Panasonic PT56DLX75 - 56" DLP TV User manual

ORDERNO. MKE0508855C1
Multi MediaDisplay
PT-56DLX75 / PT-61DLX75
SPECIFICATIONS
1

2005 PanasonicShikoku Electronics Co., Ltd. All rights
reserved. Unauthorized copying and distribution isaviolation of
law.
1. SAFETY PRECAUTIONS
1.1. GENERALGUIDELINES
1. For continued safety, no modification of anycircuitshouldbe
2

attempted.
2. Disconnect AC Plug before disassembling thisunit.
3. Itisadvisableto use an isolation transformer inthe AC supply
before servicing.
4. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
5. After servicing, see to itthat all the protective devices such as
insulation barriers, insulation papers, shield, and isolation R-C
combinations etc. are properlyinstalled.
6. After servicing, be sure to restore the wires, leads, insulation
barriers, shields, etc.
7. After servicing, make the leakage current checks to prevent the
customer from being exposed to shock hazards.
Caution:
Use aseparate Isolation Transformer for thisunitwhen servicing.
1.2. LEAKAGECURRENTCOLDCHECK
1. Unplug the AC cord and connect ajumper between the two
prongs on the plug.
2. For physicallyoperated power switches, turn power on. Otherwise
skipstep 2.
3. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metalliccabinet part on the
receiver, such as screwheads, connectors, etc. When the exposed
metallicpart has areturn path to the chassis, the reading should
be between 1M and 12 M . When the exposed metal does not
have areturn path to the chassis, the reading must be infinity.
1.3. LEAKAGECURRENTHOTCHECK
1. Plug the AC cord directlyinto the AC outlet.
Donot use an isolation transformer for thischeck.
2. Connect "A"to exposed metallicpart on the set. And connect "B"
to agood earth ground, as showninFigure 1.
3

3. Use an AC voltmeter, with 1k /Vor more sensitivity, to measure
the potential across the resistor.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reverse the AC plug inthe AC outlet and repeat each of the above
measurements.
6. The potential at anypoint shouldnot exceed 0.25 VRMS.
Aleakage current tester (Simpson Model 228 equivalent) maybe
used to make the hot checks. Leakage current must not exceed 1/
2mA. Incase ameasurement isoutside of the limits specified,
there isapossibilityof shock hazard, and the receiver shouldbe
repaired and rechecked before itisreturned to the customer.
Figure 1
1.4. UV-PRECAUTION
1. Besure to disconnect the AC Plug when replacing the lamp.
2. Since the lamp reaches averyhigh temperature during its
operation, waituntil ithas completelycooled off when replacing
the Lamp Unit.
3. The lamp emits small amounts of UV-Radiation.
Avoiddirect-eyecontact bycovering the Lamp and wearing the
UVprotective glasses.
4. The high pressure lamp involves arisk of explosion.
Figure 2
4

1.5. TEMPERATUREDETECTIONFORTHELAMP UNIT
This projectorhas bimetal (Thermostat) contacting the lampunit toprotect the lamp. If the
temperature of the lampexceeds 120 °C, the bimetal will operate toturnoff the power.
The installedposition of the bimetal is showninthe illustration.
To recoverthe bimetal fromits off state, press the protrusion of the bimetal unit until hearclick.
Figure 3
2. PREVENTION OF ELECTROSTATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistorsandsemiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischarging ESDwrist
strap,whichshouldbe removed for potential shock reasons prior
5

to applying power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as aluminum
foil, to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan antistaticsolder removal device. Some solder
removal devices not classified as "antistatic(ESDprotected)" can
generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, aluminum foil or
comparableconductivematerial).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
CAUTION :
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficientto
damage an ES device).
3. ABOUT LEAD FREE SOLDER (PbF)
6

4. SERVICE NOTES
5. DISASSEMBLY/ASSEMBLY PROCEDURES
5.1. CABINET SECTION
5.2. OPTICALBLOCK SECTION
6. ADJUSTMENT PROCEDURES 1
7. ADJUSTMENT PROCEDURES 2
8. TROUBLESHOOTING HINTS
8.1. TROUBLESHOOTING HINTS FORBLOCK LEVEL REPAIR
9. BLOCK DIAGRAMS
10. SCHEMATIC DIAGRAMS
10.1. SCHEMATICDIAGRAMAND CIRCUITBOARD LAYOUTNOTES
10.2. INTERCONNECTIONSCHEMATICDIAGRAM
10.3. FRONTJACK (CIRCUITBOARD FJ) SCHEMATICDIAGRAM
10.4. OPERATIONSCHEMATICDIAGRAMS
10.5. VOLTAGECHART
11. CIRCUIT BOARD LAYOUT
11.1. FRONTJACK (CIRCUITBOARD FJ) C.B.A.
7

11.2. OPERATIONC.B.A.
12. EXPLODED VIEWS
12.1. MAINPARTS SECTION
8

12.2. FRONTAND BASE SECTION
9

12.3. DISPLAYSECTION
10