MiTAC Master Series User manual

MB1-10AP
User Manual
V1.4
Master Series Embedded System
Intel®Apollo Lake Processors
Efficient, Versatile, and Rugged & Reliable

PREFACE
Copyright Notice
Copyright © 2016-2020 MiTAC Computing Technology Corporation (MiTAC Group). No part of this
document may be reproduced, copied, translated, or transmitted in any form or by any means,
electronic or mechanical, for any purpose, without the prior written permission of MiTAC Corp., Ltd.
All information and specification provided in this manual are for reference only and remain subject to
change without prior notice.
Disclaimer
We reserve the right to make changes, without notice, to any product, including circuits and/or
software described or contained in this manual in order to improve design and/or performance. We
assume no responsibility or liability for the use of the described product(s) conveys no license or title
under any patent, copyright, or masks work rights to these products, and make no representations or
warranties that these products are free from patent, copyright, or mask work right infringement,
unless otherwise specified. Applications that are described in this manual are for illustration purposes
only. We make no representation or guarantee that such application will be suitable for the specified
use without further testing or modification.
Declaration of Conformity
FCC
This equipment has been tested and found to comply with the limits for a
class "A" digital device, pursuant to part 15 of the FCC rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this
equipment in a residential area is likely to cause harmful interference in
which case the user will be required to correct the interference at him own
expense.
CE
This equipment is in conformity with the requirement of the following EU
legislations and harmonized standards. Product also complies with the
Council directions.

Safety Information
WARNING! / AVERTISSEMENT!
Always completely disconnect the power cord from your chassis
whenever you work with the hardware. Do not make connections
while the power is on. Sensitive electronic components can be
damaged by sudden power surges. Only experienced electronics
personnel should open the PC chassis.
CAUTION/ATTENTION
Always ground yourself to remove any static charge before touching
the CPU card. Modern electronic devices are very sensitive to static
electric charges. As a safety precaution, use a grounding wrist strap at
all times. Place all electronic components in a static-dissipative
surface or static-shielded bag when they are not in the chassis.
Safety Precautions
For your safety, please carefully read all the safety instructions before using the device. All cautions
and warnings on the equipment should be noted. Keep this user manual for future reference.
*Let service personnel to check the equipment in case any of the following problems appear:
The power cord or plug is damaged.
Liquid has penetrated into the equipment.
The equipment has been exposed to moisture.
The equipment does not work well or you cannot get it to work according to the user manual.
The equipment has been dropped and damaged.
The equipment has obvious signs of breakage on the surface.

Ordering Information
Model Number
Description
MB1-10AP-N3350
Fanless embedded system with Intel® Apollo Lake N3350
processor.
1x204Pin DDR3L SO-DIMM 1857Mhz up to 8GB, 1xHDMI,
3xGbE LAN, 4xUSB3.0, 2xCOM, 8~24V DC-in, with wall mount,
L6 system.
MB1-10AP-N3350-POE
Fanless embedded system with Intel® Apollo Lake N3350
processor.
1x204Pin DDR3L SO-DIMM 1857Mhz up to 8GB, 1xHDMI,
1xGbE LAN, 2xPoE LAN, 4xUSB3.0, 2xCOM, 8~24V DC-in,
with wall mount, L6 system.
MB1-10AP-N4200
Fanless embedded system with Intel® Apollo Lake N4200
processor.
1x204Pin DDR3L SO-DIMM 1857Mhz up to 8GB, 1xHDMI,
3xGbE LAN, 4xUSB3.0, 2xCOM, 8~24V DC-in, with wall mount,
L6 system.
MB1-10AP-N4200-POE
Fanless embedded system with Intel® Apollo Lake N4200
processor.
1x204Pin DDR3L SO-DIMM 1857Mhz up to 8GB, 1xHDMI,
1xGbE LAN, 2xPoE LAN, 4xUSB3.0, 2xCOM, 8~24V DC-in,
with wall mount, L6 system.
Packing List
Item
Description
Q’ty
1
MB1-10AP Embedded System
1
2
Wall Mount Brackets (2 pcs in 1 set)
1
3
Driver CD
1
4
Full to Half Size mPCIe Card Adapter Plate
1
5
3-pin Terminal Block Power Connector
1
6
Quick Installation Guide
1

Optional Xpansion Modules
Model Number
Description
MS-01VGA-D10
Xpansion Module with VGA Port
MS-01DVI-D10
Xpansion Module with DVI-D Port
MS-01DPN-D10
Xpansion Module with DisplayPort
MS-02COM-D10
Xpansion Module with 2 x RS232/422/485 (Non-isolation)
Support 5V/12V Power
MS-08DIO-T10
Xpansion Module with 8-bit Isolated DIDO (4 x DI, 4 x DO)

CONTENTS
PREFACE ...............................................................................................................................................2
CHAPTER 1: INTRODUCTION ................................................................................................................8
1.1 Overview ................................................................................................................................8
1.2 Product Features ....................................................................................................................8
1.3 Hardware Specification ..........................................................................................................9
1.4 Mechanical Specification .....................................................................................................12
1.5 System I/O Placement..........................................................................................................13
CHAPTER 2: DIP SWITCH SETTING AND PIN DEFINITION...................................................................16
2.1 DIP Switch and Connector Overall Placement .....................................................................16
2.2 DIP Switch Setting ................................................................................................................18
2.3 Connector Pin Definition......................................................................................................19
CHAPTER 3: SYSTEM SETUP................................................................................................................26
3.1 2.5” SATA HDD/SSD Installation ...........................................................................................26
3.2 WiFi module Installation......................................................................................................27
3.3 DRAM Installation ................................................................................................................28
CHAPTER 4: BIOS SETUP.....................................................................................................................31
4.1 Main Page.............................................................................................................................31
4.2 Advance Page .......................................................................................................................33
4.3 Security Page........................................................................................................................42
4.4 Boot Page .............................................................................................................................46
4.5 Save & Exit Page ...................................................................................................................47

INTRODUCTION
This chapter provides the MB1-10AP Embedded
System product overview, including features,
hardware and mechanical specifications.
1

CHAPTER 1: INTRODUCTION
This chapter provides the MB1-10AP Embedded System product overview, including features,
hardware, mechanical specifications, and I/O placement.
1.1 Overview
MiTAC’s MB1-10AP embedded system is the next generation embedded system with Intel® Apollo
Lake embedded processor. The efficient performance, OCP/OVP power protection, and expandable
design provide the solution for routine tasks and most types of application.
1.2 Product Features
MB1-10AP Embedded System offers the following features:
Intel® Apollo Lake-M N3350/N4200 Processors
Support 2 x PoE LAN (Optional)
Support HDMI as primary display, and VGA/DisplayPort/DVI-D as second option
Fan-less chassis and Expandable module design
Support COM/DIO via Xpansion Modules
8-24V Wide Power Voltage
-25°C to 70°C (For non-PoE SKU, with 0.7m/s Air Flow and Wide Temperature
Memory/Storage)
-25°C to 60°C (For PoE SKU, with 0.7m/s Air Flow and Wide Temperature
Memory/Storage)

1.3 Hardware Specification
SYSTEM
CPU
Intel®Apollo Lake-M N3350 / N4200 Processors
Chipset
Intel®SoC Integrated
System Memory
DDR3L 1866 MHz / 1 x 204-pin SO-DIMM / Max. 8GB (Non-ECC)
Graphics
Intel®HD Graphics
Display Interface
HDMI 1.4 / Optional DisplayPort / VGA / DVI-D by Xpansion Module
Storage Slot
1 x 2.5 HDD / SSD (Default w/ HDD Bracket)
1 x mSATA
Ethernet
2 x Intel® I210-IT Giga LAN (2 x PoE LAN: Optional)
1 x Realtek RTL8154 LAN (Up to 480Mbps)
Audio
Realtek®ALC662
I/O Chipset
Nuvoton NCT6116D
TPM
Nuvoton NPCT750AAAYX TPM2.0 (Optional)
Expansion Slot
LTE/Wireless: Mini PCIe Full size (USB / PCIe), w/ SIM Card Holder (w/ Full to Half
size adapter plate)
Storage: mPCIe Full size (USB / PCIe / SATA)
Indicator
Power LED, HDD LED
FRONT I/O
1 x HDMI 1.4
4 x USB 3.0
1 x Xpansion Module Door
2 x RS232 / 422 / 485 (Support Power 5V / 12V)
2 x SMAAntenna (Optional for WiFi/LTE function)
REAR I/O
3 x RJ-45
1 x Mic-in & 1 x Line-out
1 x 2-pin Remote Power On/Off Header
1 x 3-pin Terminal Block Power Input
2 x SMAAntenna (Optional for WiFi/LTE function)
Watchdog Timer
1~255 Steps by Software Program
POWER REQUIREMENT
Power Input
8~24V Wide Rage DC Input w/ Terminal Block Connectivity
MECHANICAL
Thermal Design
Fanless
Mounting
Wall mount
Dimension
6.9” x 4.1” x 2.2” (170 x 105 x 57 mm)
Material
Top cover: Aluminum Alloy , Bezel and chassis: Steel
ENVIRONMENTAL

Operating
Temperature
-25°C to 70°C (For non-PoE SKU)
-25°C to 60°C (For PoE SKU)
with 0.7m/s Air Flow and Wide Temperature Memory/Storage
Operating Humidity
10%~90% R/H (Non-condensing)
Vibration Resistance
Operating, 5 Grms, 5-500 Hz, 3 Axes
(w/ SSD, according to IEC60068-2-64)
Shock Resistance
Operating, 50 Grms, Half-sine 11 ms Duration
(w/ SSD, according to IEC60068-2-27)
Certification
CE & FCC
OS
OS Support
Windows®10 64-bit, Linux (support by request)
*Notes1: Installation in Restricted Access Location (RAL)
A restricted access location is a designated area within an incident area
(High or Low temperature environment)
With authorized people can enter for a period of time and for a specific
purpose.
1. Access can only be gained by service people or by users who have been
instructed about the reasons for the Restrictions applied to the location
and about any precautions that shall be taken.
2. Access is through the use of a tool or lock and key, or other means of
security, and is controlled by the authority Responsible for the location.
*Notes2: Please make sure that the power consumption is in the spec of the
power supply output capability from AC adaptor (72W or 120W). Please
choose the suitable AC adaptor for your application.
AC/DC 24V/5A, 120W 3PIN Terminal Block Power Adaptor (For PoE SKU)
AC/DC 24V/3A, 72W 3PIN Terminal Block Power Adaptor (For non-PoE SKU)
*Note3: Please choose 120W AC adaptor for the Optional Xpansion Module
(MS-02COM-D10) COM ports in maximum power loading scenario (12V
max. 1A loading).
*Note4: Please don’t load the COM power in the hardware configuration
and high temperature condition. Don’t operate the machine at maximum
operating temperature 70 ℃ (Non-PoE SKU) & 60 ℃ (PoE SKU) with 4*COM
12V*1A loading.

*Note5: The maximum ambient operating temperature is 40°C if the
external AC adapter model: EA11011M or EA10681V will be placed in the
same high temperature area with the embedded system.
*Note6: CAUTION - Lithium battery is included in this embedded system.
Please do not puncture, mutilate, or dispose of battery in fire. There will be
danger of explosion if battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by manufacturer. Dispose of used
battery according to manufacturer instructions and in accordance with your
local regulations.
*Note7: CAUTION - Only allow technically qualified personnel to touch the
I/O surface, and only when the unit is well fastened by wall mount, VESA
mount, or DIN Rail mount. Please also avoid to contact the I/O surface more
than 1 second in high temperature and harsh environment. Not allow to
touch aluminum alloy surface at high temperature. The technically qualified
personnel also needs to have technical knowledge, operating experiences,
and basic knowledge about MB1-10AP product spec.

1.4 Mechanical Specification
Mechanical Dimension: 170 mm x 105 mm x 57 mm

1.5 System I/O Placement
Front I/O:
Rear I/O:

Xpansion Module (Optional) Configuration

DIP SWITCH SETTING AND PIN DEFINITION
This chapter provides information about how to set up the
dip switch and use I/Os of MB1-10AP Embedded System
hardware.
2

CHAPTER 2: DIP SWITCH SETTING AND PIN DEFINITION
This chapter provides information about how to set up the dip switch, and use internal I/Os of
MB1-10AP Embedded System hardware.
2.1 DIP Switch and Connector Overall Placement
Front View:
1
Power button
2
Dual USB3.0
3
Dual USB3.0
4
HDMI
5
COM port
6
COM port
7
DDR3L SO-DIMM
8
Line-out Audio Jack
1
2
3
4
5
6
12
11
10
9
8
7
13
14

9
Mic-in Audio Jack
10
RJ45 10/100/1G
11
Dual RJ45 10/100/1G
(Non PoE or PoE)
12
3-pin Terminal Block DC IN
13
SW_CMOS1
14
Remote Power on/off Header
Bottom View:
B1
J_WLAN1
B2
J_MSATA1
B3
J_DB1
B4
J_SATA1
B5
J_BAT1
B6
AT/ATX Switch
B7
SW_PW2
B8
SW_RI2
B9
SW_RI1
B10
SW_PW1
B11
J_PW1
B12
J_SIM_1
B13
Buzzer
B5
B2
B3
B4
B6
B7
B8
B9
B10
B1
B11
B12
B13

2.2 DIP Switch Setting
Location #B6
AT
ATXA
SW_ATX1
C
Add this table insilkscreenTXT
Default ATX mode
Location #B7/B8/B9/B10

2.3 Connector Pin Definition
Indicator for Dual Intel i210-IT LAN
Diagram
LED
Color
State
Condition
Link
NA
off
LAN link is not established
or LAN disable
Link
Green
on
LAN link is established or
LAN port disable
Link
Green
blinking
LAN activity occurring
Speed
NA
off
10 M b/s data rate
or LAN disable
Speed
Green
on
100 M b/s data rate
Speed
Orange
on
1000 M b/s data rate
or LAN port disable
Indicator for Realtek RTL8154B LAN
Location #B4 –SATA and SATA PWR Connector
Pin
Signal Name
P1
VCC3
P2
VCC3
P3
VCC3
P4
GND

P5
GND
P6
GND
P7
VCC
P8
VCC
P9
VCC
P10
GND
P11
RES
P12
GND
P13
+12V
P14
+12V
P15
+12V
S1
GND
S2
SATAHDR_TXP0_C
S3
SATAHDR_TXN0_C
S4
GND
S5
SATAHDR_RXN0_C
S6
SATAHDR_RXP0_C
S7
GND
3-pin terminal block for DC Input
Pin
Signal
1
DC IN +8~24VIN
2
GND
3
-