NXP Semiconductors CBT3126 Operational manual

1. General description
The CBT3126 is a quadruple FET bus switch features independent line switches. Each
switch is disabled when the associated Output Enable (OE) input is LOW.
The CBT3126 is characterized for operation from −40 °Cto+85°C.
2. Features
nStandard ’126-type pinout
nMultiple package options
n5Ωswitch connection between two ports
nTTL-compatible input levels
nMinimal propagation delay through the switch
nLatch-up protection exceeds 500 mA per JEDEC standard JESD78 class II level A
nESD protection:
uHBM JESD22-A114E exceeds 2000 V
uMM JESD22-A115-A exceeds 200 V
uCDM JESD22-C101C exceeds 1000 V
nSpecified from −40 °Cto+85°C
3. Ordering information
CBT3126
Quad FET bus switch
Rev. 02 — 23 October 2008 Product data sheet
Table 1. Ordering information
Type number Temperature range Package
Name Description Version
CBT3126D −40 °Cto+85°C SO14 plastic small outline package; 14 leads;
body width 3.9 mm SOT108-1
CBT3126DB −40 °Cto+85°C SSOP14 plastic shrink small outline package; 14 leads;
body width 5.3 mm SOT337-1

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 2 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
[1] Also known as QSOP16.
4. Functional diagram
CBT3126DS −40 °Cto+85°C SSOP16[1] plastic shrink small outline package; 16 leads;
body width 3.9 mm; lead pitch 0.635 mm SOT519-1
CBT3126PW −40 °Cto+85°C TSSOP14 plastic thin shrink small outline package; 14 leads;
body width 4.4 mm SOT402-1
Table 1. Ordering information …continued
Type number Temperature range Package
Name Description Version
Pin numbers are for the 14 pin packages.
Fig 1. Logic symbol Fig 2. Logic diagram
001aaj023
4OE
4A 4B
3OE
3A 3B
2OE
2A 2B
1OE
1A 1B
001aaj024
23
1
1OE
1B
2B
3B
4B
1A
56
4
2OE
2A
98
10
3OE
3A
12 11
13
4OE
4A

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 3 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
5. Pinning information
5.1 Pinning
5.2 Pin description
6. Functional description
Fig 3. Pin configuration SOT108-1 (SO14), SOT337-4
(SSOP14) and SOT402-1 (TSSOP14) Fig 4. Pin configuration SOT519-1 (SSOP16)
CBT3126
1OE VCC
1A 4OE
1B 4A
2OE 4B
2A 3OE
2B 3A
GND 3B
001aaj025
1
2
3
4
5
6
78
10
9
12
11
14
13
CBT3126
n.c. VCC
1OE 4OE
1A 4A
1B 4B
2OE 3OE
2A 3A
2B 3B
GND n.c.
001aaj026
1
2
3
4
5
6
7
8
10
9
12
11
14
13
16
15
Table 2. Pin description
Symbol Pin SOT108-1 SOT337-4
and SOT402-1 Pin SOT519-1 Description
1OE to 4OE 1, 4, 10, 13 2, 5, 12, 15 output enable input
1A to 4A, 2, 5, 9, 12 3, 6, 11, 14 A input/output
1B to 4B 3, 6, 8, 11 4, 7, 10, 13 B output/input
GND 7 8 ground (0 V)
VCC 14 16 positive supply voltage
n.c. - 1, 9 not connected
Table 3. Function selection
H = HIGH voltage level; L = LOW voltage level.
Inputs Switch
nOE
L nA to nB disconnected
H nA to nB connected

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 4 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
7. Limiting values
[1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
[2] The package thermal impedance is calculated from JESD51-7.
[3] For SO14 package; Ptot derates linearly with 8 mW/K above 70 °C.
[4] For SSOP14, SSOP16 and TSSOP14 packages; Ptot derates linearly with 5.5 mW/K above 70 °C.
8. Recommended operating conditions
9. Static characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage −0.5 +7.0 V
VIinput voltage [1] −0.5 +7.0 V
ICC supply current continuous current through each VCC or GND pin - 128 mA
IIK input clamping current VI<0V −50 - mA
Tstg storage temperature −65 +150 °C
Ptot total power dissipation Tamb = −40 °C to +125 °C[2]
SO14 package [3] - 500 mW
SSOP14 and SSOP16 package [4] - 500 mW
TSSOP14 package [4] - 500 mW
Table 5. Operating conditions
All unused control inputs of the device must be held at V
CC
or GND to ensure proper device operation.
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 4.5 5.5 V
VIH HIGH-level input voltage 2.0 - V
VIL LOW-level input voltage - 0.8 V
Tamb ambient temperature operating in free-air −40 +85 °C
Table 6. Static characteristics
T
amb
= − 40 ° C to +85 ° C.
Symbol Parameter Conditions Min Typ[1] Max Unit
VIK input clamping voltage VCC = 4.5 V; II=−18 mA - - −1.2 V
Vpass pass voltage VI=V
CC = 5.0 V; IO=−100 µA - 3.8 - V
IIinput leakage current VCC = 5.5 V; VI= GND or 5.5 V - - ±1µA
ICC supply current VCC = 5.5 V; IO= 0 mA;
VI=V
CC or GND --3µA
∆ICC additional supply current control pins; per input;
VCC = 5.5 V; one input at 3.4 V,
other inputs at VCC or GND
[2] - - 2.5 mA
CIinput capacitance control pins; VI= 3 V or 0 V - 1.7 - pF
Cio(off) off-state input/output capacitance VO=3Vor0V;OE = VCC - 3.4 - pF

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 5 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
[1] All typical values are measured at VCC =5V;T
amb =25°C.
[2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[3] Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON resistance is
determined by the lowest voltage of the two (A or B) terminals.
10. Dynamic characteristics
[1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON
resistance of the switch and a load capacitance, when driven by an ideal voltage source (zero output impedance).
[2] tPLH and tPHL are the same as tpd;
tPZL and tPZH are the same as ten;
tPLZ and tPHZ are the same as tdis.
11. AC waveforms
RON ON resistance VCC = 4.0 V [3]
VI= 2.4 V; II= 15 mA - 16 22 Ω
VCC = 4.5 V
VI=0V;I
I=64mA - 5 7 Ω
VI=0V;I
I=30mA - 5 7 Ω
VI= 2.4 V; II= 15 mA - 10 15 Ω
Table 6. Static characteristics
…continued
T
amb
= − 40 ° C to +85 ° C.
Symbol Parameter Conditions Min Typ[1] Max Unit
Table 7. Dynamic characteristics
T
amb
= − 40 ° C to +85 ° C; V
CC
= 4.5 V to 5.5 V; for test circuit see Figure 7.
Symbol Parameter Conditions Min Max Unit
tpd propagation delay nA to nB or nB to nA; see Figure 5 [1][2] - 0.25 ns
ten enable time OE to nA or nB; see Figure 6 [2] 1.6 4.5 ns
tdis disable time OE to nA or nB; see Figure 6 [2] 1.0 5.4 ns
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 5. The input (nA, nB) to output (nB, nA) propagation delay times
001aai367
VMVM
VMVM
VI
input
0 V
VOH
output
VOL
tPHL tPLH

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 6 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. Enable and disable times
001aaj027
tPLZ
tPHZ
switch
disabled switch enabled
VY
VX
switch
enabled
output
LOW-to-OFF
OFF-to-LOW
output
HIGH-to-OFF
OFF-to-HIGH
nOE input
VI
VOL
VOH
VCC
VM
GND
GND
tPZL
tPZH
VM
VM
Table 8. Measurement points
Input Output
VMVMVXVY
1.5 V 1.5 V VOL + 0.3 V VOH −0.3 V

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 7 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
12. Test information
Test data is given in Table 9.
Definitions for test circuit:
RL= Load resistance.
CL= Load capacitance including jig and probe capacitance.
RT= Termination resistance should be equal to the output impedance Zoof the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 7. Test circuit for measuring switching times
VMVM
tW
tW
10 %
90 %
0 V
VI
VI
negative
pulse
positive
pulse
0 V
VMVM
90 %
10 %
tf
tr
tr
tf
001aae331
VEXT
VCC
VIVO
DUT
CL RT
RL
RL
G
Table 9. Test data
Supply voltage Input Load VEXT
VCC VItr, tfCLRLtPLH, tPHL tPLZ, tPZL tPHZ, tPZH
4.5 V to 5.5 V GND to 3.0 V ≤2.5 ns 50 pF 500 Ωopen 7.0 V open

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 8 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
13. Package outline
Fig 8. Package outline SOT109-1 (SO16)
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT109-1 99-12-27
03-02-19
076E07 MS-012
0.069 0.010
0.004 0.057 0.049 0.01 0.019 0.014 0.0100
0.0075 0.39
0.38 0.16 0.15 0.05
1.05
0.041
0.244
0.228 0.028 0.020 0.028 0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 9 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
Fig 9. Package outline SOT338-1 (SSOP16)
UNIT A1A2A3bpcD
(1) E(1) eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.21
0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25
7.9
7.6 1.03 0.63 0.9 0.7 1.00 0.55 8
0
o
o
0.130.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT338-1 99-12-27
03-02-19
(1)
wM
bp
D
HE
E
Z
e
c
vMA
X
A
y
18
16 9
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
MO-150
pin 1 index
0 2.5 5 mm
scale
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
A
max.
2

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 10 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
Fig 10. Package outline SOT519-1 (SSOP16)
UNIT A1A2A3bpcD
(1) E(1) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.25
0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 5.0 4.8 4.0 3.8 0.635 1
6.2
5.8 0.89 0.41 0.18 0.05 8
0
o
o
0.180.2 0.09
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
SOT519-1 99-05-04
03-02-18
(1)
wM
bp
D
HE
E
Z
e
c
vMA
X
A
y
18
16 9
θ
A
A1
A2
Lp
detail X
L
(A )
3
0 2.5 5 mm
scale
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm SOT519-1
A
max.
1.73

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 11 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
Fig 11. Package outline SOT403-1 (TSSOP16)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1 MO-153 99-12-27
03-02-18
wM
bp
D
Z
e
0.25
18
16 9
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
A
max.
1.1
pin 1 index

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 12 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
Fig 12. Package outline SOT763-1 (DHVQFN16)
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 3.6
3.4
Dh
2.15
1.85
y1
2.6
2.4 1.15 0.85
e1
2.5
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT763-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT763-1
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
27
15 10
9
8
1
16
X
D
E
C
BA
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
02-10-17
03-01-27

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 13 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
14. Abbreviations
15. Revision history
Table 10. Abbreviations
Acronym Description
CDM Charged Device Model
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
CBT3126_2 20081023 Product data sheet - CBT3126_1
Modifications: •The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Table 4 “Limiting values” Ptot added.
•Section 10 “Dynamic characteristics” tdis value updated.
CBT3126_1 20011212 Product data sheet - -

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 14 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors CBT3126
Quad FET bus switch
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 23 October 2008
Document identifier: CBT3126_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Functional description . . . . . . . . . . . . . . . . . . . 3
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Recommended operating conditions. . . . . . . . 4
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
11 AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 5
12 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
17 Contact information. . . . . . . . . . . . . . . . . . . . . 14
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15