionary items
1) Lighting condition in surrounding area surrounding lighting
shouldbelower10lux.Trytoisolateadj.areaintodark
surrounding.
2)Probelocation:ColorAnalyzer(CA-210)probeshouldbe
within10cmandperpendicularofthemodulesurface(80°~
100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5 Min-
utes.
- In case of LCD, Back-light on should be checked using no
signalorFull-whitepattern.
9.1.2. Equipment
1)ColorAnalyzer:CA-210(NCG:CH9/WCG:CH12/LED:
CH14)
2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4)VideoSignalGeneratorMSPG-925F720p/204-Gray
(Model:217,Pattern:49)
9.1.3. Adjustment
1) Set in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place it on
thecenterofLCDmodulewithin10cmofthesurface.
3) Press ADJ key →EZadjustusingadj.R/C→6. White-
Balancethenpressthecursortotheright(KEY►).When
KEY(►)ispressed216Grayinternalpatternwillbe
displayed.
4)OneofRGain/GGain/BGainshouldbexedat192,
and the rest will be lowered to meet the desired value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪Ifinternalpatternisnotavailable,useRFinput.InEZAdj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON,OFF.Defaultisinner(ON).ByselectingOFF,youcan
adjustusingRFsignalin216Graypattern.

- 18 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
BLOCK DIAGRAM
X-TAL
25MHZ
L A N IN
X-TAL
24MHZ
MAX3232C
MICOM
NEC
RMII MDC/MDIO
X-TAL
10MHZ
SD-D0 ~D3 / SD-CLK/SD-CM D/WP/C DS
D+/D-
S D C ARD
U S B 3. 0
RS-232C IN
RS-232C OUT
eMMC
DDR3
3GB
Full Size
Panel
(3840x2160@120Hz)
V x1
A U DIO
IN
RGB
S e nsor
I2C
Analog L/R
Loca l Ke y
H15D
H EV C
D e co der
A U DIO
OUT
Analog L/R
L G E
DDR3
DDR3
DDR3
DDR3
DDR3
512MB X 2EA 512MB X 2EA 512MB X 2EA
EEPROM
(N VRAM )
1Mb
IR/조도 S e nsor
V 5.0 ( 8GB)
PHY
RTL8201
I2C
I2C Thermal
Sensor
RTC
EEPROM
I2C
I2C
I2C
MUX
MDC/MDIO
H15A
OPS
A U DIO
Analog L/R
X-TAL
24MHZ
X-TAL
32.768KHz
UTP
URSA11
4K@60Hz Video 4K@120Hz with FRC&MEMC
Vx1
Vx1
IR
Audio AMP NTP7515
Built -in L/R SPK
I2S BTL
10W x 2ch, 6ohm
75/86UH5C
DDR3
DDR3
128MB X 2EA
Separated OSD 4K@30Hz Video
H D M I2
1:2 SPLITTER
STDP4320
D V I
H D M I3
D P 1 . 2a
TMDS
D P OUT
RX0
RX2
RX3 RX1
OPS
H D MI1
4K@60
HDMI 2.0
HDMI 2.0
HDMI 1.4
HDMI 1.4
X-TAL
27MHZ
2:1 MUX
TS3DV642
Re-Driv er
PI3HDX1204
2:1 MUX
TS3DV642
1:2
SPLITTER
PI3HDX41BD
HDMI to DP
STDP2600
2:1 MUX
TS3DV642
X-TAL
27MHZ
TMDS
TMDS
TMDS
TMDS TMDS TMDS TMDS
DP
DP
DP DP TMDS
DP
4K@60
2K@60
2K@60
4K@30 4K@30
4K@30
DP Out 가능 Port
HDCP2.2

- 19 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
200
400
540
300
121
750
LV1
A2
AM1
700
570
120
510
530
401
850
LV2
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE