ON Semiconductor NCN8024GEVB Series User manual

Semiconductor Components Industries, LLC, 2012
June, 2012 −Rev. 0
1Publication Order Number:
EVBUM2127/D
NCN8024GEVB Series
NCN8024
SOIC-28 & TSSOP-28
Evaluation Board
User's Manual
Introduction
This document gives a detailed description of the
NCN8024 Evaluation Boards (SOIC−28 & TSSOP−28
versions) with the Bill Of Material (BOM), board schematic
and layout. The appropriate lab test setup is also provided.
The NCN8024 Evaluation Boards have been designed to
help for a quick evaluation of the NCN8024 Smart card
interface device.
This document has to be used with the NCN8024
datasheet. The datasheet contains full technical details
regarding the NCN8024 specifications and operation. The
board (FR4 material) is implemented in two metal layers.
The top and Bottom layers have thicknesses of 35 mm. The
PCB thickness is 1.6 mm with dimensions of 100 mm by
74 mm (see Figure 1).
These evaluation boards can be used to evaluate the device
performance.
Figure 1. Evaluation Boards −SOIC−28 & TSSOP−28
Table 1. EQUIPMENT
Description Main Features Example of Equipment (Note 1) Qty
Regulated Power Supply 200 mA DC Current Capability Tektronix PS2520G 2
Multimeter Keitley 2000 or 2001 2
Sourcemeter Keitley 2400 1
Oscilloscope 500 MHz Bandwidth, Four Channel Scope,
Min 1 Mbit Memory per Channel (Note 2)
Tecktronix TDS744, 754 or 784/TDS5054
Series or Lecroy WR5060 TDS5104B,
1 GHz, 5GS/s
1
Voltage Probe 4 Probes 500 MHz Bandwidth Tektronix or Lecroy 4
Waveform Generator Pattern Genarator Agilent 81104A 80 MHz or HP8110A
150 MHz 2 Outputs
1
SMB Cable External Clock Input 1
1. Equipment used in the context of this Application Note Manual.
2. Greater Scope memory per channel offers better resolution.
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Test Procedure
See Figure 2.
Initial Setups (Figure 2)
The initial setups given here are recommended before
starting measurements on the board.
Set the CMDVCC/in the OFF Position (High)
Set CLKDIV1 and CLKDIV2 into Low Position
(Lowest Frequency Fclkin)
Set 5V/3Vbar into a 5V Position
As a Precaution, Turn the 1 kWPotentiometer to Obtain
a Resistor Output Value of 1 kW, and then Connect the
Jumper
DC Power Supplies
Two power supplies are used to bias the demo board.
VDDP is the input voltage of the DC-DC converter. VDD is
the “digital” power supply which biases the input stages of
the NCN8024 device (control and signal inputs).
VDD and VDDP must be connected to the board for a
correct operation.
Connect the VDD Power Supply Using the 2 Pin Male
Connector J1
Connect the VDDP Power Supply Using the 2 Pin Male
Connector J2
Power up VDDP in the Range 4.5 V–5.5 V
Power up VDD in the Range 2.7 V–5.5 V
Clock Frequency
CLKDIV1 and CLKDIV2 select the frequency divider
according to the Table 2.
Table 2. CLOCK FREQUENCY
CLKDIV1 CLKDIV2 Divider
1 0 DIV 1/1
1 1 DIV 1/2
0 1 DIV 1/4
0 0 DIV 1/8
Card Presence
The socket we use is a normally open, so CDR-PRES/ has
been chosen; nevertheless the CRD_PRES and
CRD_PRES/ test points can also be used for signaling the
presence of a card and starting up the circuit.
Start the Measurement
To start the measurements, set the board as it follows:
Set CLKDIV1 and CLKDIV2 to Select the Correct
Frequency
Set 5V/3Vbar to Select the Correct Output Voltage
Jumpers:
1kWPotentiometer Jumper: Not Connected to Start
Measurement
Finally, Toggle/CMDVCC from High to Low to Start
the Device (Activation Sequence Run)
Figure 2. SOIC−28 Board Description (Equivalent for TSSOP−28)
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Figure 3. Schematic
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Table 3. BILL OF MATERIAL (BOM)
Designator Qty Description Value Footprint Manufacturer Part Number
C1, C2, C5 3CAP CER .1 mF 16 V
10% X7R 0603
100 nF SM/C_0603H Murata GRM188R71C104KA01D
C3 1 CAP CER .22 mF 16 V
X7R 10% 0805
220 nF SM/C_0805H TDK C2012X7R1C224K
C4 1 CAP CER .33 mF 16 V
X7R 10% 0805
330 nF SM/C_0805H TDK C2012X7R1C334K/1.25
C6 1 CAP CER .1 mF 25 V
10% X7R 0805
100 nF SM/C_0805H Murata GRM21BR71E104KA01L
C7 1 CAP CER 10 mF 6.3 V
X5R 10% 1206
10 mFSM/C_1206H TDK C3216X5R0J106K/1.60
C8, C9 2CAP CER .1 mF 25 V
10% X7R 0805
100 nF SM/C_0805H Murata GRM21BR71E104KA01L
C10 1 Do Not Populate −SM/C_0603H Do Not Populate Do Not Populate
C11, C12,
C13, C14
4Do Not Populate −SM/C_0603H Do Not Populate Do Not Populate
C15, C16,
C17
3Do Not Populate −SM/C_0603H Do Not Populate Do Not Populate
R1 1 RES 100 kW1/4 W 5%
0805 SMD
100 kWSM/C_0805H Rohm Semiconductor ESR10EZPJ104
R2 1 Do Not Populate −SM/C_0603H Do Not Populate Do Not Populate
R3, R9, R10,
R11, R12
5RES 0.0 W1/10 W 0603
SMD
0 SM/C_0603H Stackpole Electronics Inc RMCF0603ZT0R00
R4 1 Single Turn Cermet
Trimmer 1 kW, 0.5 W,
10%, 63M100R
1kWCERMET-72PT Bourns 3386F-1-102TLF
R5, R6, R7,
R8
4RES 10 kW1/4 W 5%
1206 SMD
10 kWSM/C_1206H Rohm Semiconductor MCR18EZPJ103
SW1, SW2,
SW3, SW4
4PCB Slide Switches −INTER3-2,54 EAO 09.03290.01
TP1-TP5,
TP11-TP13,
TP15-TP21
15 CLKDIV1/2, 5 V/3 Vb,
INT/, I/OUC, AUX1UC,
AUX2UC, CLKIN,
CRD_AUX1, _AUX2,
_I/O, _CLK, _RST,
/PRES, PRES, Clip Test
Point Hole Diameter
1.0 mm
−TP_1 Keystone 5000
TP6, TP7,
TP8, TP9,
TP10, TP14
6/CMDVCC, VUP, VDD,
VDDP, CRD_VCC,
RSTIN, Clip Test Point
Hole Diameter 1.6 mm
−TP_1.6MMHOLE_KEYS
TONE_5010
Keystone 5010
J1, J2 2VDD, VDDP, 2 Pins,
Male Connector,
5.08 mm Step
−MSTBA2-5.08MM Phoenix Contact MSTBA2.52G5.08
J3, J4, J5 3Ground: Strap, Brass,
Diameter 1.0 mm, Pitch
10.16 mm, Height
9.9 mm
−GND_STRP HARWIN D3082-46
J6, J7, J8 3IDD, IDDP, ICC,
Breakable Single Row,
Header (2 Pins)
−CON2-2.54 TYCO Amp 5-826629-0
J9, J10, J11,
J12
4Standoff Nut −Standoff Hole Keystone 1903C
J9, J10, J11,
J12
4Standoff Screw −Standoff Hole Keystone 4814K-ND
J13 1 SMB Connector −SMB/V Amphenol Connex 142138
U1 1 NCN8024 Smart Card
Interface
−SOIC−28/TSSOP−28 ON Semiconductor NCN8024DWR2G/
NCN8024DTBR2G
U2 1 Smart Card Socket −SmartCard_
FCI_74343L0825S01
FCI 7434L0825S01LF
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