Meiko Computing Surface CS-2 User manual

Computing
Surface
The CS-2 Processor Module
S1002–10M128.02

The information supplied in this document is believed to be true but no liability is assumed for its use or for the
infringements of the rights of others resulting from its use. No licence or other rights are granted in respect of any
rights owned by any of the organisations mentioned herein.
This document may not be copied, in whole or in part, without the prior written consent of Meiko World Incor-
porated.
© copyright 1995 Meiko World Incorporated.
The specifications listed in this document are subject to change without notice.
Meiko, CS-2, Computing Surface, and CSTools are trademarks of Meiko Limited. Sun, Sun and a numeric suffix,
Solaris, SunOS, AnswerBook, NFS, XView, and OpenWindows are trademarks of Sun Microsystems, Inc. All
SPARC trademarks are trademarks or registered trademarks of SPARC International, Inc. Unix, Unix System V,
and OpenLook are registered trademarks of Unix System Laboratories, Inc. The X Windows System is a trade-
mark of the Massachusetts Institute of Technology. AVS is a trademark of Advanced Visual Systems Inc. Verilog
is a registered trademark of Cadence Design Systems, Inc. All other trademarks are acknowledged.
Circulation Control:

Meiko’s address in the US is:
Meiko
130 Baker Avenue
Concord MA01742
508 371 0088
Fax: [phone]
Meiko’s address in the UK is:
Meiko Limited
650 Aztec West
Bristol
BS12 4SD
01454 616171
Fax: [phone]
Issue Status: Draft
Preliminary
Release X
Obsolete


i. Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . i
Federal Communications Commission (FCC) Notice. . . . i
General Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii
Lifting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii
1. Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Module Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Packing Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Unpacking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3. Installing the Processor Module . . . . . . . . . . . . . . . 7
Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Using the Meiko Beta Phase Controller . . 8
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power Connections. . . . . . . . . . . . . . . . . . . . . . . . 9
Fuses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Removable Panels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10


External Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
At the Rear of the Power Supply Unit . . . 11
At the Rear of the Module . . . . . . . . . . . . 12
At the Front of the Module . . . . . . . . . . . . 12
External Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Module Identification Number . . . . . . . . . . . . . . . . . . . . . 13
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4. Installing Processor Boards. . . . . . . . . . . . . . . . . . . 17
Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
MK401 Single-SPARC Board. . . . . . . . . . . . . . . . . . . . . . 18
Field Upgradeable Components . . . . . . . . . . . . . . 18
MBus Processor Modules. . . . . . . . . . . . . 19
SBus Modules. . . . . . . . . . . . . . . . . . . . . . 20
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Boot ROM. . . . . . . . . . . . . . . . . . . . . . . . . 21
H8 ROM . . . . . . . . . . . . . . . . . . . . . . . . . . 21
NVRAM . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
External Connections . . . . . . . . . . . . . . . . . . . . . . 21
Front Panel Connections. . . . . . . . . . . . . . 22
RS232 Connections. . . . . . . . . . . . . . . . . . 22
Adding SCSI Peripherals . . . . . . . . . . . . . . . . . . . 23
SCSI Termination . . . . . . . . . . . . . . . . . . . 23
External Indicators . . . . . . . . . . . . . . . . . . . . . . . . 24
MK405 Quad-SPARC Board. . . . . . . . . . . . . . . . . . . . . . . 24
Field Upgradeable Components . . . . . . . . . . . . . . 24
MBus Processor Modules. . . . . . . . . . . . . 25
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Boot ROM. . . . . . . . . . . . . . . . . . . . . . . . . 27
H8 ROM . . . . . . . . . . . . . . . . . . . . . . . . . . 27
NVRAM . . . . . . . . . . . . . . . . . . . . . . . . . . 27
External Indicators . . . . . . . . . . . . . . . . . . . . . . . . 27

 
MK403 Vector Processor Board . . . . . . . . . . . . . . . . . . . . 28
Field Upgradeable Components . . . . . . . . . . . . . . 28
MBus/VPU Processor Modules . . . . . . . . 29
SBus Modules. . . . . . . . . . . . . . . . . . . . . . 29
Boot ROM. . . . . . . . . . . . . . . . . . . . . . . . . 29
H8 ROM . . . . . . . . . . . . . . . . . . . . . . . . . . 29
NVRAM . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
External Connections . . . . . . . . . . . . . . . . . . . . . . 30
Front Panel Connections. . . . . . . . . . . . . . 30
RS232 Connections. . . . . . . . . . . . . . . . . . 31
External Indicators . . . . . . . . . . . . . . . . . . . . . . . . 31
5. Installing Backplane Boards. . . . . . . . . . . . . . . . . . 33
Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
MK511/2 Module Switch Cards . . . . . . . . . . . . . . . . . . . . 34
MK515 Module Control Card. . . . . . . . . . . . . . . . . . . . . . 34
Field Upgradeable Components . . . . . . . . . . . . . . 34
External Indicators . . . . . . . . . . . . . . . . . . . . . . . . 35
Reset Switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
External Connections . . . . . . . . . . . . . . . . . . . . . . 36
MK516 SCSI Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Field Upgradeable Components . . . . . . . . . . . . . . 36
6. Installing SCSI Devices . . . . . . . . . . . . . . . . . . . . . . 39
Module Disk Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Installing the Disk Devices. . . . . . . . . . . . . . . . . . 40
Fixing the Disk Device into the Carrier . . 40
Fixing the Carrier into the Processor Module 40
External Indicators . . . . . . . . . . . . . . . . . . 41
External SCSI Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . 41



i
Safety Precautions i
Federal Communications Commission (FCC) Notice
Warning: Changes or modifications to this unit not expressly approved by
the party responsible for compliance could void the user’s authority to op-
erate the equipment.
NOTE: This equipment has been tested and found to comply with the limits
for a Class A digital device, pursuant to Part 15 of the FCC Rules. These lim-
its are designed to provide reasonable protection against harmful interfer-
ence when the equipment is operated in a commercial environment. The
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
Shielded cables must be used with this unit to ensure compliance with the
FCC Class A limits.

ii S1002–10M128.02
General Precautions
•Adhere strictly to the instructions and warnings provided in this
documentation.
•Do not push objects into the interior of the equipment through any openings.
Hazardous voltages and moving parts are present. Conductive objects could
cause electric shock, fire, or damage to the equipment.
•It is not permitted to make mechanical or electrical modifications to the
equipment. The manufacturer is not responsible for regulatory compliance of
equipment that has been modified. You may also invalidate your warranties if
you make unauthorised changes to your equipment.
•When connecting a visual display unit to your module your attention is drawn
to the instructions that are issued by the device manufacturer.
•Your module may contain disk devices. Your attention is drawn to the
instructions that are issued by the device manufacturers.
•A lithium battery is installed on many of the boards in the module — it is an
integral component of the non-volatile RAM (or NVRAM). Lithium batteries
are not customer replaceable. If they are mishandled there is a danger that they
may explode. Always consult Meiko if you suspect that the battery needs
replacing. Never dispose of lithium batteries in a fire or attempt to dismantle.
•Many of the electronic components fitted in the module are fragile or static
sensitive. They should only be handled by trained engineers. You must
observe anti-static precautions when handling boards or electronic devices.
•Operation of this equipment in a residential area may cause unacceptable
interference to radio and TV reception, requiring the operator to take whatever
steps are necessary to correct the interference.
Lifting
The module is heavy and must be lifted by two people or by using the Genie lift-
ing equipment that is supplied by Meiko (large multi-module systems only).

iii
When using the Genie fork lift you must first attach the two lift-clamp assemblies
to either side of the module. Unscrew the securing screw that holds the telescopic
section of the lift-clamp closed. Insert the rear locating pins into the holes at the
rear edge of the module (the open end of the box section should face the front of
the module). Align the front locating pins with the holes at the front of the mod-
ule and tighten the holding screw.
Locate the forks of the Genie lift into the two box sections in the lift clamps.
Raise the module by turning clockwise the handle on the Genie lift. Lower the
module by turning the handle anti-clockwise.
Warning – Your attention is drawn to the operating instructions for the Ge-
nie lift that are supplied by the lift’ s manufacturers.
•Genie fork lift, part number 73-FORK-GENIE.
•Module lifting gear, part number 65-MODULELIFT

iv S1002–10M128.02

1
Overview 1
The Processor Module is a physical enclosure for up to 4 processor boards. Sup-
porting infrastructure within the module consists of cooling fans, power supply,
and connections to the CS-2 data network, the CS-2 control network, and exter-
nal SCSI peripheral buses. Up to 4 SCSI disk devices may also be fitted within
the module and connected to the processor boards in one of three standard con-
figurations (all disks connected to one board, two disks to each of two boards, or
one disk per board). An LED panel at the front of the module offers a 4x4 array
of LEDs per board which are software controlled. The module is fully enclosed
and FCC compliant.
The CS-2 processor module is intended for installation on a CS-2 bay which pro-
vides a firm level support, network interconnect, and power distribution.

2S1002–10M128.02
1

3
Module Packaging 2
CS-2 modules are shipped in units of 1 to 4. The packaging consists of a wood
base, packing foam, antistatic bag, and enclosing triple wall card outer.
Packing Dimensions
All dimensions are approximate.
Packing dimensions (single module):
Packing weight (without module):
Height 74cm (29”)
Width 34cm (13.5”)
Length 112cm (44”)
4 module skid 20Kg (44lbs)
Module base 4.5Kg (10lbs)
Filler 1.8Kg (4lbs)
Outer card cover 4.5Kg (10lbs)
Packing foam 0.2Kg (0.4lbs)
Total (1 module) 11Kg (24.4lbs)
Total (4 modules) 31Kg (68.4lbs)

4S1002–10M128.02
2
Module weight (without processor boards or peripherals):
Processor board weights (all processor options fitted):
Backplane boards:
Peripherals:
Unpacking
Warning – You are reminded of the safety precautions listed in General Pre-
cautions on page ii.
Modules are shipped in groups of 4 or 1.
For 4 module shipments each module is packaged individually and secured with
the others onto a lar ge skid. To unpack a four module skid cut the outer banding
andremove onemodule. Spacethe remainingthree modulepacks uniformly over
the skid.
Module weight 43.5Kg (96lbs)
MK401 (Dino) 2Kg (4.4lbs)
MK405 (Quatro) 3Kg (6.6lbs)
MK403 (VPU) 2.7Kg (6.0lbs)
MK515 Controller 0.15Kg (0.33 lbs)
MK516 SCSI card 0.15Kg (0.33 lbs)
MK511/2 Switch 0.15Kg (0.33 lbs)
Disk carrier 0.6Kg (1.3lbs)
Disk device 0.8Kg (1.8lbs)
Total per disk 1.4Kg (3.1lbs)

Module Packaging 5
2
•To unpack each module first cut the banding and remove the outer card carton
by lifting it clear of the module.
•Remove the protective foam from the top and front of the module.
•Remove the antistatic bag by pulling upwards.
•Lift the module from the packing base. Note: the module is heavy and must be
lifted by at least two people or by using a Genie lift.
•Check the module for damage and advise the transportation company
immediately if any is found.
Retain all packaging and use it when shipping the module.

6S1002–10M128.02
2

7
Installing the Processor Module 3
You must read this chapter thoroughly and completely before using your CS-2
module.
Location
The processor module must be located in a CS-2 Bay. This provides a firm level
support for the module and has been designed to maximise the flow of cooling
air through the module.
Warning – Overheating can damage this pr oduct. Do not block or cover any
openings that are built into the module, and do not place the module near
any sources of heat.
Modules sit on module trays that are fixed to the bay by telescopic rails. The tray
mustbe extendedfrom thebay before a module maybe loadedonto itor removed
from it.
Warning – Never extend mor e than one loaded module tray .
To extend the tray first unscrew the two retaining screws and then pull the tray
forward. Lift the module onto the tray ensuring that the feet on the base of the
module mate with the holes in the tray . Fix the module into position using the
captive screws on the underside of the tray .

8S1002–10M128.02
3
Warning – Your attention is drawn to the lifting instructions in Safety Pre-
cautions on page i.
The bay may carry a number of Beta Phase connections to the module. These
connectors must be opened using the Meiko Beta Phase Controller before the
module tray is pushed into position.
Warning – Failure to open the Beta Flex connectors befor e pushing the mod-
ule trays into position will damage your equipment.
With the Beta Phase connectors held open by the Beta Phase Controller push the
module tray into position. On each of the telescopic arms is a spring slip that
must be pushed-in to allow the arm to slide. Push the tray into position carefully ,
ensuring that the Beta Phase connectors are correctly situated. Lock the module
tray into position using the two captive screws at the front of the tray .
Afterpushingthe moduletrayinto positionusethe BetaPhaseController toclose
the connectors.
Using the Meiko Beta Phase Controller
Connect the Beta Phase controller to the 37-way connector located behind the
module mounting position. Connect the Beta Phase Controller to a mains outlet
using the supplied cable. Use the Activate button on the box to open all the Beta
Phase connectors used by that module — pressing the same button a second time
will close the connectors. Status lights on the box show the condition of each
connector; red indicates open, amber indicates power is being applied, green in-
dicates no power. When using the Controller it is safe to hold the Beta Phase con-
nectors open for prolonged periods.
Power Supply
Check that the voltage and frequency of your power supply is suitable for your
equipment. The power supply unit is auto-ranging, 110–230V, 50/60/400Hz.
Maximum current is 15A.

Installing the Processor Module 9
3
Power Connections
Power is supplied to the processor module by a 3-way cable that is supplied by
Meiko.
The following cable types are available:
•Harvey Hubble to Harvey Hubble.
•Harvey Hubble to UK 13A outlet.
•Harvey Hubble to US 15A outlet.
Where several processor modules are used Meiko may also supply a mains dis-
tribution board. This connects eight modules to one power supply outlet.
•Power distribution panel, European. Part number 65-DIST-EUR-01
•Power distribution panel, USA. Part number 65-DIST-US-01
Warning – You must only use power cords and distributions panels that ar e
supplied by Meiko. These have the corr ect power rating for your system.
Warning – You should check that you have been supplied with the corr ect
type of power cord and distribution boards.
Fuses
Five fuses are located at the rear of the processor module as shown in Figure 3-
1 on page 15. One fuse protects the power supply unit from the incoming mains
supply. Two fuses protect the fans and 2 protect the disk drives.
•Main fuse: standard 250V, 15A. Part number 22-F0100-04E150.
•Fan fuse: anti-surge 250V, 10A. Part number 22-F0100-04E100.
•Fan fuse: anti-surge 250V, 5A. Part number 22-F0100-04E500.
•Disk fuse: anti-surge 250V, 10A. Part number 22-F0100-04E100.
•Disk fuse: anti-surge 250V, 5A. Part number 22-F0100-04E500.

10 S1002–10M128.02
3
There are 4 fuses located on the module backplane alongside the 4 SCSI card
connectors (see Figure 3-2 on page 16). These fuses protect the ±12V and the
±5V circuits on both the backplane and all boards that draw their power supply
from it (including the backplane cards and the LED panel). Access to these fuses
is gained from the rear of the module and requires the SCSI backplane cards to
be removed. All 4 fuses are the same type:
•1.25×0.52”, 4A anti-surge, HCR ceramic. Part number 22–FU100–03E400.
Warning – The backplane fuses may only be changed by trained engineers.
Operation
The power supply is operated by the main on/off switch located above the power
connector. 0 represents off, 1 represents on.
When first switched on five LEDs are visible through the rear of the power sup-
ply unit. Initially three of these should be green, two are red. After a short delay
all LEDs should be green.
Warning – A fault is pr esent if any light r emains red for more than 10 sec-
onds after first switching on, or changes fr om green to red during operation.
Switch the power supply off, disconnect fr om the main supply, and contact
Meiko for advice.
Removable Panels
Warning – Ensure the power supply is switched off and disconnected from
the main supply before removing the module’s front or side panels.
The front and side panels may be removed from the module. Removing the front
panel gives access to the LED board, the processor boards, and the disk devices.
The side panels may be removed but there is no requirement to do so, except to
protect them during transit or when lifting the module into a bay .