ON Semiconductor NCL30081 User manual

©Semiconductor Components Industries, LLC, 2013

March, 2013 −Rev. 0

1Publication Order Number:

EVBUM2175/D

NCL30081LEDGEVB

3.6 W Flyback 3 LED Step

Dimmable Driver Evaluation

Board User's Manual

Overview

This documentation package covers an NCL30081 LED

driver for use in a GU10 based LED lamp. The output is

mains isolated by double insulation. Maximum input power

is 5 W. The ECA (Electronic Circuit Assembly) supports 2

versions; one step dimming and one non-dimming version.

The version is controlled through minor bill-of-material

changes. The LED current dims in 5 discrete levels

sequentially by detecting the interruption of the AC mains

briefly (about 1 s) to step the LED current down one level

until it cycles back to full current.

Modifications

The value of Rtrim sets the final output current value along

with Rsense. Rtrim is for fine adjustment. The nature of the

open loop control makes the current adjustment somewhat

iterative based on available standard resistor values and

because of the circuit parameters that affect the output

current setting.

Line regulation is optimized by the selection of Rlff. A line

dependent current source creates a line dependent offset on

the CS pin to account for propagation delay errors in the

peak primary current. Changing the FET or gate driver

resistor will also have some effect on the output current.

Since the input power is < 5 W maximum, this falls below

the level where power factor or harmonic current

requirements are applicable in many countries (e.g. US). In

the EU, the harmonic current requirements for

IEC61000-3-2 Class C are applicable even at this low power

level. Compliance to the Class C requirements is simple with

a change of the input capacitor from 4.7 mF to 1 mF. This

change limits the input voltage operation to 200–265 V ac

because there is insufficient energy storage for the full

universal line range.

Figure 1. NCL30081LEDG Evaluation Board

http://onsemi.com

EVAL BOARD USER’S MANUAL

NCL30081LEDGEVB

http://onsemi.com

THEORY OF OPERATION

Figure 3 portrays the primary and secondary current of a

fly-back converter in discontinuous conduction mode

(DCM). Figure 2 shows the basic circuit of a fly-back

converter.

Figure 2. Basic Fly-back Converter Schematic

Clump

Rsense

Vout

Nsp

Lleak

Vbulk

Cclp Rclp

DRV

Clamping

Network

Transformer

During the on-time of the MOSFET, the bulk voltage Vbulk

is applied to the magnetizing and leakage inductors Lpand

Lleak. The current ramps up.

When the MOSFET is turned-off, the inductor current

first charges Clump. The output diode is off until the voltage

across Lpreverses and reaches

Nsp ǒVout )VfǓ

The output diode current increase is limited by the leakage

inductor. As a consequence, the secondary peak current is

reduced:

ID,pk t

IL,pk

Nsp

The diode current reaches its peak when the leakage

inductor is reset. Thus, in order to accurately regulate the

output current, we need to take into account the leakage

inductor current. This is accomplished by sensing the

clamping network current. Practically, a node of the clamp

capacitor is connected to Rsense instead of the bulk voltage

Vbulk. Then, by reading the voltage on the CS pin, we have

an image of the primary current (red curve in Figure 3).

When the diode conducts, the secondary current decreases

linearly from ID,pk to zero. When the diode current has

turned off, the drain voltage begins to oscillate because of

the resonating network formed by the inductors (Lp+Lleak)

and the lump capacitor. This voltage is reflected on the

auxiliary winding wired in fly-back mode. Thus, by looking

at the auxiliary winding voltage, we can detect the end of the

conduction time of secondary diode. The constant current

control block picks up the leakage inductor current, the end

of conduction of the output rectifier and controls the drain

current to maintain the output current constant. We have:

Iout +

VREF

2Nsp Rsense

(eq. 1)

The output current value is set by choosing the sense

resistor:

Rsense +

Vref

2Nsp Iout

(eq. 2)

From (eq. 1), the first key point is that the output current

is independent of the inductor value. Moreover, the leakage

inductance does not influence the output current value as the

reset time is taken into account by the controller.

NCL30081LEDGEVB

http://onsemi.com

Figure 3. Flyback Currents and Auxiliary Winding Voltage in DCM

Vaux(t)

ton tdemag

t1t2

Isec(t)

Ipri(t)

Nsp ID,pk

IL,pk

Time

At this point the Excel®spreadsheet based design guide

will help with many of the calculations.

A trim resistor allows for making fine adjustments to the

current limit to set the output current precisely. The LFF

circuit will create some error on the CS pin which is adjusted

out by proper choice of Rtrim

SPECIFICATIONS

Table 1. SPECIFICATIONS

Input voltage 90−265 V ac

Line Frequency 50−60 Hz

Power Factor 0.5Typ.

Safety (Designed to meet) IEC61347-2-13 EU

UL8750 NA

Optimized Output Voltage Range 9−10.5 V dc

Output Current 360 mA dc

Output Ripple 200 mA P-P

Efficiency 82 % Typ.

Start Up Time < 500 ms

EMI (Conducted) Class B FCC/CISPR

Dimensions 34.1 ×17.3 ×16 mm

NCL30081LEDGEVB

http://onsemi.com

SCHEMATIC

Figure 4. Input Circuit

AC_N

AC_L Rfuse

FUSE

Start L1

1.5 mH +HVDC

R11

1 kW

4.7 mF

400 V

100 nF

400 V

MB6S

Figure 5. Main Schematic

Rstart

1.0 MW

Start

+HVDC

Rbo

3.01 MW

Cout

22 mF

16 V

51.1 kW

Rzcd

56 kW

Rstart1

1.0 MWD9

BAS21DW5T1G

20 W

CVCCbulk

27 mF

Rgd

1.8 W

1.10 kW

Dclamp

BZX100A

TX+

TX−

10 kW

LED+

LED−

Dout

UFM12PL

C14

420 pF 250 VAC Y2

C15

470 pF 250 VAC Y2

Rtrim

11 W

Rsens

1.8 W

Qfet

NDD02N60Z

Dleak

UFM15PL

CVCC

4.7 mF

NCL30081

Vin

Vcc

Drv

Com

ZCD

NCL30081LEDGEVB

http://onsemi.com

Table 2. BILL OF MATERIALS

Qty Reference Part PCB Footprint Manufacturer Mfr_PN

Can be

Substituted RoHS

1 CVcc 4.7 mF0603 Taiyo Yuden EMK107ABJ475KA-T Yes Yes

1 CVccbulk 27 mFCAP-ALEL-4X11-HOR Panasonic EEU-FC1E270 Yes Yes

1 Cout 22 mF 16 V 1206 Taiyo Yuden EMK316BJ226ML-T Yes Yes

1 C2 4.7 mF 400 V CAP_ALEL_D10XL13 Rubycon 400LLE4R7MEFC10X12.5 Yes Yes

1 C3 100 nF 400 V CAP-BOX-LS5-5M0X7M2 Epcos B32559C6104+*** Yes Yes

2C14, C15 470 pF 250 VAC Y2 1808 Johanson-Dielectrics 502R29W471KV3E-****-SC Yes Yes

1 Dclamp BZX100A SOD323F NXP BZX100A,115 Yes Yes

1 Dleak UFM15PL SOD123FL MCC UFM15PL Yes Yes

1 Dout UFM12PL SOD123FL MCC UFM12PL Ye s Yes

1 D4 MB6S MB6S MCC MB6S Yes Yes

1 D9 BAS21DW5T1G SC-88A ON Semiconductor BAS21DW5T1G No Yes

1 L1 1.5 mH IND-UPRIGHT-LS25 Wurth 7447462152 Yes Yes

1 Qfet NDD02N60Z IPAK ON Semiconductor NDD02N60Z No Yes

1 Rbo 3.01 MW0805 Yageo RC0805FR-073M01L Yes Yes

1 Rfuse FUSE FUSE-HAIRPIN-LS250 Littelfuse 0263.500WRT1L Yes Ye s

2Rsens, Rgd 1.8 W0603 Vishay CRCW06031R80FKEA Yes Yes

2Rstart1, Rstart 1.0 MW0805 Yageo RC0805FR-071ML Ye s Yes

1 Rtrim 11 W0402 Yageo RT0402FRE0711RL Yes Yes

1 Rzcd 56 kW0805 Yaego RC0805FR-0756KL Yes Yes

1 R2 51.1 kW0402 Yaego RC0402FR-0751K1L Yes Yes

1 R4 1.10 kW0402 Stackpole RMCF0402FT1K10 Yes Yes

1 R5 20 W0402 Yaego RC0402FR-0720RL Yes Yes

1 R8 10 kW0402 Yaego RC0402FR-0710KL Yes Yes

1 R11 1kW0805 Yaego RC0805JR-071KL Yes Yes

1 T1 XFRM_LINEAR EP13-SMD-16PIN-MOD1 Wurth 750313306 Yes Yes

1 U1 NCL30080/1 TSOP6 ON Semiconductor NCL30080 No Yes

NCL30081

2Wire 6”, Input, White UL1430 Alpha Wire #24 AWG, Stranded Yes Yes

1Wire 6”, Output, Red UL1430 Alpha Wire #24 AWG, Stranded Yes Ye s

1Wire 6”, Output, Black UL1430 Alpha Wire #24 AWG, Stranded Yes Yes

NCL30081LEDGEVB

http://onsemi.com

GERBER VIEWS

Figure 6. Component Side PCB

Figure 7. Component Side Silkscreen

Figure 8. Solder Side PCB

NCL30081LEDGEVB

http://onsemi.com

GERBER VIEWS (CONTINUED)

Figure 9. Solder Side Silkscreen

CIRCUIT BOARD FABRICATION NOTES

1. Fabricate per IPC-6011 and IPC6012. Inspect to

IPA-A-600 Class 2 or updated standard.

2. Printed Circuit Board is defined by files listed in

fileset.

3. Modification to copper within the PCB outline is

not allowed without permission, except where

noted otherwise. The manufacturer may make

adjustments to compensate for manufacturing

process, but the final PCB is required to reflect the

associated gerber file design ±0.001 in. for etched

features within the PCB outline.

4. Material in accordance with IPC-4101/21, FR4,

Tg 125°C min.

5. Layer to layer registration shall not exceed

±0.004 in.

6. External finished copper conductor thickness shall

be 0.0013 in. min.

7. Copper plating thickness for through holes shall be

0.0007 in. min.

8. All holes sizes are finished hole size.

9. Finished PCB thickness 0.031 in.

10. All undimensioned holes to be drilled using the

NC drill data.

11. Size tolerance of plated holes: ±0.003 in.:

non-plated holes ±0.002 in.

12. All holes shall be ±0.003 in. of their true position

U.D.S.

13. Construction to be SMOBC, using liquid photo

image (LPI) solder mask in accordance with

IPC-SM-B40C, Type B, Class 2, and be green in

color.

14. Solder mask misregistration ±0.004 in. max.

15. Silkscreen shall be permanent non-conductive

white ink.

16. The fabrication process shall be UL approved and

the PCB shall have a flammability rating of

UL94V0 to be marked on the solder side in

silkscreen with date, manufactures approved logo,

and type designation.

17. Warp and twist of the PCB shall not exceed 0.0075

in. per in.

18. 100% electrical verification required.

19. Surface finish: electroless nickel immersion gold

(ENIG)

20. RoHS compliance required.

NCL30081LEDGEVB

http://onsemi.com

FLYBACK TRANSFORMER SPECIFICATION

750313306

FL1

FL2

PRI

180−265 V

100 kHz

AUX

20 V−10 mA

SEC

10 V −360 mA

Customer to tie terminals

11+12 internally on PCB

TERM. NO.’s FOR REF. ONLY

FL1

FL2

CHAMFERS LOCATE TERM.’s #1 & 16

.500 MAX.

[12.70]

.676 MAX.

[17.17]

.550 MAX.

[13.97]

LOT CODE & DATE CODE

DOT LOCATES TERM. #1

.621 MAX.

[15.77]

.050 (16)

[1.27]

.030 (16)

[.76]

.067 (14)

[1.70]

.042 REF. (16)

[1.07]

.074 REF. (16)

[1.88]

REFERENCE LAND SIZE

CUSTOMER TO DETERMINE LAND LAYOUT

D.C. RESISTANCE (@ 20°C):

DIELECTRICRATING:

INDUCTANCE:

SATURATION CURRENT:

LEAKAGE INDUCTANCE

TURNS RATIO:

10−13 (tie 11+12), 2.50 W±10%.

15−16, 1.28 W±10%.

FL1−FL2, 0.115 W±20%.

4,000 VAC, 1 minute tested by applying 4,000 VAC for 1 second between pins 10−FL1 (tie 12+13+15).

500 VAC, 1 minute tested by applying 625 VAC for 1 second between pins 10−16.

1.50 mH ±10%, 10 kHz, 100 mVAC, 0 mADC, 10−13 (11+12), Ls.

420 mA saturating current that causes 20% rolloff from initial inductance.

7 mH typ, 15 mH max., 100 kHz, 100 mVAC, 10−13 (tie 11+12, 15+16, FL1+FL2), Ls.

(10−12):(11−13), (1):(1.00), ±1%.

(10−13):(15−16), (2.5):(1.00), tie (11+12), ±1%.

(10−13):(FL1−FL2), (5):(1.00), tie (11+12), ±1%.

ELECTRICAL SPECIFICATIONS @ 255C unless otherwise noted:

CUSTOMER TERMINAL RoHS LEAD(Pb)-FREE

Sn 96%, Ag 4% Yes Yes

OPERATING TEMPERATURE RANGE: −40°C TO 125°C including temp. rise.

Unless otherwise specified, tolerances are as follows: Angles: ±1°Fractions: ±1/64 Decimals: ±0.005 (.127 mm)

This drawing is dual dimensioned. Dimensions in brackets are in millimeters.

Update views to show flying leads and lead length dimension.

Leads are 2″from outside bobbin rail and 1.8″tinned.

NCL30081LEDGEVB

http://onsemi.com

ECA PICTURES

Figure 10. Top View

Figure 11. Bottom View

CVccbulk Detected for

Non-dimming Version

Figure 12. Transformer and Output Terminations

Trim Transformer Flying Leads

to Shortest Possible Length

Flying Leads are

Solder Strippable

Flagged FL1

NCL30081LEDGEVB

http://onsemi.com

TEST PROCEDURE

Equipment Needed

•AC Source:

90−265 V ac 50/60 Hz Minimum 1 A ac capability

•AC Wattmeter:

30 W Minimum, True RMS Input Voltage and Current,

Power Factor 0.2% accuracy or better

•DC Voltmeter:

100 V dc minimum 0.1% accuracy or better

•DC Ammeter:

1 A dc minimum 0.1% accuracy or better

•LED Load:

9–10.5 V dc – 3 LED Load @ 360 mA

Test Connections

1. Connect the Unit Under Test (UUT) per the test set

up in Figure 13

2. Set the AC source per the test procedure.

NOTE: Unless otherwise specified, all voltage measurements are

taken at the terminals of the UUT.

Figure 13. Test Set Up

AC Power

Source

Wattmeter UUT LED

Test Load

DC Ammeter

DC Voltmeter

Functional Test Procedure

Test Condition Test Variable

Test Limits

Pass/Fail

Min Max

Vin = 90 V ac Output Current 350 mA 370 mA −

Vin = 120V ac Output Current 350 mA 370 mA −

Vin = 265 V ac Output Current 350 mA 370 mA −

Vin = 120 V ac Power Factor 0.55 − −

Vin = 120 V ac

Vout = 10.5 V dc

Efficiency

(use actual measured data)

80% − −

Efficiency = 100% ×(VOUT ×IOUT) / Pin

This manual suits for next models

Table of contents

Other ON Semiconductor Motherboard manuals

ON Semiconductor

ON Semiconductor MT9J003I12STCVH-GEVB User manual

ON Semiconductor

ON Semiconductor SECO-NCV7685RGB-GEVB User manual

ON Semiconductor

ON Semiconductor MT9M114 User manual

ON Semiconductor

ON Semiconductor NCP45491PMNGEVB User manual

ON Semiconductor

ON Semiconductor MT9V117PACSTCH-GEVB User manual

ON Semiconductor

ON Semiconductor NB4N11MDTEVB User manual

ON Semiconductor

ON Semiconductor NB3x6x1xxG8DFN User manual

ON Semiconductor

ON Semiconductor AR0134CSSM25SUEAH3-GEVB User manual

ON Semiconductor

ON Semiconductor MT9M114 User manual

ON Semiconductor

ON Semiconductor NCP51705 User manual

ON Semiconductor

ON Semiconductor ARX3A0-CSP35 User manual

ON Semiconductor

ON Semiconductor AR0835HS User manual

ON Semiconductor

ON Semiconductor MT9P111 User manual

ON Semiconductor

ON Semiconductor EVBUM2250/D User manual

ON Semiconductor

ON Semiconductor AR0132AT6R00XPEAH3-S215-GEVB User manual

ON Semiconductor

ON Semiconductor RSL10 User manual

ON Semiconductor

ON Semiconductor NCP45491IMNGEVB User manual

ON Semiconductor

ON Semiconductor MT9M024 User manual

ON Semiconductor

ON Semiconductor PYTHON EVBUM2258/D User manual

ON Semiconductor

ON Semiconductor NB6L295MNGEVB User manual

ON Semiconductor

ON Semiconductor AR0230AT User manual

ON Semiconductor

ON Semiconductor AR1337-84LBGA User manual

ON Semiconductor

ON Semiconductor MT9M034I12STCH-GEVB User manual

ON Semiconductor

ON Semiconductor MT9M114EBLSTCZDH-GEVB User manual

Popular Motherboard manuals by other brands

DFI

DFI SD170 user manual

ASROCK

ASROCK ROMED8-2T user manual

Asus

Asus P2L97A user manual

Winmate

Winmate IC70 user manual

Asus

Asus MES-B user manual

Grantech

Grantech SYS8F377VGGA-3OMN user manual

Telit Wireless Solutions

Telit Wireless Solutions SL869-3DR user guide

Texas Instruments

Texas Instruments ADS8372EVM user guide

Commell

Commell MS-C73 user manual

Gigabyte

Gigabyte GA-9IVDT user manual

IBT Technologies

IBT Technologies MB860 user manual

Nvidia

Nvidia TEGRA DG-04927-001_V01 user guide

Intel

Intel D33217CK specification

Asus

Asus F1A55-M LX PLUS R2.0 user manual

EPC

EPC EPC9147C quick start guide

Asus

Asus EX-B760M-V5 D4 quick start guide

EPOX

EPOX MU-8KHA0010 user manual

Ski-Doo

Ski-Doo Bombardier MPEM 219 700 090 user guide