Panasonic TX-32LXD500 User manual

ORDERNO. PCZ0505058C2
WideLCD TV
TX-32LXD500 / TX-26LXD500 / TX-32LX500F / TX-32LX500P/
TX-26LX500F / TX-26LX500P
LH41 Chassis
SPECIFICATIONS
Specifications
PowerSource AC220 -240 V, 50 / 60 Hz
PowerConsumption Averageuse :138 W (0.8A)(TX-26LXD500)
Averageuse :172 W (1.0A)(TX-32LXD500)
Standbycondition :
0.4W (WithoutDVBTimerprogrammes)
18 W (With DVBTimerprogrammes)
Averageuse :131 W (TX-26LX500F/P)
Averageuse :165 W (TX-32LX500F/P)
Standbycondition :0.4W
LCD WideXGA(1,366 ×768 pixels)
16 :9aspectratio LCDpanel
Visiblescreen Size 66.1cmV, 564.8mm (W)×317.6mm (H)(TX-26LXD500, TX-26LX500F/P)
80.0cmV, 697.3mm (W)×392.0mm (H)(TX-32LXD500,TX-32LX500F/P)
Sound
Speaker Woofer 80 mm ×2pcs, Tweeter16 mm ×73 mm ×4 pcs
Audio Output 20 W (5W +5W, 5W +5W )
Headphones M3(3.5mm)Jack ×1
Scanning format 480i(60Hz), 480p(60Hz), 576i(50Hz), 576p(50Hz), 720p(50Hz), 720p(60Hz), 1080i(50Hz),
1080i(60Hz)
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PCsignals XGAdisplay
VGA, SVGA, XGA
SXGA...... (compressed)
Horizontal scanning frequency31 -69 kHz
Vertical scanning frequency59 -86 Hz
Receiving Systems / PAL I (TX-26LXD500/32LXD500) UHF E21-68.
Band name DVB(TX-26LXD500/32LXD500) Digital terrestrial services viaUHF aerial input.
PAL B, G, H, SECAMB, GSECAML / L’ (TX-26LX500F/P, TX-32LX500F/P)
VHF E2-E12 VHF H1-H2(ITALY)
VHF A-H(ITALY) UHF E21 -E69
CATV(S01 -S05) CATVS1-S10 (M1-M10)
CATVS11 -S20 (U1-U10) CATVS21 -S41 (Hyperband)
PAL D, K, SECAMD, K(TX-26LX500F/P, TX-32LX500F/P)
VHF R1-R2 VHF R3-R5
VHF R6-R12 UHF E21 -E69
PAL 525/60 Playback ofNTSCtapefromsome PAL Video
recorders(VCR)
M.NTSC Playback fromM. NTSCVideo recorders(VCR)
NTSC(AVinputonly) Playback fromNTSCVideo recorders(VCR)
Aerial -Rear UHF (TX-26/32LXD500)UHF/VHF (TX-26/32LX500F/P)
Operating Conditions Temperature:5°C-35 °C
Humidity:5%-90 %RH(non-condensing)
Connection Terminals
AV1(Scartconnecter) 21 Pin terminal (Audio/Video in, Audio/Video out, RGBin)
AV2(Scartconnecter) 21 Pin terminal (Audio/Video in, Audio/Video out, S-Video in, Q-Link)
AV3
VIDEO RCAPINType×1
S-VIDEO Mini DIN4-pin
AUDIOL -R RCAPINType×2
AV4(Scartconnecter) 21 Pin terminal (Audio/Video in, Audio/Video out, RGBin, S-Video in, Q-Link)
COMPONENT Y, PB, PR
HDMI
PC
TYPEAConnecter
HIGH-DENSITYD_SUB 15PIN
AUDIOL -R RCAPINType×2
Card slot SDCARDslot×1, PCCARDslot×1
Output
AUDIOL -R RCAPINType×2
Dimensions(W ×H×D)
Including TVStand 724 mm ×549 mm ×300 mm (TX-26LXD500, TX-26LX500F/P)
857 mm ×624 mm ×300 mm (TX-32LXD500, TX-32LX500F/P)
TVSetOnly 724 mm ×487 mm ×141 mm (TX-26LXD500, TX-26LX500F/P)
857 mm ×563 mm ×141 mm (TX-32LXD500, TX-32LX500F/P)
Mass (Weight) 21 kg Net(TX-26LXD500, TX-26LX500F/P)
24.5kg Net(TX-32LXD500, TX-32LX500F/P)
Note:
Design and Specificationsaresubjectto changewithoutnotice. Weightand Dimensionsshown areapproximate.
2005 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorizedcopying and distribution isaviolation oflaw.
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1. SafetyPrecautions
1.1. General Guidelines
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperlyinstalled.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrombeing exposedtoshock hazards.
1.2. Touch-CurrentCheck
1. Plug theACcorddirectlyintotheACoutlet. Donotuse an
isolation transformerforthischeck.
2. Connect ameasuring networkfortouchcurrents betweeneach
exposedmetallicparton theset and agood earthground suchas
awaterpipe, as shownin Figure 1.
3. Use LeakageCurrentTester(Simpson 228 orequivalent) to
measurethepotential across themeasuring network.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. ReservetheACplug intheACoutlet and repeat eachoftheabove
measure.
6. Thepotential at anypoint(TOUGHCURRENT)expressedas
voltageU1and U2, does notexceedthefollowing values:
Fora. c.:U1=35 V(peak) and U2=0.35 V(peak);
Ford. c.:U1=1.0V,
Note:
ThelimitvalueofU2=0.35 V (peak)for a. c. and U1=1.0V for d. c. correspond tothevalues 0.7
mA(peak)a. c. and 2.0mAd. c.
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ThelimitvalueU1=35 V (peak)for a. c. correspond tothevalue70 mA(peak)a. c. for
frequencies greaterthan100 kHz.
7. Incase ameasurementisoutofthelimits specified, thereisa
possibilityofashock hazard, and theequipmentshouldbe
repairedand recheckedbeforeitisreturnedtothecustomer.
Figure1
2. Prevention of ElectroStaticDischarge (ESD) to
ElectrostaticallySensitive(ES) Devices
Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such
componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical
ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectro staticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischarging ESDwrist strap, which
shouldberemovedforpotential shock reasonspriortoapplying
powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas alminumfoil,
topreventelectrostaticchargebuildup orexposureofthe
assembly.
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3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderremoval device. Somesolder
removal devices notclassifiedas "anti-static(ESDprotected)"can
generate electrical chargesufficienttodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, alminumfoil orcomparable
conductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricity(ESD)sufficientto
damageanES device).
3. Applicablesignals
Applicableinputsignal for Component(Y, PB, PR), HDMIand PC(D-sub 15P)(*Mark)
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Note:
-Signalsotherthanabovemaynotbedisplayedproperly.
-Applicableinputsignal forPCisbasicallycompatibletoVESA
standardtiming.
-PCsignal ismagnifiedorcompressedfordisplay, sothat itmaynot
bepossibletoshow finedetail withsufficientclarity.
4. Self Check Function
4.1. SelfCheck
1. Self-Check isusedtoautomaticallycheck thebuslines and
hexadecimal codeoftheTVset.
2. To get intotheSelf-Check modepress theDown( )button on
thecustomercontrolsat thefrontoftheset, at thesametime
pressing theStatus/Information ( )button on theremote
control, and thescreenwill show :
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3. Turnoff theTVtoreset JPEG ViewercircuitafterSELF-CHECK.
IftheCCU portshave beencheckedand found tobeincorrector notlocatedthen“--”will appear
inplace of“O.K.”.
Display Ref. No. Description P.C.B.
MEM IC1107 Memory DG-Board
GC4P IC4054 Global CoreProcessor DG-Board
GC4L IC4057 Global Core DG-Board
GC3FS IC4013 Global Corefor Sub DG-Board
HAD IC4012 OSDRGBA/D
Converter
DG-Board
AVSW1 IC3005 AV SwitchVIDEO H-Board
AVSW2 IC2105 AV SwitchAUDIO H-Board
Tun1 TU3201 Tuner H-Board
DAC1 IC1106 DACcontrol 1 DG-Board
DAC2 IC1116 DACcontrol 2 DG-Board
DAC3 IC3006 DACcontrol 3 H-Board
MSP IC2106 StereoDecoder H-Board
SDM SD-Module MPEG4/PHOTOview,
SDrecording
SD-Module
HDMI IC5003 HDMII/FReceiver DV-Board
IPC IC8013 HDSLPEAKS Lite XV-Board
ADV IC4005 A/DConverter DG-Board
4.2. PowerLEDBlinking timing chart
1. Subject
Information ofLEDFlashing timing chart.
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2. Contents
Whenanabonormalityhas occurredtheunit, theprotection circuit
operates and reset tothestand bymode. Atthistime, thedefective
block canbeidentifiedbythenumberofblinking ofthePowerLED
on thefrontpanel oftheunit.
5. ChassisBoardLayout
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Board Name Function
AP-Board Regulator
DG-Board Global Core, A/DConverter, MCU
H-Board AV connector, TV Tuner, AV Switch
K-Board PowerSwitch
G-Board FrontAV &HP connector, Key Switch
P-Board DC PowerSupply
V-Board RemoteReceiver, LED
XV-Board DVBTuner(TX-26LXD500/TX-32LXD500)
DV-Board HDMIinterface
GP-Board PCCard slot, PCCard interface
GS-Board SDCard slot, SDCard Interface
SDModule MPEG/JPEGinterface
6. Beforeservicing
6.1. Kind and location oftheflexiblecableand bridgecable
RefNo. Connectertype Pins Location OppositeRefNo.
G1 - 10pin G-Board V1
G4 - 30pin G-Board H4
G5 - 20pin G-Board H5
G10 - 4pin G-Board speakerboxL
G11 - 5pin G-Board speakerboxR
GP6 - 3pin GP-Board H6
GP10 Flexibletype 50pin GP-Board SDModule
GS3 Flexibletype 40pin GS-Board SDModule
GS8 - 7pin GS-Board H8
GS9 - 15pin GS-Board H9
AP1 BridgeType 23pin AP-Board H1
AP2 - 7pin AP-Board P2(CN101)
AP3 BridgeType 11pin AP-Board P3(CN201)
AP4 BridgeType 22pin AP-Board DG4
AP5 BridgeType 22pin AP-Board DG5
AP6 - 3pin AP-Board K6
AP10 - 2pin AP-Board ACcord
DG2 Flexibletype 40pin DG-Board H2
DG3 Flexibletype 40pin DG-Board H3
DG4 Bridgetype 23pin DG-Board AP4
DG5 Bridgetype 23pin DG-Board AP5
DG6 - 8pin DG-Board CN3(Inverter)
DG7 - 32pin DG-Board LCD Panel
DG8 - 7pin DG-Board LCD Panel
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RefNo. Connectertype Pins Location OppositeRefNo.
DG10 - 60pin DG-Board DV15
DV15 - 60pin DV-Board DG10
H1 Bridgetype 23pin H-Board AP1
H2 Flexibletype 40pin H-Board DG2
H3 Flexibletype 40pin H-Board DG3
H4 - 30pin H-Board G4
H5 - 20pin H-Board G5
H6 - 3pin H-Board GP6
H8 - 7pin H-Board GS8
H9 - 15pin H-Board GS9
K6 - 3pin K-Board AP6
P1
(CN203)
- 8pin P-Board CN5(Inverter)
P2
(CN101)
- 7pin P-Board AP2
P3
(CN201)
BridgeType 11pin P-Board AP3
P4
(CN202)
- 8pin P-Board CN4(Inverter)
V1 - 10pin V-Board G1
6.2. How toremovetheconnector
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Bridgecableconnector
Flexiblecableconnector
6.3. Wiredressing 1
1. Make thewiredressing as illustratedbelow.
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6.4. Wiredressing 2
<Clamping>
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Notes :
1. Connect everyconnectorsurely.
2. Managewires nottotouchanysharpedgeofthemetal parts.
3. Managewires nottohavetoo muchtension.
7. Servicing method
7.1. Removing thestand ass’y
1. Laydownthemainunitsothat therearcoverfaces upward.
2. Removethecablecover.
3. Removethefixing screws(4pcs).
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4. Removethestand ass’y.
7.2. Removing therearcover
1. Removethestand ass’y. (See 7.1.)
2. Removethefixing screws(13pcs).
3. Removetherearcover.
7.3. Removing thespeakerboxLand R
1. Removetherearcover. (See 7.2.)
2. Release thespeakercables fromtheclamperson thespeakerbox
Land R, and disconnect thespeakerrelaycouplers(SPLand SPR).
3. Removethefixing screws(6pcs).
4. RemovethespeakerboxLand R.
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7.4. Removing therearAVbracket
1. Removetherearcover(See 7.2.)and thespeakerboxLand R.
(See 7.3.)
2. Release thebushing ofACcordfromtherearAVbracket and the
clamperon therearmetal frame, disconnect thecoupler(AP10)
and removetheACcord.
3. Removethefixing screws(3pcs).
4. RemovetherearAVbracket.
7.5. Removing therearmetal frame
1. RemovetherearAVbracket. (See 7.4.)
2. Release thecables fromtheclamperson therearmetal frames.
3. Removethefixing screws(4pcs).
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4. Removetherearmetal frames (rightand left).
7.6. Removing theP-Board
1. Removetherearcover. (See 7.2.)
2. Disconnect thecouplersP2(CN101), P3(CN201) P4(CN202), and
P1(CN203).
3. Removethefixing screw (4pcs).
4. RemovetheP-Board.
7.7. Removing theXV-Board(ForLXD500 model only)
1. RemovetherearAVbracket (See 7.4.)and therearmetal frame.
(See 7.5.)
2. Disconnect thecouplerscarefully(XV01 and DG1).
3. Removethefixing screws(5pcs ).
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4. RemovetheXV-Boardunit.
5. Removethescrews(5pcs )
6. RemovetheXV-Board.
7.8. Removing theDG-Board
1. RemovetherearAVbracket (See 7.4.)and therearmetal frame.
(See 7.5.)
2. RemovetheXV-Boardunit. (See 7.7.)(forLXD500 model only)
3. Disconnect thecouplers(DG6, DG8and DG7), theflexiblecables
(DG2and DG3) and thebridgecables (DG4and DG5).
4. Removethefixing screws(7pcs).
5. RemovetheDG-BoardwithDV-Board.
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7.9. Removing theDV-Board
1. RemovetheDG-BoardwithDV-Board. (See 7.8.)
(See abovefigureinitem7.8.)
2. Removeafixing screw ( )(reverse side) and removethecopper
foil sheet carefullynottobrake.
3. Disconnect thecoupler(DV15-DG10) and removetheDV-Board.
7.10. Removing theAP-Board
1. RemovetherearAVbracket ass'y(See 7.4.)and therearmetal
frame. (See 7.5.)
2. Disconnect thecouplers(AP2, AP6and AP10 (ACCord)) and the
bridgecables (H1(AP1) on theH-Board, P3/CN201 (AP3) on theP-
Boardand DG4(AP4) and DG5(AP5) on theDG-Board.
3. Removethefixing screws(7pcs).
4. RemovetheAP-Board.
7.11. Removing theH-Board
1. RemovetherearAVbracket (See 7.4.)(and therearmetal frame).
(See 7.5.)
2. Disconnect theflexiblecables (H2and H3), thebridgecable(H1)
and thecouplers(H4, H5, H6, H8and H9).
3. Removethefixing screws(4pcs).
4. RemovetheH-Board.
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7.12. Removing G-Boardbracket (G-Boardand GP-Board)
1. RemovetherearAVbracket (See 7.4.)and therearmetal frames.
(See 7.5.)
2. Removethefixing screws(2pcs ) and pull outtherearAVbracket
slightly.
3. Disconnect theflexiblecable(GP10) and thecouplers(G1, G4, G5,
G10, G11 and GP6).
4. Removeascrew on theDG-Boardand release theearthlug from
theDG-Board.
5. Release thecables fromthecableholdersoftheG-Boardbracket.
6. RemovetheG-Boardbracket withtheG-Boardand GP-Board.
7.13. Removing theG-Boardand GP-Board
1. RemovetheG-Boardbracket. (See 7.12.)
<Removing theG-Board>
2. Pushthehooks (7 points) torelease theG-BoardfromtheG-Board
bracket.
3. RemovetheG-Board.
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<Removing theGP-Board>
4. Removethescrews(2pcs ) and pushthehooks (2 points ).
5. RemovetheGP-Board.
7.14. Removing theGS-Boardbracket.
1. Removethescrews(3pcs ) (See figureinitem7.12.)
2. RemovetheGS-Boardbracket.
3. Removethecouplers(GS9and GS10) and aflexiblecable(GS3).
4. Removethescrews(2pcs ).
5. RemovetheGS-Board
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