Littfinski Daten Technik SX-GB-8-B User manual

Assembly Instruction
Littfinski DatenTechnik (LDT)
8-fold feedback module
with integrated
occupancy detector
from the Digital-Professional-Series !
SX-GB-8-B Part-No.: 320041
>> kit <<
⇒feedback report via Sx-bus
(Selectrix® or compatible digital central units)
⇒short circuit protected
(one automatic fuse on each output)
⇒up to 1 Ampere load on each output
⇒feedback address programmable:
from 0to 103
⇒release-delay programmable:
from 0 to 2,48 seconds
This product is not a toy! Not suitable for children under 14 years of age! The kit
contains small parts, which should be kept away from children under 3! Improper
use will imply danger of injuring due to sharp edges and tips! Please store this
instruction carefully.
Introduction:
You have purchased the 8 fold feedback module SX-GB-8with
integrated detection of track occupancy for your model railway.
The SX-GB-8is a high quality product that is supplied within
the assortment of Littfinski DatenTechnik (LDT).
We are wishing you having a good time using this product.
Feedback modules SX-GB-8 of the Digital-Professional-
Series can be operated with your digital model railway without
any problems.
The SX-GB-8is suitable for all Selectrix® or compatible
digital central units which support the Sx-bus by using the
5-poles diode-plug.
General:
Tools required for the assembly
Please assure that the following tools are available:
•a small side cutter
•a mini soldering iron with a small tip
•solder tin (if possible 0,5mm diameter)
Safety Instructions
•All electrical and electronic components included in this kit
shall be used on low voltage only by using a tested and
approved voltage transducer (transformer). All components
are sensitive to heat. During soldering the heat shall be
applied for a very short period only.
•The soldering iron develops up to 400°C. Please keep
continual attention to this tool. Keep sufficient distance to
combustible material. Use a heat resistant pad for this work.
•This kit consist of small parts, which can be possibly
swallowed from children. Children (especially under 3 years)
shall not participate on the assembly without supervision.
Set-Up:
For the board assembly please follow exact the sequence of
the below assembly list. Cross each line off as done after
completing the insertion and the soldering of the respective
part.
For the diodes please keep special attention to the correct
polarity (marked line for the cathode).
The connector of tantalum capacitors marked with "+"has to
correspond with the respective marking on the pc-board.
Integrated circuits (IC`s) are either marked with a half round
notch on one end or a printed point for the correct mounting
position. Push the IC`s into the correct socket assuring that the
notch or the printed point is corresponding to the half-rounded
marking on the pc-board.
Please attend to the sensitivity of the ICs to electrostatic
discharge, which will cause immediate damage of the IC.
Before touching those components please discharge yourself
by contacting an earthed metal (for example: an earthed
radiator) or work with an electrostatic safety pad.
On transistors and voltage-regulators it has to be attended
to the flattened side.
The position of the soldered wire-bridge is marked on the
board with a thick white line between the respective bores.
Before assembling the clamps please connect the two 2-pole
and the two 3-pole clamps together to a block with 10
connections.
The light emitting diodes have to be assembled on the pc-
board with the longer leg to be connected to "+". Before
soldering the diodes push the distance spacers onto the legs.
Assembly List:
Pos.
Qty.
Component
Remarks
Ref.
Done
1 1 Printed Circuit Board
2 1 Resistor 560 Ohm green-blue-black-black R3
3 8 Resistors 1KOhm brown-black-black-brown R4..R11
4 4 Resistors 4,7KOhm yellow-violet-black-brown R12..R15
5 2 Resistors 22KOhm red-red-black-red R16, R17
6 4 Resistors10KOhm brown-black-black-red R18..R21
7 9 Resistors 100KOhm brown-black-black-orange R22..R30
8 2 Resistors 100Ohm brown-black-black-black R31,R32
9 1 Resistor 1MOhm brown-black-black-yellow R33
10 3Wire-bridges spare wire Br1..Br3
11 1Diode BAW 75 attend to the polarity! D17
12 1IC-Socket 20-poles IC1
13 3IC-Sockets 14-poles IC4..IC6
14 1IC-Socket 8-poles IC2
15 7Capacitors 100nF 100nF = 104 C1..C7
16 1Tantalum cap. 0,1uF/35V attend to the polarity! C8
17 1Resonator 12MHz CR1
18 1Push button S1
19 16 Diodes BY251 attend to the polarity! D1..D16
20 1Transistor BC 557 attend to the polarity! T1
21 1Voltage regulator 78L05 attend to the polarity! IC3
22 1LED + dist. Spacer attend to the polarity! LED1
23 8Multi-Fuses R090 MF1..8
24 2Clamps 2-poles build blocks before assembly
25 2Clamps 3-poles build blocks before assembly
26 2Sockets 5poles ST1, ST2
27 1IC: AT89C2051 attend to the polarity! IC1
28 3IC: LM339 attend to the polarity! IC4..IC6
29 1IC: 24C02 attend to the polarity! IC2
30 Final Control
Made in Europe by
Littfinski DatenTechnik (LDT)
Kleiner Ring 9
D-25492 Heist/Germany
Phone: 0049 4122 / 977 381; Fax: 0049 4122 / 977 382
Internet: http://www.ldt-infocenter.com
Subject to technical changes and errors. 05/2013 by LDT

Soldering instruction
Provided you have no special experience in soldering electronic
components please read first this soldering instruction before starting the
job. Soldering has to be trained!
1. Never use additional fluxes for soldering electronic circuits which
contain acids (e.g. zinc chloride or ammonium chloride). Those can
destroy components and printed circuits when not washed off
completely.
2. As soldering material only lead free soldering tin with a rosin core for
fluxing should be used.
3. Use a small soldering iron with max 30 Watt heating power. The solder
tip shall be free from scale to assure an excellent heat transfer to the
area to be soldered.
4. The soldering shall be performed on a speedy way because a long
heat transfer can destroy the components. To much or to long heating
can take off the copper pads and copper tracks from the board.
5. For a good soldering a well tinned solder-tip has to be brought in
contact to the copper-pad and the component wire at the same time.
Simultaneous a little solder-tin shall be applied for heating up. As soon
as the solder-tin starts melting the tin wire has to be taken away. Just
wait until the tin has well wetted the pad and the wire and take the
soldering iron away from the soldering area.
6. Make sure not to move the just soldered component for about 5
seconds after removing the soldering iron. This should create a silver
shining faultless soldering joint.
7. For a faultless soldering joint and well done soldering is a clean non-
oxidized soldering-tip absolutely required. It is not possible to perform
a sufficient soldering joint with a dirty soldering tip. Therefore please
clean the soldering tip from excessive solder-tin and dirt by using a wet
sponge or a silicone cleaning pad after each soldering process.
8. After completion of the soldering all connection wires have to be cutted
off directly above the soldering joint by using a side cutter.
9. By soldering semiconductors (transistors, diodes), LED`s and IC`s is
it very important never to exceed the soldering time of 5 seconds to
prevent the destruction of the component. It is absolutely required to
attend to the correct polarity of the component before starting the
soldering process.
10. After the board assembly carefully control the pc-board about correct
insertion of the components and the correct polarity. Please check if
no connections or copper tracks are accidentally short circuited by
soldering tin. This can not only result to malfunction of the module but
also result to a destruction of expensive components.
11. Please take into account that improper soldering joints, wrong
connections, faulty operation or wrong board assembly is not a matter
within our sphere of influence.
General installation information
The contact-wires of resistors and diodes to be assembled in a lying
position shall be bended in accordance to the raster distance into a right
angular position and assembled into the specified bores (in accordance to
the board assembly plan or the assembly markings). To prevent that the
components will not fall out by turn-over the pc-board please bend the
connection wires about 45° apart and solder them carefully to the copper
pads on the rear side of the board. Finally the excessive wires shall be
cutted off with a small side cutter.
The resistors in the supplied kits are metal-foil resistors. Those have a
tolerance of 1% and are marked with a brown “tolerance-ring”. The
tolerance ring can be identified by the larger margin distance respectively
the larger distance to the other four marking rings. Normally there are five
color rings on the metal-foil resistors. To read the color code you have to
locate the resistor that way that the brown tolerance ring will be on the right
side. The color rings will be red now from left to right!
Please take care to assemble diodes with the correct polarity (position of
the cathode marking). Take care about a very short soldering time! The
same will apply to the transistors and the integrated circuits (IC`s). The flat
side of the transistors has to correspond with the marking on the pc-board.
The transistor legs should never be assembled in a crossed position.
Further those components should have a distance of about 5mm to the
board. Attend to the short soldering time to prevent the damage of the
component by excessive heat.
Capacitors shall be assembled into the respective marked bores, the wires
to be bent a little apart and careful soldered to the copper pad. By the
assembly of electrolytic capacitors (electrolytic cap) it has to be attended to
the correct polarity (+,-)! Wrong-way soldered electrolytic capacitors
can explode during the application! Therefore is it very important to
check the correct polarity two-or even better three-times. In addition it has
to be attended to the correct capacitor values, e.g. n10 = 100pF (not
10nF!).
A careful and clean assembly will drastically reduce the possibility that
anything will not be in correct function. Check every step and every
soldering joint two times before carrying on! Attend closely to the assembly
list! Perform the described step not different and do not skip any step!
Mark each step as done at the foreseen column after assembly and careful
check.
Take your time. Private work is no piece-work because the time for careful
assembly work is much less than an extensive fault diagnosis.
Final assembly
Sockets and integrated circuits (IC´s) of the kits will be supplied on a piece
of foam to assure safe transport.
This foam shall never be used below or between components as this foam
is electrical conductive.
In case the kit will be taken into operation the conductive foam can produce
a short circuitry and destroy the complete kit. Anyhow the function of the
module will not be as expected.
Warranty
As we have no influence to the proper and correct assembly we have to
limit our warranty to the complete supply and the faultless quality of the
components.
We guarantee the function of the components in accordance to the
identified values within a non-assembled condition of the parts and the
compliance of the technical data of the circuit by attending to the
respective soldering instruction and the specified start of operation of the
module including connection and operation.
Further demands are not accepted.
We are not taking over any warranty nor any liability for any harm or
sequential damage connected to this product.
We reserve our right for a repair, rework, supply of replacement or refund
of the purchase price.
The following criteria will result to a non-repair respectively to a lost of right
to claim under guarantee:
•if acid-containing soldering tin or fluxes with corrosive content and
others have been used
•if the kit has been improper soldered or assembled
•by alterations or repair-trials on the device
•by own circuit amendments
•by construction of non-intended improper displacement of
components, free wiring of components etc.
•application of other non-original kit-components
•by damaging of copper tracks or soldering copper pads on the board
•by wrong assembly and the sub sequential damages
•overloading the module
•by damages caused by intervention of foreign persons
•by damages caused by disregarding the operation manual respectively
the connection plan
•by connecting a wrong voltage respectively a wrong current
•by wrong polarity connection of the module
•by wrong operation or damages caused by negligent usage or abuse
•by defects caused by bridged or wrong fuses.
All such cases will result to a return of the kit to your expenses.
Subject to technical changes and errors. 05/2013 by LDT
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