Content ProtoMat S
6HB V0.9/Mrz-11 ©2011 LPKF AG
4Transport and storage....................................................................... 39
4.1 Transport................................................................................................................. 39
4.1.1 Transport lock............................................................................................... 39
4.2 Storage ................................................................................................................... 39
5Installation.......................................................................................... 41
5.1 Assembly conditions ............................................................................................... 41
5.2 Unpacking the device ............................................................................................. 42
5.3 Installation and commissioning............................................................................... 42
5.3.1 Installation..................................................................................................... 42
5.3.1.1 Remove the transport lock ...................................................................... 43
5.3.1.2 Connecting the circuit board plotter......................................................... 44
5.3.2 Commissioning ............................................................................................. 45
5.3.3 Remove the dummy tool............................................................................... 46
6Operation............................................................................................ 47
6.1 Production process ................................................................................................. 47
6.2 Start system ............................................................................................................ 48
6.2.1 Tool status monitoring .................................................................................. 49
6.2.2 Grafical user interface .................................................................................. 50
6.2.2.1 Menu bar ................................................................................................. 51
6.2.2.2 Function bar............................................................................................. 52
6.2.3 Window Processing ...................................................................................... 53
6.2.3.1 Manual control of the mill/drill head......................................................... 54
6.2.3.2 Select head.............................................................................................. 55
6.2.3.3 Operate.................................................................................................... 56
6.2.3.4 Move to Position ...................................................................................... 57
6.2.3.5 Head actions............................................................................................ 58
6.3 Establish a connection............................................................................................ 59
6.4 Place material ......................................................................................................... 61
6.5 Tool setup ............................................................................................................... 62
6.5.1 Tool colour code ........................................................................................... 64
6.6 Manual drilling......................................................................................................... 65
6.7 Manual milling ......................................................................................................... 68
6.8 Automatic mode ...................................................................................................... 73
6.8.1 Specify production type ................................................................................ 74
6.8.2 Loading the CBF file ..................................................................................... 76
6.8.2.1 Production of the printed circuit board..................................................... 78
6.9 Dispense ................................................................................................................. 80
6.9.1 Mount dispense set ...................................................................................... 81
6.9.2 Dispense process ......................................................................................... 82
