Panasonic DMR-E85HEB User manual

ORDERNO.DSD0403005C2
DVDVideoRecorder
DMR-E85HEB/ DMR-E85HEG
Colour
(K).......................Black Type
(S).......................SilverType
SPECIFICATIONS
1

2004 Matsushita ElectricIndustrial CO., Ltd. All rights reserved.
Unauthorizedcopying and distribution isaviolation oflaw.
1. Safetyprecautions
1.1. General guidelines
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
2

damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperlyinstalled.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrombeing exposedtoshock hazards.
1.1.1. Leakagecurrentcoldcheck
1. Unplug theACcordand connect ajumperbetweenthetwoprongs
on theplug.
2. Measuretheresistance value, withanohmmeter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Whentheexposedmetallicparthas areturnpathtothechassis,
thereading shouldbebetween1M and 5.2M . / Whenthe
exposedmetal does nothaveareturnpathtothechassis, the
reading must be . Figure1
1.1.2. Leakagecurrenthotcheck / (See Figure 1 .)
1. Plug theACcorddirectlyintotheACoutlet. Donotuse an
isolation transformerforthischeck.
2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F
capacitors, betweeneachexposedmetallicparton theset and a
good earthground suchas awaterpipe, as shownin Figure1.
3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to
measurethepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverse theACplug intheACoutlet and repeat eachoftheabove
measurements.
3

6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A
leakagecurrenttester(Simpson Model 229 orequivalent) maybe
usedtomake thehotchecks, leakagecurrentmust notexceed1/2
milliampere. Incase ameasurementisoutsideofthelimits
specified, thereisapossibilityofashock hazard, and the
equipmentshouldberepairedand recheckedbeforeitisreturned
tothecustomer.
2. Prevention of ElectrostaticDischarge (ESD) to
ElectrostaticSensitive(ES) Devices
Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such
componentscommonlyarecalledElectrostaticSensitive (ES)Devices. Examples oftypical ES
devices areintegratedcircuitsand somefield-effecttransistor-sandsemiconductor "chip"
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectrostaticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischarging ESDwrist strap,
whichshouldberemovedforpotential shock reasonspriorto
applying powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas aluminum
foil, topreventelectrostaticchargebuildup orexposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderremoval device. Somesolder
removal devices notclassifiedas "anti-static(ESDprotected)"can
generate electrical chargesufficienttodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, aluminumfoil or
4

comparableconductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricitysufficienttodamage
anES device).
3. Precaution of LaserDiode
4. Handling the Lead-free Solder
5

4.1. Aboutleadfree solder(PbF)
Distinction ofPbF P.C.B.:
P.C.B.s(manufactured)using leadfree solderwill have aPbF stampon theP.C.B.
Caution:
-Pbfree solderhas ahighermelting pointthanstandardsolder;
Typicallythemelting pointis50 -70°F(30 -40°C)higher. Please
use ahigh temperaturesoldering iron. Incase ofthesoldering iron
withtemperaturecontrol,please set itto700 ±20°F(370 ±10°C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about
1100°F/600°C).
-Whensoldering orunsoldering, please completelyremoveall ofthe
solderon thepinsorsolderarea, and besuretoheat thesoldering
points withthePbfree solderuntil itmelts enough.
5. Each Buttons
6. Taking out the Disc fromRAM-DriveUnit when the
Disc cannot be ejected byOPEN/CLOSE button
6.1. ForcibleDisc Eject
6.1.1. Whenthepowercanbeturnedoff.
1. Turnoff thepowerand press [STOP][CH UP]keyson thefront
panel simultaneouslyfor5seconds.
6.1.2. Whenthepowercannotbeturnedoff.
1. Press [POWER]keyon thefrontpanel forover10 secondstoturn
off thepowerforcibly, and press [STOP][CH UP]keyson thefront
panel simultaneouslyfor5seconds.
6.2. WhentheForcibleDisc Eject cannotbedone.
1. Turnoff thepowerand pull outACcord.
2. RemovetheTop Case.
3. RemovetheFrontPanel.
4. Remove4screwsand UpperBase UnitfromDVD-RAMDrive.
5. Take outthedisc and puttheOpenerRolleron fullyposition for
6

direction ofArrow.
6. PuttheUpperBase Unitsothat theOpenerRollerisinsertedinto
thegroove.
7. Check centerofOpenerRollerisseenthrough theOpener
position Checking Hole, and tighten4screws.
7. Service Explorer
Confirm “RAM-Drive LastError”inService Mode
ExecuteService Mode
1. Press [STOP], [TIMESLIP]and [OPEN/CLOSE]simultaneouslyfor
5secondswhenP-off.
FL Display:
7

*Afterfinishing display“(7). FactorofDriveErroroccurring”,
press [0] [2] ~[9] [9] keysoftheRemote Controllersothat 99
memories canbedisplayedas maximum.
2. Press [4] [2] keysofremote controller.
ExampleofFL Display:
(1)Error Numberisdisplayedfor 5seconds.
(2)Timewhentheerror has occurredisdisplayedfor 5seconds.
(3)LastDrive Error (1/2)isdisplayedfor 5seconds.
(4)LastDrive Error (2/2)isdisplayedfor 5seconds.
(5)Error occurring Disc typeisdisplayedfor 5seconds.
(6)Disc Maker's IDisdisplayedfor 5seconds.
ExampleofDisc Maker's ID:
DVD-R Disc
8

No. FL Display (Disc
Maker's ID) Disc Maker Country
1MEI Panasonic Japan
2PVC Pioneer Japan
3MCC Mitsubishi Chemical
Corporation Japan
4TDK TDK Japan
5MXL Maxell Japan
6MCI MITUICHEMICALS Japan
7 JVC Victor JVC Japan
8TAIYOYUDEN Taiyoyuden Japan
TYG
9GSC GigaStorage Taiwan
10 PRODISC Prodisc Taiwan
11 PRINCO PRINCO Taiwan
12 RITEK RITEK Taiwan
13 OPTDISC OPTDISC Taiwan
14 LEADDATA LEADDATA Taiwan
15 CMC CMC Taiwan
16 AUVISTAR AUVISTAR Taiwan
17 ACER Acer Taiwan
18 VIVASTAR VIVASTAR Switzerland
19 LGE LGElectronics Korea
DVD-RAMDisc
No. FL Display (Disc
Maker's ID) Disc Maker Country
1MEI Panasonic
2MATSUSHITA Panasonic Japan
3MXL Maxell Japan
4PRODISC Prodisc Taiwan
5OPTDISC OPTDISC Taiwan
6CMC CMC Taiwan
*Since andisplay isarbitrarilysetup bythedisk producerside, theabove-mentioneddisplay
may bechanged.
Please make itreference as anexampleofadisplay.
(7)Factor ofDrive Error occurring isleft displayed
Error Occurring Disc Type
9

FL Display Disc Type
00 DVD-ROM/Video
01 Audio-CD
02 2.6GBDVD-RAM
03 4.7GBDVD-RAM
04 DVD-R
Error Occurring Disc State
8. Self-Diagnosisand Special Mode Setting
8.1. Self-DiagnosisFunctions
Self-DiagnosisFunction provides information for errorstoservice personnel by“Self-Diagnosis
Display”whenanyerror has occurred.
U14, H** and F** arestoredinmemoryand held.
Display on FL will becancelledwhenthepoweristurnedoff or ACinputisturnedoff during self-
diagnosisdisplay isON.
10