Panasonic TX-32LE60F User manual

Service Manual
Colour LCD Television
TX-32LE60F
TX-32LE60P
TX-26LE60F
TX-26LE60P
GLP21 Chassis
Specifications
(Informations in brackets [ ] refers to models 26´´)
Power Source: 220-240V AC, 50Hz
Power Consumption: 117W [104W]
Stand-by Power
Consumption: 1W [1W]
Aerial Impedance: 75Ωunbalanced, Coaxial Type
Receiving System: PAL-B/G, D/K,
SECAM B/G, D/K, L/L’
PAL-525/60 (AV only)
M.NTSC (AV only)
NTSC (AV only)
Receiving Channels:
VHF E2-E12 VHF H1-H2 (ITALY)
VHF A-H (ITALY) VHF R1-R2
VHF R3-R5 VHF R6-R12
UHF E21-E69 CATV (S01-S05)
CATV S1-S10 (M1-M10) CATV S11-S20 (U1-U10)
CATV S21-S41 (Hyperband)
Operating Conditions:
Temperature: 5°C ÷35°C
Humidity: 5% ÷90% RH (non-condensing)
Intermediate Frequency:
Video/Audio
Video 38,9MHz, 33,9MHz
Audio 33,4MHz (B/G), 33,16MHz (A2)
33,05MHz (NICAM B/G, D/K, L)
32,4MHz (D/K), 32,66MHz (CZ STEREO)
40,4MHz (L’), 39,75Mhz (L’NICAM),
Colour 34,47MHz (PAL)
34,5MHz, 34,65MHz (SECAM)
38,3MHz, 38,15MHz (SECAM L’)
Terminals:
AV1 IN Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 10kΩ
RGB (21 pin) 0,7V p-p 75Ω
AV1 OUT Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 1kΩ
AV2 IN Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 10kΩ
RGB (21 pin) 0,7V p-p 75Ω
S-video IN Y: 1V p-p 75Ω
(21-pin) C:0,3V p-p 75Ω
AV2 OUT Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 1kΩ
AV3 IN S-Video IN Y: 1V p-p 75Ω
(4-pin) C:0,3V p-p 75Ω
Audio (RCAx2) 500mV rms 10kΩ
Video (RCAx1) 1V p-p 75Ω
HDMI1 Type A Connector
COMPONENT YUV Video (RCAx3) Y:1V p-p 75Ω
Pb, Pr: 0,7V p-p 75Ω
AUDIO IN Audio (RCAx2) 500mV rms 10kΩ
LCD screen: L5EDD8Q00023 [L5EDD6Q00017]
1366 x 768 XGA, 16:9
Visible Diagonal 800mm [660mm]
Audio Output: 2x10W RMS
8Ωimpedance
Headphones: 3,5mm, 8ΩImpedance
Accessories
supplied : Remote Control
2 x R6 (UM3) Batteries
Dimensions:
Height: Width: Depth:
Including TV stand 615mm 791mm 301mm
[525mm] [657mm] [301mm]
TV set only 563mm 791mm 107mm
[473mm] [657mm] [107mm]
Net weight: 17,5kg [14,kg]
Specifications are subject to change without notice.
Weights and dimensions shown are approximate.
ORDER No. PCZ0608063CE

CONTENTS
SAFETY PRECAUTIONS ........................................... 3
GENERAL GUIDE LINES...................................... 3
TOUCH – CURRENT CHECK............................... 3
PREVENTION OF ELECTROSTATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES .................................................................... 4
ABOUT LEAD FREE SOLDER (PBF)......................... 5
SUGGESTED PB FREE SOLDER ........................ 5
SERVICE HINTS ........................................................ 6
CHASSIS BOARD LAYOUT ....................................... 7
SETTING INSPECTION.............................................. 7
SELF-CHECK ............................................................. 8
ADJUSTMENT METHOD ........................................... 9
BLOCK DIAGRAMS.................................................. 10
PARTS LOCATION................................................... 13
REPLACEMENT PARTS LIST.................................. 14
SCHEMATIC DIAGRAMS ......................................... 25
A-BOARD (1 OF 5) SCHEMATIC DIAGRAM ...... 26
A-BOARD (2 OF 5) SCHEMATIC DIAGRAM ...... 27
A-BOARD (3 OF 5) SCHEMATIC DIAGRAM ...... 28
A-BOARD (4 OF 5) SCHEMATIC DIAGRAM ...... 29
A-BOARD (5 OF 5) SCHEMATIC DIAGRAM ...... 30
P-BOARD SCHEMATIC DIAGRAM .................... 31
B-BOARD SCHEMATIC DIAGRAM .................... 32
H-BOARD SCHEMATIC DIAGRAM .................... 32
V-BOARD SCHEMATIC DIAGRAM .................... 33
K-BOARD SCHEMATIC DIAGRAM .................... 33
CONDUCTOR VIEWS .............................................. 34
2

Safety Precautions
General Guide Lines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated
or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following touch current checks to prevent the customer from being exposed to shock hazards.
4. Always ensure panel TKKL5290 is correctly replaced before returning to customer (see Fig.1).
Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth
ground such as a water pipe, as shown in Fig. 2.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
Note:
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and
2.0 mA d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100
kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should
be repaired and rechecked before it is returned to the customer.
Fig. 2
Fig. 1
3
TO
A
PPLIANCES
EXPOSED
METAL PARTS
Resistance values in ohms (Ω)
V
R0=500
Ω
RS=1500
Ω
CS=0.22
µ
F
10k
Ω
0.022
µ
F
U1
COLD
WATER PIPE
(EARTH GROUND)
V: Voltmetr or oscilloscope
(r.m.s. or peak reading)
Measuring network for TOUCH CURRENTS
Input resistance: ≥ 1M
Ω
Input capacitance: ≤ 200pF
Frequency range: 15Hz to 1MHz and d.c.respectively
NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms
U2(V)

Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect
transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of
component damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on
your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD
wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD
protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity
(ESD) sufficient to damage an ES device).
There are special components used in this equipment which are important for safety.
These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do
not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
4

About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,
we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
stamped on the back of PCB.
Caution
•Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C)
higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
•Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before
applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
•After applying PbF solder to double layered boards, please check the component side for excess solder which may
flow onto the opposite side. (see Fig.3)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used. (see Fig.4)
Fig.3
Fig.4
5