Panasonic KX-TC1464LCB User manual

ORDERNO. KM40304063C3
Telephone Equipment
KX-TC1464LCB
900MHzCordless Phone
Black Version
(for Peru)
(for Chile)
SPECIFICATIONS
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2003 PanasonicCommunications Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthat contains lead.
We will use PbF whendiscussing the leadfree solderusedinourmanufacturing process which
is made fromTin(Sn), Silver(Ag), and Copper(Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggest using the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solder has amelting point that is50°F ~ 70°F (30°C~ 40°C)
higher than Pb solder. Please use asoldering iron with
temperature control and adjust itto 700°F ± 20°F (370°C± 10°C). In
case of using high temperature soldering iron, please be careful
not to heat too long.
-PbF solder will tend to splash ifitisheated much higher than its
melting point, approximately1100°F, (600°C).
-Ifyou must use Pb solder on aPCB manufactured using PbF
solder, remove as much of the original PbF solder as possibleand
be sure that anyremaining ismelted prior to applying the Pb
solder.
-When applying PbF solder to doublelayered boards, please check
the component side for excess which mayflow onto the opposite
side (See figure, below).
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1.1. Suggested PbF Solder
There are several types of PbF solderavailable commercially. While this product is
manufacturedusing Tin, Silver, and Copper,
(Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+Cu), orTin, Zinc, and Bismuth, (Sn+Zn+Bi).
Please check the manufac
turer’s specific instructions forthe melting points of theirproducts and anyprecautions for
using theirproduct withother
materials.
The following leadfree (PbF) solderwire sizes are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
1.2. Base Unit
1.2.1. Main
(Component View)
(FlowSolderSide View)
1.2.2. Locator
(Component View)
(FlowSolderSide View)
1.2.3. RFModule
(Component View)
1.3. Handset
1.3.1. Main
(Component View)
(FlowSolderSide View)
1.3.2. RFModule
(Component View)
2. FOR SERVICE TECHNICIANS
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ICs and LSIs are vulnerable tostatic electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Cover the plasticparts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use aconductive mat on the worktable.
4. Donot touch ICor LSI pins with bare fingers.
3. CAUTION
Dangerof explosion if batteryis incorrectlyreplaced. Replace onlywiththe same orequivalent
type recommendencedbythe manufacturer.
Dispose of usedbatteries according tothe manufacture’s Instructions.
4. STANDARD BATTERY LIFE
4.1. Recharge
4.2. BatteryInformation
AfteryourPanasonic batteryis fullycharged:
Operation Operating time
While inuse (TALK) Uptoabout 5 hours
While not inuse (Standby) Uptoabout 5 days
-The batteryoperating time mayvarydepending on usage
conditions and ambient temperature.
-Clean the handset and the base unitcharge contacts with asoft,
drycloth. Clean ifthe unitissubject to grease, dust or high
humidity. Otherwise the batterymaynot charge properly.
-Ifthe batteryisfullycharged, you do not have to place the handset
on the base unituntil the INUSE indicator flashes. Thiswill
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maximize the batterylife.
-The batterycannot be overcharged.
5. LOCATION OF CONTROLS
5.1. Base unit
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5.2. Handset
5.3. BatteryReplacement
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6. CONNECTIONS
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-USE ONLY WITHPanasonicAC ADAPTORPQWATC1461BX.
-The AC adaptor must remainconnected at all times. (Itisnormal
for the adaptor to feel warm during use.)
-When more than one unitisused, the units mayinterfere with each
other. To prevent or reduce interference, please leave ample
space between the base units.
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6.1. Adding Another Phone
This unit will not function during a powerfailure. To connect a standardtelephone on the same
line, use a T-adaptor.
7. OPERATIONS
7.1. Making Calls
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7.2. Answering Calls
8. DISASSEMBLY INSTRUCUTIONS
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ShowinFig. To remove. Remove.
1LowerCabinet Screws (2.6 × 8)....................... (A) × 4
2LocatorP.C.Board Screws (2.3 × 6)....................... (B) × 4
LocatorP.C.Board
3RFP.C.Board Screws (2 × 6)....................... (C) × 3
RFP.C.Board
4MainP.C.Board Screws (2.3 × 6)....................... (D) × 4
MainP.C.Board
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ShowinFig. To remove. Remove.
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RearCabinet Batterycompartment cover. 6Screws (2.6 × 8)......................(E) × 2
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8 Antenna Screw(2.6 × 8)......................(F) × 1
RFP.C.Board Screws (2 × 6)......................(G) × 2
RFP.C.Board.
9MainP.C.Board Screws (2 × 6)......................(H) × 2
MainP.C.Board
9. HOW TO REMOVE TEL JACK
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1. Keep 2hooks for TEL JACK fixing open inthe direction of arrow
1, then pull the top of TEL JACK forward as shownarrow 2until
the hooks click. (Refer to Fig. 1.)
2. Remove TEL JACK pulling just above inthe direction of arrow 3.
(Refer to Fig. 2.)
10. TROUBLESHOOTING GUIDE
Cross Reference:
Check Power ()
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Bell Reception ()
Check Battery Charge ()
Check Link ()
Check Handset Transmission ()
Check Handset Reception ()
10.1. Check Power
Cross Reference:
Reset Circuit ()
Power Supply Circuit ()
** : CONNECTIONS ()
Note:
CPU: IC3
Cross Reference:
Charge Circuit ()
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Note:
CPU: U1
*: Eachmeasurement points are shownin CIRCUIT BOARD (BASE UNIT) () or CIRCUIT BOARD
(HANDSET) ()
10.2. Bell Reception
Cross Reference:
Telephone Line Interface ()
Note:
CPU : IC3
*: Eachmeasurement points are shownin CIRCUIT BOARD (BASE UNIT) () or CIRCUIT BOARD
(HANDSET) ()
10.3. Check BatteryCharge
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Cross Reference:
Charge Circuit ()
Power Supply Circuit ()
** : CONNECTIONS ()
Note:
CPU: IC3
Cross Reference:
Reset Circuit/Charge Circuit ()
Note:
CPU: U1
*: Eachmeasurement points are shownin CIRCUIT BOARD (BASE UNIT) () or CIRCUIT BOARD
(HANDSET) ()
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10.4. Check Link
**: Referto Adjustment ()
Note:
CPU: IC3
RFIC: IC1
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*: Eachmeasurement points are shownin CIRCUIT BOARD (BASE UNIT) () or CIRCUIT BOARD
(HANDSET) ()
**: Referto Adjustment ().
Note:
CPU: U1
RFIC: IC1
*: Eachmeasurement points are shownin RF Module ()
10.5. Check Handset Transmission
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Cross Reference:
SIGNAL ROUTE ()
10.6. Check Handset Reception
Cross Reference:
SIGNAL ROUTE ()
11. ADJUSTMENTS (BASE UNIT)
If yourunit have belowsymptoms, adjust orconfirm eachitemusing remedycolumnfromthe
table.
Symptom Remedy*
The base unit dose not respond toa call fromhandset. Make adjustments in
item
The base unit dose not transmit orthe transmit frequencyis off. Make adjustments in
item
The transmit frequencyis off. Make confirmation in
item
The transmit poweroutput is low, and the operating distance between
the base unit and
the handset is less thannormal.
Make confirmation in
item
The reception sensitivityof base unit is lowwithnoise. Make confirmation in
item
The transmit level is high orlow. Make confirmation in
item
The reception level is high orlow. Make adjustments in
item
The unit does not link. Make confirmation in
item
*: Referto Adjustment ().
11.1. Test Mode Flow Chart (Base Unit)
The operation-flowof Test mode and maincheck items are shownbelow.
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Note:
**: Refertothe above table.
11.2. Adjustment
Adjustment
Items Test Mode Adjustment
Point
*Procedure
(A
)RX VCO CH1 Talk L502 -Adjust L502 so that thereading oftheDigital Voltmeter is1.75V± 0.2V. (at TP808)
(B
)TX VCO CH1 Talk L503 -Adjust L503 so that thereading oftheDigital Voltmeter is1.8V± 0.15V. (at TP809)
(C
)TX Frequency CH1 Talk VC1 -AdjustmentVC1so that thereading ofthefrequencycounter is1ch Freq.
(902.1MHz)± 9KHz at theantenna.
(D
)TX Power Confirmation CH1 Talk T5 -Confirm so that thereading oftheRF VTVMis-7 ± 2dBm. (at TP510)
(E
)RX Sensitivity
Confirmation
CH1
Talk -1. Apply-107dBm outputfrom S.S.G. (modulation frequency1KHz, dev. 0KHz).
2. Confirm that thedistortion reading ofAudio Analyzer isless than 25%.
(F) Line Output
Level
Confirmation
CH1
Talk -1. Apply-60dBm outputfrom S.S.G. (modulation frequency1KHz, dev. 25KHz).
2. Confirm that thereading ofAudio Analyzer is-20 ± 1dBm (600 load).
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