Panasonic VDR-D300EG User manual

©2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
VDR-D300EG
VDR-D300E
VDR-D300EB
VDR-D300EP
VDR-D300EE
VDR-D300GC
VDR-D300GN
VDR-D300SG
VDR-D300GCS
VDR-D308GK
VOL.1
Colour
(S)....................Silver Type
DVD Video Camcorder
ORDER NO.VM0603011CE

1 Safety Precaution 3
1.1. General Guidelines 3
2 Warning 4
2.1. Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 4
2.2. Service caution based on legal restrictions 5
2.3. Caution for AC Cord (RJA0053-3X type) 6
2.4. How to Replace the Lithium Battery (PROCEDURE) 7
3 Service Navigation 8
3.1. Service Information 8
3.2. Service Caution 9
3.3. Procedure for Removing Disc 10
4 Specifications 11
5 Location of Controls and Components 12
6 Service Mode 23
6.1. Error Display 23
6.2. Service Menu 24
6.3. Firmware Version Check 26
7 Service Fixture & Tools 27
7.1. Service Tools and Equipment 27
8 Disassembly and Assembly Instructions 28
8.1. Disassembly Frow Chart 28
8.2. P.C.B. Layout 29
8.3. Disassembly Procedures 30
8.4. Disassembly Procedures of Camera Lens Unit 39
9 Measurements and Adjustments 40
9.1. Service Positions 40
9.2. Location for Connectors of the Main P.C.B. & Sub P.C.B.
42
9.3. Electrical Adjustment Procedures 44
10 Maintenance 47
10.1. Cleaning Lens, Viewfinder and LCD Panel 47
10.2. Cleaning Disc 47
10.3. Cleaning optical pickup 47
11 Schematic Diagrams 49
11.1. OVERALL SCHEMATIC DIAGRAM 49
11.2. INTERCONNECTION SCHEMATIC DIAGRAM 50
11.3. FLASH SCHEMATIC DIAGRAM 52
11.4. FRONT SCHEMATIC DIAGRAM 53
11.5. SIDE R SCHEMATIC DIAGRAM 54
11.6. MONITOR SCHEMATIC DIAGRAM 55
11.7. JACK SCHEMATIC DIAGRAM 56
11.8. EVF SCHEMATIC DIAGRAM 56
11.9. EVF FPC SCHEMATIC DIAGRAM 56
11.10. DVD DRIVE FPC SCHEMATIC DIAGRAM 57
11.11. DISK COVER LOCK UNIT SCHEMATIC DIAGRAM 57
11.12. SIDE L UNIT SCHEMATIC DIAGRAM 57
11.13. REAR CASE UNIT SCHEMATIC DIAGRAM 58
11.14. FRONT FPC SCHEMATIC DIAGRAM 58
11.15. SIDE R FPC SCHEMATIC DIAGRAM 58
11.16. MONITOR FPC SCHEMATIC DIAGRAM 58
11.17. 3CCD FPC SCHEMATIC DIAGRAM 59
12 Printed Circuit Board 61
12.1. FLASH P.C.B. 61
12.2. FRONT P.C.B. 62
12.3. JACK P.C.B. 63
12.4. EVF P.C.B. 63
12.5. SIDE R P.C.B. 64
12.6. MONITOR P.C.B. 65
13 Parts and Exploded Views 67
13.1. EXPLODED VIEWS 67
13.2. REPLACEMENT PARTS LIST 73
CONTENTS
Page Page
2
VDR-D300EG / VDR-D300E / VDR-D300EB / VDR-D300EP / VDR-D300EE / VDR-D300GC / VDR-D300GN / VDR-D300SG / VDR-D300GCS / VDR-D308GK

1 Safety Precaution
1.1. General Guidelines
1.IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by in the
Schematic Diagrams, Circuit Board Layout, Exploded Views and Replacement Parts List. It is essential that these critical parts
should be replaced with manufacturer’s specified parts to prevent X-RADIATION, shock fire, or other hazards. Do not modify
the original design without permission of manufacturer.
2.An Isolation Transformer should always be used during the servicing of AC Adaptor whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury
from electrical shocks. It will also protect AC Adaptor from being damaged by accidental shorting that may occur during
servicing.
3.When servicing, observe the original lead dress. It a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
4.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
5.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
3
VDR-D300EG / VDR-D300E / VDR-D300EB / VDR-D300EP / VDR-D300EE / VDR-D300GC / VDR-D300GN / VDR-D300SG / VDR-D300GCS / VDR-D308GK

2 Warning
2.1. Prevention of Electro Static Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
4
VDR-D300EG / VDR-D300E / VDR-D300EB / VDR-D300EP / VDR-D300EE / VDR-D300GC / VDR-D300GN / VDR-D300SG / VDR-D300GCS / VDR-D308GK

2.2. Service caution based on legal restrictions
2.2.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
· The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
· To put lead free solder, it should be well molten and mixed with the original lead free solder.
· Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
· Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt
the lead free solder.
· Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
degrees C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
· The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
5
VDR-D300EG / VDR-D300E / VDR-D300EB / VDR-D300EP / VDR-D300EE / VDR-D300GC / VDR-D300GN / VDR-D300SG / VDR-D300GCS / VDR-D308GK