Panasonic Viera TX-32LX600F User manual

Service Manual
Colour LCD Television
TX-32LX600F
TX-32LX600P
TX-26LX600F
TX-26LX600P
LH50 Chassis
Specifications
(Informations in brackets [ ] refers to models 26´´)
Power Source: 220-240V AC, 50/60Hz
Power Consumption 136W TX-32LX600F
169W TX-32LX600P
82W TX-26LX600F
118W TX-26LX600P
Stand-by Power Consumption: 0,4W
Aerial Impedance: 75Ωunbalanced, Coaxial Type
Receiving System: PAL-I, B/G, H, D/K,
SECAM B/G, D/K, L/L’
PAL-525/60, M.NTSC, NTSC (AV only)
Receiving Channels:
VHF E2-E12 VHF H1-H2 (ITALY)
VHF A-H (ITALY) VHF R1-R2
VHF R3-R5 VHF R6-R12
UHF E21-E69 CATV (S01-S05)
CATV S1-S10 (M1-M10) CATV S11-S20 (U1-U10)
CATV S21-S41 (Hyperband)
Operating Conditions: Temperature: 0°C ÷35°C
Scanning format: 480i(60Hz), 480p(60Hz), 576i(50Hz), 576p(50Hz), 720p(60Hz), 720p(50Hz), 1.080i(60Hz),
1.080i(50Hz)
PC signals: VGA, SVGA, XGA
SXGA(compressed)
Horizontal scanning frequency 31 – 69 kHz
Vertical scanning frequency 59 – 86 Hz
Intermediate Frequency:
Video/Audio
Video 38,9MHz, 33,9MHz
Audio 33,4MHz (B/G), 33,16MHz (A2)
33,05MHz (NICAM B/G, D/K, L)
32,4MHz (D/K), 32,66MHz (CZ STEREO)
40,4MHz (L’), 39,75Mhz (L’NICAM),
Colour 34,47MHz (PAL)
34,5MHz, 34,65MHz (SECAM)
38,3MHz, 38,15MHz (SECAM L’)
Terminals:
AV1 IN Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 10kΩ
RGB (21 pin) 0,7V p-p 75Ω
ORDER No. PCZ0608056CE

AV1 OUT Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 1kΩ
AV2 IN Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 10kΩ
S-video IN (21-pin)Y: 1V p-p 75Ω
C:0,3V p-p 75Ω
AV2 OUT Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 1kΩ
AV3 IN Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 10kΩ
RGB (21 pin) 0,7V p-p 75Ω
S-video IN (21-pin)Y: 1V p-p 75Ω
C:0,3V p-p 75Ω
AV3 OUT Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 1kΩ
AV4 IN S-Video IN (4-pin) Y: 1V p-p 75Ω
C:0,3V p-p 75Ω
Audio (RCAx2) 500mV rms 10kΩ
Video (RCAx1) 1V p-p 75Ω
HDMI1, HDMI2 Type A Connector
COMPONENT YUV Video (RCAx3) Y:1V p-p 75Ω
Pb, Pr: 0,7V p-p 75Ω
AUDIO IN Audio (RCAx2) 500mV rms 10kΩ
AUDIO OUT Audio (RCAx2) 500mV rms 1kΩ
PC HIGH-DENSITY D_SUB 15PIN
CARD SLOT SD CARD slot x1
LCD screen: L5EDD8Q00025 [L5EDD6Q00019]
1366 x 768 XGA, 16:9
Visible Diagonal 800mm [660mm]
Audio Output: 20W (5W + 5W, 5W + 5W)
Headphones: 3,5mm, 8ΩImpedance
Accessories supplied : Remote Control 2 x R6 (UM3) Batteries
Dimensions:
Height: Width: Depth:
Including TV stand 624mm 857mm 300mm
[549mm] [724mm] [300mm]
TV set only 563mm 857mm 141mm
[487mm] [724mm] [141mm]
Net weight: 22,5kg [19,5kg]
Specifications are subject to change without notice.
Weights and dimensions shown are approximate.
This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not
contain warnings or cautions to advise non-technical individuals of potencial dangers in attempting to service a product. Products
powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the
product or products deal within this service information by anyone else could result in serious injury or death.
Warning
2

CONTENTS
SAFETY PRECAUTIONS ........................................... 4
GENERAL QUIDE LINES...................................... 4
TOUCH – CURRENT CHECK............................... 4
PREVENTION OF ELECTROSTATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES .................................................................... 5
ABOUT LEAD FREE SOLDER (PBF)......................... 6
SUGGESTED PB FREE SOLDER ........................ 6
APPLICABLE SIGNALS.............................................. 7
SERVICE HINTS ........................................................ 8
CHASSIS BOARD LAYOUT ....................................... 9
SETTING INSPECTION.............................................. 9
SELF-CHECK ........................................................... 10
POWER LED BLINKING TIMING CHART ................ 11
SERVICE MODE FUNCTION ................................... 12
SERVICE 1 ............................................................... 13
SERVICE 2 ............................................................... 14
OPTION DESCRIPTION........................................... 15
ADJUSTMENT METHOD ......................................... 17
WIRING DIAGRAM................................................... 18
BLOCK DIAGRAMS.................................................. 19
PARTS LOCATION................................................... 22
REPLACEMENT PARTS LIST.................................. 24
SCHEMATIC DIAGRAMS ......................................... 49
AP-BOARD (1 OF 3) SCHEMATIC DIAGRAM.... 50
AP-BOARD (2 OF 3) SCHEMATIC DIAGRAM.... 51
AP-BOARD (3 OF 3) SCHEMATIC DIAGRAM.... 52
DG-BOARD (1 OF 8) SCHEMATIC DIAGRAM ... 53
DG-BOARD (2 OF 8) SCHEMATIC DIAGRAM ... 54
DG-BOARD (3 OF 8) SCHEMATIC DIAGRAM ... 55
DG-BOARD (4 OF 8) SCHEMATIC DIAGRAM ... 56
DG-BOARD (5 OF 8) SCHEMATIC DIAGRAM ... 57
DG-BOARD (6 OF 8) SCHEMATIC DIAGRAM ... 58
DG-BOARD (7 OF 8) SCHEMATIC DIAGRAM ... 59
DG-BOARD (8 OF 8) SCHEMATIC DIAGRAM ... 60
G-BOARD SCHEMATIC DIAGRAM .................... 61
GS-BOARD SCHEMATIC DIAGRAM.................. 62
H-BOARD (1 OF 4) SCHEMATIC DIAGRAM...... 63
H-BOARD (2 OF 4) SCHEMATIC DIAGRAM...... 64
H-BOARD (3 OF 4) SCHEMATIC DIAGRAM...... 65
H-BOARD (4 OF 4) SCHEMATIC DIAGRAM...... 66
V ,K-BOARD SCHEMATIC DIAGRAM ................ 67
CONDUCTOR VIEWS......................................... 68
3

Safety Precautions
General Guide Lines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated
or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following touch current checks to prevent the customer from being exposed to shock hazards.
4. Always ensure panel TKKL5290 is correctly replaced before returning to customer (see Fig.1).
Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth
ground such as a water pipe, as shown in Fig. 2.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
Note:
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and
2.0 mA d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100
kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should
be repaired and rechecked before it is returned to the customer.
Fig. 2
Fig. 1
4
TO
A
PPLIANCES
EXPOSED
METAL PARTS
Resistance values in ohms (Ω)
V
R0=500
Ω
RS=1500
Ω
CS=0.22
µ
F
10k
Ω
0.022
µ
F
U1
COLD
WATER PIPE
(EARTH GROUND)
V: Voltmetr or oscilloscope
(r.m.s. or peak reading)
Measuring network for TOUCH CURRENTS
Input resistance: ≥ 1M
Ω
Input capacitance: ≤ 200pF
Frequency range: 15Hz to 1MHz and d.c.respectively
NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms
U2(V)

Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect
transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of
component damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on
your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD
wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD
protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity
(ESD) sufficient to damage an ES device).
There are special components used in this equipment which are important for safety.
These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do
not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
5

About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,
we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
stamped on the back of PCB.
Caution
•Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C)
higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
•Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before
applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
•After applying PbF solder to double layered boards, please check the component side for excess solder which may
flow onto the opposite side. (see Fig.3)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used. (see Fig.4)
Fig.3
Fig.4
6

Applicable signals
Note:
•Signals other than above may not be displayed properly.
•Applicable input signal for PC is basically compatible to VESA standard timing.
•PC signal is magnified or compressed for display, so that it may not be possible to show fine detail.
Signal name Horizontal
frequency (kHz)
Vertical frequency
(Hz) Conponent HDMI PC
525 (480)/60i 15,73 59,94 ∗∗
525 (480)/60p 31,47 59,94 ∗∗
625 (576)/50i 15,63 50,00 ∗∗
625 (576)/50p 31,25 50,00 ∗∗
750 (720)/60p 45,00 60,00 ∗∗
750 (720)/50p 37,50 50,00 ∗∗
1.125 (1.080)/60i 33,75 60,00 ∗∗
1.125 (1.080)/50i 28,13 50,00 ∗∗
640 x 400 @70 Hz 31,46 70,07 ∗
640 x 480 @60 Hz 31,47 59,94 ∗
640 x 480 @75 Hz 37,50 75,00 ∗
852 x 480 @60 Hz 31,47 59,94 ∗
800 x 600 @60 Hz 37,88 60,32 ∗
800 x 600 @75 Hz 46,88 75,00 ∗
800 x 600 @85 Hz 53,67 85,06 ∗
1.024 x 768 @60 Hz 48,36 60,00 ∗
1.024 x 768 @70 Hz 56,48 70,07 ∗
1.024 x 768 @75 Hz 60,02 75,03 ∗
1.024 x 768 @85 Hz 68,68 85,00 ∗
1.280 x 1024 @60 Hz 63,98 60,02 ∗
1.366 x 768 @60 Hz 48,36 60,00 ∗
Macintosh 13” (640 x 480) 35,00 66,67 ∗
Macintosh 16” (832 x 624) 49,72 74,54 ∗
Macintosh 21” (1.152 x 870) 68,68 75,06 ∗
7

Service Hints
How to remove the Pedestal assembly
Lay the main unit face down. (see Fig.5)
Remove the cable cover. (see Fig.6)
Remove the 4 fixing screws and the pedestal assembly. (see Fig.7)
How to remove the backcover
Remove the cable cover. (see Fig.6)
Remove the 15 fixing screws. (see Fig.8)
Fig.5
Fig.6
SCREWS
Fig.7
SCREWS SCREWS
Fig.8
8

Chassis Board Layout
Setting Inspection
Voltage Confirmation
Board Name Function
AP-Board Mains Input, Power Supply Regulator
DG-Board Global Core, HDMI
G-Board Local Key, Audio Amplifier
GS-Board SD Card Slot, SD Card Interface
H-Board AV Connector, TV tuner, AV Switch
K-Board Main Switch
P-Board DC Power Supply
SD-Module MPEG/JPEG interface
V-Board Remote Receiver, LED IR, Bats
9
V-BOARD
K-BOARD
AP-BOARD
DG-BOARD
H-BOARD
P-BOARD
Confirm the following voltages:
AP board Normal mode
Test point Position Voltage
TP7201 Cathode D7102 7V ± 1V
TP7301 J218 9V ± 0,45V
TP7303 J415 5,1V ± 0,25V
TP7401 JS7958 18,8V ± 0,8V
TP7403 J213 3,3V ± 0,15V
TP7501 JS7503 5,1V ± 0,25V
TP7502 J221 9V ± 0,45V
TP7601 J406 31,5V ± 2,5V
TP7702 JS7702 12,2V ± 0,6V
Standby mode
TP7201 Cathode D7102 10V ± 2V
TP7301 J218 max 2V
TP7303 J415 max 2V
TP7401 JS7958 max 2V
TP7403 J213 max 2V
TP7501 JS7503 max 2V
TP7502 J221 max 2V
TP7601 J406 max 4,5V
TP7702 JS7702 max 2V
SD-MODULE
GS-BOARD
G-BOARD

Self Check
Self-check is used to automatically check the bus lines and hexadecimal code of the TV set. To enter Self-Check mode, keep
pressing the STATUS button on the remote control and press the down (-/v) button on the TV set. To exit Self Check,
switch off the TV set at the power button.
Display Ref. No. Description P.C.B.
MEM IC1102 EAROM DG-Board
GC5 IC4037 GLOBAL CORE DG-Board
GC3FS IC4020 GLOBAL CORE FOR SUB DG-Board
AVSW1 IC3005 AV SWITCH H-Board
AVSW2 IC2105 AV SWITCH H-Board
TUN1 TU3201 MULTISTANDART SOUND
PROCESSOR H-Board
VIF TU3201 VIDEO INTERMEDIATE FREQUENCY H-Board
MSP IC2106 MAIN SOUND PROCESSOR H-Board
SDM SD-MODULE MPEG/PHOTO VIEW, SD RECORDING SD-MODULE
HDMI IC4026 HDMI I/F RECEIVER DG-Board
ADV IC4019 A/D CONVERTER DG-Board
If the CCU
p
orts have been checked and found to be incorrect or not located then " - - " will a
pp
ear in
p
lace of "O.K.".
MEM O.K.
GC5 O.K.
GC3FS O.K.
A
VSW1 O.K.
A
VSW2 O.K.
TUN1 O.K.
VIF O.K.
MSP O.K.
SDM O.K.
HDMI O.K.
A
DV O.K.
TX-32LX600F TX-32LX600P TX-26LX600F TX-26LX600P
OPTION 1 4F 4F 4F 4F
OPTION 2 11 11 11 11
OPTION 3 3A 3A 3A 3A
OPTION 4 D9 59 D9 59
OPTION 5 EB EB 6B 6B
OPTION 6 AB AB AB AB
OPTION 7 00 00 00 00
OPTION 8 78 78 78 78
OPTION 9 00 00 00 00
OPTION 10 80 80 80 80
OPTION 11 C1 C1 C1 C1
OPTION 12 20 20 20 20
OPTION 13 20 20 20 20
CHECK 02 82 82 02
10