LG W2363D User manual

P/NO : MFL46750606 (1003-REV00) Printed in Korea
OLOR MONITOR
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
CAUTION
BEFORE SERVI ING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : LM94D
MODEL: W2363D W2363D-PFV
Internal Use Only

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION............................................................................................3
SERVICING PRECAUTIONS.....................................................................4
SPECIFICATIONS......................................................................................6
TIMING CHART .......................................................................................10
ADJUSTMENT .........................................................................................12
BLOCK DIAGRAM...................................................................................16
TROUBLE SHOOTING ............................................................................17
EXPLODED VIE .................................................................................. 21
SVC. SHEET ...............................................................................................

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
PRECAUTION
ARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components sed in LCD monitor that
are important for safety. These parts are marked on the
schematic diagram and the Exploded View. It is essential
that these critical parts sho ld be replaced with the
man fact rer’s specified parts to prevent electric shock, fire or
other hazard.
• Do not modify original design witho t obtaining written
permission from man fact rer or yo will void the original parts
and labor g arantee.
TAKE CARE DURING HANDLING THE LCD MODULE ITH
BACKLIGHT UNIT.
• M st mo nt the mod le sing mo nting holes arranged in fo r
corners.
• Do not press on the panel, edge of the frame strongly or electric
shock as this will res lt in damage to the screen.
• Do not scratch or press on the panel with any sharp objects,
s ch as pencil or pen as this may res lt in damage to the panel.
• Protect the mod le from the ESD as it may damage the
electronic circ it (C-MOS).
• Make certain that treatment person’s body are gro nded
thro gh wrist band.
• Do not leave the mod le in high temperat re and in areas of
high h midity for a long time.
• The mod le not be exposed to the direct s nlight.
• Avoid contact with water as it may a short circ it within the
mod le.
• If the s rface of panel become dirty, please wipe it off with a
softmaterial. (Cleaning with a dirty or ro gh cloth may damage
the panel.)
ARNING
BE CAREFUL ELECTRIC SHOCK !
• If yo want to replace with the new backlight (CCFL) or LIPS
part, m st disconnect the AC power beca se high voltage
appears at inverter circ it abo t 650Vrms.
• Handle with care wires or connectors of the inverter circ it. If
the wires are pressed ca se short and may b rn or take fire.
Leakage Current Hot Check Circuit
•Replaceable batteries
* CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN
INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO THE
INSTRUCTIONS
CAUTION
Please se only a plastic screwdriver to protect yo rself
from shock hazard d ring service operation.
1.5 Kohm/10W
To Instr ment's
exposed
METALLIC PARTS
Good Earth Gro nd
s ch as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Gro nd
for 1 second, Resistance m st be less than 0.1
*Base on Adj stment standard
Ω
0.15 F

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
man al and its s pplements and addenda, read and follow the
SAFETY PRECAUT ONS on page 3 of this p blication.
NOTE: If nforeseen circ mstances create conflict between the
following servicing preca tions and any of the safety preca tions on
page 3 of this p blication, always follow the safety preca tions.
Remember: Safety First.
General Servicing Precautions
1. Always npl g the receiver AC power cord from the AC power
so rce before;
a. Removing or reinstalling any component, circ it board
mod le or any other receiver assembly.
b. Disconnecting or re-connecting any receiver electrical pl g or
other electrical connection.
c. Connecting a test s bstit te in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part s bstit tion or incorrect polarity
installation of electrolytic capacitors may res lt in an
explosion hazard.
2. Test high voltage only by meas ring it with an appropriate high
voltage meter or other voltage meas ring device (DVM,
FETVOM, etc) eq ipped with a s itable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service man al, clean
electrical contacts only by applying the following mixt re to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by vol me) Acetone and 90% (by
vol me) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixt re.
Unless specified otherwise in this service man al, l brication of
contacts in not req ired.
5. Do not defeat any pl g/socket B+ voltage interlocks with which
receivers covered by this service man al might be eq ipped.
6. Do not apply AC power to this instr ment and/or any of its
electrical assemblies nless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver gro nd lead to the receiver
chassis gro nd before connecting the test receiver positive
lead.
Always remove the test receiver gro nd lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixt re gro nd strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semicond ctor (solid-state) devices can be damaged easily
by static electricity. S ch components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circ its and some field-effect transistors and
semicond ctor "chip" components. The following techniq es
sho ld be sed to help red ce the incidence of component
damage ca sed by static by static electricity.
1. Immediately before handling any semicond ctor component or
semicond ctor-eq ipped assembly, drain off any electrostatic
charge on yo r body by to ching a known earth gro nd.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which sho ld be removed to
prevent potential shock reasons prior to applying power to the
nit nder test.
2. After removing an electrical assembly eq ipped with ES
devices, place the assembly on a cond ctive s rface s ch as
al min m foil, to prevent electrostatic charge b ild p or
expos re of the assembly.
3. Use only a gro nded-tip soldering iron to solder or nsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges s fficient to damage ES devices.
5. Do not se freon-propelled chemicals. These can generate
electrical charges s fficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package ntil immediately before yo are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by cond ctive foam, al min m foil
or comparable cond ctive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, to ch the protective material
to the chassis or circ it assembly into which the device will be
installed.
CAUTION: Be s re no power is applied to the chassis or circ it,
and observe all other safety preca tions.
8. Minimize bodily motions when handling npackaged
replacement ES devices. (Otherwise harmless motion s ch as
the br shing together of yo r clothes fabric or the lifting of yo r
foot from a carpeted floor can generate static electricity
s fficient to damage an ES device.)
General Soldering G idelines
1. Use a gro nded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperat re within the
range or 500ºF to 600ºF.
2. Use an appropriate ga ge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoro ghly clean the s rfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) br sh with a metal handle.
Do not se freon-propelled spray-on cleaners.
5. Use the following nsoldering techniq e
a. Allow the soldering iron tip to reach normal temperat re.
(500ºF to 600ºF)
b. Heat the component lead ntil the solder melts.
c. Q ickly draw the melted solder with an anti-static, s ction-
type solder removal device or with solder braid.
CAUTION: Work q ickly to avoid overheating the circ it
board printed foil.
6. Use the following soldering techniq e.
a. Allow the soldering iron tip to reach a normal temperat re
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead ntil the solder melts.
c. Q ickly move the soldering iron tip to the j nction of the
component lead and the printed circ it foil, and hold it there
only ntil the solder flows onto and aro nd both the
component lead and the foil.
CAUTION: Work q ickly to avoid overheating the circ it
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle br sh.

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes
LGE Internal Use Only
IC Remove/Replacement
Some chassis circ it boards have slotted holes (oblong) thro gh
which the IC leads are inserted and then bent flat against the
circ it foil. When holes are the slotted type, the following techniq e
sho ld be sed to remove and replace the IC. When working with
boards sing the familiar ro nd hole, se the standard techniq e
as o tlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying p on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static s ction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Caref lly insert the replacement IC in the circ it board.
2. Caref lly bend each IC lead against the circ it foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle br sh.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circ it board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circ it board and crimp the "U" with
long nose pliers to ins re metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from aro nd the transistor leads.
2. Remove the heat sink mo nting screw (if so eq ipped).
3. Caref lly remove the transistor from the heat sink of the circ it
board.
4. Insert new transistor in the circ it board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendic lar y to the circ it
board.
3. Observing diode polarity, wrap each lead of the new diode
aro nd the corresponding lead on the circ it board.
4. Sec rely crimp each connection and solder it.
5. Inspect (on the circ it board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each f se or resistor lead at top of the circ it board hollow
stake.
2. Sec rely crimp the leads of replacement component aro nd
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circ it board to
prevent excessive component temperat res.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circ it
board will weaken the adhesive that bonds the foil to the circ it
board ca sing the foil to separate from or "lift-off" the board. The
following g idelines and proced res sho ld be followed whenever
this condition is enco ntered.
At I onnections
To repair a defective copper pattern at IC connections se the
following proced re to install a j mper wire on the copper pattern
side of the circ it board. (Use this techniq e only on IC
connections).
1. Caref lly remove the damaged copper pattern with a sharp
knife. (Remove only as m ch copper as absol tely necessary).
2. caref lly scratch away the solder resist and acrylic coating (if
sed) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small ga ge j mper wire and
caref lly crimp it aro nd the IC pin. Solder the IC connection.
4. Ro te the j mper wire along the path of the o t-away copper
pattern and let it overlap the previo sly scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess j mper wire.
At Other onnections
Use the following techniq e to repair the defective copper pattern
at connections other than IC Pins. This techniq e involves the
installation of a j mper wire on the component side of the circ it
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ens re that a hazardo s
condition will not exist if the j mper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect ins lated 20-ga ge j mper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Caref lly crimp and solder the connections.
CAUTION: Be s re the ins lated j mper wire is dressed so the
it does not to ch components or sharp edges.

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
SPECIFICATIONS
1. General Specification
No Item Content Remark
1 C stomer BRAND
2 User Model Name W2363D
3 Sale region Refer to S ffix standard
4 Feat re 58cm (23 inch) 3D F ll HD TFT LCD MONITOR
5 Chassis Name LM94D
External SW &Adj. G-MODE, So rce, Men , set, Power
6 General AUTO / SELECT, Power
Scope F nction OSD, control lock, 2 HDMI inp t,1 DVI inp t, PC A dio
inp t, Headphone O tp t, sRGB, HDCP, Over scan, Black level,
Vol me ,RTC, LED Lighting Level, SRS HD, GAME MODE, 3D 120Hz
7 Power Cord Length : 1.87 m ± 0.05 m, Shape : Wall-o t Refer to S ffix standard
Color : Black and power cord table
Length : 1.5 m Refer to S ffix
DVI Shape : Detachable Type standard(US:1.5m,
Color : Black other: 1.5m
Pin : Triple Row, 24-Position DVI-D(D al)
8 Cable Length : 1.5 m P/N : 6852TAZ006J
A dio Shape : Pl g
Color : Black
2 Pin
9 LIPS Inp t: Delta Electronics INC.
10 Applying mod le list P/No Specification
EAJ60870701 LM230WF4-TLA1 120Hz
No Item Content Remark
Width (W) Length (D) Height (H)
1 Prod ct Before Packing 555.5 206.0 419.2 With stand
Dimension
555.5 73.3 409.5 Witho t stand
After Packing 620 458 120
2 Prod ct Only SET 5.2 kg
Weight With BOX 7.0 kg
3 Container Individ al or 20 ft 40 ft For the EU Pallet
Loading Palletizing Indi. Pallet Indi. Pallet
Q antity 672 405 1,376 900
Type Base Detachable, Tilt Only
4 Stand Size (W x D x H) 264.9 * 206.0 * 28.5
Assy Tilt Degree -5 ~ +15
Tilt force 0.8 kg ~ 2.0 kg
5 Appearance General Refer to Standard of LG(55)G1-1020
2. Mechanical specification

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
3. Optical Character
No Item Criteria Remark
1 Viewing Angle Horizontal(R/L) : +85º / -85 º (Typ.)
<CR ≥10> Vertical(Top/Bottom) : +75º / -85 º (Typ.)
2 L minance Average L minance (cd/m2) 180(Typ.) (Typ.
± 30) sRGB
Average L minance (cd/m2) 250 (min.) 300(Typ) (F ll white pattern, 0.7V) 6500K
Average L minance (cd/m2) 180 (min) (F ll white pattern, 0.7V) 9300K
L minance Uniformity 75 % (min)
3 Contrast Ratio 700(Min), 1000(Typ) , DFC-->70000:1(Min)
4 Response Time On/off: 5 ms (TYP), Gray to Gray: 2 ms (TYP)
5 Light Leakage Condition: Do not visible at 300 L x
5. Engineering Specification
1 S pported Sync. Type Separate Sync., SOG, Digital Remarks
2 Operating Freq ency Analog/ Horizontal 30 kHz ~ 83 kHz
Digital Vertical 50 Hz ~ 120 Hz
HDMI Horizontal 30 kHz ~ 83 kHz
Vertical 56 Hz ~ 61 Hz
3 Resol tion Analog/ Max. 1920 x 1080 @ 120 Hz
Digital Recommend 1920 x 1080 @ 60 Hz 1920 x 1080 @ 120 Hz (3D)
HDMI Max. 1920x1080 @ 60 Hz
Recommend 1920x1080 @ 60 Hz
4 Inp t Voltage Voltage : 100 – 240 Vac, 50 Hz or 60 Hz, 1.2 A
5 Inr sh C rrent Cold Start : 50 A Hot : 120 A
Operating Condition Sync(H/V) Video LED Wattage
Test condition
52W (Max) 1. 1920x1080 @ 60Hz
6 On Mode On/On Active Bl e 49W (typ) 2. b rst pattern
3. 100 V - 240 V
4. After aging 30 min
Off/On Bl e DVI: 1.6
Sleep Mode On/Off Off Blinking HDMI: 1.6
Off/Off
Off Mode - - Off <1W
(Power switch off)
7 MTBF 50,000 HRS with 90% Lamp Life : 50,000 Ho rs(Min)
Confidence level
8 Using Altit de 5,000 m (for Reliability) 3,000 m(for FOS)
Temperat re 10°C ~ 35°C
9 Environment 0perating H midity 10 % ~ 80
Condition Storage Temperat re - 20°C ~ 60°C
H midity 5 % ~ 90 % non-condensing
4. Electric operating sound noise specification
item Criteria
1 So nd noise level Front 18dB Back 20dB

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
6. LCD Panel Characteristic
10.1. LM230WF1-TLA1 (P/No: EAJ54852301)
(1) Standard Meas rement Condition
• Ambient L minance Level : dark ( < 10 l x)
• Ambient Temperat re : Normal Temperat re(10ºC ~ 25ºC)
• warm- p Time : More than 30 min (at F ll White Pattern)
• Inp t Signal : VESA 1920X1080 @60 Hz
• Contrast : 70
• Brightness : Max. 100
• 6500K : Color Temperat re Setting is 6500 K( if it’s not special specification)
• Clock/Clock Phase : The Best Setting
(2) Another Spec.: Prod ct Specification Standard( LG(55)G1-1034 )
(3) Cosmetic Spec. : LCD Mod le IIS Spec.
6.1 Display Area
1) Active Display Area of the LCD Monitor Sho ld be within Cabinet’s Bezel.
2) Distance Difference between Active Area and Bezel
| A-B|<1.0 mm , | C-D|<1.0 mm
A: The Distance from The Left of Active Area to the Bezel
B: The Distance from The Right of Active Area to the Bezel
C: The Distance from The Top of Active Area to the Bezel
D: The Distance from The Bottom of Active Area to the Bezel
C
B
D
A
Active Area
Bezel
No Item Content Remark
Maker LGD
Type 58 cm (23 inch)F ll HD TFT LCD
Active Display Area 509.184 mm (H) X 286.416 mm (V)
Pixel Pitch [mm] 0.266 mm x 0.266 mm
1 LCD Mod le Electrical Interface 4ch-LVDS
Feat re Color Depth 8-bit with A-FRC, 16,777,216 colors
Size (O tline) [mm] 533.2(H) x 312.0(V) x 16.5(D) (Typ.)
S rface Treatment Hard coating(3H) &
Anti-Glare treatment of the front polarizer
Operating Mode Transmissive mode, Normally White
Back light Unit 4 CCFL
R/T Typical Rise Time: 1, Fall Time: 4
Max. Rise Time: 3, Fall Time: 7
Minim m Normal Maxim m
White Wx 0.283
Wy Typ-0.015 0.298 Typ+0.015 9300K
2 CIE Color White ’ 0.313
Coordinates v’ Typ-0.03 0.329 Typ+0.03
Red Rx 0.644
Ry 0.336 6500K
Green Gx Typ-0.03 0.295 Typ+0.03
Gy 0.614
Bl e Bx 0.146
By 0.072

7. EDID
7.1 Data ( 128 Bytes )
1) EDID Ver. 1.3 FOR DIGITAL(256Byte)
2) EDID Ver. 1.3 FOR HDMI 1 (256Byte)
3) EDID Ver. 1.3 FOR HDMI 2 (256Byte)
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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
TIMING CHART
• DVI DTV Mode is not s pported (interlace mode)
(1) Signal(Video & Sync)
(2) H/V Timing
Mode Section Polarity
DOT
Clock
[Mhz]
Frequency
[kHz]/[Hz]
Total
Period
Active
Di play
Front
Porch
Sync.
Back
Porch
Re olution
H(Pixel ) + 31.469 800 640 16 96 48
1
V(Line ) -
25.175
70.09 449 350 37 2 60
640 x 350
H(Pixel ) - 31.468 900 720 18 108 54
2
V(Line ) +
28.321
70.08 449 400 12 2 35
720 X 400
H(Pixel ) - 31.469 800 640 16 96 48
3
V(Line ) -
25.175
59.94 525 480 10 2 33
640 x 480
H(Pixel ) - 37.5 840 640 16 64 120
4
V(Line ) -
31.5
75 500 480 1 3 16
640 x 480
H(Pixel ) + 37.879 1056 800 40 128 88
5
V(Line ) +
40
60.317 628 600 1 4 23
800 x 600
H(Pixel ) + 46.875 1056 800 16 80 160
6
V(Line ) +
49.5
75 625 600 1 3 21
800 x 600
H(Pixel ) - 48.363 1344 1024 24 136 160
7
V(Line ) -
65
60 806 768 3 6 29
1024 x 768
H(Pixel ) - 60.123 1312 1024 16 96 176
8
V(Line ) -
78.75
75.029 800 768 1 3 28
1024 x 768
H(Pixel ) +/- 67.5 1600 1152 64 128 256
9
V(Line ) +/-
108
75 900 864 1 3 32
1152 x 864
H(Pixel ) + 63.981 1688 1280 48 112 248
10
V(Line ) +
108
60.02 1066 1024 1 3 38
1280 x 1024
H(Pixel ) + 79.976 1688 1280 16 144 248
11
V(Line ) +
135
75.035 1066 1024 1 3 38
1280 X 1024
H(Pixel ) + 64.674 1840 1680 48 32 80
12
V(Line ) -
11 9
59.883 1080 1050 3 6 21
1680 x 1050
H(Pixel ) - 65.29 2240 1680 104 176 280
13
V(Line ) +
146.25
59.954 1089 1050 3 6 30
1680 x 1050
H(Pixel ) + 67.5 2200 1920 88 44 143
14
V(Line ) +
148.5
60 1125 1080 4 5 36
1920 x 1080
H(Pixel ) + 113.22 2080 1920 48 32 80
15
V(Line ) +
235.5
99.93 1133 1080 3 5 45
1920 x 1080
H(Pixel ) + 125.12 2080 1920 48 32 80
16
V(Line ) +
260.25
109.95 1138 1080 3 5 50
1920 x 1080
H(Pixel ) + 137.26 2080 1920 48 32 80
17
V(Line ) +
285.50
119.98 1144 1080 3 5 56
1920 x 1080

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
(3) HDMI Video inp t
Factory s pport mode Horizontal freq. Vertical freq.
(Preset Mode) (KHz) (Hz)
1 480P 31.5 60
2 576P 31.25 50
3 720P 37.5 50
4 720P 45 60
5 1080i 28.12 50
6 1080i 33.75 60
7 1080P 56.25 50
8 1080P 67.5 60
• HDMI jack is for AV(video signal)

ADJUSTMENT
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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
1. Coverage
Apply to 58 cm (23 inch) Wide monitor made in Monitor Factory
(Pye ngTek Korea) or made in accordance with the standard of
Pye ngtek Factory process.
2. Appointment
2.1 Adj stment m st be done as fixed seq ence, and adj stment
seq ence can be modified after agreement withthe responsible
R&D engineer considering mass-prod ction condition.
2.2 Power : AC100~240 Voltage (Free)
2.3
Inp t signal : As Prod ct Standard ( Signal ROM: TBD)
2.4 Warm- p Time: Over than 5 min tes
2.5 Adj stment eq ipment : White balance eq ipment (CA-
110/210), Display adj st eq ipment, VG-819(or VG828),
Oscilloscope, PC (More than 486 comp ter ) & White balance
adj st program.,HDCP Adj sting Jig eq ipment.
3. Adjustment
3.1 Overview
Use factory a tomation eq ipment and adj st a tomatic
movement. B t, do via passivity adj st in errorocc rrence.
3.2 Adjustment order
(refer to the Adj stment standard and adj stment command table)
3.2.1 Board Assembly Line
· Connect inp t signal to 24pin DVI.
· Ready for adj stment: check whether adj stment command
works normally or not and the operating state of each mode.
· Check the display state of gray color when 256 gray scale
pattern is embodied.
· Read by EEPROM Read Command to check whether initial
3.2.2 Total Assembly Line
· Inp t analog signal.(1920x1080@60 Hz )
· Write HDCP Key to EEPROM(24C32) by sing DDC2AB
protocol&HDCP Adj sting jig eq ipment [Address 0xA0 00, 289
bytes]
· If error is occ rred, write and check again.
· Ready : Heat-r n d ring 5 min tes in the state with signal
· Connect inp t signal to DVI.
· Defa lt val e before adj stment : Contrast “70” , Brightness
“100(Max)”
3.2.3 Adj stment of Horizontal/Verticality screen
position, Clock and Clock Phase at each Mode.
· There is no special factory mode adj stment.
Writing initial val e of EEPROM in Board Assembly line is
adj sting Preset Mode and Reset mode.
(EEPROM is initialized when AC Power is ON first.)
· If the change of FOS data is needed after M.P, it is possible by
writing Mode Data with EEPROM write command or modifying
the Mode Data in MICOM itself.
# Ca tion) M st keep power-on more than 3 seconds after AC
Power-on first time.
3.2.4 Color coordinates adj stment and L minance
adj stment.
3.2.4.1 Color coordinates adj stment
· Monitor Contrast / Brightness
- Contrast : 70
- Brightness : 100(Max)
· CA-110/CA-210: Set °∞Channel 7°±? CA-110: channel: 8. CA-
210: channel 9
· Adj stment : Board Assembly Line
3.2.4.2. Confirm PRESET 6500K Color coordinates and Adj st
PRESET 9300K Color coordinates .
· Set as Aging mode ON, by commanding AGING_ON/OFF
command code.
· Select Mod le that is being sed in present prod ction by
commanding MODULE SELECT.
· Send SYSTEM RESET command to set Mod le data.
· Inp t F ll White Pattern (Video level : 700 mVp-p)
· Set as 9300K by commanding COLOR_MODE_CHANGE
Command code.
· Adj st to meet x = 0.283 ± 0.004, y=0.298±0.004, and confirm.
· Save 9300K Color by commanding COLOR SAVE Command
code.
· Inp t F ll White Pattern (Video level : 700 mVp-p)
· Set as 6500K by commanding COLOR_MODE_CHANGE
Command code.
· 6500K color adj stment
It’s not TCO model.
Don’t need to adj st 6500K color.
If this TCO 03 spec sho ld be satisfied later, refer to below
method.
Adj st to meet x = 0.313 ± 0.007, y=0.329 ± 0.007, and confirm.
(Option) It°Øs another method for 6500K color adj stment at
G mi & ND
At first, check UV. If that is nder 0.0065, the set is not
adj sted.
If not. It is adj st to meet ’= 0.198 ± 0.0065, v’=0.469 ± 0.0065
· Set as sRGB by commanding COLOR_MODE_CHANGE
Command code.
· Adj st to meet Y = 180 ± 10, and confirm.
3.2.4.3. Confirm User color coordinates
· Confirm Whether User color is saved same as 6500K.
· After confirming Color coordinates, M st ret rn to 6500K.
· Adj st meeting x= 0.313± 0.03, y=0.329± 0.03
· Check whether written EDID data is correct or not.

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
3.2.5 Confirm Operation state.
3.2.5.1 Operation mode : Confirm whether each appointed mode
operate correctly or not.
3.2.5.2 Confirmation of Adj stment condition and operation :
Confirm whether it meet A to/Man al eq ipment Adj stment
standard or not.
· Confirm Analog screen state : Confirm screen state at below
mode.
Appointment mode :
640*480@60Hz (Mode 2),
800*600@75Hz(Mode 5)
1024*768@60Hz(Mode 6), 1280*1024@60Hz(Mode 9)
1680*1050@60Hz(Mode 12)
SMPTE pattern(Check 0%,5%,95%,100%)
–Mode can be added.
· Check HDCP signal screen by sing Video generator that
generate HDCP signal
3.2.5.3 Other q ality
1) HDMI-VIDEO
· Select inp t Component and whether pict re is displayed or not
- s pport 50Hz/60Hz (480i /480p/576i/576p/720p /1080i/1080P)
2) HDMI-DVI
Confirm that each items satisfy nder standard condition that
was written prod ct spec. Below pattern is signal condition for
checking
- F ll White Pattern
- Black Level pattern
- 16 Gray Step Pattern(MUST CHECK. To check for mid-level
color)
- SMPTE(MUST CHECK. To Check c toff and sat ration => 0%
gray & 5%gray, 95% gray & 100%gray )
- 1line On/off Pattern
· Confirm that each items satisfy nder standard condition that was
written prod ct spec.
· Confirm Applying Mod le & MICOM Setting ? Confirm with
Service OSD
· Confirm at Service OSD by “Men + Power key” on. (From Power
off)
· Confirm first set of new lot by periods, and confirm periodically
when there is Process change
or Adj stment setting change.
3.2.5.4. OSD & Adj stment device Confirmation : Confirm
operation mentioned as prod ct spec.
· Vary Brightness and Contrast and confirm the variation of
L minance and display stat s.
· Make s re to do FACTORY RESET after confirmation of OSD
f nction.
3.2.5.5. Confirm the display state by inp tting 8 color Bar Pattern &
256 Gray Scale pattern.
3.2.5.6. DPM operation confirmation : Check if Power LED Color
and Power Cons mption operates as standard.
3.2.5.7. DDC EDID Write
- HDMI part EDID data
· Confirm whether mod le selection is correct or not on the self-
diagnostics OSD with signal cable disconnected.
· Connect HDMI Signal Cable to DVI-D wafer.
· Write EDID DATA to EEPROM(24C02) by sing DDC2B protocol.
· Check whether written EDID data is correct or not.
- DVI part EDID data
· Confirm whether mod le selection is correct or not on the self-
diagnostics OSD with signal cable disconnected.
· Connect Digital Signal Cable to DVI-D wafer.
· Write EDID DATA to EEPROM(24C02) by sing DDC2B protocol.
· Check whether written EDID data is correct or not.
-> After writing EDID, send Elapsed Time Clear command.
(Elapsed time sho ld not be displayed, after EDID writing)
: Confirm periodically (in the first set of new lot, process
change) whether mod le name and
aging time disappeared on the self-diagnostics OSD with signal
cable disconnected.
-> If Elapsed Time Clear command isn’t exec ted, mod le name,
aging time and TCO word appear on the self-diagnostics
OSD.(Mod le name and aging time sho ld not appear after
writing EDID)
-> Make s re to do FACTORY RESET at the final process.
3.2.5.8. Shipping condition
· Contrast : 70
· Power Switch : Off
· Brightness : “100(Max)”
· Color Select : Preset ( 6500K )
· Lang age Select : Refer to prod ct spec.
· OSD Position : ON
· Power indicator : ON
· Flatron f-engine : Normal
· So nd : ON
· Check HDMI A dio headphone f nction, after check, please set
signal so rce to RGB Mode by Hand.

No . Item Adj stment & meas rement Operation Operation Meas rement
standard mode Pattern Position
1 Voltage(V)
5V± 0.3V / 3.3V±0.25V, MODE 14 Pattern 4
TP of Each power
1.8V± 0.07
2 Color coordinates Black Level A to Adj stment MODE 14 Pattern 0 Center of Screen
(9300/6500K)
3 Color coordinates DRIVE1 X 0.198±0.002
(6500K) MODE 14 Pattern 1 Centerof Screen
Y 0.468±0.004
Color coordinates DRIVE2 X 0.283±0.004
(9300K) Y 0.298±0.004
L minance 6500K More than 210 cd/m2MODE 14 Pattern 1 Center of Screen
(700mVp-p)
4 Screen Position FULL SIZE MODE 14 Pattern 4 F ll Screen
5 Screen Clock phase FULL SIZE MODE 14 Pattern 4 F ll screen
Compensation AUTO FULL SIZE MODE 14 Pattern 4 F ll screen
6 DPM On Mode 71W(Max) MODE 14 note1 BLUE
Confirmation 67W(typ)
Sleep Mode ≤1.4W Pattern 6/7/8 Amber
Off Mode ≤1W Off
7 SOG signal Confirmation Inp t SOG signal MODE 14 Pattern 9 F ll screen
8 Gray scale Confirmation Linear gray Scale MODE 14 Pattern 9 F ll screen
9 Withstanding Voltage When 1500Vac or 2121Vdc is impressed between the first of power (Live/Ne tral) and gro nd
(Earth) for 1 second, check whether something wrong happens or not.
10 Gro nd Confirmation When 25A is impressed between Earth and 2 nd Gro nd for 1 second, Resistance m st be less
than 0.1 Ω
11 C toff/ADC Adj stment Pattern 16 step pattern for ADC MODE 14 Patten11
1920 * 1080 (700mVp-p)
- 14 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
4.Standard of Auto/Manual equipment adjustment
*Note 1 (Test condition):
- 1920x1080 @60Hz
- B rst pattern
- 100 V - 240 V ac
- Analog & Digital
- After aging 30 min

- 15 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
5. Pattern for Adjustment
Pattern 0 : FULL BLACK (State of witho t video signal )
Pattern 1 : FULL WHITE (Don’t display other Character except for White Pattern)
Pattern 3 : FULL WHITE
Pattern 4 : Cross hatch pattern (Horizontal 10Line, Vertcial 8Line) & Rectangle
Pattern
Pattern 5 : 1 Dot on, 1 Dot off & Rectangle Pattern
Pattern 6 : Vertical Sync only inp t (Use signal cable of which Pin #5 is GND)
Pattern 7 : Horizontal Sync only inp t (Use signal cable of which Pin #5 is GND)
Pattern 8 : State of witho t Vertical/Horizontal Sync and Video Signal. (Use signal
cable of which Pin #5 is GND)
Pattern 9 : 8 Color Bar Pattern + 16 Gray Level Pattern
Pattern 10 : SMPTE Pattern
Pattern 11 : 16 Gray Step Pattern (700mV)

BLOCK DIAGRAM
- 16 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only

TROUBLESHOOTING GUIDE
- 17 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
1. NO PO ER
NO POWER
(POWER INDICATOR OFF)
CHECK IC102, 301
NO
NO
NO
CHECK POWER AND FIND OUT A SHORT
POINT AS OPENING EACH POWER LINE
CHECK REGULATOR AND FIND OUT
A SHORT POINT AS OPENING
EACH POWER LINE
CHECK POWER (5V) AND I2C
LINE OF CONTROL ASSEMBY
CHECK POWER
INPUT VOLTAGE 5,6PIN
OF P600( 5V) AND
1,2PIN OF P600(18V)
CHECK IC602,702
PIN2( 1.8V)
IC600,700 PIN6 (3.3V)
IC601,701 PIN6 (1.27V)
CHECK CONTROL
ASSEMBLY OPERATION
YES
YES
YES
NO CHECK CRYSTAL( X100,300)
CHECK PULSE OF IC102,
301 PIN A4, B5
YES

- 18 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
2. NO RASTER (OSD IS NOT DISPLAYED) – INVERTER
NO RASTER
(OSD IS NOT DISPLAYED)
TROUBLE IN CABLE OR
LCD MODULE
NO
NO
NO
CHECK ADAPTER AND FIND OUT A SHORT
POINT AS
OPENING EACH POWER LINE
CHECK REGULATOR AND FIND OUT A
SHORT POINT
AS OPENING EACH POWER LINE
CHECK CRYSTAL( X100 ,X300)
CHECK POWER
INPUT VOLTAGE 5,6PIN
OF P600( 5V) AND
1,2PIN OF P600(18V)
CHECK IC602,702
PIN2( 1.8V)
IC600,700 PIN6 (3.3V)
IC601,701 PIN6 (1.27V)
CHECK PULSE OF IC102,
301 PIN A4, B5
YES
YES
YES
NO CHECK CONNECTION LINE FROM IPUT
SIGNAL LINE
CHECK RXC+ and RXC- of
inp t line(DVI- D ,HDMI )
YES

- 19 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
3. NO RASTER (OSD IS NOT DISPLAYED) – Mstar
NO RASTER
(OSD IS NOT DISPLAYED)
CHECK VCC( 12V) OF
THE LCD MODULE
NO
NO
NO
CHECK ADAPTER AND FIND OUT A SHORT
POINT AS
OPENING EACH POWER LINE
CHECK REGULATOR AND
FIND OUT A SHORT POINT AS OPENING
EACH POWER LINE
CHECK THE LINES BETWEEN
IC100 AND IC100
CHECK POWER
INPUT VOLTAGE 5,6PIN
OF P600( 5V) AND
1,2PIN OF P600(18V)
CHECK IC602,702
PIN2( 1.8V)
IC600,700 PIN6 (3.3V)
IC601,701 PIN6 (1.27V)
CHECK PIN5, 6
(M_SCL, M_SDA)
OF IC100
YES
YES
YES
NO CHECK IC 102 AND Q604 OPERATION
CHECK FET( Q604)
SWITCHING OPERATION
YES

- 20 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
4. TROUBLE IN DPM
TROUBLE IN DPM
NO
CHECK IC 102, 301
CHECK CONNECTION LINE
FROM IPUT SIGNAL LINE
YES
CHECK RXC+ and RXC-
of inp t line
(DVI- D ,HDMI )