Microchip Technology MRF24J40MD User manual

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2014 Microchip Technology Inc. Advance Information DS70005173A-page 1
MRF24J40MD/ME
Features:
• IEEE Std. 802.15.4™ Compliant RF Transceiver
• Supports ZigBee®, MiWi™ Development
Environment Proprietary Wireless Networking
Protocols
• 4-Wire Serial Peripheral Interface (SPI) with
Interrupt
• Small size: 0.9" x 1.3" (22.9 mm x 33.0 mm),
Surface Mountable: Pin Compatible with
MRF24J40MB and MRF24J40MC
• Integrated Crystal, Internal Voltage Regulator,
Matching Circuitry, Power Amplifier, Low Noise
Amplifier
• PCB Antenna (MRF24J40MD), External Antenna
Connector (MRF24J40ME): Ultra Miniature
Coaxial (U.FL), 50Ω
• Easy Integration into Final Product: Minimize
Product Development, Quicker Time to Market
• Compliance:
- Modular Certified for the United States (FCC)
and Canada (IC)
- European R&TTE Directive Assessed Radio
Module
- Australia/New Zealand
• Compatible with Microchip microcontroller
families (PIC16, PIC18, PIC24, dsPIC33 and
PIC32)
• Range up to 4000 ft
Operational:
• Operating Voltage: 3.0V-3.6V (3.3V typical)
• Temperature Range: -40°C to +85°C Industrial
• Low-Current Consumption:
- Rx Mode: 32 mA (typical)
- Tx Mode: 140 mA (typical)
- Sleep: 10 A (typical)
RF/Analog Features:
• ISM Band 2.405 GHz-2.475 GHz Operation
• Data Rate: 250 kbps
• -104 dBm Typical Sensitivity with -23 dBm
Maximum Input Level
• +19 dBm Typical Output Power with 45 dB Tx
Power Control Range
• Integrated Low Phase Noise VCO, Frequency
Synthesizer and PLL Loop Filter
• Digital VCO and Filter Calibration
• Integrated RSSI ADC and I/Q DACs
• Integrated LDO
• High Receiver RSSI Dynamic Range
MAC/Baseband Features:
• Hardware CSMA-CA Mechanism, Automatic ACK
Response and FCS Check
• Independent Beacon, Transmit and GTS FIFO
• Supports all CCA modes and RSS/LQI
• Automatic Packet Retransmit Capable
• Hardware Security Engine (AES-128) with CTR,
CCM and CBC-MAC modes
• Supports Encryption and Decryption for MAC Sub
layer and Upper Layer
Pin Diagram:
2
3
4
5
6
1
7
VIN
GND
8
9
10
RESET
WAKE
SDO
SDI
SCK
CS
NC
GND
INT
12
11 GND
2.4 GHz IEEE Std. 802.15.4™
RF Transceiver Module with PA/LNA

MRF24J40MD/ME
DS70005173A-page 2 Advance Information 2014 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 3
2.0 Circuit Description ...................................................................................................................................................................... 11
3.0 Regulatory Approval................................................................................................................................................................... 19
4.0 Electrical Characteristics ........................................................................................................................................................... 25
Appendix A: Revision History............................................................................................................................................................... 27
The Microchip Web Site ....................................................................................................................................................................... 29
Customer Change Notification Service ................................................................................................................................................ 29
Product Identification System............................................................................................................................................................... 30
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Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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2014 Microchip Technology Inc. Advance Information DS70005173A-page 3
MRF24J40MD/ME
1.0 DEVICE OVERVIEW
The MRF24J40MD/ME is a 2.4 GHz IEEE Std.
802.15.4™ compliant, surface mount module with
integrated crystal, internal voltage regulator, matching
circuitry, Power Amplifier (PA), Low Noise Amplifier
(LNA) with PCB Trace Antenna (MRF24J40MD) or 50Ω
external antenna connector (MRF24J40ME). The
MRF24J40MD/ME module operates in the non-
licensed 2.4 GHz frequency band. The integrated
module design frees the integrator from extensive RF
and antenna design, and regulatory compliance testing
allowing quicker time to market.
The MRF24J40MD/ME module is compatible with
Microchip’s MiWi™ Development Environment
software stacks. The MiWi Development Environment
software stack including the source code is available as
a free download, from the Microchip web site: http://
www.microchip.com/wireless.
The MRF24J40MD/ME module has received
regulatory approvals for modular devices in the United
States (FCC) and Canada (IC). Modular approval
removes the need for expensive RF and antenna
design, and allows the end user to place the
MRF24J40MD/ME module inside a finished product
and does not require regulatory testing for an
intentional radiator (RF transmitter). To maintain
conformance, refer to module settings in Section 3.1.2
“RF Exposure” for the United States and Section
“Transmitter Antenna (from Section 7.1.2 RSS-Gen,
Issue 3, December 2010): User manuals for
transmitters shall display the following notice in a
conspicuous location:” for Canada.
The MRF24J40MD/ME module is an R&TTE Directive
assessed radio module for operation in Europe. The
module tests can be applied toward final product
certification and Declaration of Conformity (DoC). To
maintain conformance for Europe, refer to module
settings in Section 3.4 “Australia”. Additional testing
may be required depending on the end application.
1.1 Interface Description
Figure 1-1 shows a simplified block diagram of the
MRF24J40MD/ME module. The module is based on
the Microchip Technology MRF24J40 IEEE
802.15.4™ 2.4 GHz RF Transceiver IC. The module
interfaces to many popular Microchip PIC®microcon-
trollers through a 4-wire SPI interface, interrupt, wake,
reset, power and ground, as shown in Figure 1-2.
Table 1-1 provides the pin descriptions.
Serial communication and module configuration for the
MRF24J40MD/ME module are documented in the
“MRF24J40 Data Sheet” (DS39776). Refer to the data
sheet for specific serial interface protocol and register
definitions.
Also, see Section 1.4 “Operation” for specific register
settings that are unique to the MRF24J40MD/ME
module.
FIGURE 1-1: MRF24J40MD/ME BLOCK DIAGRAM
Antenna
U.FL
PA
Physical MAC
Interface
Power
Management
SPI
20 MHz
Crystal
Digital
I/O
Power
MRF24J40MD/ME IEEE Std. 802.15.4™ Module
MRF24J40
LNA
Connector

MRF24J40MD/ME
DS70005173A-page 4 Advance Information 2014 Microchip Technology Inc.
FIGURE 1-2: MICROCONTROLLER TO MRF24J40MD/ME INTERFACE
TABLE 1-1: PIN DESCRIPTION
Pin Symbol Type Description
1 GND Ground Ground
2 RESET DI Global hardware Reset pin
3 WAKE DI External wake-up trigger
4 INT DO Interrupt pin to microcontroller
5 SDI DI Serial interface data input
6 SCK DI Serial interface clock
7 SDO DO Serial interface data output from MRF24J40
8CS DI Serial interface enable
9 NC — No connection
10 VIN Power Power supply
11 GND Ground Ground
12 GND Ground Ground
Legend: Pin type abbreviation: D = Digital, I = Input, O = Output
SDO
I/O
SDI
SCK
INTX
MRF24J40MD/ME
CS
SDI
SDO
SCK
INT
I/O WAKE
VIN
GND
PIC®MCU
I/O RESET

2014 Microchip Technology Inc. Advance Information DS70005173A-page 5
MRF24J40MD/ME
1.2 Mounting Details
The MRF24J40MD/ME is a surface mountable mod-
ule. Module dimensions are shown in Figure 1-3. The
module Printed Circuit Board (PCB) is 0.032" thick
with castellated mounting points on the edge.
Figure 1-4 is a recommended host PCB footprint for
the MRF24J40MD/ME.
The MRF24J40MD has an integrated PCB antenna.
For the best performance, follow the mounting details
shown in Figure 1-5. It is recommended that the mod-
ule be mounted on the edge of the host PCB, and an
area around the antenna, approximately 1.2", be kept
clear of metal objects. A host PCB ground plane
around the MRF24J40MD acts as a counterpoise to
the PCB antenna. It is recommended to extend the
ground plane at least 0.4" around the module.
The MRF24J40ME has 50Ωultra miniature coaxial
(U.FL) connector.
1.3 Soldering Recommendations
The MRF24J40MD/ME module was assembled using
a standard lead-free reflow profile. The module is com-
patible with standard lead-free solder reflow profiles. To
avoid damaging the module, the following recommen-
dations are given:
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the last flow
FIGURE 1-3: MODULE DETAILS
Caution: The U.FL connector is fragile and can only
tolerate very limited number of insertions.

MRF24J40MD/ME
DS70005173A-page 6 Advance Information 2014 Microchip Technology Inc.
FIGURE 1-4: RECOMMENDED PCB FOOTPRINT
FIGURE 1-5: MOUNTING DETAILS
0.315”
Edge of PCB
Keep area around antenna
(approximately 1.2 inches)
clear of metallic structures
for best performance
PCB Ground Plane (Counterpoise)
Underneath and extend as far as possible
to the sides and below the module
(at least 0.4 inches on each side)
for best performance
0.4”
0.4” 0.4”
1.2”
1.2”

2014 Microchip Technology Inc. Advance Information DS70005173A-page 7
MRF24J40MD/ME
1.4 Operation
The MRF24J40MD/ME module is based on the
Microchip Technology MRF24J40 2.4 GHz IEEE
802.15.4 RF Transceiver IC. Serial communication and
configuration are documented in the “MRF24J40 Data
Sheet” (DS39776).
This section emphasizes operational settings that are
unique to the MRF24J40MD/ME module design that
must be followed for proper operation.
1.4.1 PA/LNA CONTROL
Operation of the PA U6 and LNA U1 is controlled by the
MRF24J40 internal RF state machine through RF
switches, U3 and U4, and the GPIO0, GPIO1 and GPIO2
pins on the MRF24J40. Figure 1-6 shows the PA/LNA
block diagram. Figure 2-5 is the schematic diagram for
the module.
The internal RF state machine is configured for the PA/
LNA Mode by setting TESTMODE (0x22<2:0>) = 111.
Pins GPIO0, GPIO1 and GPIO2 control the RF
switches, PA and LNA automatically when the
MRF24J40 receives and transmits data.
FIGURE 1-6: PA/LNA BLOCK DIAGRAM
Note: A complete explanation of the operation of
the PA/LNA control is documented in the
“MRF24J40 Data Sheet” (DS39776),
Section 4.2 “External PA/LNA Control”.
MRF24J40
GPIO1
GPIO2
U.FL
Connector
(ME)
Balun RFP
RFN
PA
SST12LP17E
LNA
PA
RF Switch
RF3023TR7
RF Switch
RF3023TR7
LNA
SST12LN01
V2 V1 V2 V1
GPIO0
PA_ON
TX
RX
BPF
PCB
Antenna
(MD)

MRF24J40MD/ME
DS70005173A-page 8 Advance Information 2014 Microchip Technology Inc.
1.4.2 ENERGY DETECTION (ED)
Before performing an energy detection (see Section
3.6.1 “RSSI Firmware Request (RSSI Mode 1)” in the
“MRF24J40 Data Sheet” (DS39776), perform the
following steps:
1. Configure the internal RF state machine to normal
operation (TESTMODE (0x22F<2:0>) = 000).
2. Configure GPIO2 and GPIO1 direction for
output (TRISGP2 (0x34<2>) = 1and TRISGP1
(0x34<1>) = 1).
3. Set GPIO2 (0x33<2>) = 1and GPIO1
(0x32<1>) = 0. This enables the LNA and
disables the PA.
4. Perform the energy detection following the steps
in Section 3.6.1 “RSSI Firmware Request (RSSI
Mode 1)” in the “MRF24J40 Data Sheet”
(DS39776).
1.4.3 SLEEP
To get the lowest power consumption from the
MRF24J40MD/ME module during Sleep, it is neces-
sary to disable the PA, PA voltage regulator and LNA.
To do this, perform the following steps:
1. Configure the internal RF state machine to normal
operation (TESTMODE (0x22F<2:0>) = 000).
2. Configure the GPIO2, GPIO1 and GPIO0
direction for output (TRISGP2 (0x34<2>) = 1,
TRISGP1 (0x34<1>) = 1) = 1and TRISGP0
(0x34<0>) = 1).
3. Set GPIO2 (0x33<2>) = 0and GPIO1
(0x32<1>) = 0. This disables the LNA and the PA.
4. Put the MRF24J40 to Sleep following the steps
in the “MRF24J40 Data Sheet” (DS39776).
When waking the module, re-enable the PA/LNA Mode.
Note: The LNA will amplify the received signal.
The RSSI value will include the receive
signal strength plus the LNA amplification.

2014 Microchip Technology Inc. Advance Information DS70005173A-page 9
MRF24J40MD/ME
1.4.4 TRANSMIT POWER SETTINGS
Table 1-2 lists the power settings in register RFCON3
(0x203<7:3>) and the output power at antenna
connector J1.
Note 1: Typical output power at antenna connector J1, Channel 11, 50Ωimpedance.
TABLE 1-2: MRF24J40ME TRANSMIT POWER SETTINGS
RFCON3 (0x203<7:3>) MRF24J40 Power Setting Conducted Output Power(1) (dBm)
11111 –36.3 -13.6
11110 –34.9 -12.4
11101 –33.7 -11.5
11100 –32.8 -10.7
11011 –31.9 -10.0
11010 –31.2 -9.6
11001 –30.5 -9.2
11000 –30.0 -3.4
10111 –26.3 -1.3
10110 –24.9 -0.7
10101 –23.7 0.1
10100 –22.8 0.5
10011 –21.9 1.0
10010 –21.2 1.3
10001 –20.5 5.8
10000 –20.0 7.0
01111 –16.3 8.1
01110 –14.9 9.0
01101 –13.7 9.7
01100 –12.8 10.4
01011 –11.9 10.9
01010 –11.2 11.3
01001 –10.5 16.0
01000 –10.0 17.2
00111 –6.3 17.9
00110 –4.9 18.5
00101 –3.7 19.0
Note: Refer to Section 3.0 “Regulatory
Approval” for the required maximum
power setting necessary to maintain
certification requirements for each country
the module will be used.

MRF24J40MD/ME
DS70005173A-page 10 Advance Information 2014 Microchip Technology Inc.
NOTES:

2014 Microchip Technology Inc. Advance Information DS70005173A-page 11
MRF24J40MD/ME
2.0 CIRCUIT DESCRIPTION
The MRF24J40MD/ME is a 2.4 GHz IEEE
Std. 802.15.4™ compliant surface mount module with
integrated crystal, internal voltage regulator, matching
circuitry, power amplifier, low noise amplifier with PCB
trace antenna (MRF24J40MD) and 50Ωexternal
antenna connector (MRF24J40ME).
The MRF24J40MD/ME module interfaces to many
popular Microchip PIC microcontrollers through a 4-wire
SPI Interface, interrupt, wake, reset, power and ground.
An example application schematic is illustrated in
Figure 2-4.
Serial communications and register definitions for the
MRF24J40MD/ME module are documented in the
“MRF24J40 Data Sheet” (DS39776). Refer to this data
sheet for specific serial interface protocol and register
definitions. Also, see Section 1.4 “Operation” for
specific register settings that are unique to the
MRF24J40MD/ME module.
2.1 PCB Antenna (MRF24J40MD)
The Printed Circuit Board (PCB) antenna is fabricated
on the top copper trace of the module PCB. The layers
below the antenna have no copper traces. The ground
and power planes under the components serve as a
counterpoise to the PCB antenna. Additional ground
plane on the host PCB will substantially enhance the
performance of the module. For best performance,
place the module on the host PCB following the recom-
mendations in Section 1.2 “Mounting Details”.
The PCB antenna was designed and simulated using
Ansoft Designer®and HFSS™ 3D full-wave solver soft-
ware by Ansoft Corporation (www.ansoft.com) and
tested in an anechoic room. The design goal was to
create a compact, low-cost antenna with the best radi-
ation pattern. Figure 2-1 shows the simulation drawing
and Figure 2-2 and Figure 2-3 show the 2D and 3D
radiation patterns, respectively. As shown by the radia-
tion patterns, the performance of the antenna is depen-
dent upon the orientation of the module. The discrete
matching circuitry matches the impedance of the
antenna with the MRF24J40 transceiver IC.
FIGURE 2-1: PCB ANTENNA SIMULATION DRAWING

MRF24J40MD/ME
DS70005173A-page 12 Advance Information 2014 Microchip Technology Inc.
FIGURE 2-2: SIMULATED 2D RADIATION PATTERN
FIGURE 2-3: SIMULATED 3D RADIATION PATTERN
2.2 External Antenna (MRF24J40ME)
The MRF24J40ME module has a 50Ωultra miniature
coaxial (U.FL) connector to connect to an external 2.4
GHz antenna.
Modular certification of the MRF24J40ME module was
performed with the external antenna types listed in
Table 2-1. An antenna type comprises antennas having
similar in-band and out-of-band radiation patterns.
Refer to Section 3.0 “Regulatory Approval” for
specific regulatory requirements by country.
TABLE 2-1: TESTED EXTERNAL
ANTENNA TYPES
Caution: The U.FL connector is fragile and can only
tolerate very limited number of insertions.
Type Gain
Whip Dipole 5 dBi
Note 1: An antenna type comprises antennas
having similar in-band and out-of-band
radiation patterns.

2014 Microchip Technology Inc. Advance Information DS70005173A-page 13
MRF24J40MD/ME
2.3 Module Schematic
A schematic diagram of the module is illustrated in
Figure 2-5 and the Bill of Materials (BOM) is shown in
Table 2-2.
The MRF24J40MD/ME module is based on the
Microchip Technology MRF24J40 IEEE 802.15.4™ 2.4
GHz RF Transceiver IC (U2). The Serial I/O (SCK, SDI,
SDO and CS), RESET, WAKE and INT pins are
brought out to the module pins. The SDO signal is
tri-state buffered by U7 to solve a silicon errata, where
the SDO signal does not release to a high-impedance
state, after the CS pin returns to its inactive state.
Crystal, X1, is a 20 MHz crystal with a frequency
tolerance of ±10 ppm @ 25°C to meet the IEEE Std.
802.15.4 symbol rate tolerance of ±40 ppm.
A balun is formed by components: L2, L4, L5, C19,
C20, C22 and C43. L2 is also a pull-up for the RFP and
RFN pins on the MRF24J40. C19 also act as a DC
block capacitor. RF switches, U3 and U4, switch
between the power amplifier, U6, when transmitting
and low noise amplifier, U1, when receiving. A
band-pass filter U5 is placed after the PA U6 to reduce
harmonics. The remaining passive components
provide bias and decoupling.
FIGURE 2-4: MRF24J40MD/ME APPLICATION SCHEMATIC

MRF24J40MD/ME DS70005173A-page 14 Advance Information 2014 Microchip Technology Inc.
FIGURE 2-5: MRF24J40MD/ME SCHEMATIC
VDD
NC7SZ125P5X
24
Vcc 5
GND
3
OE 1
U7
VDD
CS
CS
SC K
SD I
IN T
WA K E
SCK
SDI
INT
WAKE
SDO
SD O
33pF
C6
1uF
C5
0.01uF
C10
0.1uF
C4
0.01uF
C2
1uF
C9
33pF
C3
0.01uF
C7
33pF
C1
GND
100pF
C31
18pF
C32
20MH z
X1
18pF
C33
0.1uF
C35
0.1uF
C34
B1
1
GND
2
B2
3
Vc1 6
Vc2 4
A5
U3RF3023TR 7
4.7nH
L2
4.7nH
L5
0.5pF
C22
1.8pF
C19
VDD
0.5pF
C20
3.0nH
L4
B1 1
GND
2
B2 3
Vc1 6 Vc2 4
A
5
U4RF3023TR 7
TX RX
RX
TX
SST12LN 01
RFIN
2
GND
0
VDD 6
RFOUT 5
U1
NP
C14
33pF
C29
NP
C30
2450B P15B 100E
GND
1
OUT
2
GND
3
IN 4
U5
SST12LP17E
VCC2 1
VCC1 2
RFIN 3
VREF 4 DET
5
RFOUT
6
GND
0
U6
33pF
C23
0.2pF
C27
6.8nH
L10
8.2nH
L8
1nF
C17
1nF
C18 1nF
C15
1nF
C16
0.1uF
C11
2N7002P,215
Q2
BSS84
Q1
VDD
470k
R1
RX TX
J1-ME
UFL C onnector
RX
PA _ON
PA _ON _R
VDD
0.0R
R2
0.0R
R3-ME
A1A
i
Power Net
i
50 Ohm
iPowerNet
i
Power Net
iPowerNet
i
50 Ohm
i
50 Ohm
i
50 Ohm
i
50 Ohm
i50 Ohm
i50 Ohm
i
50 Ohm
i50Ohm
i
50 Ohm
i
50 Ohm
i
50 Ohm
i50 Ohm
i
50 Ohm
i
50 Ohm
i50 Ohm
i
50 Ohm
i
50 Ohm
GND
1
RESET
2
WA K E
3
IN T
4
SD I
5
SC K
6SD O 7
CS 8
VIN 10
GND 11
GND 12
NC 9
M1
MR F24J40 Module Footprint
RF Testpoint
NC
1nF
C37
1nF
C38
2.2uF
C26
5.6R
R8
33pF
C28
1.5pF
C44
33pF
C36
GND
NP
R9
NC
GPIO 4
10
GPIO 5
9
GPIO 1
8
GPIO 0
7
GND
6
VDD
5
VDD
4
RFN
3
RFP
2
VDD
1
CS
20
SCK
19
SDI
18
SDO
17
INT
16
WAKE
15
GND
14
RESET
13
GPIO3
12
GPIO2
11
NC 30
NC 29
NC 28
NC 27
NC 26
GND 25
GND 24
NC 23
GND 22
VDD 21
LCAP 40
VDD 39
NC 38
VDD 37 GND 36 VDD 35
OSC1 34
OSC2 33
VDD 32 VDD 31 GND 41
U2
GND
VDD
GND
GND
GND
VDD
VDD
VDD
GND
VDD
VDD
VDDVDD GND
100pF
C42
GND
NP
R7
GND GND
GND
GND
GND
GND
GND
GND
33pF
C8
GND
1.5pF
C21
1pF
C24
2.7nH
L6
GND
GND
GND
RESET
RESET
33pF
C43
VDD
51R
R6

2014 Microchip Technology Inc. Advance Information DS70005173A-page 15
MRF24J40MD/ME
TABLE 2-2: MRF24J40MD/ME BILL OF MATERIALS
Designator Quantity Value Manufacturer Manufacturer PN
C1 133 pF Murata Electronics GRM1535C1H330JDD5D
C2, C10 20.01 uF Murata Electronics GRM155R71E103KA01D
C3, C6, C8, C9, C23, C25, C28, C29, C36, C43 10 33 pF Murata Electronics GRM1535C1H330JDD5D
C4 11 100 nF Murata Electronics GRM155R61A104KA01D
C5 11 uF Murata Electronics GRM155R60J105KE19D
C7, C15, C16, C17, C18 51000 pF Murata Electronics GRM155R71H102KA01D
C11, C34, C35 30.1 uF Murata Electronics GRM155R61A104KA01D
C14, C30 0Not Populated
C19, C21 21.8 pF Murata Electronics GRM1555C1H1R8CA01D
C20, C22 20.5 pF Murata Electronics GRM1555C1HR50CA01D
C24 11 pF Murata Electronics GRM1555C1H1R0CA01D
C26 12.2 uF Murata Electronics GRM188R60J225KE19D
C27 10.2 pF Murata Electronics GRM1555C1HR20WA01D
C20, C22 20.5 pF Murata Electronics GRM1555C1HR50BA01D
C19 11.8 pF Murata Electronics GRM1555C1H1R8BA01D
C21 11.5 pF Murata Electronics GRM1555C1H1R5BA01D
C31, C42 2100 pF Murata Electronics GRM1555C1H101GA01D
C32, C33 218 pF Murata Electronics GRM1555C1H180JA01D
C11, C4, C34, C35 4100 nF Murata Electronics GRM155R61A104KA01D
C2, C10 210 nF Murata Electronics GRM155R71E103KA01D
C1, C3, C6, C8, C9, C23, C28, C29, C36, C37, C38, C43 12 33 pF Murata Electronics GRM1535C1H330JDD5D
C7,C15, C16, C17, C18 51 nF Murata Electronics GRM155R71H102KA01D
C5 11 uF Murata Electronics GRM155C80G105KE19D
C24 11 pF Murata Electronics GJM1555C1HR75BB01D
C44 11.5 pF Murata Electronics GRM1555C1H1R5BA01D
L2, L5 24.7 nH Murata Electronics LQG15HS4N7S02D
L4 13.0 nH Murata Electronics LQG15HN3N0S02D
L6 12.7 nH Murata Electronics LQG15HS2N7S02D
L7 10R Yageo RC0603JR-0710KL
L8 18.2 nH Murata Electronics LQW15AN8N2J00D
L10 16.8 nH Murata Electronics LQG15HS6N8J02D

MRF24J40MD/ME DS70005173A-page 16 Advance Information 2014 Microchip Technology Inc.
Q1 1BSS84 Fairchild Semiconductor BSS84
Q2 12N7002P,215 NXP Semiconductor 2N7002P,215
R1 1470k Yageo RC0402FR-07470KL
R5 150R Yageo RC0402JR-0751RL
R2, R3, R4, R6, R10 50 ohm Yageo RC0402JR-070RL
R7, R9 0Not Populated
R8 15.6 R Yageo RC0402JR-075R6L
U1 1SST12LN01 Microchip SST12LN01-QU6F
U2 1MRF24J40 Microchip MRF24J40-I/ML
U3, U4 2RF3023 RFMD RF3023
U5 12450BP15B100E Johanson Technology Inc 2450BP15B100E
U6 1SST12PL17E Microchip SST12PL17E-XX8E
U7 1NC7SZ125P5X Fairchild Semiconductor NC7SZ125P5X
X1 120 MHz Abracon ABM8-156-20.000MHz
TABLE 2-2: MRF24J40MD/ME BILL OF MATERIALS (CONTINUED)
Designator Quantity Value Manufacturer Manufacturer PN

2014 Microchip Technology Inc. Advance Information DS70005173A-page 17
MRF24J40MD/ME
2.4 Printed Circuit Board
The MRF24J40MD/ME module PCB is constructed
with high temperature FR4 material, four layers and
0.032 " thick. The layers are illustrated in Figure 2-6
through Figure 2-10. The stack up of the PCB is
illustrated in Figure 2-11.
FIGURE 2-6: TOP SILK SCREEN
FIGURE 2-7: TOP COPPER
FIGURE 2-8: LAYER 2 – GROUND
PLANE
FIGURE 2-9: LAYER 3 – POWER
PLANE

MRF24J40MD/ME
DS70005173A-page 18 Advance Information 2014 Microchip Technology Inc.
FIGURE 2-10: BOTTOM COPPER
FIGURE 2-11: PCB LAYER STACK UP
Top Copper
Ground Plane
Power Plane
Bottom Copper
1/2 oz. Copper
1/2 oz. Copper
1/2 oz. Copper
1/2 oz. Copper
8 mil FR4
12 mil FR4
8 mil FR4
0.032"
±0.005"

2014 Microchip Technology Inc. Advance Information DS70005173A-page 19
MRF24J40MD/ME
3.0 REGULATORY APPROVAL
This section outlines the regulatory information for the
MRF24J40MD/ME module for the following countries:
• United States
• Canada
• Europe
• Australia
• New Zealand
• Other Regulatory Jurisdictions
3.1 United States
The MRF24J40MD/ME module has received Federal
Communications Commission (FCC) CFR47 Telecom-
munications, Part 15 Subpart C “Intentional Radiators”
modular approval in accordance with Part 15.212 Mod-
ular Transmitter approval. Modular approval allows the
end user to integrate the MRF24J40MD/ME module
into a finished product without obtaining subsequent
and separate FCC approvals for intentional radiation,
provided no changes or modifications are made to the
module circuitry. Changes or modifications could void
the user's authority to operate the equipment. The end
user must comply with all of the instructions provided
by the Grantee, which indicate installation and/or oper-
ating conditions necessary for compliance.
The finished product is required to comply with all appli-
cable FCC equipment authorizations regulations,
requirements and equipment functions not associated
with the transmitter module portion. For example, com-
pliance must be demonstrated to regulations for other
transmitter components within the host product; to
requirements for unintentional radiators (Part 15 Sub-
part B “Unintentional Radiators”), such as digital
devices, computer peripherals, radio receivers, etc.;
and to additional authorization requirements for the
non-transmitter functions on the transmitter module
(i.e., Verification, or Declaration of Conformity) (e.g.,
transmitter modules may also contain digital logic func-
tions) as appropriate.
3.1.1 LABELING AND USER
INFORMATION REQUIREMENTS
The MRF24J40MD/ME module has been labeled with
its own FCC ID number, and if the FCC ID is not visible
when the module is installed inside another device,
then the outside of the finished product into which the
module is installed must also display a label referring to
the enclosed module. This exterior label can use word-
ing as follows:
A user’s manual for the product should include the
following statement:
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748 available at the FCC Office of Engi-
neering and Technology (OET) Laboratory Division
Knowledge Database (KDB)
http://apps.fcc.gov/oetcf/kdb/index.cfm.
Contains Transmitter Module FCC ID: 
W7OMRF24J40MDME
or
Contains FCC ID: W7OMRF24J40MDME
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equip-
ment generates, uses and can radiate radio fre-
quency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the
following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a cir-
cuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV
technician for help.