MYiR MYC-Y335X User manual

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MYC-Y335X | Product Manual
MYC-Y335X
CPU Module Product Manual
Product Overall
The AM335x microprocessors based on the ARM Cortex-A8 are enhanced with image, graphics
processing, peripherals and industrial interface options such as etherCAT and Profibus.
The MYC-Y335X CPU Module has integrated the AM335X processor,512MB DDR3,512MB Nand
Flash and Gigabit Ethernet PHY chip on board and can be served as the core of your embedded
system. It is ideal for industrial embedded applications such as automotive, control systems, lighting,
refining and processing.
Product Feature
·ARM Cortex-A8 Processor
·256MB DDR3,256MB Nand Flash
·10M/100M/1000M Ethernet MAC Controller
.Support CAN, USB HOST, USB OTG, Ethernet, UART, SPI Standard Communication Interfaces
.Support Maximum Display Resolution: 2048x2048 pixels
.10 Laminates Design, Immersion Gold Process, Lead-Free
.Compact Dimensions (65mm x 35 mm)
.146PIN stamp hole
Applications
·Gaming Peripherals, Advanced Toys
·Home and Industrial Automation
·Consumer Medical Appliances
·Printers Weighing Scales
·Smart Toll Systems, Connected Vending Machines
·Weighing Scales, Educational Consoles
Project customization
·Matching different sizes memory chips according to customer demand
·Cutting system according to customer demand
·Assist the development of related driver according to customer demand
·Custom motherboard according to the customer's specific needs

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MYC-Y335X | Product Manual
Correct Errors
Silkscreen of Ethernet was labeled wrong. The left is ETH1，and the right is ETH0
Version History
Version
Des
Date
V1.0
Initial Version
2013.12.17
V1.1
Replace Figures, Correct some errors.
2014.03.17
V1.2
Support Linux3.2, Android 4.2.2
2014.04.01
V2.1
Document format unification
2016.12.21
According to the lasted naming rules of MYIR Product.
Daughter board ( CPU module board )have a prefix “MYC”
Motherboard (baseboard) have a prefix “MYB”
The HW Kits have a prefix “MYD”
MYC-AM335X is renamed to MYC-C335X according to the naming rules.
MCC-AM335X-J is renamed to MYC-J335X according to the naming rules.
MCC-AM335X-Y is renamed to MYC-Y335X according to the naming rules.

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MYC-Y335X | Product Manual
Table of Contents
Contents................................................................................................................................... 3
1.Product Introduction......................................................................................................... 4
2 Hardware Parameter.......................................................................................................... 6
2.1 CPU Property....................................................................................................................... 6
2.2 Hardware Resource on Board........................................................................................... 7
2.3 Expand Port Interface......................................................................................................... 9
3. Interface............................................................................................................................. 10
3.1 Pin Order ...........................................................................................................................10
3.2 Pin List.................................................................................................................................10
4. Hardware Design............................................................................................................. 11
4.1 Power...................................................................................................................................11
4.2 DDR3 SDRAM................................................................................................................... 13
4.3 eMMC ................................................................................................................................ 14
4.4 Nand Flash......................................................................................................................... 15
4.5 EEPROM.............................................................................................................................15
4.6 Ethernet...............................................................................................................................16
4.7 Boot Mode...........................................................................................................................16
5. Electrical Parameter....................................................................................................... 18
6. Mechanical Parameter................................................................................................... 19
7. Hardware Development Kits........................................................................................ 20
Appendix 1 Warranty & Technical Support Services................................................ 21

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MYC-Y335X | Product Manual
1.Product Introduction
TI AM335X microprocessors based on the ARM Cortex-A8 features PowerVR™ SGX530
for 2D and 3D graphics acceleration as well as PRU/ICSS supporting real-time protocols
such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and
others.
MYC-Y335X is a 65 mm x 35 mm core module as shown in Figure as follows.
Figure 1-1 MYC-Y335X Top Side

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MYC-Y335X | Product Manual
AM335X MPU have two kinds of package type.One is ZCZ (BGA324),and the other is
ZCE.There are sharing the same pin-out with software fully compatible. The table shows
the difference among the MPU.
Table 1-1 AM335X Series Product
MPU
AM3352
AM3354
AM3356
AM3357
AM3358
AM3359
Clock
Speed
300 MHz
600 MHz
800 MHz
1000 MHz
600 MHz
800 MHz
1000 MHz
300 MHz
600 MHz
800 MHz
300 MHz
600 MHz
800 MHz
600 MHz
800 MHz
1000 MHz
600 MHz
800 MHz
MIPS
600
1200
1600
2000
1200
1600
2000
600
1200
1600
-
600
1200
1600
-
1200
1600
2000
1200
1600
3D
-
yes
-
-
yes
yes
RPU
-
-
PRU
-
PRU
EtherCAT
PRU
-
PRU
EtherCAT

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MYC-Y335X | Product Manual
2. Hardware Parameter
2.1 CPU Property
Figure 2-1 AM335X Architecture
Sitara™ ARM® Cortex®-A8 32-Bit RISC Microprocessor, Up to 1GHz
NEON™ SIMD Co processor
32KB L1 Instruction /Data Cache with Single-Error Detection/parity

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MYC-Y335X | Product Manual
256KB of L2 Cache with Error Correcting Code (ECC)
Emulation/Debug - JTAG
mDDR(LPDDR)/DDR2/DDR3 Support. addressing space can be up to 1GB.
General-Purpose Memory Support (Nand,NOR,SRAM)Supporting Up to 16-bit ECC
SGX530 Graphics Engine
Programmable Real-Time Unit Subsystem
Real-Time Clock (RTC)
Up to Two USB 2.0 High-Speed OTG Ports with Integrated PHY
10/100/1000 Ethernet Switch Supporting Up to Two Ports
Two Controller Area Network Ports (CAN)
Six UARTs, Two McASPs, Two McSPI, and Two I2C Ports
12-Bit Successive Approximation Register (SAR) ADC
Up to Three 32-Bit Enhanced Capture Modules (eCAP)
Up to Three Enhanced High-Resolution PWM Modules (eHRPWM)
Crypto Hardware Accelerators (AES, SHA,PKA, RNG)
2.2 Hardware Resource on board
The MYC-Y335X CPU Module has integrated the AM335X processor, 256MB DDR3
SDRAM, 256MB Nand Flash and one Gigabit Ethernet PHY chip on board.It shows in
figure 2-2.

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MYC-Y335X | Product Manual
Figure 2-2 CPU Module Board
256MB DDR3 SDRAM
256MB Nand Flash
32KB EEPROM
10/100/1000M Ethernet PHY
Power LED and User LED

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MYC-Y335X | Product Manual
2.3 Signals On Connector
MYC-Y335X provides many kinds of interfaces due to the reused function of IO.Table 2-1
shows the resource from the connector of CPU module board.
Table 2-1 Signals on Connector
Ethernet Interface
2
USB2.0 interface
2
UARTs Ports
6
I2C Interface
2
CAN Interface
2
SPI Interface
2
ADC Channels
7
MCASP Port
2
LCD Port
1
MMC/SD/SDIO
3
JTAG Port
1
GPIOs
many

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MYC-Y335X | Product Manual
3. Interface
3.1 PIN Order
MYC-AM335X provides signals with a 146Pin stamp hole footprint.The pin pitch is
1.27mm. The pin order shows in figure 3-1.
Figure 3-1 Pin Order
3.2 PIN List
For more function of PINs,please refer to the document MYC-Y335X PIN LIST.

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MYC-Y335X | Product Manual
4. Hardware Design
4.1 Power
TPS65217 is a single chip power management IC specifically designed to support the
AM335X series of application processors in portable and 5-V, non-portable applications. It
provides a linear battery charger for single-cell Li-ion and Li-Polymer batteries, dual-input
power path, three step-down converters, four LDOs, and a high-efficiency boost converter
to power two strings of up to 10 LEDs each. The system can be supplied by any
combination of USB port, 5-V AC adapter, or Li-Ion battery. The device is characterized
across a -40°C to +105°C temperature range which makes it suitable for industrial
applications. The power supply distribution shows in figure 4-1.
Figure 4-1 Power Supply For CPU Board
VDD_MPU：Power for MPU, The MPU clock speed will be affect if change
VDD_MPU voltage .

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MYC-Y335X | Product Manual
VDD_CORE：MPU core voltage is 1.1V.
VDDS_DDR：voltage for DDR,1.5V.
VDD_3V3：for CPU module board power supply
VDD_1V8：for MPU
VDD-3.3VA: for MPU
VDD-3.3VB: for Nand Flash, EEPROM and others peripheral device.
Power-on Order shows in figure 4-2.
Figure 4-2 Power-on Order

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MYC-Y335X | Product Manual
4.2 DDR3 SDRAM
SDRAM controller supports up to 1GB addressing space.The interface circuit shows in
figure 4-3.
Figure 4-3 Interface Circuit of DDR3

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MYC-Y335X | Product Manual
4.3 eMMC
eMMC and Nand Flash shares some of the same pins in AM335X MPU.MYC-Y335X
keeps eMMC DNP by default.The interface circuit shows in figure 4-4.
Figure 4-4 Interface Circuit of eMMC

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MYC-Y335X | Product Manual
4.4 Nand Flash
MYC-Y335X CPU module board has a Nand Flash with 256MB capacity by default ,and
the Part type is MT29F2G08ABAEAWP.The interface circuit shows in figure 4-5.
Figure 4-5 Interface Circuit of Nand Flash
4.5 EEPROM
EEPROM can be used for saving information like factory settings,device configuration and
so on.The board has a EEPROM, and the part type is 24LC32A by default. The interface
circuit shows in figure 4-6.
Figure 4-6 Interface Circuit of EEPROM

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MYC-Y335X | Product Manual
4.6 Ethernet
AM335X contains a 10/100/1000 Ethernet switch supporting up to two ports.MYC-Y335X
CPU module board has one Ethernet PHY on board.The interface circuit shows in figure
4-7.
Figure 4-7 The Interface Circuit of Ethernet
4.7 Boot Mode
The ROM code performs platform configuration and initialization as part of the public
start-up procedure. The booting device list is created based on the SYSBOOT pins. A
booting device can be a memory booting device or a peripheral interface connected to a
host.Once the booting device list is set up, the booting routine examines the devices
enumerated in the list sequentially and either executes the memory booting or peripheral
booting procedure depending on the booting device type.

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MYC-Y335X | Product Manual
For more about booting device,please refer to the documents of AM335X data sheet.
The interface circuit of booting configurations shows in figure 4-8.
Figure 4-8 SYS_BOOT PINs Configurations

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MYC-Y335X | Product Manual
5. Electrical Parameter
5.1 Operate Temperature
Application Scenarios
Parameter
Des.
MIN
Nor.
Max
Unit
Commercial Level
0
—
+70
℃
—
Industrial Level
-40
—
+85
℃
—
5.2 GPIO Voltage
GPIO Voltage
Label
Parameter
Des.
MIN
Nor.
MAX
Unit
Input High voltage
VIH
2.0
—
3.6
V
—
Input Low voltage
VIL
-0.3
—
0.8
V
—
Output High Voltage
VOH
2.9
—
—
V
—
Input Low Voltage
VOL
—
—
0.4
V
—
5.3 Power Supply
Voltage
Label
Parameter
Des
MIN
Nor
MAX
Unit
Input Voltage
5V
4.75
—
5.25
V
—
Input Current
I5V
—
280
—
mA
—
ADC ref Vol
VDDA_ADC0
—
1.8
—
V
Had Connected to
1.8V

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MYC-Y335X | Product Manual
6. Mechanical Parameter
Operate Temperature:
Industrial Level Temperature: -40~+85 Degree
Commercial Level temperature: 0~+70 Degree
Humidity: 20%~90%, Non-Condensing
Mechanical Dimensions:65 mm x 35 mm x 1.2mm
Weight: 12g
PCB Technical: 10 Layers PCB, Immersion Gold Process, Lead-Free
Interface Type: 147 Pin stamp hole, pinpitch 1.27mm.
Mechanical Size
Figure 6-1 CPU Module Board Size Information

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MYC-Y335X | Product Manual
7. HW Development Kits
7.1 MYD-Y335X Development board
MYD-Y335X is using the MYC-Y335X CPU module as the core controller board and
connected to base board through1.27mm pitch 146-pin stamp hole interface. The board
can work in harsh environment supporting -40 to+85 Celsius extended temperature
operation for industrial embedded applications.
For more information, please visit the website http://www.myirtech.com.
Figure 7-1 MYD-Y335X Development Board