Panasonic KX-TG4011AGT User manual

© Panasonic System Networks Co., Ltd. 2010© Panasonic System Networks Co., Ltd. 2010
Unauthorized copying and distribution is a violationUnauthorized copying and distribution is a violation
of law.of law.
ORDER NO. KM41009270CEORDER NO. KM41009270CE
Telephone EquipmentTelephone Equipment
Model No.Model No.
KX-TG4011AGTKX-TG4011AGT
KX-TG4012AGTKX-TG4012AGT
KX-TG4013AGTKX-TG4013AGT
KX-TGA403AGTKX-TGA403AGT
Expandable Digital Cordless PhoneExpandable Digital Cordless Phone
T: Black Metallic VersionT: Black Metallic Version
(for Argentina)(for Argentina)

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGTKX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGTKX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGTKX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
TABLE OF CONTENTSTABLE OF CONTENTS
PP
AA
GG
EE
PP
AA
GG
EE
11
SafetSafet
y Precauy Precau
tiontion
ss
----------------------------------------------------------------------------------------------
44
1.1.1.1.
For Service TFor Service T
echnechn
icianician
ss
--------------
------------
------------
------------
--------------
--
44
22
WaWa
rnirni
ngng
----------------------------------------------------------------------------------------------------------------------------
44
2.1.2.1.
BattBatt
ery ery
CautiCauti
on----on----
------------
--------------
------------
------------
--------------
--------------
----
44
2.2.2.2.
About LeAbout Le
ad Free Soldad Free Sold
er (PbF: Pb freeer (PbF: Pb free
)---------)---------
----------
44
2.3.2.3.
Discarding Discarding
of of
PP
. .
C. C.
Board------------------------------Board------------------------------
----
55
33
SpecSpec
ificaifica
tiontion
ss
----------------------------------------------------------------------------------------------------------
66
44
TeTe
chnical chnical
DescriptionsDescriptions
----------------------------------------------------------------------------------
77
4.1.4.1.
US-DEUS-DE
CT CT
DescDesc
riptiripti
onon
------------
------------
------------
--------------
------------
----------
77
4.2.4.2.
BlocBloc
k k
DiagrDiagr
am (Base Unit_Maiam (Base Unit_Mai
n)---------n)---------
------------
------------
--
99
4.3.4.3.
Block Block
Diagram Diagram
(Base (Base
Unit_RF Unit_RF
Part)Part)
-----------------10-----------------10
4.4.4.4.
Circuit Circuit
Operation Operation
(Base (Base
Unit)Unit)
----------------------------------------------------
1111
4.5.4.5.
Block Block
Diagram Diagram
(Handset)-------------------------------18(Handset)-------------------------------18
4.6.4.6.
Block Block
Diagram Diagram
(Handset_RF (Handset_RF
Part)-------------------19Part)-------------------19
4.7.4.7.
Circuit Circuit
Operation Operation
(Handset)----------------------------(Handset)----------------------------
2020
4.8.4.8.
Circuit Circuit
Operation Operation
(Charger (Charger
Unit)Unit)
----------------------22----------------------22
4.9.4.9.
SignaSigna
l l
RouteRoute
--------------
------------
------------
------------
------------
--------------
------------
---23---23
55
Location of Location of
Controls and Controls and
ComponentComponent
ss
------------------------------------
2424
66
Installation Installation
InstructionsInstructions
------------------------------------------------------------------------------
2424
77
OperaOpera
ting Instruting Instru
ctioctio
nsns
----------------------------------------------------------------------------------
2424
88
TT
est Mest M
odeode
--------------------------------------------------------------------------------------------------------------------
2525
8.1.8.1.
Engineering Engineering
ModeMode
----------------------------------------25----------------------------------------25
99
ServiServi
ce ce
ModeMode
----------------------------------------------------------------------------------------------------------
2929
9.1.9.1.
How to Clear How to Clear
User SettUser Sett
ing (Handset ing (Handset
Only)---------29Only)---------29
1010
TroubTroub
leshooting leshooting
GuideGuide
--------------------------------------------------------------------------------
3030
10.1.10.1.
TroubleshootTroubleshoot
ing ing
FlowchartFlowchart
-----------------------------30-----------------------------30
1111
Disassembly aDisassembly a
nd Assembly nd Assembly
InstructionsInstructions
------------------------------
4141
11.11.
1.1.
Disassembly Disassembly
InstructionsInstructions
-------------------------------41-------------------------------41
11.11.
2.2.
How tHow t
o Replaco Replac
e te t
he Handshe Hands
et LCDet LCD
-------------------44-------------------44
1212
MeasurementMeasurement
s and s and
AdjustmentAdjustment
ss
------------------------------------------------------
4545
12.1.12.1.
Equipment Equipment
RequiredRequired
-------------------------------------45-------------------------------------45
12.2.12.2.
The Setting Method of The Setting Method of
JIGJIG
------------
------------
------------
------------
-----45-----45
12.3.12.3.
Adjustment Adjustment
StSt
andard (Base andard (Base
Unit)---------------------49Unit)---------------------49
12.4.12.4.
Adjustment Adjustment
StSt
andard (Charger andard (Charger
Unit)-----------------50Unit)-----------------50
12.5.12.5.
AdjusAdjus
tmentmen
t t
StSt
andard andard
(Hands(Hands
et)et)
------------
--------------
----------
----51----51
12.6.12.6.
ThingThing
s to Do after Replas to Do after Repla
cing IC or X'tacing IC or X'ta
ll
------------
------52------52
12.7.12.7.
Frequency Frequency
TT
ableable
------------------------------------------54------------------------------------------54
1313
MiscMisc
ellanellan
eouseous
--------------------------------------------------------------------------------------------------------
5555
13.1.13.1.
How to How to
Replace tReplace t
he Flat he Flat
Package Package
ICIC
----------------55----------------55
13.2.13.2.
How to How to
Replace Replace
the the
Shield Shield
CaseCase
---------------------57---------------------57
13.3.13.3.
How to Replace How to Replace
the LLP (Leadless the LLP (Leadless
LeadframeLeadframe
Package) IC------------------------------------------------59Package) IC------------------------------------------------59
13.4.13.4.
TT
erminal Guide of the ICs, Terminal Guide of the ICs, T
ransistors andransistors and
DiodesDiodes
-------------------------------------------------------61-------------------------------------------------------61
1414
SchemSchem
atic Diaatic Dia
gramgram
------------------------------------------------------------------------------------------
6262
14.1.14.1.
For For
Schematic Schematic
Diagram---------------------------------Diagram---------------------------------
6262
14.2.14.2.
Schematic Schematic
Diagram Diagram
(Base (Base
Unit_Main)Unit_Main)
--------------64--------------64
14.3.14.3.
Schematic Schematic
Diagram Diagram
(Handset_Main)----------------(Handset_Main)----------------
6666
14.4. 14.4.
ScheSche
matimati
c Diagram (Charc Diagram (Char
ger Unit)ger Unit)
------------
------------
-----68-----68
1515
PrinPrin
ted Circuted Circu
it Boardit Board
--------------------------------------------------------------------------------------
6969
15.1.15.1.
Circuit Circuit
Board Board
(Base (Base
Unit_Main)Unit_Main)
-----------------------69-----------------------69
15.2.15.2.
Circuit Circuit
Board Board
(Handset_Main)-------------------------71(Handset_Main)-------------------------71
15.3.15.3.
Circuit Circuit
Board Board
(Charger (Charger
Unit)Unit)
---------------------------73---------------------------73
1616
Exploded VExploded V
iew and Replaceiew and Replace
ment Parts ment Parts
ListList
----------------------
7474
16.1.16.1.
CabinCabin
et and Electricet and Electric
al Parts (Basal Parts (Bas
e Unit)e Unit)
------------
-----74-----74
16.2.16.2.
Cabinet Cabinet
and and
Electrical Electrical
Parts Parts
(Handset)(Handset)
-------------75-------------75
16.3.16.3.
CabinCabin
et and Electret and Electr
ical Partical Part
s (Charger Units (Charger Unit
))
------------
-76-76
16.4.16.4.
AccessoriesAccessories
------------------------------------------------77------------------------------------------------77
16.5.16.5.
ReplaRepla
cemencemen
t t
PartPart
s s
List-----List-----
--------------
--------------
------------
------------
----
7878

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGTKX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
11
SS
aa
ff
ee
tt
y Py P
rr
ee
cc
aa
uu
tt
ii
oo
nn
ss
11
..
11
..
FF
oo
r Sr S
ee
rr
vv
ii
cc
e Te T
ecec
hh
nn
ii
cc
ii
aa
nn
ss
••
Repair service shall be provided in accordance with repair technology information such as service manual so as toRepair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be prevent fires, injury or electric shock, which can be
caused by improper repair workcaused by improper repair work
..
1.1.
When repair services are provided, neither the products nor their partWhen repair services are provided, neither the products nor their part
s or members shall be remodeled.s or members shall be remodeled.
2.2.
If a lead wire assembly is If a lead wire assembly is
supplied as a repair part, tsupplied as a repair part, t
he lead wire assembly shalhe lead wire assembly shal
l be replaced.l be replaced.
3.3.
FASFAS
TON terminals sTON terminals s
hall be plugged straight in and unplugged sthall be plugged straight in and unplugged st
raight out.raight out.
••
ICs and LSIs are ICs and LSIs are
vulnerable to static electricity.vulnerable to static electricity.
When repairing, the following precautions will help prevent When repairing, the following precautions will help prevent
recurring malfunctions.recurring malfunctions.
1.1.
Cover plastic Cover plastic
parts boxes parts boxes
with aluminum fwith aluminum f
oil.oil.
2.2.
GrounGroun
d the solderind the solderin
g irons.g irons.
3.3.
Use a coUse a co
nductive manductive ma
t on worktt on workt
able.able.
4.4.
Do not grasp IC or Do not grasp IC or
LSI pins with LSI pins with
bare fingers.bare fingers.
22
WW
aa
rr
nn
ii
nn
gg
22
..
11
..
BB
aa
tt
tt
ee
rr
y y
CC
aa
uu
tt
ii
oo
nn
1. Danger of explosion if 1. Danger of explosion if
battery is incorrectly replaced.battery is incorrectly replaced.
2. Replace only with the same 2. Replace only with the same
or equivalent type recommended by the manufacturer.or equivalent type recommended by the manufacturer.
3. Dispose of 3. Dispose of
used batteries according to used batteries according to
the manufacture’s Instructionsthe manufacture’s Instructions
..
2.2.
2.2.
AbAb
ouou
t Lt L
eaea
d Fd F
rere
e Se S
olol
dede
r (r (
PbPb
F: F:
Pb Pb
frfr
eeee
))
Note:Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder thatIn the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repairThis model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same work we suggest using the same
type of solder.type of solder.
CautionCaution
••
PbF solder PbF solder
has a meltinhas a meltin
g point that ig point that i
s 50s 50
°°
F ~ 70F ~ 70
°°
F (30F (30
°°
C ~ 40C ~ 40
°°
C) higher than Pb solder. Please use a soldering iron withC) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700temperature control and adjust it to 700
°°
F ± 20F ± 20
°°
F (370F (370
°°
C ± 10C ± 10
°°
C).C).
••
Exercise cExercise c
are while using hiare while using hi
gher temperature solderigher temperature solderi
ng irons.:ng irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the Do not heat the PCB for too long time in order to prevent solder splash or damage to the
PCB.PCB.
••
PbF solder will tend to splash if it is heated much higher than its melting point, approximatPbF solder will tend to splash if it is heated much higher than its melting point, approximat
ely 1100ely 1100
°°
F (600F (600
°°
C).C).
••
When applying PbF solder to double layered boards, please check thWhen applying PbF solder to double layered boards, please check th
e component side for excess which may floe component side for excess which may flo
w onto thew onto the
opposite side (See the figure below).opposite side (See the figure below).

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
2
.
2
.
1.
S
ug
g
e
s
t
e
d P
b
F S
o
l
d
er
There are several types of
PbF solder available commercially
. While this
product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specif
ic instructions for the melting points of their
products and any precautions for using their product with
other
materials.
The following lead free (PbF)
solder wire sizes are recommended for service of this pr
oduct: 0.3 mm, 0.6 mm and 1.0
mm.
2.
3.
D
is
ca
rd
i
ng
of
P
.
C
.
B
oa
rd
When discarding P
. C. Board,
delete all personal
information such as telephone directory and
caller list or
scrap P
. C. Board.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
3
S
p
e
c
i
f
i
c
a
t
i
o
n
s
Note:
•
Design and specific
ations are subject to c
hange without notice.
Note for Service:
•
Operation range:
Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
•
Analog telephone
connection:
Telephone Line

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4
T
e
ch
ni
ca
l D
es
c
ri
pt
io
ns
4
.
1
.
U
S
-
D
E
C
T D
e
s
c
r
i
p
t
i
o
n
The frequency range of 1.91 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to
Frequency Table
(P.54).
4
.
1
.
1
.
T
D
D
F
r
a
m
e
F
o
r
m
a
t
4
.
1
.
2
.
T
D
M
A
s
y
s
t
e
m
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417
µ
s, the 10 ms of
voice data is transmitted.
•
2 - Handsets Link
Traffic Bearer
A link is
established b
etween base unit an
d handset.
The state where duplex
communicat
ion is performed.
Handset doesn't make up duplex in no
free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the
all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no
free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF
parts, it is better in least interference condition.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.
1.
3.
Si
gn
al
Fl
ow
ch
ar
t i
n th
e R
ad
io P
ar
t
s
Reception
A voice sign
al from TEL li
ne is encoded to
digital data
"TXDA
TA
" by BBIC
(IC501) in a base uni
t.
Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a hands
et RF
, RF signal is
received in one ant
enna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice sign
al from microp
hone is encoded to
digital data
"TXDA
TA
" by BBIC
(IC1) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.
As for a base
unit RF
, RF signal is
received in two
antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal
in the selected antenna,
and demodulates it
to digital data "RXDAT
A".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.
2.
B
lo
ck
Di
ag
ra
m (
Ba
se
U
ni
t_
M
ai
n)
S
W
1
K
X
-
T
G
4
0
1
1
/
4
0
1
2
/
4
0
1
3
B
L
O
C
K
D
I
A
G
R
A
M
(
B
a
s
e
U
n
i
t
_
M
a
i
n
)
D
1
0
1
C
H
A
R
G
E
_
C
O
N
T
A
C
T
+
-
X
5
0
1
1
3
.
8
2
4
M
H
z
A
N
T
2
A
N
T
1
T
E
L
J
A
C
K
L
1
T
L
1
R
D
C
P
D
C
M
D
C
J
A
C
K
R
L
Y
S
I
D
E
T
O
N
E
C
I
R
C
U
I
T
Q
1
6
1
Q
1
4
1
B
E
L
L
D
E
T
E
C
T
H
O
O
K
B
E
L
L
Q
1
1
1
L
I
N
L
O
U
T
R
F
_
P
A
R
T
H
S
M
I
P
H
S
M
I
N
I
C
5
0
1
B
B
I
C
I
N
U
S
E
D
E
T
E
C
T
2
I
N
U
S
E
D
E
T
E
C
T
1
R
E
C
E
I
V
E
A
M
P
D
C
I
N
1
D
C
I
N
2
I
C
3
0
2
V
C
C
P
A
V
B
A
T
_
A
P
U
V
B
A
T
V
C
C
_
F
E
V
C
C
_
I
F
V
C
C
_
V
C
O
P
D
N
D
E
T
3
.
0
V
D
O
U
B
O
U
T
S
C
L
,
S
D
A
W
P
I
C
6
1
1
E
E
P
R
O
M
M
E
M
O
R
Y
R
1
5
1
,
R
1
5
2
R
1
3
1
,
R
1
3
3
Q
1
7
1
V
B
A
T
K
E
Y
1
K
E
Y
C
3
.
0
V
R
E
G
U
L
A
T
O
R
I
C
3
3
1
R
E
S
E
T
I
C
S
T
M
/
C
K
M
R
3
7
1
R
3
7
2
V
C
C
A
V
C
C
A
N
T
2
A
N
T
1
R
X
p
R
X
n
R
X
O
N
T
X
p
T
X
n
T
X
O
N
R
E
S
E
T
R
S
T
N

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.
3.
Bl
oc
k
Di
ag
ra
m
(B
as
e
Un
it
_R
F
Pa
rt
)
KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_RF Part)
DA801
ANT2
ANT1
TXON
RXON
RXp
RXn
ANT2
ANT1
TXp
TXn

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.
4.
C
ir
cu
it
Op
er
at
io
n (
B
as
e U
ni
t)
General Description:
(BBIC, EERROM) is a digital speech/signal processing system that implements all the functions of speech compression and
memory management required in a digital telephone.
The BBIC system is fully controlled by
a host processor. The host processor provides activation and
control of all that
functions
as follows.
4.
4.
1.
BB
IC
(B
as
e B
an
d I
C:
I
C5
01
)
•
DTMF Generator
When the DTMF data from the handset is
received, the DTMF signal is output.
•
Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
•
Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
T
elephone line, etc. They are determined by the
signal path route operation of voice signal.
•
Block Interface Circuit
RF part, Key scan, Telephone line.
4
.
4
.
2
.
E
E
P
R
O
M
(
I
C
6
1
1
)
Following information data is stored.
•
Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.
4.
3.
Po
we
r Su
pp
ly C
ir
cu
it
/R
es
et C
ir
cu
it
The power supply voltage from AC
adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for
peripherals and analog part
is
insulated from VBAT by Doubler of BBIC.
Circuit Operation:

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4
.
4
.
3.
1
.
C
h
a
r
g
e
C
i
r
c
u
i
t
The voltage from the AC adaptor is
supplied to the charge circuits.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.
4.
4.
T
el
ep
ho
ne
Li
ne
In
te
rf
ac
e
Tel
ephone Line
Interface Circuit:
Function
•
Bell si
gnal det
ecti
on
•
ON/OFF hook
and pulse dia
l circuit
•
Side
tone
circ
uit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q141
is open to cut the DC
loop current and decrease the ring load.
When ring voltage appears at the Tip (T)
and Ring (R)
leads (When the telephone rings), the
AC ring voltage is transferred as follows:
T
→
L101
→
R111
→
C111
→
Q111
→
BBIC pin 5 [BELL]
When the CPU
(BBIC) detects a ring signal, Q141 turns on,
thus providing an off-hook condition (active DC current flow
through
the circuit). Following signal flow is the D
C current flow.
T
→
L101
→
D101
→
Q141
→
Q161
→
R163
→
R167
→
D101
→
L102
→
P101
→
R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-
hook condition.
Pulse Dial Circuit:
Pin 6 of
BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.4
.5.
Para
lle
l C
onn
ecti
on
Dete
ct
Cir
cui
t/A
uto
Dis
con
nec
t C
irc
uit
Function:
In order to disable call waiting and
stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or
off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at
pin 17 of
IC501. There is no parallel connection if the
voltage is
0.54 V or higher, while a
parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:
When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage
changes.
If the Auto disconnect function is ON
and statuses are Hold, BBIC disconnects the line
after detecting parallel connection is off
hook.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.
4.
6.
Ca
ll
in
g
Li
ne
Id
en
ti
fi
ca
ti
on
(Ca
ll
er
ID
)
Function:
Caller ID
The caller ID is a chargeable ID which the
user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The
data for the caller ID
from the telephone exchange is sent during
the interval between the
first and second rings of the
bell signal. The data from the telephone exchange is
a modem signal which is modulated in an
FSK
(Frequency Shift Keying) * format. Data
"
1
"
is a 1200 Hz sine wave, and data
"
0
"
is a 2200 Hz sine wave. There are
two types of
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and
data code information in addition to the
time and telephone number data.
*: Also the
telephone exchange service provides other formats.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
Call Waiting Caller ID
Calling Identity Delivery on Call Waiting (CIDCW)
is a CLASS service that allows
a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line
→
P101
→
L101, L102
→
C121, C122
→
R121, R122
→
IC501 (25, 24).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second
and subsequent callers is not
displayed on the
portable handset display
.

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4
.
5
.
B
l
o
c
k D
i
a
g
r
a
m (
H
an
d
s
e
t)
IC1
IC3
MICp
AVD
LD0_CTRL
MICn
LSRp
LSRn
BELL_LED
PAOUTp
PAOUTn
CKM//STM
CKM/STM
BBIC
RESET
CHG_CTL
CHG_DET
W
P
,
C
L
K
,
D
A
T
A
P
3
_
3
~
P
3
_
7
P
1
_
1
~
P
1
_
4
CHARGE
Q4
D7
MIC
Receiver
LED
3V
Monitor SP
LCD
KEYS
IC801
RF PART
ANT1
X1
10.368 MHz
EEPROM
3V
BATTERY
(BELL)
BATTERY
3V
BATTERY
3V
KX-TGA403 BLOCK DIAGRAM (Handset)
KEY_LED
Q7
LED
(KEY)
TXn
Power_adj
TXp
VDD_PADRV
PSEL
PON
TXON
RXON
RF_RXn
RF_RXp
CP_VOUT2
BATTERY
VDDPA
1.8V
VDD2
VDD1
3V
Q2
1.8V
C144
D1

KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
4.
6.
B
lo
ck D
i
ag
ra
m (H
an
ds
et
_R
F P
ar
t)
KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)
DA801
TXON
RXON
ANT
RF_RXn
RF_RXp