Panasonic TH-37PW7BX User manual

©2004 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-37PW7BX
TH-37PW7EX
TH-37PWD7BK
TH-37PWD7EK
TH-37PWD7UY
TH-42PW7EX
TH-42PW7BX
TH-42PWD7BK
TH-42PWD7BS
TH-42PWD7EK
TH-42PWD7ES
TH-42PWD7UY
GP7D Chassis
Progressive Wide Plasma Display
Specifications
Power Source (UY Version)
1
20 V AC, 50/60 Hz
Power Source (Except UY)
2
20 - 240 V AC, 50/60
H
z
Power Consumption (UY Version)
Maximum
2
25 W (37 inch)
2
90
W
(
42
i
nch)
Stand-by condition
S
ave OFF 0.8 W,
S
ave
O
N
0
.5
W
Power off condition
0
.1 W
Power Consumption (Except UY)
Normal use
1
85 W (37 inch)
2
50
W
(
42
i
nch)
Stand-by condition
S
ave off 1.0 W, Save
o
n
0
.7
W
Power off condition
0
.3 W
Plasma Display panel
D
rive method: AC
t
ype
1
6:9
a
spec
t
r
atio
Contrast Ratio
4
000:1
Screen size
8
18 mm (W) × 461
m
m
(
H)
×
9
39
m
m
(
diago
n
al)
(37 inch)
9
20
m
m
(
W) × 518 mm (H) × 1,056
m
m
(
diago
n
al)
(42 inch)
(No. of pixels)
4
08,960 (852 (W)
×
4
80
(
H))
[
2,556
×
4
80
d
ots]
Operating condition
Temperatuer
3
2 °F - 104 °F (0
°
C
-
4
0
°
C)
Humidity
2
0%-80%
Applicable signals
Colour System
N
TSC, PAL, PAL6
0
,
S
ECA
M
,
M
odif
i
ed
N
TSC
ORDER NO. ITD0408033C0
D10 Canada: B07

1 Applicable signals 5
2 Safety Precautions 6
2.1. General Guidelines 6
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 7
4 About lead free solder (PbF) 8
5 PCB Structure sheet of GP7D chassis 9
6 Service Hint 10
7 P.C.Board and Plasma panel replacement 11
7.1. Removal of the back cover 11
Scanning format 525
(
480) / 60i 60p,
6
25
(
575)
/
5
0i
5
0p,
7
50
(
720)
/
6
0p
5
0p, 1125 (1080) / 60i
5
0i
2
4p
25p 30p 24sF .... SMPTE274M, 1250 (1080) / 50i
PC signals VGA
d
isplay
VGA
SVGA, XGA, SXGA, UXGA
.
....
(
comp
r
esse
d
)
Horizontal scanning freque
n
cy
1
5
-
1
10
k
Hz
Vertic
a
l scanning freque
n
cy
4
8
-
1
20
H
z
Connection terminals
AV (TH-37/42PWDUY) VIDEO IN / OUT (BNC)
1
.0 Vp-p
(
75-oh
m
o
r high impedance)
S VIDEO IN (MINI DIN
4
PIN)
Y
:
1
Vp-p
(
75-oh
m
), C: 0.286 Vp-p (75-
o
hm)
AUDIO IN (RCA PIN JACK
×
2)
0
.5 Vrms
(
high
i
mpedance)
COMPONENT / RGB (TH-
37/42PWDUY) Y/
G
(BNC)
1
.0 Vp-p
/
c
omp
o
site (75-ohm)
0
.7 Vp-p
/
n
on-c
o
mposite (75-ohm)
PB
/
B
(BNC), PR / R (BNC
)
0
.7 Vp-p
(
75
o
hm)
AUDIO IN (RCA PIN JACK
×
2
)
0
.5 Vrms
(
high
i
mpedance)
PC (HIGH-DENSITY D-SUB
1
5PIN
)
R
,
G
,
B
/
0
.7 Vp-p (75-ohm)
H
D, VD
/
1
.0
-
5
.0 Vp-p (high impedance)
C
o
m
p
o
n
e
n
t
Y
:
1
.0 Vp-p
(
75-oh
m
:
include sync)
P
B
/
C
B
:
±
0.35 Vp-p
(
75-
o
hm)
P
R
/
C
R
:
±
0.35 Vp-p
(
75-
o
hm)
AUDIO IN (M3 JACK)
0
.5 Vrms
(
high
i
mpedance)
SERIAL EXTE
R
NAL CONTROL
T
ERM
I
NAL
(
D-SU
B
9
PIN)
R
S-
2
32C
C
OMPATIBLE
SPEAKERS (6 W)16 W [8 W + 8 W] (10
%
T
HD)
Accessories Supplied
Remote Control Transmitter EUR6
4
6529
Batteries 2 × AA Size
Fixing bands (TMM
E
203 or TMME187)
×
2
Ferrite core J0KF00000018 × 1, J0KG
0
0000
0
54
×
2
Dimensions ( W × H × D ) 920
m
m × 550 mm × 89
m
m
(
37
i
nch)
1
,020
m
m
×
6
10
m
m × 89 mm (42 inch)
Mass (Weight) (UY Version)
main unit only appro
x
. 54.0 lbs (37 inch)
a
ppro
x
.
6
3.9
l
bs
(
42 inch)
with speakers appro
x
. 63.3 lbs (37 inch)
a
ppro
x
.
7
3.2
l
bs
(
42 inch)
Mass (Weight) (Except UY)
main unit only appro
x
. 24.0 kg net (37
i
nch)
a
ppro
x
.
2
8.5
k
g
n
et (42 inch)
with speakers appro
x
. 28.2 kg (37 inch)
a
ppro
x
.
3
2.7
k
g
(
42 inch)
Notes:
· Design and specifications are subject to change without notice.Mass and dimensions shown are approximate.
CONTENTS
Page Page
2
TH-37PW7BX

7.2. Removal of the Slot block 11
7.3. Removal of the J-Board 11
7.4. Removal of the HX-Board 11
7.5. Removal of the P-Board 12
7.6. Removal of the Z-Board 12
7.7. Removal of the D-Board 12
7.8. Removal of the PF-Board 13
7.9. Removal of the H3-Board 13
7.10. Removal of the SU-Board 13
7.11. Removal of the SD-Board 13
7.12. Removal of the SC-Board 14
7.13. Removal of the SS-Board 14
7.14. Removal of the C1-Board 14
7.15. Removal of the C2-Board 14
7.16. Removal of the Front frame (glass) 14
7.17. Removal of stand brackets 15
7.18. Replacement of the plasma panel 15
8 Location of Lead Wiring 16
9 Adjustment Procedure 17
9.1. Driver Set-up 17
9.2. Initialization Pulse Adjust 18
9.3. P.C.B. (Printed Circuit Board) exchange 19
9.4. Adjustment Volume Location 19
9.5. Test Point Location 19
10 Service mode 20
10.1. CAT (computer Aided Test) mode 20
10.2. IIC mode structure (following items value is sample data.)
22
11 Alignment 23
11.1. PC/RGB panel white balance 23
11.2. HD/ 525i /525p /625i /625p panel white balance 26
12 Trouble shooting guide 28
12.1. Self Check 28
12.2. No Power 29
12.3. No Picture 30
12.4. Local screen failure 30
13 Option Setting 31
14 Circuit Board Layout 33
14.1. PF-Board (37 inch) 33
14.2. PF-Board (42 inch) 35
14.3. P-Board 37
14.4. HA-Board 40
14.5. HB-Board 41
14.6. HX-Board (37 inch) 42
14.7. HX-Board (42 inch) 43
14.8. J-Board (37 inch) 44
14.9. J-Board (42 inch) 46
14.10. D-Board 48
14.11. C1-Board (37 inch) 50
14.12. C1-Board (42 inch) 51
14.13. C2-Board (37 inch) 52
14.14. C2-Board (42 inch) 53
14.15. SC-Board 54
14.16. SU-Board (37 inch) 57
14.17. SU-Board (42 inch) 58
14.18. SD-Board (37 inch) 59
14.19. SD-Board (42 inch) 60
14.20. SS-Board 61
14.21. Z-Board 63
14.22. H3, S1 and V1-Board 64
15 Schematic Diagrams 65
15.1. Schematic Diagram Notes 65
15.2. Main Block Diagram 66
15.3. PF-Board Block Diagram 67
15.4. PF-Board Schematic Diagram (TH-37PW7/PWD7 series)
68
15.5. PF-Board Schematic Diagram (TH-42PW7/PWD7 series)
69
15.6. P-Board Block Diagram 70
15.7. P-Board (1 of 6) Schematic Diagram 71
15.8. P-Board (2 of 6) Schematic Diagram 72
15.9. P-Board (3 of 6) Schematic Diagram 73
15.10. P-Board (4 of 6) Schematic Diagram 74
15.11. P-Board (5 of 6) Schematic Diagram 75
15.12. P-Board (6 of 6) Schematic Diagram 76
15.13. HA-Board Block and Schematic Diagram 77
15.14. HB-Board Block Diagram 78
15.15. HB-Board (1 of 2) Schematic Diagram 79
15.16. HB-Board (2 of 2) Schematic Diagram 80
15.17. HX-Board Block Diagram 81
15.18. HX-Board Schematic Diagram 82
15.19. J-Board Block Diagram 83
15.20. J-Board (1 of 4) Schematic Diagram (TH-37PW7/PWD7
series) 84
15.21. J-Board (2 of 4) Schematic Diagram (TH-37PW7/PWD7
series) 85
15.22. J-Board (3 of 4) Schematic Diagram (TH-37PW7/PWD7
series) 86
15.23. J-Board (4 of 4) Schematic Diagram (TH-37PW7/PWD7
series) 87
15.24. J-Board (1 of 4) Schematic Diagram (TH-42PW7/PWD7
series) 88
15.25. J-Board (2 of 4) Schematic Diagram (TH-42PW7/PWD7
series) 89
15.26. J-Board (3 of 4) Schematic Diagram (TH-42PW7/PWD7
series) 90
15.27. J-Board (4 of 4) Schematic Diagram (TH-42PW7/PWD7
series) 91
15.28. D-Board Block Diagram 92
15.29. D-Board (1 of 12) Schematic Diagram 93
15.30. D-Board (2 of 12) Schematic Diagram 94
15.31. D-Board (3 of 12) Schematic Diagram 95
15.32. D-Board (4 of 12) Schematic Diagram 96
15.33. D-Board (5 of 12) Schematic Diagram 97
15.34. D-Board (6 of 12) Schematic Diagram 98
15.35. D-Board (7 of 12) Schematic Diagram 99
15.36. D-Board (8 of 12) Schematic Diagram 100
15.37. D-Board (9 of 12) Schematic Diagram 101
3
TH-37PW7BX

15.38. D-Board (10 of 12) Schematic Diagram 102
15.39. D-Board (11 of 12) Schematic Diagram 103
15.40. D-Board (12 of 12) Schematic Diagram 104
15.41. C1, C2 and V1-Board Block Diagram 105
15.42. C1-Board (1 of 2) Schematic Diagram (TH-37PW7/PWD7
series) 106
15.43. C1-Board (2 of 2) Schematic Diagram (TH-37PW7/PWD7
series) 107
15.44. C1-Board (1 of 2) Schematic Diagram (TH-42PW7/PWD7
series) 108
15.45. C1-Board (2 of 2) Schematic Diagram (TH-42PW7/PWD7
series) 109
15.46. C2-Board (1 of 2) and V1-Board Schematic Diagram (TH-
37PW7/PWD7 series) 110
15.47. C2-Board (2 of 2) Schematic Diagram (TH-37PW7/PWD7
series) 111
15.48. C2-Board (1 of 2) and V1-Board Schematic Diagram (TH-
42PW7/PWD7 series) 112
15.49. C2-Board (2 of 2) Schematic Diagram (TH-42PW7/PWD7
series) 113
15.50. SC-Board Block Diagram 114
15.51. SC-Board (1 of 2) Schematic Diagram 115
15.52. SC-Board (2 of 2) Schematic Diagram 116
15.53. SU-Board Block Diagram 117
15.54. SU-Board Schematic Diagram (TH-37PW7/PWD7 series)
118
15.55. SU-Board Schematic Diagram (TH-42PW7/PWD7 series)
119
15.56. SD-Board Block Diagram 120
15.57. SD-Board Schematic Diagram (TH-37PW7/PWD7 series)
121
15.58. SD-Board Schematic Diagram (TH-42PW7/PWD7 series)
122
15.59. SS and S1-Board Block Diagram 123
15.60. SS and S1-Board Schematic Diagram 124
15.61. Z and H3-Board Block Diagram 125
15.62. Z-Board (1 of 2) Schematic Diagram 126
15.63. Z-Board (2 of 2) and H3-Board Schematic Diagram 127
16 Parts Location 129
17 Packing Exploded Views 130
17.1. Packing Exploded Views (1) 130
17.2. Packing Exploded Views (2) 131
17.3. Packing Exploded Views (3) 132
18 Mechanical Replacement Parts List 133
19 Replacement Parts List 135
19.1. Replacement Parts List Notes 135
19.2. Electrical Replacement List 136
4
TH-37PW7BX

1 Applicable signals
5
TH-37PW7BX

2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MWand 5.2MW.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
6
TH-37PW7BX

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
TH-37PW7BX

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
8
TH-37PW7BX

5 PCB Structure sheet of GP7D chassis
Board Name Function Remarks
DDigital Signal Processor 1
JSlot Interface & SYNC processor 1
ZAudio out, DC-DC converter
SS Sustain Out 1
SC Scan out 1
SU Sustain connection (Upper) 1
SD Sustain connection (Lower) 1
C1 Data Drive (Lower Right)
C2 Data Drive (Lower Left)
H3 Speaker terminal
S1 Power switch
SS2 Sustain connection (Upper)
SS3 Sustain connection (Lower)
V1 Front SW. & Remote receiver
PF Line filter
PPower supply 1
HX PC_type_Input terminal
HB BNC Composite/Component Video 2
HA BNC Component Video 2
Remarks
1.Recommend PCB´s for initial service for GP7D chassis.
2.For System model except BK, BS, EK, ES model
9
TH-37PW7BX

6 Service Hint
Service position for HB-Board, HA-Board and TY-42TM6
Note:
Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC0704)
10
TH-37PW7BX

Prior to the replacement, place the unit on the pedestal
stand remove the front frame.
7.1. Removal of the back cover
a. Unscrew the screws (×16 ,×6 ,×4 ) and remove the
back cover.
7.2. Removal of the Slot block
a. Unscrew the couplers (J1, J3, J5, J6, J8, J10).
b. Unscrew the screws (×4) and remove the slot block.
7.3. Removal of the J-Board
a. Unscrew the screws (×7) and remote the J-Board.
7.4. Removal of the HX-Board
a. Unscrew the screws (×6) and remove the slot case.
b. Unscrew the screws (×4).
c. Unscrew the screws (×2) and remove the HX-Board.
7 P.C.Board and Plasma panel replacement
11
TH-37PW7BX

7.5. Removal of the P-Board
a. Remove the couplers (P2, P5, P7, P9, P10, P11, P12, P23,
P25, P27).
b. Unscrew the screws (×5) and remove the P-Board.
7.6. Removal of the Z-Board
a. Remove the couplers (Z5, Z6, Z7, Z8).
b. Unscrew the screws (×4 ) and remove the Z-Board with
theZ-BoardBracket.
c. Unscrew the screws (×4 ) and remove the Z-Board.
7.7. Removal of the D-Board
a. Disconnect the couplers (D1, D3, D5, D25, D27) and the
flexible cables (D31, D32).
b. Remove the shield cuse.
c. Unscrew the screws (×6) and remove the D-Board.
12
TH-37PW7BX

7.8. Removal of the PF-Board
a. Remove the coupler (PF1).
b. Unscrew the screws (×2) and remove the AC inlet.
c. Remove the couplers (PF9, PF10).
d. Unscrew the screws (×4), and remove the PF-Board.
7.9. Removal of the H3-Board
a. Unscrew the screws (×2 ), and remove the H3-Board
with the Bracket.
b. Unscrew the screws (×4 ), and remove the H3-Board.
7.10. Removal of the SU-Board
a. Unscrew the screws (×2).
b. Slide the SU-Board to the left and disconnect from the
couplers (SC41) on the SC-Board.
c. Remove the coupler (SU45).
d. Remove the flexible cables (SU1, SU2, SU3) connected to
the SU-Board, and remove the SU-Board.
7.11. Removal of the SD-Board
a. Unscrew the screws (×2).
b. Slide the SD-Board to the left and disconnect from the
couplers (SC42) on the SC-Board.
c. Remove the coupler (SD46).
d. Remove the flexible cables (SD1, SD2, SD3) connected to
the SD-Board, and remove the SD-Board.
13
TH-37PW7BX

7.12. Removal of the SC-Board
a. Remove the couplers (SC2, SC20, SC23, SC45, SC46).
Unscrew the screws (×6) and remove the SC-Board.
7.13. Removal of the SS-Board
a. Remove the couplers (SS11, SS12, SS23, SS34).
b. Remove the flexible cables (SS41, SS42, SS43, SS44).
c. Unscrew the screws (×6), and remove the SS-Board.
7.14. Removal of the C1-Board
a. Remove the flexible cables (CB1, CB2, CB3).
b. Remove the flexible cables (C11, C12) release the speaker
cables from the clampers (×2) on the C1-Board.
c. Unscrew the screws (×4), and remove the C1-Board.
7.15. Removal of the C2-Board
a. Remove the cables (CB4, CB5, CB6, CB7).
b. Remove the couplers (C23, C24), a flexible cable (C21) and
release the speaker cables from the clamper on the C2-Board.
c. Unscrew the screws (×4), and remove the C2-Board.
7.16. Removal of the Front frame
(glass)
a. Remove the screws (×2) fasten on the panel and remove the
front panel.
14
TH-37PW7BX

b. Release all cables from the clamper on the bracket of the
front frame.
c. For leaving the plasma panel from the front frame, pull the
bottom of the front frame to forward, lift, and remove.
7.17. Removal of stand brackets
a. Remove the plasma panel section from the servicing stand
and lay on a table (covered), with the plasma panel surface
facing downward.
Spread a soft cloth for protection, to prevent panel surface from
scratching.
b. Remove the stand bracket (left, right) fastening screws (×4
each) and remove the stand brackets (left, right).
7.18. Replacement of the plasma
panel
a. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
b. Fit the stand brackets (left, right.) fast 4 screws each on the
new plasma panel.
c. Place the plasma panel section on the servicing stand.
d. Attach the front frame each P.C.Board and so on, to the new
plasma panel.
* When fitting the front frame, be careful not to allow any
debris, dust or handling residues to remain between the
front glass and plasma panel.
15
TH-37PW7BX

8 Location of Lead Wiring
16
TH-37PW7BX

9.1. Driver Set-up
9.1.1. Item / Preparation
1.Input an APL 100 % white signal.
2.Set the picture controls: -
Picture mode: Normal
White balance: Normal
Aspect: 16:9
9.1.2. Adjustments
Adjust driver section voltages referring the panel data on the
panel data label.
Name Test Point Voltage Volume Remarks
Vsus TPVSUS
(SS) 174V ± 1V R628 (P)
Ve TPVE (SS) 156V ± 1V VR6074 (SS)
Vset TPVSET
(SC) 232V ± 5V ---
Vad TPVAD (SC) -90V ± 1V VR6477
(SC)
Vscn TPVSCN
(SC) Vad*+120V ± 2V ---
Vda TPVDA (SS) 67V ± 1V R665 (P)
*See the Panel label.
9 Adjustment Procedure
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9.2. Initialization Pulse Adjust
1.Input the Cross hatch signal to plasma video input.
2.Set the picture controls as follows.
· Picture mode: Normal
· White balance: Cool
3.Connect OSC: lloscope to TPSCI and adjust R6523 for 15±10µ Sec.
4.Connect OSC: lloscope to TPSCI and adjust R6557 for 184±10µ Sec.
Test point Volume Level
T1 TPSC1 (SC) R6523 (SC) 15 ± 10µ Sec
T2 TPSS1 (SS) R6557 (SC) 184 ± 10µ Sec
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9.3. P.C.B. (Printed Circuit Board) exchange
9.3.1. Caution
1.To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.
9.3.2. Quick adjustment after P.C.B. exchange
P.C.B. Name Test Point Voltage Volume Remarks
P Board Vsus TPVSUS (SS) 174V ± 1V R628 (P)
Vda TPVDA (SS) 67V ± 1V R665 (P)
SC Board Vad TPVAD (SC) -90V ± 1V VR6477 (SC)
Vset TPVSET (SC) 232V ± 5V ---
Vscn TPVSCN (SC) Vad + 120 ± 2V ---
SS Board Ve TPVE (SS) 156V ± 1V VR6074 (SS)
D, J Board White blance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals
*See the Panel label.
9.4. Adjustment Volume Location
9.5. Test Point Location
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10 Service mode
10.1. CAT (computer Aided Test) mode
To exit the CAT mode, access the ID mode and switch off the main power.
10.1.1. IIC mode
Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on
the remote control.
Subject and item are mentioned on page 14.
To exit the IIC mode, press the R button on the remote control.
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