LPKF ProtoMat 93s Manual
3
1 Introduction......................................................................................................5
1.1 Characteristics of the LPKF ProtoMat 93s.........................................5
2 General Information.........................................................................................6
2.1 Scope of supply.................................................................................6
2.2 Optional accessories .........................................................................6
2.3 Safety precautions.............................................................................7
2.4 Air-borne sound.................................................................................7
2.5 Installation..........................................................................................8
2.6 Machine orientation ...........................................................................10
2.7 LPKF ProtoMat 93s displays and connections ..................................11
2.8 Use of BoardMaster...........................................................................13
3 Setup...............................................................................................................13
3.1 Before switching on ...........................................................................13
3.2 Turning the system on.......................................................................13
3.3 Switch-on instructions for high-speed spindles..................................14
3.4 After switching on ..............................................................................15
3.5 Function test with BoardMaster .........................................................15
3.6 HOME-Position and two-pin system..................................................16
3.7 Programming the HOME position in BoardMaster.............................17
3.8 Making a new two-pin system............................................................18
3.9 Checking and correcting the HOME position.....................................20
4 The LPKF ProtoMat 93s operating displays....................................................20
5 Computer-controlled functions of the LPKF ProtoMat 93s..............................21
5.1 Connection to a PC............................................................................21
5.2 The LPKF ProtoMat 93s Commands.................................................22
5.2.1 Command structure..............................................................22
5.2.2 HP-GL standard commands.................................................22
5.2.3 Special commands...............................................................24
5.2.4 Special command for the high-speed spindle ......................28
5.2.5 Direct commands.................................................................28
5.3 Producing a PCB with BoardMaster ..................................................29
6 Tools and accessories.....................................................................................31
6.1 Tools..................................................................................................31
6.2 Pen holder (optional) .........................................................................32
6.3 Materials used for machining.............................................................33
7 Milling and drilling with the LPKF ProtoMat 93s..............................................34
7.1 Securing the PCB on the machine bed..............................................34
7.2 The mechanical working depth limiter................................................35
7.3 Functional elements on the mill/drill head..........................................37
7.4 Drilling................................................................................................39
7.5 Isolation milling..................................................................................39
7.6 Contour milling in PCB material.........................................................41
7.7 Milling wide isolation channels...........................................................42
7.8 Front plate engraving.........................................................................42
7.9 Milling layout films..............................................................................43
7.9.1 Correction agents.................................................................43
7.9.2 Coloring milled films.............................................................44
7.9.3 Coating removal...................................................................44
7.10 Basis material..................................................................................45
