Panasonic DMR-ES20P User manual

© 2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and distribu-
tion is a violation of law.
ORDER NO.DSD0508063CE
B24
DVD Video Recorder
DMR-ES20P
DMR-ES20PC
Vol. 1
Colour
(K).......................Black Type (ES20P only)
(S).......................Silver Type

2
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precaution -------------------------------------------------3
1.1. General guidelines-----------------------------------------3
1.2. Caution for fuse replacement ---------------------------3
2Warning--------------------------------------------------------------4
2.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatic Sensitive (ES) Devices---------------4
2.2. Precaution of Laser Diode -------------------------------5
2.3. Handling the Lead-free Solder--------------------------5
3 Service Navigation------------------------------------------------6
3.1. Service Information ----------------------------------------6
3.2. Flow chart for confirmation ------------------------------6
3.3. Confirm “RAM-Drive Last Error” in Service
Mode ----------------------------------------------------------7
4 Specifications ------------------------------------------------------9
5Features------------------------------------------------------------ 10
5.1. Quick start function(REC)------------------------------ 10
6 Location of Controls and Components------------------ 11
7 Operation Instructions ---------------------------------------- 12
7.1. Taking out the Disc from RAM-Drive Unit
when the Disc cannot be ejected by OPEN/
CLOSE button--------------------------------------------- 12
8 Service Mode ----------------------------------------------------- 13
8.1. Self-Diagnosis and Special Mode Setting---------- 13
9 Service Fixture & Tools --------------------------------------- 20
10 Disassembly and Assembly Instructions --------------- 21
10.1. Disassembly Flow Chart-------------------------------- 21
10.2. P.C.B. Positions------------------------------------------- 21
10.3. Top Cover -------------------------------------------------- 22
10.4. Front Panel ------------------------------------------------ 22
10.5. Digital P.C.B. ---------------------------------------------- 22
10.6. DV Javk P.C.B.-------------------------------------------- 23
10.7. DVD-RAM Drive ------------------------------------------ 23
10.8. Rear Panel & Fan Motor ------------------------------- 24
10.9. Main P.C.B. ------------------------------------------------ 25
10.10. Front (L) P.C.B. ------------------------------------------- 25
11 Measurements and Adjustments -------------------------- 26
11.1. Service Positions ----------------------------------------- 26
11.2. After replacing the RAM Drive with new one------ 29
11.3. When the unit does not operate normally after
replacing the Timer Microprocessor or Main
P.C.B.-------------------------------------------------------- 29
11.4. Standard Inspection Specifications after
Making Repairs ------------------------------------------- 29
12 Miscellaneous ---------------------------------------------------- 30
12.1. Abbreviations---------------------------------------------- 30

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1 Safety Precaution
1.1. General guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage current cold check
1. Unplug the AC cord and connect a jumper between the
two prongs on the plug.
2. Measure the resistance value, with an ohmmeter,
between the jumpered AC plug and each exposed metal-
lic cabinet part on the equipment such as screwheads,
connectors, control shafts, etc. When the exposed metal-
lic part has a return path to the chassis, the reading
should be between 1M:and 5.2M:.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
1.1.2. Leakage current hot check
(See Figure 1 .)
1. Plug the AC cord directly into the AC outlet. Do not use
an isolation transformer for this check.
2. Connect a 1.5k:, 10 watts resistor, in parallel with a
0.15PF capacitors, between each exposed metallic part
on the set and a good earth ground such as a water pipe,
as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-
tivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the volt-
age at each point.
5. Reverse the AC plug in the AC outlet and repeat each of
the above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliampere. In case a mea-
surement is outside of the limits specified, there is a pos-
sibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the cus-
tomer.
1.2. Caution for fuse replacement

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2Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand semi-
conductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)"
can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to
damage an ES device).

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2.2. Precaution of Laser Diode
2.3. Handling the Lead-free Solder
2.3.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.
Caution:
• Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70qF (30 - 40qC) higher. Please
use a high temperature soldering iron. In case of the soldering iron with temperature control, please set it to 700 ± 20qF (370 ±
10qC).
• Pb free solder will tend to splash when heated too high (about 1100qF/600qC).
• When soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat the
soldering points with the Pb free solder until it melts enough.

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3 Service Navigation
3.1. Service Information
3.2. Flow chart for confirmation

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3.3. Confirm “RAM-Drive Last Error” in Service Mode
Execute Service Mode
1. Press [REC], [CH UP] and [OPEN/CLOSE] simultaneously for 5 seconds when P-off.
FL Display:
*After finishing display “(9). Factor of Drive Error occurring”, press [0] [2] ~[1] [9] keys of the Remote Controller so that 19
memories can be displayed as maximum.
2. Press [4] [2] keys of remote controller.
Example of FL Display:
(1) Error Number is displayed for 5 seconds.
(2) Time when the error has occurred (1/2) is displayed for 5 seconds.
(3) Time when the error has occurred (2/2) is displayed for 5 seconds.
(4) Last Drive Error code No.1 is displayed for 5 seconds.
(5) Last Drive Error code No2. (1/2) is displayed for 5 seconds.

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(6) Last Drive Error code No2. (2/2) is displayed for 5 seconds.
(7) Error occurring Disc type is displayed for 5 seconds.
(8) Unused (No display).
(9) Factor of Drive Error occurring is left displayed
Error Occurring Disc State

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4 Specifications

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5Features
5.1. Quick start function(REC)
1. General
A few seconds after tuning on the unit,you can start recording to DVD-RAM.
You can switch the operation of this function (ON/OFF) on the menu screen. .
2. Quick start (REC) principle
In the power-off at Quick start, only power supplies for video IC,tuner and storage media are cut off.
When the REC button is pushed a few second after the power button is pushed, Audio and Video data are stored in
DDR SDRAM before a storage media (DVD-RAM) preparation.
*Preparation time oDVD-RAM: About 8seconds
After a storage media (DVD-RAM) preparation,Audio and Video data are transfer from DDR SDRAM to the
storage media.