Panasonic SA-HT330GCT User manual

nAmplifier Section
RMS Output power : Dolby Digital Mode
Front Ch 65 W per channel (6 Ω), 1 kHz,
10% THD
Surround Ch 65 W per channel (6 Ω), 1 kHz,
10% THD
Center Ch 65 W per channel (6 Ω), 1 kHz,
10% THD
Subwoofer Ch 75 W per channel (4 Ω), 100 Hz,
10% THD
Total RMS Dolby Digital mode
power
400 W
PMPO output power 3500 W
DIN Output Power : Dolby Digital Mode
Front Ch 55 W per channel (6 Ω), 1 kHz,
1% THD
Surround Ch 55 W per channel (6 Ω), 1 kHz,
1% THD
Center Ch 55 W per channel (6 Ω), 1 kHz,
1% THD
Subwoofer Ch 65 W per channel (4 Ω), 100 Hz,
1% THD
Total DIN Dolby Digital mode
power
340 W
nFM/AM Tuner, Terminals Section
Preset station FM 15 stations
AM/MW 15 stations
©2005 Matsushita Electric Industrial Co. Ltd.. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
SA-HT330GCT
SA-HT330GCP
Colour
(S)... Silver Type
Frequency Modulation (FM)
Frequency range 87.50 - 108.00 MHz (50-kHz step)
Sensitivity 2.5 µV (IHF)
S/N 26 dB 2.2 µV
A
ntenna terminals 75 Ω(unbalance)
A
mplitude Modulation (AM/MW)
Frequency range 522 - 1629 kHz (9 - kHz step)
520 - 1630 kHz (10 - kHz step)
A
M Sensitivity S/N 20 dB at 999
kHz
560 µV/m
Phone jack
Terminal Stereo, 3.5 mm jack
Mic jack
Sensitivity 0.7mV, 1.2k Ω
Terminal Mono, 6.3mm (1 system)
nDisc Section
Discs played ( 8 cm or 12 cm)
(1) DVD-RAM (DVD-VR compatible, JPEG formatted discs)
(2) DVD-Audio
(3) DVD-Video
(4) DVD-R, DVD-RW (DVD-Video compatible)
+R, +RW (video compatible)
(5) CD-Audio (CD-DA)
(6) Video CD
(7) SVCD (Conforming to IEC62107)
DVD Home Theater Sound System
Specification
ORDER NO. MD0507281C3
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(8) CD-R/RW (CD-DA, Video-CD, SVCD, MP3, WMA, JPEG
formatted disc)
(9) MP3/WMA
*1
lCompatible compression rate:
MP3 : between 32 kbps and 320 kbps
WMA : between 48 kbps and 320 kbps
(10) JPEG
*1
lExif Ver 2.1 JPEG Baseline files
lPicture resolution : between 320 x 240 and 6144 x 4096 pixels (sub
sampling is 4:2:2 or 4:2:0)
(11) HighMAT Level 2 (Audio and Image)
*
1
The total combined maximum number of recognizable audio and
picture contents and groups: 4000 audio and picture contents and
400 groups.
Pick up
Wavelength CD 785 nm
DVD 662 nm
Laser power CLASS 2 / CLASS 3A
A
udio output (Disc)
Number of channels 5.1ch (FL, FR, C, SL, SR, SW)
nVideo Section
Video system
Signal system (For GCT) PAL625/50, PAL525/60, NTSC
Signal system (For GCP) NTSC
Composite video output
Output level 1Vp-p(75Ω)
Terminal Pin jack (1 system)
S-video output
Y output level 1Vp-p(75Ω)
C output level (For GCT) PAL; 0.3 Vp-p (75 Ω)
NTSC; 0.286 Vp-p (75 Ω)
C output level (For GCP) NTSC; 0.286 Vp-p (75 Ω)
1 Safety Precautions 4
1.1. GENERAL GUIDELINES 4
2 Before Repair and Adjustment 5
3 Protection Circuitry 5
4 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
5 Handling the Lead-free Solder 6
5.1. About lead free solder (PbF) 6
6 Precaution of Laser Diode 7
7 Handling Precautions for Optical Pickup Unit 8
7.1. Cautions to be taken in handling the Optical Pickup Unit
8
7.2. Cautions to be taken when replacing the Optical Pickup
Unit 8
Terminal S terminal (1 system)
Component video output (For GCT)
[NTSC: 525 (480) p/525 (480) i, PAL: 625 (576) p/625 (576) i]
Component video output (For GCP)
(480p/480i)
Y output level 1Vp-p(75Ω)
PBoutput level 0.7 Vp-p (75 Ω)
PRoutput level 0.7 Vp-p (75 Ω)
Terminal Pin jack (Y: green, PB:blue,
PR:red)(1system)
nGeneral
Power supply AC 110 - 240 V, 50/60 Hz
Power consumption Main unit 80 W
Dimensions (W x H x D) 430 mm x 60 mm x 337 mm
Mass Main unit 3.3 kg
Operating temperature range +5 °C to +35 °C
Operating humidity range 5%to90%RH(no
condensation)
Power consumption in standby
mode
approx 0.5 W
SB-HT335EG consists of SB-FS335EG (x4) & SB-PC335EG (x1)
Notes :
1. Specifications are subject to change without notices.
Mass and dimensions are approximate.
2. Total harmonic distortion is measured by the digital spectrum
analyzer.
7.3. Grounding for electrostatic breakdown prevention 8
8 Accessories 10
9 Operation Procedures 11
10 Disc information 12
11 About HighMAT 14
11.1. What's HighMAT? 14
11.2. Why take advantage of HighMAT? 14
11.3. Benefits of HighMAT? 15
12 Assembling and Disassembling 18
12.1. Disassembly flow chart 18
12.2. P.C.B. Locations 19
12.3. Disassembly of Top Cabinet 20
12.4. Disassembly of SMPS Module P.C.B. 20
CONTENTS
Page Page
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12.5. Disassembly of Rear Panel 20
12.6. Disassembly of AC Inlet P.C.B. 21
12.7. Disassembly of Digital Amplifier P.C.B. 21
12.8. Disassembly of DVD Lid (when taking out disc manually)
22
12.9. Disassembly of Front Panel 22
12.10. Disassembly of Headphone, Panel and Tact Switch P.C.B.
23
12.11. Disassembly of DVD Mechanism unit 24
12.12. Disassembly of Main P.C.B. 24
12.13. Disassembly and Assembly Mechanism Unit 25
13 Service Positions 33
13.1. Checking procedure 33
14 Optical Pick-up Self-Diagnosis and Replacement Procedure
35
14.1. Optical Pickup Breakdown Diagnosis 35
14.2. Service Mode Table 1 36
14.3. DVD Self Diagnostic Function-Error Code 36
14.4. Service mode table 2 38
14.5. Sales demonstration lock function 41
14.6. Handling after completing repairs 41
15 Self-Diagnosis Function 42
15.1. Automatic Displayed Error Codes 42
15.2. Memorized Error Codes 42
16 Service Precautions 43
16.1. Recovery after the DVD player is repaired 43
16.2. Firmware version-up of the DVD player 43
17 Adjustment Procedure 44
17.1. Service Tools and Equipment 44
17.2. Important points in adjustment 44
17.3. Storing and handling Test Discs 44
17.4. Optical adjustment 45
18 Abbreviations 47
19 Voltage Measurement and Waveform Chart 49
19.1. Voltage Measurement 49
19.2. Waveform Chart 54
20 Block Diagram 55
20.1. DVD MODULE BLOCK 55
20.2. MAIN BLOCK 58
21 Notes of Schematic Diagram 64
22 Schematic Diagram 65
22.1. OPTICAL PICKUP UNIT CIRCUIT 65
22.2. DVD MODULE CIRCUIT 66
22.3. MAIN CIRCUIT 73
22.4. PANEL CIRCUIT 81
22.5. SMPS MODULE CIRCUIT and AC INLET CIRCUIT 82
22.6. DIGITAL AMPLIFIER CIRCUIT 84
22.7. HEADPHONE CIRCUIT, TACT SWITCH CIRCUIT and CD
TRAY LOADING CIRCUIT 87
23 Printed Circuit Board 88
23.1. DVD MODULE P.C.B 88
23.2. MAIN P.C.B 90
23.3. PANEL P.C.B, HEADPHONE P.C.B and TACT SWITCH
P.C.B 92
23.4. DIGITAL AMPLIFIER P.C.B 93
23.5. CD TRAY LOADING P.C.B and AC INLET P.C.B 94
24 Wiring Connection Diagram 95
25 Illustration of IC's, Transistors and Diodes 97
26 Terminal Function of IC's 98
26.1. IC2018 (C2CBHG000197): MICROPROCESSOR IC 98
27 Parts Location and Replacement Parts List 99
27.1. DVD Loading Mechanisms 100
27.2. Cabinet Part List 102
27.3. Electrical Part List 105
27.4. Packaging Materials & Accessories Parts List 115
27.5. Packaging 115
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1 Safety Precautions
1.1. GENERAL GUIDELINES
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, ensure that all the protective devices such as insulation barriers, insulation papers shields are properly installed.
3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards.
1.1.1. LEAKAGE CURRENT COLD CHECK
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MΩand 5.2Ω.
When the exposed metal does not have a return path to the chassis, the reading must be .
Fig. 1
1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. Should the measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and re-checked before it is returned
to the customer.
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2 Before Repair and Adjustment
Disconnect AC power, discharge Power Supply Capacitors C506, C507 & C508 through a 10Ω, 1W resistor to ground.
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
· Current consumption at AC 110 V - 240 V, 50/60 Hz in NO SIGNAL mode (at volume min) should be approximately ~650 mA.
3 Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
· No sound is heard when the power is turned on.
· Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
"shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
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4 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium
foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
5 Handling the Lead-free Solder
5.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.
Caution:
· Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70°F (30 - 40°C) higher. Please
use a high temperature soldering iron. In case of soldering iron with temperature control, please set it to 700 ± 20°F (370 ±
10°C).
· Pb free solder will tend to splash when heated too high (about 1100°F/600°C).
· When soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat the
soldering points with the Pb free solder until it melts enough.
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This unit utilizes a class 1 laser.
Invisible laser radiation is emitted from the optical pickup lens.
When the unit is turned on:
6 Precaution of Laser Diode
CAUTION:
1. Do not look directly into the pick up lens.
2. Do not use optical instruments to look at the pick up lens.
3. Do not adjust the preset variable resistor on the pickup lens.
4. Do not disassemble the optical pick up unit.
5. If the optical pick up is replaced, use the manufacturer’s specified replacement pick up only.
6. Use of control or adjustments or performance of procedures other than those specified herein may result in hazardous radiation
exposure.
CAUTION!
THIS PRODUCT UTILIZES A LASER.
USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT
IN HAZARDOUS RADIATION EXPOSURE.
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7 Handling Precautions for Optical Pickup Unit
The laser diode in the optical pickup unit may break down due to static electricity of clothes or human body. Special care must be
taken avoid to electrostatic breakdown when servicing and handling the laser diode.
7.1. Cautions to be taken in handling the Optical Pickup Unit
The laser diode in the optical pickup unit may be damaged due to electrostatic discharge generating from clothes or human body.
Special care must be taken avoid to electrostatic discharge damage when servicing the laser diode.
1. Do not give a considerable shock to the optical pickup unit as it has an extremely high-precise structure.
2. To prevent the laser diode from the electrostatic discharge damage, the flexible cable of the optical pickup unit removed should
be short-circuited with a short pin or a clip.
3. The flexible cable may be cut off if an excessive force is applied to it. Use with caution when handling the flexible cable.
4. The antistatic FPC is connected to the new optical pickup unit. After replacing the optical pickup unit and connecting the flexible
cable, cut off the antistatic FPC.
7.2. Cautions to be taken when replacing the Optical Pickup Unit
The flexible cable of the optical pickup unit which was supplied as a component is equipped with a short clip to prevent the laser
diode from being damaged due to electrostatic discharge. Remove the short clip before connecting the flexible cable and make
sure that the short land is open. (If the flexible cable is short-circuited, remove the solder.)
7.3. Grounding for electrostatic breakdown prevention
Some devices such as the DVD player use the optical pickup (laser diode) and the optical pickup will be damaged by static
electricity in the working environment. Proceed servicing works under the working environment where grounding works is
completed.
7.3.1. Worktable grounding
1. Put a conductive material (sheet) or iron sheet on the area where the optical pickup is placed, and ground the sheet.
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7.3.2. Human body grounding
1. Use the anti-static wrist strap to discharge the static electricity from your body.
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8 Accessories
Note : Refer to Packing Materials & Accessories Parts List (Section 27.4) for the part number.
Remote Control
AC cord
FM indoor antenna
AM loop antenna
Video cable
AC Plug
Adaptor
Speaker
Label
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9 Operation Procedures
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10 Disc information
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11 About HighMAT
11.1. What's HighMAT?
Consumers worldwide are using PCs to create their own collections of music, photos and even video by burning them onto CDs.
But how these collections can be experienced across different devices can be confusing to navigate, time consuming to access for
a DVD player, and be incomplete in terms of music information available to the customer.
HighMAT offers a solution to this growing consumer problem. HighMAT dramatically improves the digital media experience on
consumer electronic devices by delivering a simple, standardized approach that allows consumers who have created personal
collections of digital music, photography and video on their PC to:
· Create a HighMAT CD or DVD which can be easily played back on consumer electronics devices such as CD and DVD players,
and car stereos.
· Move digital media files (using recordable media such as CD-R and CD-RW) between the PC and various playback devices
such as CD and DVD players.
A new standard for creating personal media on consumer electronic devices, HighMAT enable easier and more seamless
interoperability between Windows PCs and devices designed for your living room, or the car.
11.2. Why take advantage of HighMAT?
A Problem Defined:Today, when consumers create their own digital audio, video or photo collections on CD-R or other physical
formats, there are numerous, inconsistent ways that devices read the data. For the consumer, the playback experience can be
confusing:
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A Solution Created: HighMAT delivers a better digital media access experience by creating a standard approach for PCs to
structure digital media on various physical formats and for playback devices to read the data.
11.3. Benefits of HighMAT?
Conventional HighMAT
Even though DVD player is CD-R/RW compatible, the inconsistent ways
that various DVD players can read the music or photos files often leads
to a confusing and inconsistent playback experince.
HighMAT compatible products play content back with consistent
interface. This includes products which are JPEG compatible products
without HighMAT support.
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HighMAT is now available for CD Burning and in Leading DVD Players. HighMAT is a new technology that is now available in
leading software and consumer electronic devices to dramatically improve the digital media experience when you create
homemade CDs. HighMAT delivers a simple, standardized way for PC software and consumer electronics devices to talk to each
other and work better together.
When you create your homemade CDs with software that supports HighMAT CD burning, and then play them back on a DVD
player that supports HighMAT, you get better, easier navigation. You get folders you can access with a single click of your DVD
player´s remote control. You can view important information about your music like full song names, artist titles, album names and
genre. And you can get faster startup on your home entertainment device.
To enjoy the benefits of HighMAT, all you need is software that supports HighMAT for CD burning of music or photos, as well as
a home entertainment device like a DVD player that supports HighMAT for playback. Always look for the HighMAT logo on your
software or home entertainment device to ensure it supports the HighMAT experience.
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12 Assembling and Disassembling
“ATTENTION SERVICER”
Some chassis components may be have sharp edges. Be careful when disassembling and servicing.
1. This section describes procedures for checking the operation of the major printed circuit boards and replacing the main
components.
2. For reassembly after operation checks or replacement, reverse the respective procedures.
Special reassembly procedures are described only when required.
3. Select items from the following index when checks or replacement are required.
· Disassembly of Top Cabinet
· Disassembly of SMPS Module P.C.B.
· Disassembly of Rear Panel
· Disassembly of AC Inlet P.C.B.
· Disassembly of Digital Amplifier P.C.B.
· Disassembly of DVD Lid (when taking out disc manually)
· Disassembly of Front Panel
· Disassembly of Headphone, Panel and Tact Switch P.C.B.
· Disassembly of DVD Mechanism unit
· Disassembly of Main P.C.B.
Warning:
This product uses a laser diode. Refer to “Precaution of Laser Diode”.
12.1. Disassembly flow chart
The following chart is the procedure for disassembling the casing and inside parts for internal inspection when carrying out the
servicing.
To assemble the unit, reverse the steps shown in the chart below.
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12.2. P.C.B. Locations
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12.3. Disassembly of Top Cabinet
Step 1 : Remove 4 screws.
Step 2 : Remove 3 screws.
Step 3 : Remove Top Cabinet as arrows shown.
12.4. Disassembly of SMPS Module
P.C.B.
· Follow the (Step 1) - (Step 3) of item 12.3.
Step 1 : Remove 4 screws.
Step 2 : Detach connector (CN1, CN2, CN3), and remove
SMPS Module P.C.B.
Note : SMPS Module should be replaced as an assembly unit
in case it is faulty.
12.5. Disassembly of Rear Panel
· Follow the (Step 1) - (Step 3) of item 12.3.
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