Panasonic KX-TG4011AGT User manual

© Panasonic System Networks Co., Ltd. 2010© Panasonic System Networks Co., Ltd. 2010
Unauthorized copying and distribution is a violationUnauthorized copying and distribution is a violation
of law.of law.
ORDER NO. KM41009270CEORDER NO. KM41009270CE
Telephone EquipmentTelephone Equipment
Model No.Model No.
KX-TG4011AGTKX-TG4011AGT
KX-TG4012AGTKX-TG4012AGT
KX-TG4013AGTKX-TG4013AGT
KX-TGA403AGTKX-TGA403AGT
Expandable Digital Cordless PhoneExpandable Digital Cordless Phone
T: Black Metallic VersionT: Black Metallic Version
(for Argentina)(for Argentina)

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGTKX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGTKX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGTKX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
TABLE OF CONTENTSTABLE OF CONTENTS
PP
AA
GG
EE
PP
AA
GG
EE
11
SafetSafet
y Precauy Precau
tiontion
ss
----------------------------------------------------------------------------------------------
44
1.1.1.1.
For Service TFor Service T
echnechn
icianician
ss
--------------
------------
------------
------------
--------------
--
44
22
WaWa
rnirni
ngng
----------------------------------------------------------------------------------------------------------------------------
44
2.1.2.1.
BattBatt
ery ery
CautiCauti
on----on----
------------
--------------
------------
------------
--------------
--------------
----
44
2.2.2.2.
About LeAbout Le
ad Free Soldad Free Sold
er (PbF: Pb freeer (PbF: Pb free
)---------)---------
----------
44
2.3.2.3.
Discarding Discarding
of of
PP
. .
C. C.
Board------------------------------Board------------------------------
----
55
33
SpecSpec
ificaifica
tiontion
ss
----------------------------------------------------------------------------------------------------------
66
44
TeTe
chnical chnical
DescriptionsDescriptions
----------------------------------------------------------------------------------
77
4.1.4.1.
US-DEUS-DE
CT CT
DescDesc
riptiripti
onon
------------
------------
------------
--------------
------------
----------
77
4.2.4.2.
BlocBloc
k k
DiagrDiagr
am (Base Unit_Maiam (Base Unit_Mai
n)---------n)---------
------------
------------
--
99
4.3.4.3.
Block Block
Diagram Diagram
(Base (Base
Unit_RF Unit_RF
Part)Part)
-----------------10-----------------10
4.4.4.4.
Circuit Circuit
Operation Operation
(Base (Base
Unit)Unit)
----------------------------------------------------
1111
4.5.4.5.
Block Block
Diagram Diagram
(Handset)-------------------------------18(Handset)-------------------------------18
4.6.4.6.
Block Block
Diagram Diagram
(Handset_RF (Handset_RF
Part)-------------------19Part)-------------------19
4.7.4.7.
Circuit Circuit
Operation Operation
(Handset)----------------------------(Handset)----------------------------
2020
4.8.4.8.
Circuit Circuit
Operation Operation
(Charger (Charger
Unit)Unit)
----------------------22----------------------22
4.9.4.9.
SignaSigna
l l
RouteRoute
--------------
------------
------------
------------
------------
--------------
------------
---23---23
55
Location of Location of
Controls and Controls and
ComponentComponent
ss
------------------------------------
2424
66
Installation Installation
InstructionsInstructions
------------------------------------------------------------------------------
2424
77
OperaOpera
ting Instruting Instru
ctioctio
nsns
----------------------------------------------------------------------------------
2424
88
TT
est Mest M
odeode
--------------------------------------------------------------------------------------------------------------------
2525
8.1.8.1.
Engineering Engineering
ModeMode
----------------------------------------25----------------------------------------25
99
ServiServi
ce ce
ModeMode
----------------------------------------------------------------------------------------------------------
2929
9.1.9.1.
How to Clear How to Clear
User SettUser Sett
ing (Handset ing (Handset
Only)---------29Only)---------29
1010
TroubTroub
leshooting leshooting
GuideGuide
--------------------------------------------------------------------------------
3030
10.1.10.1.
TroubleshootTroubleshoot
ing ing
FlowchartFlowchart
-----------------------------30-----------------------------30
1111
Disassembly aDisassembly a
nd Assembly nd Assembly
InstructionsInstructions
------------------------------
4141
11.11.
1.1.
Disassembly Disassembly
InstructionsInstructions
-------------------------------41-------------------------------41
11.11.
2.2.
How tHow t
o Replaco Replac
e te t
he Handshe Hands
et LCDet LCD
-------------------44-------------------44
1212
MeasurementMeasurement
s and s and
AdjustmentAdjustment
ss
------------------------------------------------------
4545
12.1.12.1.
Equipment Equipment
RequiredRequired
-------------------------------------45-------------------------------------45
12.2.12.2.
The Setting Method of The Setting Method of
JIGJIG
------------
------------
------------
------------
-----45-----45
12.3.12.3.
Adjustment Adjustment
StSt
andard (Base andard (Base
Unit)---------------------49Unit)---------------------49
12.4.12.4.
Adjustment Adjustment
StSt
andard (Charger andard (Charger
Unit)-----------------50Unit)-----------------50
12.5.12.5.
AdjusAdjus
tmentmen
t t
StSt
andard andard
(Hands(Hands
et)et)
------------
--------------
----------
----51----51
12.6.12.6.
ThingThing
s to Do after Replas to Do after Repla
cing IC or X'tacing IC or X'ta
ll
------------
------52------52
12.7.12.7.
Frequency Frequency
TT
ableable
------------------------------------------54------------------------------------------54
1313
MiscMisc
ellanellan
eouseous
--------------------------------------------------------------------------------------------------------
5555
13.1.13.1.
How to How to
Replace tReplace t
he Flat he Flat
Package Package
ICIC
----------------55----------------55
13.2.13.2.
How to How to
Replace Replace
the the
Shield Shield
CaseCase
---------------------57---------------------57
13.3.13.3.
How to Replace How to Replace
the LLP (Leadless the LLP (Leadless
LeadframeLeadframe
Package) IC------------------------------------------------59Package) IC------------------------------------------------59
13.4.13.4.
TT
erminal Guide of the ICs, Terminal Guide of the ICs, T
ransistors andransistors and
DiodesDiodes
-------------------------------------------------------61-------------------------------------------------------61
1414
SchemSchem
atic Diaatic Dia
gramgram
------------------------------------------------------------------------------------------
6262
14.1.14.1.
For For
Schematic Schematic
Diagram---------------------------------Diagram---------------------------------
6262
14.2.14.2.
Schematic Schematic
Diagram Diagram
(Base (Base
Unit_Main)Unit_Main)
--------------64--------------64
14.3.14.3.
Schematic Schematic
Diagram Diagram
(Handset_Main)----------------(Handset_Main)----------------
6666
14.4. 14.4.
ScheSche
matimati
c Diagram (Charc Diagram (Char
ger Unit)ger Unit)
------------
------------
-----68-----68
1515
PrinPrin
ted Circuted Circu
it Boardit Board
--------------------------------------------------------------------------------------
6969
15.1.15.1.
Circuit Circuit
Board Board
(Base (Base
Unit_Main)Unit_Main)
-----------------------69-----------------------69
15.2.15.2.
Circuit Circuit
Board Board
(Handset_Main)-------------------------71(Handset_Main)-------------------------71
15.3.15.3.
Circuit Circuit
Board Board
(Charger (Charger
Unit)Unit)
---------------------------73---------------------------73
1616
Exploded VExploded V
iew and Replaceiew and Replace
ment Parts ment Parts
ListList
----------------------
7474
16.1.16.1.
CabinCabin
et and Electricet and Electric
al Parts (Basal Parts (Bas
e Unit)e Unit)
------------
-----74-----74
16.2.16.2.
Cabinet Cabinet
and and
Electrical Electrical
Parts Parts
(Handset)(Handset)
-------------75-------------75
16.3.16.3.
CabinCabin
et and Electret and Electr
ical Partical Part
s (Charger Units (Charger Unit
))
------------
-76-76
16.4.16.4.
AccessoriesAccessories
------------------------------------------------77------------------------------------------------77
16.5.16.5.
ReplaRepla
cemencemen
t t
PartPart
s s
List-----List-----
--------------
--------------
------------
------------
----
7878

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGTKX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
11
SS
aa
ff
ee
tt
y Py P
rr
ee
cc
aa
uu
tt
ii
oo
nn
ss
11
..
11
..
FF
oo
r Sr S
ee
rr
vv
ii
cc
e Te T
ecec
hh
nn
ii
cc
ii
aa
nn
ss
••
Repair service shall be provided in accordance with repair technology information such as service manual so as toRepair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be prevent fires, injury or electric shock, which can be
caused by improper repair workcaused by improper repair work
..
1.1.
When repair services are provided, neither the products nor their partWhen repair services are provided, neither the products nor their part
s or members shall be remodeled.s or members shall be remodeled.
2.2.
If a lead wire assembly is If a lead wire assembly is
supplied as a repair part, tsupplied as a repair part, t
he lead wire assembly shalhe lead wire assembly shal
l be replaced.l be replaced.
3.3.
FASFAS
TON terminals sTON terminals s
hall be plugged straight in and unplugged sthall be plugged straight in and unplugged st
raight out.raight out.
••
ICs and LSIs are ICs and LSIs are
vulnerable to static electricity.vulnerable to static electricity.
When repairing, the following precautions will help prevent When repairing, the following precautions will help prevent
recurring malfunctions.recurring malfunctions.
1.1.
Cover plastic Cover plastic
parts boxes parts boxes
with aluminum fwith aluminum f
oil.oil.
2.2.
GrounGroun
d the solderind the solderin
g irons.g irons.
3.3.
Use a coUse a co
nductive manductive ma
t on worktt on workt
able.able.
4.4.
Do not grasp IC or Do not grasp IC or
LSI pins with LSI pins with
bare fingers.bare fingers.
22
WW
aa
rr
nn
ii
nn
gg
22
..
11
..
BB
aa
tt
tt
ee
rr
y y
CC
aa
uu
tt
ii
oo
nn
1. Danger of explosion if 1. Danger of explosion if
battery is incorrectly replaced.battery is incorrectly replaced.
2. Replace only with the same 2. Replace only with the same
or equivalent type recommended by the manufacturer.or equivalent type recommended by the manufacturer.
3. Dispose of 3. Dispose of
used batteries according to used batteries according to
the manufacture’s Instructionsthe manufacture’s Instructions
..
2.2.
2.2.
AbAb
ouou
t Lt L
eaea
d Fd F
rere
e Se S
olol
dede
r (r (
PbPb
F: F:
Pb Pb
frfr
eeee
))
Note:Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder thatIn the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repairThis model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same work we suggest using the same
type of solder.type of solder.
CautionCaution
••
PbF solder PbF solder
has a meltinhas a meltin
g point that ig point that i
s 50s 50
°°
F ~ 70F ~ 70
°°
F (30F (30
°°
C ~ 40C ~ 40
°°
C) higher than Pb solder. Please use a soldering iron withC) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700temperature control and adjust it to 700
°°
F ± 20F ± 20
°°
F (370F (370
°°
C ± 10C ± 10
°°
C).C).
••
Exercise cExercise c
are while using hiare while using hi
gher temperature solderigher temperature solderi
ng irons.:ng irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the Do not heat the PCB for too long time in order to prevent solder splash or damage to the
PCB.PCB.
••
PbF solder will tend to splash if it is heated much higher than its melting point, approximatPbF solder will tend to splash if it is heated much higher than its melting point, approximat
ely 1100ely 1100
°°
F (600F (600
°°
C).C).
••
When applying PbF solder to double layered boards, please check thWhen applying PbF solder to double layered boards, please check th
e component side for excess which may floe component side for excess which may flo
w onto thew onto the
opposite side (See the figure below).opposite side (See the figure below).

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
2
.
2
.
1.
S
ug
g
e
s
t
e
d P
b
F S
o
l
d
er
There are several types of
PbF solder available commercially
. While this
product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specif
ic instructions for the melting points of their
products and any precautions for using their product with
other
materials.
The following lead free (PbF)
solder wire sizes are recommended for service of this pr
oduct: 0.3 mm, 0.6 mm and 1.0
mm.
2.
3.
D
is
ca
rd
i
ng
of
P
.
C
.
B
oa
rd
When discarding P
. C. Board,
delete all personal
information such as telephone directory and
caller list or
scrap P
. C. Board.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
3
S
p
e
c
i
f
i
c
a
t
i
o
n
s
Note:
•
Design and specific
ations are subject to c
hange without notice.
Note for Service:
•
Operation range:
Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
•
Analog telephone
connection:
Telephone Line

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4
T
e
ch
ni
ca
l D
es
c
ri
pt
io
ns
4
.
1
.
U
S
-
D
E
C
T D
e
s
c
r
i
p
t
i
o
n
The frequency range of 1.91 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to
Frequency Table
(P.54).
4
.
1
.
1
.
T
D
D
F
r
a
m
e
F
o
r
m
a
t
4
.
1
.
2
.
T
D
M
A
s
y
s
t
e
m
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417
µ
s, the 10 ms of
voice data is transmitted.
•
2 - Handsets Link
Traffic Bearer
A link is
established b
etween base unit an
d handset.
The state where duplex
communicat
ion is performed.
Handset doesn't make up duplex in no
free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the
all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no
free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF
parts, it is better in least interference condition.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.
1.
3.
Si
gn
al
Fl
ow
ch
ar
t i
n th
e R
ad
io P
ar
t
s
Reception
A voice sign
al from TEL li
ne is encoded to
digital data
"TXDA
TA
" by BBIC
(IC501) in a base uni
t.
Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a hands
et RF
, RF signal is
received in one ant
enna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice sign
al from microp
hone is encoded to
digital data
"TXDA
TA
" by BBIC
(IC1) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.
As for a base
unit RF
, RF signal is
received in two
antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal
in the selected antenna,
and demodulates it
to digital data "RXDAT
A".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.
2.
B
lo
ck
Di
ag
ra
m (
Ba
se
U
ni
t_
M
ai
n)
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