Panasonic KX-TG5431BXS User manual

© 2005 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation o law.
KX-TG5431BXS
KX-TGA542BXS
5.8 GHz Digital Cordless Answering
System
Silver Version
( or Asia, Middle Near East and Other areas)
Telephone Equipment
ORDER NO. KM40505726CE

1 ABOUT LEAD F EE SOLDE (PbF: Pb free) 4
1.1. Suggested PbF Solder 4
1.2. How to Recognize that Pb Free Solder is Used 5
2 FO SE VICE TECHNICIANS 6
3 CAUTION 6
4 BATTE Y 7
4.1. Battery Installation 7
4.2. Battery Charge 7
4.3. Recharging the Battery 7
4.4. Battery Strength 8
4.5. Battery Replacement 8
4.6. Battery Per ormance 8
5 LOCATION OF CONT OLS 9
5.1. Base Unit 9
5.2. Handset 9
6 DISPLAYS 11
6.1. Display Items 11
6.2. Troubleshooting (Handset LCD) 12
7 SETTINGS 13
7.1. Connections 13
7.2. Connecting an Optional Headset 14
7.3. Guide to Handset Programming 14
7.4. Date and Time 15
7.5. Dialing Mode 16
7.6. Line Mode 16
7.7. Flash Button 16
7.8. Voice Enhancer 17
7.9. Handset Ringer Tone 17
7.10. Dial Lock 18
7.11. Direct Commands 19
8 OPE ATION 21
8.1. Phonebook 21
8.2. Caller ID Service 23
8.3. PAUSE Button (For PBX/Long Distance Service Users) 24
9 ANSWE ING SYSTEM 25
9.1. Recording Your Greeting Message 25
9.2. Turning the Answering System On/O 26
9.3. Caller’s Recording Time 26
9.4. Message Alert 26
9.5. Listening to Messages 27
9.6. Remote Operation 28
10 T OUBLESHOOTING 31
10.1. General Use 31
10.2. Programmable Settings 31
10.3. Making/Answering Calls, Intercom 32
10.4. Phonebook 32
10.5. Caller ID 33
10.6. Answering System 34
10.7. Battery Charge 35
10.8. Power Failure 35
11 DISASSEMBLY INST UCTIONS 36
11.1. Base Unit 36
11.2. Handset 37
12 ASSEMBLY INST UCTIONS 38
12.1. Fix the LCD and the Receiver Guide to the Main P.C.
Board (Handset) 38
13 T OUBLESHOOTING GUIDE 39
13.1. Check Power 40
13.2. Error Message Table 40
13.3. Check Record 41
13.4. Check Playback 42
13.5. Check Battery Charge 42
13.6. Check Link 43
13.7. Check the RF part 44
13.8. Check Handset Transmission 50
13.9. Check Handset Reception 50
13.10. Check Caller ID 50
14 ADJUSTMENT AND TEST MODE 51
14.1. Test Mode Flow Chart or Base Unit 51
14.2. Test Mode Flow Chart or Handset 55
14.3. X501 (Base Unit), X201 (Handset) Check 59
14.4. Adjust Battery Low Detector Voltage (Handset) 59
Note:
Because CONTENTS 4 to 10 are the extracts rom the Operating Instructions o this model, they are subject to change without
notice. Please re er to the original Operating Instructions or urther in ormation.
CONTENTS
Page Page
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KX-TG5431BXS / KX-TGA542BXS

14.5. Base Unit Re erence Drawing 60
14.6. Handset Re erence Drawing 61
14.7. Frequency Table 62
14.8. How to Clear User Setting 64
15 DESC IPTION 65
15.1. Frequency 65
15.2. FHSS (Frequency Hopping Spread Spectrum) 65
15.3. Signal Flowchart in the Whole System 67
16 EXPLANATION OF LINK DATA COMMUNICATION 68
16.1. Calling 68
16.2. To Terminate Communication 68
16.3. Ringing 68
17 BLOCK DIAG AM (BASE UNIT_MAIN) 69
18 CI CUIT OPE ATION (BASE UNIT_MAIN) 70
18.1. DSP (Digital Speech/Signal Processing: IC501) 70
18.2. Flash Memory (IC601) 70
18.3. Power Supply Circuit 71
18.4. Reset Circuit 73
18.5. Locator/Intercom Mode 74
18.6. Telephone Line Inter ace 74
18.7. Auto Disconnect Circuit 75
18.8. Parallel Connection Detect Circuit 76
18.9. Calling Line Identi ication (Caller ID) 77
19 BLOCK DIAG AM (BASE UNIT_ F PA T) 78
20 BLOCK DIAG AM (HANDSET_ F PA T) 79
21 CI CUIT OPE ATION ( F PA T) 80
21.1. Power Supply Circuit 81
21.2. 2.4GHz Mod/Demod Circuit 82
21.3. 5.8GHz Converter Circuit 83
21.4. 5.8GHz LNA (Low Noise Ampli ier) Circuit 84
21.5. 5.8GHz Power Ampli ier and Antenna Switch Circuit 85
22 BLOCK DIAG AM (HANDSET) 86
23 CI CUIT OPE ATION (HANDSET) 87
23.1. Construction 87
23.2. Power Supply Circuit 88
23.3. Charge Circuit 89
23.4. Ringer and Handset SP-Phone 89
23.5. Sending Signal 90
23.6. Reception Signal 90
24 SIGNAL OUTE 91
25 CPU DATA (BASE UNIT) 93
25.1. IC501 93
26 CPU DATA (HANDSET) 94
26.1. IC201 94
27 EXPLANATION OF IC TE MINALS ( F PA T) 95
27.1. IC701 95
27.2. IC801 96
27.3. IC851 97
28 HOW TO EPLACE THE FLAT PACKAGE IC 98
28.1. PREPARATION 98
28.2. FLAT PACKAGE IC REMOVAL PROCEDURE 98
28.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 99
28.4. BRIDGE MODIFICATION PROCEDURE 99
29 CABINET AND ELECT ICAL PA TS (BASE UNIT) 100
30 CABINET AND ELECT ICAL PA TS (HANDSET) 101
31 ACCESSO IES AND PACKING MATE IALS 102
31.1. KX-TG5431BXS 102
32 TE MINAL GUIDE OF THE ICs, T ANSISTO S AND DIODES
103
32.1. Base Unit 103
32.2. Handset 103
33 EPLACEMENT PA TS LIST 104
33.1. Base Unit 104
33.2. Handset 106
33.3. Accessories and Packing Materials 108
34 FO SCHEMATIC DIAG AM 109
34.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT_MAIN))
109
34.2. Handset (SCHEMATIC DIAGRAM (HANDSET_MAIN)) 109
35 SCHEMATIC DIAG AM (BASE UNIT_MAIN) 110
36 SCHEMATIC DIAG AM (BASE UNIT_ F PA T) 112
37 SCHEMATIC DIAG AM (BASE UNIT_OPE ATION) 114
38 SCHEMATIC DIAG AM (HANDSET_MAIN) 116
39 SCHEMATIC DIAG AM (HANDSET_ F PA T) 118
40 CI CUIT BOA D (BASE UNIT_MAIN) 121
40.1. Component View 121
40.2. Flow Solder Side View 122
41 CI CUIT BOA D (BASE UNIT_OPE ATION) 123
41.1. Component View 123
41.2. Flow Solder Side View 124
42 CI CUIT BOA D (BASE UNIT_ F PA T) 125
43 CI CUIT BOA D (HANDSET_MAIN) 127
43.1. Component View 127
43.2. Flow Solder Side View 128
44 CI CUIT BOA D (HANDSET_ F PA T) 129
3
KX-TG5431BXS / KX-TGA542BXS

1 ABOUT LEAD F EE SOLDE (PbF: Pb free)
Note:
In the in ormation below, Pb, the symbol or lead in the periodic table o elements, will re er to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead ree solder used in our manu acturing process which is made rom Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manu actured using lead ree solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type o solder although, with some precautions, standard Pb solder can also be used.
Caution
• • •
• PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20° F (370°C ± 10°C). In case o using high temperature soldering iron, please
be care ul not to heat too long.
• • •
• PbF solder will tend to splash i it is heated much higher than its melting point, approximately 1100°F (600°C).
• • •
• I you must use Pb solder on a PCB manu actured using PbF solder, remove as much o the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
• • •
• When applying PbF solder to double layered boards, please check the component side or excess which may low onto the
opposite side (See the igure below).
1.1. Suggested PbF Solder
There are several types o PbF solder available commercially. While this product is manu actured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manu acturer’s speci ic instructions or the melting points o their products and any precautions or using their product with other
materials.
The ollowing lead ree (PbF) solder wire sizes are recommended or service o this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TG5431BXS / KX-TGA542BXS

1.2. How to ecognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
IC701
IC851
IC801
IC201
1
25
26
50 51 75 76
100
MIC
PbF
IC241
IC261
Marked
(Component View)
Note:
The location o the “PbF” mark is subject to change without notice.
5
KX-TG5431BXS / KX-TGA542BXS

2 FO SE VICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum oil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare ingers.
3 CAUTION
Danger o explosion i battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manu acturer.
Dispose o used batteries according to the manu acturer´s Instructions.
6
KX-TG5431BXS / KX-TGA542BXS

4 BATTE Y
4.1. Battery Installation
4.2. Battery Charge
4.3. echarging the Battery
Note for service:
The battery strength may not be indicated correctly i the battery is disconnected and connected again, even a ter it is ully
charged. In that case, by recharging the battery as mentioned above, you will get a correct indication o the battery strength.
7
KX-TG5431BXS / KX-TGA542BXS

4.4. Battery Strength
4.5. Battery eplacement
4.6. Battery Performance
8
KX-TG5431BXS / KX-TGA542BXS

5 LOCATION OF CONT OLS
5.1. Base Unit
5.2. Handset
9
KX-TG5431BXS / KX-TGA542BXS

5.2.1. How to Use the Soft Keys/Navigator Key
10
KX-TG5431BXS / KX-TGA542BXS

6 DISPLAYS
6.1. Display Items
11
KX-TG5431BXS / KX-TGA542BXS

6.2. Troubleshooting (Handset LCD)
Cross eference:
(*1) e-registering the Handset (P.44)
(*2) Erasing Items in the Phonebook (P.22)
12
KX-TG5431BXS / KX-TGA542BXS

7 SETTINGS
7.1. Connections
13
KX-TG5431BXS / KX-TGA542BXS

7.2. Connecting an Optional Headset
7.3. Guide to Handset Programming
14
KX-TG5431BXS / KX-TGA542BXS

7.4. Date and Time
15
KX-TG5431BXS / KX-TGA542BXS

7.5. Dialing Mode
7.6. Line Mode
7.7. Flash Button
16
KX-TG5431BXS / KX-TGA542BXS

7.8. Voice Enhancer
7.9. Handset inger Tone
17
KX-TG5431BXS / KX-TGA542BXS

7.10. Dial Lock
For Service Hint:
*: I the current password is orgotten, enter “726276642” and you will be able to go to step 4.
18
KX-TG5431BXS / KX-TGA542BXS

7.11. Direct Commands
Cross eference:
Date and Time (P.15)
Dial Lock (P.18)
19
KX-TG5431BXS / KX-TGA542BXS

Cross eference:
emote Code (P.29)
e-registering the Handset (P.44)
20
KX-TG5431BXS / KX-TGA542BXS