LG M227WDP User manual

LCD MONITOR TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LD93C
MODEL : M227WDP M227WDP-PZL
M237WDP M237WDP-PZL
North/Latin A erica http://aic.lgservice.co
Europe/Africa http://eic.lgservice.co
Asia/Oceania http://biz.lgservice.co
Internal Use Only

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION ...............................................................18
TROUBLE SHOOTING ............................................................................22
BLOCK DIAGRAM...................................................................................30
EXPLODED VIE .................................................................................. 31
SVC. SHEET ...............................................................................................
- 2 -

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Only for training and service purposes
- 3 -
PRECAUTION
ARNING FOR THE SAFETY-RELATED COMPONENT.
There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View It is essential that these critical parts
should be replaced with the manufacturer’s specified
parts to prevent electric shock, fire or other hazard.
Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
ITH BACKLIGHT UNIT.
Must mount the module using mounting holes arranged
in four corners.
Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
Make certain that treatment person’s body are
grounded through wrist band.
Do not leave the module in high temperature and in
areas of high humidity for a long time.
The module not be exposed to the direct sunlight.
Avoid contact with water as it may a short circuit within
the module.
If the surface of panel become dirty, please wipe it off
with a soft material. (Cleaning with a dirty or rough cloth
may damage the panel.)
ARNING
BE CAREFUL ELECTRIC SHOCK !
If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
Replaceable batteries
* CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
Ω
0.15uF

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Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or re-connecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures s ecified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Re lacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

No Item Specification Unit Remark
1 Type TFT Color LCD Module
2 Diagonal Size 21.53 inches diagonal
3 Active Display area 476.64(H) 268.11(V) mm
4 Outline Dimension 495.6(H) x 292.2(V) x16.5(D) mm Typ. (Without Inverter)
5 Aspect Ratio 16:9
6 Pixel Number 1920 x RGB x 1080 pixel
7 Pixel Pitch 0.248(H) x 0.248(V) mm
8 Color arrangement RGB vertical Stripe
9 Color Depth 16.7M color (6bit with A-FRC)
10 Electrical Interface LVDS 2Port
11 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)
12 Operating Mode Normally White
13 Backlight Unit 4 CCFL (4 lamps)
14 Response Time Rising Time : 1.3 + Falling Time : 3.7 ms Typ.
15 Color Gamut 72%
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Only for training and service purposes
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
4. Module Specification
4.1 M227WDP-PZL : LGD,LM215WF-TLA1( P/N : EAJ60156901 / P6)
1. Application Range.
This spec sheet is applied to the 22”/ 23” LCD Monitor TV used
LD93C chassis.
2. Specification
Each part is tested as below without special appointment
2.1 Temperature : 25±5°C(77±9°F), CST : 40±5°C
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
(100~240V@ 50/60Hz)
Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
2.5 The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
Safety : CE, IEC specification
EMC : CE, IEC
Safety : IEC/EN60065
EMI : EN55013
EMS : EN55020

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4.2 M227WDP-PZL : AUO / M215HW01-V0( P/N : EAJ55729601)
No Item Specification Unit Remark
1 Type TFT Color LCD Module
2 Diagonal Size 21.53 inches(546.86mm) diagonal
3 Active Display area 476.64(H) 268.11(V) mm
4 Outline Dimension 495.6(H) x 292.2(V) x16.35(D) mm Typ. (Without Inverter)
5 Aspect Ratio 16:9
6 Pixel Number 1920 x RGB x 1080 pixel
7 Pixel Pitch 0.248(H) x 0.248(V) mm
8 Color arrangement RGB vertical Stripe
9 Color Depth 16.7M color (6bit with Hi-FRC)
10 Electrical Interface LVDS 2Port
11 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)
12 Operating Mode Normally White
13 Backlight Unit 4 CCFL (4 lamps)
14 Response Time Rising Time : 3.8 + Falling Time : 1.2 ms Typ.
15 Color Gamut 72%
4.3 M237WDP-PZL : LGD / LM230WF1-TLA3( P/N : EAJ60682701 / P7, ZBD)
REPLACEMENT MODULE : LGD / LM230WF1-TLA6( P/N: EAJ60682703 / P7, ZBD / Magna Drive IC)
No Item Specification Unit Remark
1 Type TFT Color LCD Module
2 Diagonal Size 23 inches(584.2mm) diagonal
3 Active Display area 509.184(H) 286.416(V) mm
4 Outline Dimension 533.2(H) x 312(V) x16.5(D) mm Typ. (Without Inverter)
5 Aspect Ratio 16:9
6 Pixel Number 1920 x RGB x 1080 pixel
7 Pixel Pitch 0.265(H) x 0.265(V) mm
8 Color arrangement RGB vertical Stripe
9 Color Depth 16.7M color
10 Electrical Interface LVDS 2Port
11 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)
12 Operating Mode Normally White
13 Backlight Unit 4 CCFL (4 lamps)
14 Response Time Rising Time : 1.3 + Falling Time : 3.7 ms Typ.
15 Color Gamut 72%

No Item Specification Remarks
1 Market EU(PAL Market-26Countries) DTV & Analog
UK, France, Germany, Spain, Sweden, Finland,
Italy, Netherland, Belgium, Czech
Luxemburg, Greece, Denmark, Austria, Hungary,
Switzerland, Croatia, Turkey
Analog Only -
Poland, Portugal, Norway, Bulgaria,
Serbia,Slovenia, Russia, Romania
2 Broadcasting system 1) PAL-BG
2) PAL-DK
3) PAL-I/I’
4) SECAM L/L’
5) DVB-T
3 Receiving system Analog : Upper Heterodyne
Digital : COFDM
4 Scart Jack (2EA) PAL, SECAM Scart 1 Jack is Full scart and support RF-OUT(ATV)
Scart 2 jack is Half scart and support MNT/DTV-OUT.
5 Component Input (1EA) Y/Cb/Cr
Y/Pb/Pr
6 RGB Input RGB-PC Analog(D-SUB 15Pin)
7 DVI Input DVI-D Digital
8 HDMI Input (1EA) HDMI-DTV HDMI version 1.3 Support HDCP / Not support PC
9 Audio Input (2EA) RGB/DVI Audio
Component L/R Input
10 SPDIF out (1EA) SPDIF out
11 Earphone out (1EA) Antenna, AV1, AV2, Component,
RGB, DVI, HDMI
12 USB (1EA) Picture, Music Software Update + Picture + Music
13 RS-232C (1EA) Commercial Mode
5. General Specification
5.1 TV
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No Item Specification Remarks
1 Supported Sync. Type Separate Sync., Digital
2 Operating Frequency Analog Horizontal 30 ~ 83kHz
Vertical 56 ~ 75 Hz
Digital Horizontal 30 ~ 83kHz
Vertical 56 ~ 75 Hz
3 Resolution Analog Max. 1920x1080 @ 60Hz
Recommend 1920x1080 @ 60Hz
Digital Max. 1920x1080 @ 60Hz
Recommend 1920x1080 @ 60Hz
4 Input Voltage Voltage :100 – 240 Vac, 50 or 60Hz
5 Inrush Current Cold Start : 50 A Hot : 120 A
6 Operating Condition Sync (H/V) Video LED Wattage
Power S/W On On Typ. On/On Active Blue 53W
mode Max On/On Active Blue 60W M227WDP-PZL
Typ. On/On Active Blue 55W
Max On/On Active Blue 60W M237WDP-PZL
Sleep mode Off/On Off Amber 1W RGB/
On/Off
Power S/W Off Off mode - Off Off 0.5W
7 MTBF 50,000 HRS with 90% Confidence leve 22”AUO:40,000 Hours(min)
Lamp Life 22”LGD:50,000 Hours(min)
23”LGD:50,000 Hours(min)
8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)
9 Operating Environment Temp : 10°C ~ 35°C
Humidity : 20 % ~ 80 %
10 Storage Environment Temp : -10°C~60°C non condensing
Humidity : 5 % ~ 90 % non condensing
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- 9 -
5.2 RGB / DVI

No. Item Specification Min. Typ. Max. Remark
1 Viewing Angle[CR>10] Horizontal 150 170 - CR >10
Vertical 140 160
2 Luminance Luminance (cd/m2) 240 300 -
Variation(%) 75 80
3 Contrst Ratio CR 600 1000
Full white/Full black
4 Color Coordinates [CIE1931] White WX0.313
WYTyp. 0.329 Typ.
RED RX -0.03 0.648 +0.03 DVI or RGB
RY0.339 Standard, 6500K
Green GX0.282
Full white(100IRE)
GY0.603 Backlight 100
Blue BX0.143
BY0.070
5 Response Time(ms) Rise Time TrR 3.8 5.5 Condition : DVI
Decay Time TrD 1.2 2.5 Standard, Backlight100
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- 10 -
6. Chroma & Brightness
6.1 M227WDP – AUO Module (for more details, refer to the module spec.)
No. Item Specification Min. Typ. Max. Remark
1 Viewing Angle[CR>10] Right/Left 70/70 85/85 - CR >10
Up/Down 60/70 75/85
2 Luminance Luminance (cd/m2) 250 300 -
Variation(%) 75
3 Contrst Ratio CR 700 1000
Full white/Full black
4 Color Coordinates [CIE1931] White WX0.313
WYTyp. 0.329 Typ.
RED RX -0.03 0.646 +0.03 DVI or RGB
RY0.334 Standard, 6500K
Green GX0.303
Full white(100IRE)
GY0.616 Backlight 100
Blue BX0.147
BY0.067
5 Response Time(ms) Rise Time TrR 1.3 2.6 Condition : DVI
Decay Time TrD 3.7 7.4 Standard, Backlight100
6.2 M227WDP – LGD Module (for more details, refer to the module spec.)

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* Optical Test Condition
- Surrounding Brightness Level : dark
- Surrounding Temperature : 25±5°C
- warm-up Time : 30 Min
- Contrast, Brightness : Outgoing condition
- *Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.
* Active area
1. Active area of LCD PANEL is in bezel of cabinet.
2. Interval between active area and bezel
|A-B|<1.0 mm , |C-D|<1.0 mm
A: Interval between left of active area and bezel
B: Interval between right of active area and bezel
C: Interval between top of active area and bezel
D: Interval between bottom of active area and bezel
C
B
D
A
Active Area
Bezel
No. Item Specification Min. Typ. Max. Remark
1 Viewing Angle[CR>10] Right/Left 70/70 85/85 - CR >10
Up/Down 60/70 75/85
2 Luminance Luminance (cd/m2) 250 300 -
Variation(%) 75
3 Contrst Ratio CR 700 1000
Full white/Full black
4 Color Coordinates [CIE1931] White WX0.313
WYTyp. 0.329 Typ.
RED RX -0.03 0.644 +0.03 DVI or RGB
RY0.336 Standard, 6500K
Green GX0.301
Full white(100IRE)
GY0.611 Backlight 100
Blue BX0.146
BY0.070
5 Response Time(ms) Rise Time TrR 1.3 2.6 Condition : DVI
Decay Time TrD 3.7 7.4 Standard, Backlight100
6.3 M237WDP – LGD Module (for more details, refer to the module spec.)

No Item module Min Typ Max Remark
1 22/23 inch 40000:1 50000:1 PC Mode(D-sub, DVI) , Mode : Outgoing condition
Input signal : 100 IRE Full white pattern
No Item module Luminance (cd/m2) C/R(min) Remark
Min Typ Max RF,AV,
COMPONENT,HDMI
1 22/23 inch - 170 200 - 500 RF,AV,COMPONENT,HDMI
Test condition
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- 12 -
8. Component Video Input (Y, PB, PR)
7. SET Optical Feature
7.1 PC Mode (-Mode : Outgoing condition, Input signal : 100IRE White pattern(Pattern #4 : MSPG series))
*If input signal is 100 IRE full white pattern, the luminance and color coordinate will depend on the panel.
When testing DFC, please wait for at least 1 minutes after checking luminance at black pattern.
No Item module Luminance (cd/m2) C/R(min) Remark
Min Typ Max Min Typ
1 22/23 inch - 240 230 - 600 700 RGB & DVI
DFC 50000:1
No. Specification Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz)
1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480 31.47 59.94 27.000 SDTV 480P
5. 720*480 31.50 60.00 27.027 SDTV 480P
6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280*720 44.96 59.94 74.176 HDTV 720P
8. 1280*720 45.00 60.00 74.250 HDTV 720P
9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10. 1920*1080 33.72 59.94 74.176 HDTV 1080I
11. 1920*1080 33.75 60.00 74.250 HDTV 1080I
12. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
13. 1920*1080 56.25 50 148.5 HDTV 1080P
14. 1920*1080 67.432 59.94 148.350 HDTV 1080P
15. 1920*1080 67.5 60.00 148.5 HDTV 1080P
7.2 Mode (-Mode : Outgoing condition, Input signal : 100IRE White pattern(Pattern #4 : MSPG series))
7.3
-DFC Working Condition : Full Black Pattern(All Black, No pattern(MSPG Pattern#2)) signal in D-sub & DVI

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9. RGB Input ( PC )
10. RGB EDID Data
10.1 M227WDP(Product ID : 22388)
**
**
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1. 720*400 31.468 70.08 28.321
2. 640*480 31.469 59.94 25.175
3. 640*480 37.5 75 31.5
4. 800*600 37.879 60.317 40.0
5. 800*600 46.875 75.0 49.5
6. 1024*768 48.363 60.0 65.0
7. 1024*768 60.123 75.029 78.75
8. 1152*864 67.500 75.000 108.0
9. 1280*1024 63.981 60.02 108.0
10. 1280*1024 79.976 75.035 135.0
11. 1680*1050 64.674 59.883 119.0
12. 1680*1050 65.290 59.954 146.25
13. 1600*1200 75.0 60.0 162.0
14. 1920*1080 66.587 59.934 138.5
10.2 M237WDP(Product ID : 22391)
** **
**

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- 14 -
11. DVI Input ( PC )
12. DVI EDID Data
12.1 M227WDP(Product ID : 22389)
** **
**
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1. 720*400 31.468 70.08 28.321
2. 640*480 31.469 59.94 25.175
3. 640*480 37.5 75 31.5
4. 800*600 37.879 60.317 40.0
5. 800*600 46.875 75.0 49.5
6. 1024*768 48.363 60.0 65.0
7. 1024*768 60.123 75.029 78.75
8. 1152*864 67.500 75.000 108.0
9. 1280*1024 63.981 60.02 108.0
10. 1280*1024 79.976 75.035 135.0
11. 1680*1050 64.674 59.883 119.0
12. 1680*1050 65.290 59.954 146.25
13. 1600*1200 75.0 60.0 162.0
14. 1920*1080 66.587 59.934 138.5
12.2 M237WDP(Product ID : 22392)
** **
**

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
13. HDMI input (DTV) (Not Support PC)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1. 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P
2. 720*576 31.25 50 27.864 SDTV 576P
3. 1280*720 37.500 50 74.25 HDTV 720P
4. 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P
5. 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I
6. 1920*1080 28.125 50.00 74.25 HDTV 1080I
7. 1920*1080 27 24 74.25 HDTV 1080P
8. 1920*1080 33.75 30.00 74.25 HDTV 1080P
9. 1920*1080 56.250 50 148.5 HDTV 1080P
10. 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P
14. HDMI1/2 EDID Data
14.1 M227WDP (Product ID : 22390)
** **
**
**

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 16 -
14.2 M237WDP (Product ID : 22393)
** **
**
**

- 17 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
15. Mechanical specification
15.1 M227WDP-PZL
No. Item Content Unit Remark
1. Product Width(W) Length(D) Height(H) mm
Dimension Before Packing 519.8 193.2 400.5 mm
After Packing 592 446 135 mm
2. Product Only SET 4.7 Kg
Weight With BOX 6.3 Kg
3. Container Individual or 20ft 40ft
Loading Palletizing Indi. Wooden Indi. Wooden
Quantity 816 600 1700 1380
4. Stand
Type Detachable ( Base detachable)
Assy
Size(W x D x H) 271.2x 193.2x 108.4
Tilt Degree -5~15 degree
Tilt force 0.8~3.5kgf
Swivel Degree none
Swivel Force
5. Appearance General Refer to Standard of LG(55)G1-1020
*Appearance Gap spec
Front: 0.5 mm
Back & Bottom : 1.0 m
15.2 M237WDP-PZL
No. Item Content Unit Remark
1. Product Width(W) Length(D) Height(H) mm
Dimension Before Packing 560.8 193.2 427 mm
After Packing 651 456 161 mm
2. Product Only SET 5.6 Kg
Weight With BOX 7.4 Kg
3. Container Individual or 20ft 40ft
Loading Palletizing Indi. Wooden Indi. Wooden
Quantity 630 560 1290 1176
4. Stand
Type Detachable ( Base detachable)
Assy
Size(W x D x H) 271.2x 193.2x 108.4
Tilt Degree -5~15 degree
Tilt force 0.8~3.5kgf
Swivel Degree none
Swivel Force
5. Appearance General Refer to Standard of LG(55)G1-1020
*Appearance Gap spec
Front: 0.5 mm
Back & Bottom : 1.0 m

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 18 -
ADJUSTMENT INSTRUCTION
1. Application
This document is applied to LD84G chassis 22” LCD Monitor
TV which is manufactured in Monitor Factory or is produced
on the basis of this data.
2. Designation
2.1 The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2.2. Power Adjustment: Free Voltage
2.3. Magnetic Field Condition: Nil.
2.4. Input signal Unit: Product Specification Standard
2.5. Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25°C±5°C
Relative humidity : 65 ±10%
Input voltage : 220V, 60Hz
2.6. Adjustment equipment: Color Analyzer (CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent),
DDC Adjustment Jig equipment, SVC remote controller
2.7. Don’t push The “IN STOP KEY” after completing the
function inspection.
3. Main PCB check process
APC - After Manual-Insult, executing APC
Download
1. Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
2. Set as below, and then click "Auto Detect" and check
"OK" message.
If display "Error", Check connect computer, jig, and
set.
3. Click "Connect" tab.
If display "Can’t ", Check connect computer, jig, and
set.
4. Click "Read" tab, and then load download
file(XXXX.bin) by clicking "Read"
5. Click "Auto" tab and set as below
6. Click "Run".
7. After downloading, check "OK" message.
(1) (3)
(2) OK
Please Check the Speed :
To use speed between
from 2 KHz to 4 KHz
(4)
filexxx.bin

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 19 -
USB DOWNLOAD
1. Put the USB Stick to the USB socket
2. Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is
Low, it didn’t work. But your downloaded version is High,
USB data is automatically detecting
3. Show the message "Copying files from memory"
4. Updating is staring.
5. Updating Completed, The TV will restart automatically.
6. If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a
DTV/ATV test on production line.
After downloading, have to adjust TOOL OPTION again.
1. Push "ADJ " key in service remote controller
2. Select "Tool Option 1" and Push "OK" button
3. Punch in the number. (Each model has their number.)
4. Completed selecting Tool option
3.1 ADC Process
3.1.1 PC input ADC
3.1.1.1 Auto RGB Gain/Offset Adjustment
- Convert to PC in Input-source
- Signal equipment displays
Output Voltage: 700 m Vp-p
Impress Resolution XGA (1024 x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925 SERIES)
Adjustment pattern (PC )
- Adjust by commanding AUTO_COLOR_ADJUST.
3.1.1.2 Confirmation
- We confirm whether "0xAA (RGB)" address of EEPROM
"0xA2" is "0xAA" or not.
- If "0xAA (RGB)" address of EEPROM "0xA2" isn’t "0xAA",
we adjust once more
- We can confirm the ADC values from "0xA4~0XA9 (RGB)"
addresses in a page "0xA2"
*Manual ADC process using Service Remocon. After enter
Service Mode by pushing "ADJ" key,
execute "ADC Adjust" by pushing " " key at "ADC
CALIBRATION: RGB".
iTV Software Upgrade
Copying files from memory
Do not remove the memory card from the pc
Do not plug off!
iTV Software Upgrade
Upgrading...
Do not plug off!
63%
iTV Software Upgrade
Upgrading COMPLETED
The TV will restart after seconds.
100%

3.1.2 COMPONENT input ADC
3.1.2.1 Component Gain/Offset Adjustment
- Conve t to Component in Input-sou ce
- Signal equipment displays
Imp ess Resolution 1080i
Model: 223 in Patte n Gene ato (1080i Mode)
Patte n : 65 in Patte n Gene ato ( MSPG-925 SERIES)
Adjustment patte n (COMPONENT )
- Adjust by commanding AUTO_COLOR_ADJUST.
3.1.2.2 Confi mation
- We confi m whethe "0xB3 (480i)/0xBC (1080i)" add ess of
EEPROM "0xA2" is "0xAA" o not.
- If "0xB3 (480i)/0xBC(1080i)" add ess of EEPROM "0xA2"
isn’t "0xAA", we adjust once mo e
- We can confi m the ADC values f om "0xAD~0XB2
(480i)/0XB6~BB (1080i)" add esses in a page "0xA2"
*Manual ADC p ocess using Se vice Remocon. Afte ente
Se vice Mode by pushing "ADJ" key,
execute "ADC Adjust" by pushing " " key at "ADC
CALIBRATION :COMPONENT".
Imp ess Resolution 1080i
3.2 Function Check
3.2.1 Check display and sound
-Check Input and Signal items. (cf. wo k inst uctions)
1. TV
2. AV (SCART1/SCART2/CVBS/S-Video)
3. COMPONENT (1080i)
4. RGB (PC : 1920x1080 @ 60Hz)
5. DVI (PC : 1920x1080 @ 60Hz)
6. HDMI
6. PC Audio In
* Display and Sound check is executed by Remote cont olle .
4. Total Assembly line process
4.1 Adjustment P epa ation
- W/B Equipment condition
CA210: CH 9, Test signal: Inne patte n (85IRE)
- Above 5 minutes H/ un in the inne patte n. ("powe on" key
of adjust emote cont ol)
- 15 Pin D-Sub Jack is connected to the AUTO W/B
EQUIPMENT.
- Adjust P ocess will sta t by execute I2C Command (Inne
patte n (0xF3, 0xFF).
- Adjust P ocess will finish by execute I2C Command (Inne
patte n (Inne patte n (0xF3,0x00)).
** Caution **
Colo Tempe atu e: COOL, Medium, Wa m
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust othe two lowe than C0.
(when R/G/B Gain a e all C0, it is the FULL Dynamic Range of
Module)
* W/B condition
- Su ounding Tempe atu e : 20 % ~ 80 %
- Su ounding Tempe atu e : 25±5 °C
- wa m-up Time : Unde 5 Min.
*Manual W/B p ocess using adjusts Remote cont ol.
- Afte ente Se vice Mode by pushing "ADJ" key,
- Ente White Patte n off of se vice mode, and change off -> on.
- Ente "W/B ADJUST" by pushing " " key at "5. W/B ADJUST".
- 20 - LGE Inte nal Use OnlyCopy ight LG Elect onics. Inc. All ight ese ved.
Only fo t aining and se vice pu poses
EZ ADJUST
MODE : Component
TEMPERATURE : Cool
R-GAIN : 192
G-GAIN : 192
B-GAIN : 192
R-OFFSET : 128
G-OFFSET : 128
B-OFFSET : 128
COPY ALL
1. Tool Option : 2249
2. ADC CALIBRATION Exte nal : DTV
3. ADC CALIBRATION Inte nal
4. ADC ADJUST
5. W/B ADJUST
6. WHITE PATTERN : Off
7. EDID D/L
X=0.283 ( 0.015)M197WDP <Test Signal>
Y=0.298 ( 0.015)M227WDP Inner pattern
X=0.295 (0.015)M237WDP (216gray,85IRE)
Y=0.305 (0.015)
X=0.313 ( 0.015)
Y=0.329 ( 0.015)
Lu inance Cool Min : 120 Typ : 170 <Test Signal>
(cd/ )Mediu Min : 120 Typ : 170 Inner pattern
War Min : 120 Typ : 170 (216gray,85IRE)
Cool Min : 170 Typ : 220 M227WDP
Mediu Min : 170 Typ : 220 M237WDP
War Min : 170 Typ : 220
°
K
M197WDP
°
K
Mediu
8,000k
°
K
Color Te perature
Cool
9,300k
War
6,500k