Panasonic DVD-LS50EB User manual

Service Manual
TOP NEXT
ORDER NO.DSD0406020C8
Portable DVD/CD PLAYER
●DVD-LS50EB
DVD-LS50EG
DVD-LS50GCS
DVD-LS50GK
DVD-LS50GN
REA1904Z Mechanism Series
Colour
(S).................Silver Type
Specifications
Operating temperature
range: +5 to+35°C (+41 to+95°F)
Operating humidity range: 5-90% RH (no condensation)
Region number: Region No.2 (DVD-LS50EB/EG)
Region No.3 (DVD-LS50GCS)
Region No.4 (DVD-LS50GN)
Region No.6 (DVD-LS50GK)

Discs played: DVD-RAM (DVD-VR compatible, JPEG formatted discs)
DVD-Video, DVD-Audio
Music CD [CD-DA (CD-TEXT compatible)]
Video CD
CD-R/ CD-RW
[CD-DA (CD-TEXT compatible), Video CD, SVCD,MP3, WMA, JPEG, HighMAT
Level 2 (Audio and Image)]
DVD-R (DVD-Video compatible)
MP3/WMA
Compatible compression rate:
between 32 kbps and 320 kbps (MP3)
between 48 kbps and 320 kbps (WMA)
JPEG
Exif Ver2.1 JPEGBaseline files
Picture resolution: between 320×240 and 6144×4096 pixels
(sub sampling is 4:2:2 or 4:2:0)
Signal system: PAL/PAL60(NTSC) selectalble
LCD screen: 7”
-Si, TFT wide-screen LCD
Composite-video output:
Output level: 1Vp-p (75Ω)
Output terminal: Mini-jack
Number of terminals: 1system (output only)
S-video output:
Y output level: 1Vp-p (75Ω)
C output level: 0.3Vp-p (75Ω)
Output terminal: Mini-jack
Number of terminals: 1system (also used for composite-video output)
Audio output:
Output level: 1.5Vrms (1kHz, 0dB, 10kΩ)
Output terminal: Stereo mini-jack
Number of terminals: 1system (output only)
Audio performance:
(1) Frequency response:
•DVD (linear audio): 4Hz-22kHz (48kHz sampling)
4Hz-44kHz (96kHz sampling)
•DVD audio: 4Hz-88kHz (192kHz sampling)
•CD audio: 4Hz-20kHz
(2) S/N ratio:
•CD audio: 115dB
(3) Dynamic range:
•DVD (linear audio): 98dB
•CD audio: 97dB
(4) Total harmonic distortion:
•CD audio: 0.008%
Digital audio output:
Optical digital output: Mini optical terminal
Number of terminals: 1system
(also used for audio output)
Pickup:
Wave length: 662nm/ 785nm
Laser power: CLASS 3B/ CLASS 3B
Power supply: DC 9V (DC IN terminal)/
DC 7.2V (Exclusive battery terminal)
Power consumption
(Using included AC adaptor): 13W (Unit only: 9W) Standby mode 0.5W
Recharge mode 13W

AC adaptor:
Power source: AC 100-240V, 50/60Hz
Power consumption: 30W
DC output: 9V, 2000mA
Battery pack CGR-H701 (lithium ion):
Voltage: 7.2V
Capacity: 2150mAh
Battery duration When brightness is set to“-5” while playing DVD
2.5 hours (CGR-H701)
/10 hours (CGR-H703)
*CGR-H703: Option
*Room temperature
*using headphones
When brightness is set to“0” while playing DVD
2 hours (CGR-H701)
/8 hours (CGR-H703)
When brightness is set to“+5” while playing DVD
1.5 hours (CGR-H701)
/6 hours (CGR-H703)
When LCD panel is off while DVD playing
4 hours (CGR-H701)
/16 hours (CGR-H703)
Dimensions (excluding protrusions and battery): 190(W) x 165(D) x 29.2*(H) mm
[715/ 32” (W) x 61/ 2” (D) x 15/ 32” (H)]
*27.8mm(13/ 32”) at lowest point
[H=37.8mm (11/ 2”) including battery]
Mass (including battery): 795g (28.04oz.)
solder:
This model uses lead free solder (PbF).
Note
Specifications are subject to change without notice.
Mass and dimensions are approximate.
Power consumption in standby mode (using included AC adaptor): Main unit: 0.5W
Manufactured under license from Dolby Laboratories.
“Dolby“ and the double-D symbol are trademarks of Dolby Laboratories.
“DTS“ and“DTS 2.0+ Digital Out” are trademarks of Digital Theater Systems, Inc.
Apparatus Claims of U.S. Patent Nos. 4,631,603, 4,577,216, and 4,819,098, licensed for limited viewing uses only.
This product incorporates copyright protection technology that is protected by method claims of certain U.S. patents and other intellectual property rights owned by
Macrovision Corporation and other rightsowners. Use of this copyright protection technology must be authorized by Macrovision Corporation, and is intended for
home and other limited viewing uses only unless otherwise authorized by Macrovision Corporation. Reverse engineering or disassemblyis prohibited.
Windows Media, and the Windows logo are trademarks, or registered trademarks of Microsoft Corporation in the United States and/or other countries.
WMA is a compression format developedby Microsoft Corporation. It achieves the same sound quality as MP3 with a file size that is smaller than that of MP3.
MPEG Layer-3 audio decoding technology licensed from Fraunhofer llS and Thomson multimedia.
HighMAT and the HighMAT logo are either trademarks or registered trademarks of Microsoft Corporationin the United States and/or other countries.
© 2004 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
TOP NEXT

1 SAFETY PRECAUTIONS
TOP PREVIOUS NEXT
1.1 GENERAL GUIDELINES
1.1.1 LEAKAGE CURRENT COLD CHECK
1.1.2 LEAKAGE CURRENT HOT CHECK
TOP PREVIOUS NEXT

1.1 GENERAL GUIDELINES
TOP PREVIOUS NEXT
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts
which have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation
papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from
being exposed to shock hazards.
1.1.1 LEAKAGE CURRENT COLD CHECK
1.1.2 LEAKAGE CURRENT HOT CHECK
TOP PREVIOUS NEXT

1.1.1 LEAKAGE CURRENT COLD CHECK
TOP PREVIOUS NEXT
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each
exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts,
etc. When the exposed metallic part has a return path to thechassis, the reading should be
between 1MΩand 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be
.
TOP PREVIOUS NEXT

1.1.2 LEAKAGE CURRENT HOT CHECK
TOP PREVIOUS NEXT
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this
check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15μF capacitors, between each
exposed metallic part on the set and a good earth ground such as a water pipe.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across
the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester
(Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must
not exceed 1/2 milliamp. In case a measurement is outsideof the limits specified, there is a
possibility of a shock hazard, and the equipment should be repaired and rechecked before it is
returned to the customer.
TOP PREVIOUS NEXT

2 PREVENTION OF ELECTRO STATIC
DISCHARGE (ESD) TO ELECTROSTATICALLY
SENSITIVE (ES) DEVICES
TOP PREVIOUS NEXT
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistorsand semiconductor "chip" components.
The following techniques should be used to help reduce the incidence of component damage caused
by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped
assembly, drain off any ESD on your body by touching a known earth ground. Alternatively,
obtain and wear a commercially available dischargingESD wrist strap, which should be
removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a
conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure
of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as
"anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to
damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before
you are ready to install it. (Most replacement ES devices are packaged with leads electrically
shorted together by conductive foam, alminum foil or comparableconductive material).
7. Immediately before removing the protective material from the leads of a replacement ES
device, touch the protective material to the chassis or circuit assembly into which the device
will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise
hamless motion such as the brushing together of your clothes fabric or the lifting of your foot
from a carpeted floor can generate static electricity (ESD) sufficient todamage an ES device).
TOP PREVIOUS NEXT

3 PRECAUTION OF LASER DIODE
TOP PREVIOUS NEXT
TOP PREVIOUS NEXT

4 HOW TO REPLACE THE LITHIUM BATTERY
TOP PREVIOUS NEXT
This model is using a lithium battery for the remote control ass’y.
NOTE:
The lithium battery is a critical component. ( Type No.: CR2025 Manufactured by Panasonic. )
It must never be subjected to excessive heat or discharge.
It must therefore only be fitted in equipment designed specifically for its use.
Replacement batteries must be of the same type and manufacture.
They must be fitted in the same manner and location as the original battery, with the correct polarity contacts observed.
Do not attempt to re-charge the old battery or re-use it for any other purpose.
It should be disposed of in waste products destined for burial rather than incineration.

TOP PREVIOUS NEXT

5 ABOUT LEAD FREE SOLDER (PbF)
TOP PREVIOUS NEXT
Distinction of PbF PCB: PCBs (manufactured) using lead free solder will have a PbF stamp on the
PCB.
Caution:
●Pb free solder has a higher melting point than standard solder; Typically thmelting point is 50
- 70°F (30 - 40°C) higher. Please use a high temperature soldering iron. In case of the
soldering iron with temperature control,please set it to 700 ± 20°F (370 ± 10°C).
●Pb free solder will tend to splash when heated too high (about 1100°F/ 600°C).
When soldering or unsoldering, please completely remove all of the solder on the pins or solder area,
and be sure to heat the soldering points with the Pb free solder until it melts enough.
TOP PREVIOUS NEXT

6 HANDLING PRECAUTIONS FOR TRAVERSE
DECK
TOP PREVIOUS NEXT
The laser diode in the optical pickup may break down due to potential difference caused by static
electricity of clothes or human body.
So be careful of electrostatic break down during repair of the optical pickup.
6.1 Handling of optical pickup
6.2 Grounding for electrostatic breakdown prevention
TOP PREVIOUS NEXT

6.1 Handling of optical pickup
TOP PREVIOUS NEXT
1. Do not subject the optical pickup to static electricity as it is extremely sensitive to electrical
shock.
2. To prevent the breakdown of the laser diode, an antistatic shorting pin is inserted into the
flexible board (FPC Board).
When removing or connecting the short pin, finish the job in as short times as possible.
3. Be careful not to apply excessive stress to the flexible board (FPC Board).
4. Do not turn the variable resistor (Laser power adjustment).
It has already been adjusted.
TOP PREVIOUS NEXT

6.2 Grounding for electrostatic breakdown
prevention
TOP PREVIOUS NEXT
1. Human body grounding
Use the antistatic wrist strap to discharge the static electricity from your body.
2. Work table grounding
Put a conductive material (sheet) or steel sheet on the area where the optical pickup is placed
and ground the sheet.
Caution
The static electricity of your clothes will not be grounded through the wrist strap. So take care
not to let your clothes touch the optical pickup.
TOP PREVIOUS NEXT

7 DISASSEMBLY, REASSEMBLY AND SERVICE
POSITION
TOP PREVIOUS NEXT
7.1 Disassembly
7.2 P.C.B. location
7.3 Main cabinet of the unit
7.4 Traverse assembly
7.4.1 Removing traverse assembly
7.4.2 Reinstalling traverse assembly
7.5 Optical pick-up unit

7.5.1 Removing optical pick-up unit
7.5.2 Reinstalling optical pick-up unit
7.6 Disc motor
7.6.1 Removing disc motor
7.6.2 Caution to be taken when replacing the disc motor
7.7 Switch P.C.B.
7.8 Main P.C.B.
7.9 Monitor assembly
7.10 Disc cover
7.11 Monitor cover
7.12 Mono arm
7.13 LCD drive P.C.B.
7.14 Inverter P.C.B.
7.15 LCD panel
7.16 Service position
7.16.1 Board checks
TOP PREVIOUS NEXT

7.1 Disassembly
TOP PREVIOUS NEXT
TOP PREVIOUS NEXT

7.2 P.C.B. location
TOP PREVIOUS NEXT
TOP PREVIOUS NEXT