
11.8. Frequency Table 48
12 DESCRIPTION 49
12.1. Frequency 49
12.2. Time Division Duplex (TDD) operation 49
12.3. Signal Flowchart in the Whole System 50
13 EXPLANATION OF BBIC (Base Band IC) DATA
COMMUNICATION 51
13.1. Calling 51
13.2. To Terminate Communication 51
13.3. Ringing 51
13.4. Ports for Transmitting and Receiving of Data 51
14 BLOCK DIAGRAM (Base Unit) 52
15 CIRCUIT OPERATION (Base Unit) 53
15.1. DSP (Digital Speech/Signal Processing: IC201) 53
15.2. Flash Memory (IC300) 53
15.3. Power Supply Circuit 54
15.4. Reset Circuit 55
15.5. Locator/Intercom Mode 56
15.6. Telephone Line Interface 56
15.7. Auto Disconnect Circuit 57
15.8. Parallel Connection Detect Circuit 57
15.9. Signal Route 58
15.10. Calling Line Identification (Caller ID)/Call Waiting Caller ID
59
16 BLOCK DIAGRAM (Handset) 61
17 CIRCUIT OPERATION (Handset) 62
17.1. Construction 62
17.2. Power Supply Circuit 62
17.3. Charge Circuit 63
17.4. Ringer and Handset SP-Phone 63
17.5. Sending Signal 63
17.6. Reception Signal 64
18 CPU DATA (Base Unit) 65
18.1. IC201 65
19 CPU DATA (Handset) 66
19.1. IC201 66
20 EXPLANATION OF RF UNIT TERMINALS 67
20.1. IC101 67
21 HOW TO REPLACE A FLAT PACKAGE IC 68
21.1. Preparation 68
21.2. Procedure 68
21.3. Removing Solder from Between Pins 68
22 CABINET AND ELECTRICAL PARTS (Base Unit) 69
23 CABINET AND ELECTRICAL PARTS (Handset) 70
24 ACCESSORIES AND PACKING MATERIALS 71
25 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
72
25.1. Base Unit 72
25.2. Handset 72
26 REPLACEMENT PARTS LIST 73
26.1. Base Unit 73
26.2. Handset 75
27 FOR SCHEMATIC DIAGRAM 78
27.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit)) 78
27.2. Handset (SCHEMATIC DIAGRAM (Handset)) 78
27.3. Memo 79
28 SCHEMATIC DIAGRAM (Base Unit) 80
29 SCHEMATIC DIAGRAM (Handset) 82
30 SCHEMATIC DIAGRAM (RF Unit) 84
31 CIRCUIT BOARD (RF Unit) 85
31.1. MEMO 86
32 CIRCUIT BOARD (Base Unit) 87
32.1. Component View 87
32.2. Flow Solder Side View 88
33 CIRCUIT BOARD (Handset) 89
33.1. Component View 89
33.2. Flow Solder Side View 90
3
KX-TG2257BXS