Panasonic KX-TCD430GC User manual

ORDERNO. KM40312313C2
Telephone Equipment
KX-TCD430GC / KX-TCD430GF / KX-TCD432GC / KX-
TCD432GF / KX-A143EXC / KX-A143EXF
Digital Cordless Phone
Dark Blue Version
Light Blue Version
(for Germany)
SPECIFICATIONS
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2004 PanasonicCommunications Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthat contains lead.
We will use PbF solderwhendiscussing the leadfree solderusedinourmanufacturing process
whichis made fromTin(Sn), Silver(Ag), and Copper(Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggest using the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solder has amelting point that is50°F ~70°F (30°C~ 40°C)
higher than Pb solder. Please use asoldering iron with
temperature control and adjust itto 700°F ± 20°F (370°C± 10°C). In
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case of using high temperature soldering iron, please be careful
not to heat too long.
-PbF solder will tend to splash ifitisheated much higher than its
melting point, approximately1100°F (600°C).
-Ifyou must use Pb solder on aPCB manufactured using PbF
solder, remove as much of the original PbF solder as possibleand
be sure that anyremaining ismelted prior to applying the Pb
solder.
-When applying PbF solder to doublelayered boards, please check
the component side for excess which mayflow onto the opposite
side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solderavailable commercially. While this product is
manufacturedusing Tin, Silver, and Copper
(Sn+Ag+Cu), you canalsouse Tinand Copper(Sn+Cu) orTin, Zinc, and Bismuth(Sn+Zn+Bi).
Please check the manufac
turer’s specific instructions forthe melting points of theirproducts and anyprecautions for
using theirproduct withother
materials.
The following leadfree (PbF) solderwire sizes are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
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1.2. How to recognize that Pb Free solder isused
1.2.1. Base Unit PCB
(Component View)
(FlowSolderSide View)
Note:
The location of the “PbF“ mark is subject tochange without notice.
1.2.2. Handset PCB
(Component View)
(FlowSolderSide View)
Note:
The location of the “PbF“ mark is subject tochange without notice.
1.2.3. ChargerUnit PCB
Note:
The location of the “PbF“ mark is subject tochange without notice.
2. FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable tostatic electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Cover the plasticparts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use aconductive mat on the worktable.
4. Donot touch ICor LSI pins with bare fingers.
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3. CAUTION
Dangerof explosion if batteryis incorrectlyreplaced. Replace onlywiththe same orequivalent
type recommendencedbythe manufacturer.
Dispose of usedbatteries according tothe manufacture’s Instructions.
4. BATTERY
4.1. BatteryInstallation
1. Insert the batteries negative (-) terminal first.
2. Close the batterycover.
Note:
-Use onlyrechargeableP03P (Ni-MH)/P03H(Ni-Cd) batteries.
4.2. BatteryCharge
Place the handset on the base unit forabout 7 hours before initial use.
Whenthe batteries are fullycharged, flashes. Whencharging, the batteryicon is
shownas follows.
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