Panasonic TH-58PH10EK User manual

©2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-58PH10BK
TH-58PH10EK
GPH10D Chassis
High Definition Plasma Display
Specifications
Power Source 220-240 V AC, 50/60 Hz
Power Consumption
Powe
r
on 630 W
Stand-b
y
condi
t
ion Save OFF 0.8 W, Save ON 0.6 W
Powe
r
off condi
t
ion 0.3 W
Plasma Displa
y
panel Drive method: AC type 58-inch,
16:9 aspe
c
t ratio
Screen size 1,287 mm (W) × 723 mm (H) × 1,476 mm (diagonal)
(No. of pixels) 1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]
Operating condition
Temperature 0 °C - 40 °C
Humidit
y
20 % - 80 %
Applicable signals
Colo
r
System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)
/
50i 50p, 750 (720)
/
60p 50p, 1125 (1080) / 60i 50i 24p 25p
30p 24sF .... SMPTE274M, 1250 (1080) / 50i
PC signals VGA, SVGA, XGA,
SXGA, UXGA ..... (compressed)
Horizontal scanning frequenc
y
15 - 110 kHz
Vertical scanning frequenc
y
48 - 120 Hz
Connection terminals
A
VIN VIDEO IN (BNC) 1.0 Vp-p (75-ohm)
S VIDEO IN (MINI DIN 4PIN) Y: 1.0 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 4) 0.5 Vrms (high impedance)
PC IN (HIGH-DENSITY MINI-D-SUB 15PIN)
Y
o
r
G with syn
c
1.0 Vp-p (75-ohm)
Y
o
r
G without syn
c
0.7 Vp-p (75-ohm)
B
/
PB
/
CB:0.7 Vp-p (75-ohm)
R
/
PR
/
CR:0.7 Vp-p (75-ohm)
HD
/
VD:1.0 - 5.0 Vp-p (high impedance)
VBS (use HD port) with picture 1.0 Vp-p (high impedance)
ORDER NO. PCZ0706065CE

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
2.2. Touch-Current Check 5
3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Disassembly 9
6.1. Removal of Rear Cover 9
6.2. Removal of HU-Board 9
6.3. Removal of Slot Block 9
6.4. Removal of DS-Board 10
6.5. Removal of HX-Board 10
6.6. Removal of DN-Board 10
6.7. Removal of P-Board 11
6.8. Removal of D-Board 11
6.9. Removal of H3-Board (L, R) 11
6.10. Removal of SU-Board and SD-Board 11
6.11. Removal of SC-Board 12
6.12. Removal of SS2-Board and SS3-Board 12
6.13. Removal of SS-Board 12
6.14. Removal of C1, C2 and C3-Board 12
6.15. Removal of S1-Board 13
6.16. Removal of Fan 14
6.17. Removal of V1-Board, V2-Board and Operation Button 14
6.18. Removal of Escutcheon and Front Glass 15
6.19. Removal of Plasma Panel 16
7 Location of Lead Wiring 19
7.1. Location of Lead Wiring (1) 19
7.2. Location of Lead Wiring (2) 20
8 Adjustment Procedure 21
8.1. Driver Set-up 21
8.2. Initialization Pulse Adjust 22
8.3. P.C.B. (Printed Circuit Board) exchange 22
8.4. Adjustment Volume Location 23
8.5. Test Point Location 23
9 Service mode 24
9.1. CAT (computer Aided Test) mode 24
9.2. IIC mode structure (following items value is sample data.)
27
10 Adjustment 28
10.1. RGB white balance adjustment 28
10.2. HD white balance adjustment 30
10.3. Power control adjustment 32
11 Trouble shooting guide 33
11.1. Self Check 33
11.2. No Power 35
11.3. No Picture 35
11.4. Local screen failure 36
12 Option Setting 37
13 Conductor Views 39
13.1. P-Board 39
13.2. HU-Board 45
13.3. HX-Board 46
13.4. H3, S1, V1 and V2-Board 47
without picture 0.3 Vp-p (high impedance)
A
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS (6Ω) 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter EUR7636090R
Batteries 2 × R6 Size
Fixing bands TMME203 × 2
Dimensions (W × H × D) 1,399 mm × 843 mm × 99 mm
Mass (weight)
main unit onl
y
appro
x
. 54.0 kg net
with spea
k
ers appro
x
. 59.0 kg
Notes:
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
· This equipment complies with the EMC standards listed below.
EN55022, EN55024, EN61000-3-2, EN61000-3-3.
CONTENTS
Page Page
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TH-58PH10BK / TH-58PH10EK

13.5. DS-Board 48
13.6. DN-Board 50
13.7. D-Board 52
13.8. C1-Board 54
13.9. C2-Board 55
13.10. C3-Board 56
13.11. SC-Board 57
13.12. SU-Board 60
13.13. SD-Board 61
13.14. SS-Board 62
13.15. SS2 and SS3-Board 65
14 Block and Schematic Diagram 67
14.1. Schematic Diagram Notes 67
14.2. Main Block Diagram 68
14.3. P-Board Block Diagram 69
14.4. P-Board (1 of 2) Schematic Diagram 70
14.5. P-Board (2 of 2) Schematic Diagram 71
14.6. HU-Board Block Diagram 72
14.7. HU-Board (1 of 2) Schematic Diagram 73
14.8. HU-Board (2 of 2) Schematic Diagram 74
14.9. HX-Board Block and Schematic Diagram 75
14.10. V1 and V2-Board Block and Schematic Diagram 76
14.11. DS-Board (1 of 2) and H3-Board Block Diagram 77
14.12. DS-Board (2 of 2) Block Diagram 78
14.13. DS-Board (1 of 5) Schematic Diagram 79
14.14. DS-Board (2 of 5) and H3-Board Schematic Diagram 80
14.15. DS-Board (3 of 5) Schematic Diagram 81
14.16. DS-Board (4 of 5) Schematic Diagram 82
14.17. DS-Board (5 of 5) Schematic Diagram 83
14.18. DN-Board (1 of 2) Block Diagram 84
14.19. DN-Board (2 of 2) Block Diagram 85
14.20. DN-Board (1 of 6) Schematic Diagram 86
14.21. DN-Board (2 of 6) Schematic Diagram 87
14.22. DN-Board (3 of 6) Schematic Diagram 88
14.23. DN-Board (4 of 6) Schematic Diagram 89
14.24. DN-Board (5 of 6) Schematic Diagram 90
14.25. DN-Board (6 of 6) Schematic Diagram 91
14.26. D-Board Block Diagram 92
14.27. D-Board (1 of 6) Schematic Diagram 93
14.28. D-Board (2 of 6) Schematic Diagram 94
14.29. D-Board (3 of 6) Schematic Diagram 95
14.30. D-Board (4 of 6) Schematic Diagram 96
14.31. D-Board (5 of 6) Schematic Diagram 97
14.32. D-Board (6 of 6) Schematic Diagram 98
14.33. C1, C2 and C3-Board Block Diagram 99
14.34. C1-Board (1 of 2) Schematic Diagram 100
14.35. C1-Board (2 of 2) Schematic Diagram 101
14.36. C2-Board (1 of 2) Schematic Diagram 102
14.37. C2-Board (2 of 2) Schematic Diagram 103
14.38. C3-Board (1 of 2) Schematic Diagram 104
14.39. C3-Board (2 of 2) Schematic Diagram 105
14.40. SC, SU and SD-Board Block Diagram 106
14.41. SC-Board (1 of 3) Schematic Diagram 107
14.42. SC-Board (2 of 3) Schematic Diagram 108
14.43. SC-Board (3 of 3) Schematic Diagram 109
14.44. SU-Board (1 of 2) Schematic Diagram 110
14.45. SU-Board (2 of 2) Schematic Diagram 111
14.46. SD-Board (1 of 2) Schematic Diagram 112
14.47. SD-Board (2 of 2) Schematic Diagram 113
14.48. SS, S1, SS2 and SS3-Board Block Diagram 114
14.49. SS-Board (1 of 2) and S1-Board Schematic Diagram 115
14.50. SS-Board (2 of 2), SS2 and SS3-Board Schematic
Diagram 116
15 Exploded View and Replacement Parts List 117
15.1. Exploded View 117
15.2. Escutcheon part location enlarged view 118
15.3. Fan part location enlarged view 118
15.4. Cable relation 119
15.5. Packing summary 120
15.6. Replacement Parts List Notes 122
15.7. Mechanical Replacement Parts List 123
15.8. Electrical Replacement Parts List 124
3
TH-58PH10BK / TH-58PH10EK

1 Applicable signals
4
TH-58PH10BK / TH-58PH10EK

2 Safety Precautions
2.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires
have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight out.
4. When servicing, observe the original lead dress.If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1
5
TH-58PH10BK / TH-58PH10EK

3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
TH-58PH10BK / TH-58PH10EK

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
7
TH-58PH10BK / TH-58PH10EK

5 Service Hint
Board Name Function
DN Digital Signal Processor, Microcomputer
D Format Converter, Plasma AI Processor
Sub-Filed Processor
DS Slot Interface (Audio / Video / Sync Input Switch),
SYNC Processor, Audio Processor,
Speaker Out Amplifier,
DC-DC Converter
SS Sustain drive
SC Scan drive
SU Scan out (Upper)
SD Scan out (Lower)
C1 Data Drive (Lower Right)
C2 Data Drive (Lower Center)
C3 Data Drive (Lower Left)
H3 Speaker terminal
S1 Power switch
SS2 Sustain out (Upper)
SS3 Sustain out (Lower)
V1 Remote receiver, LED-G, R
V2 Key switch
P Power supply
HX PC / RS-232C Input terminal
HU Dual Video terminal (BNC / S)
Note:
Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC07040)
8
TH-58PH10BK / TH-58PH10EK

6 Disassembly
· To disassemble P.C.B., wait for 1 minute after power was
off for discharge from electrolysis capacitors.
· and marks indicate screw positions.
6.1. Removal of Rear Cover
1. Remove screws (×12 , ×24 ) and then remove the Rear
Cover.
6.2. Removal of HU-Board
1. Remove 4 screws (A) and then remove the HU Terminal
Block.
2. Remove 4 screws (B).
3. Remove 3 screws (C) and then remove HU-Board.
6.3. Removal of Slot Block
1. Disconnect the connectors (DS2, DS4, DS6, DS7, DS8,
DS15).
2. Remove the Flexible Cable from the connector (DS1).
3. Remove 4 screws and then remove the Slot Block.
9
TH-58PH10BK / TH-58PH10EK

6.4. Removal of DS-Board
1. Remove the HU Terminal Block.
(Refer to Removal of HU-Board)
2. Remove the Slot Block.
(Refer to Removal of Slot Block)
3. Disconnect the connector (DS14).
4. The Slot Block is turned inside out.
5. Remove 6 screws and then remove the Slot Cover.
6. Remove 6 screws and then remove DS-Board.
6.5. Removal of HX-Board
1. Remove the HU Terminal Block.
(Refer to Removal of HU-Board)
2. Remove the Slot Block.
(Refer to Removal of Slot Block)
3. Remove the DS-Board.
(Refer to Removal of DS-Board)
4. Remove 2 screws and then remove the Slot Case.
5. Remove 4 Hexagonal-Head screws and 2 screws and then
remove HX-Board.
6.6. Removal of DN-Board
1. Disconnect the connectors (DN6, DN31, DN33, DN35).
2. Remove the Flexible Cable from the connector (DN1).
3. Remove 4 screws and then remove DN-Board.
Note:
A re-setup of the destination is performed by MS mode
after DN-Board exchange.
10
TH-58PH10BK / TH-58PH10EK

6.7. Removal of P-Board
1. Disconnect the connectors (P2, P6, P7, P9, P11, P12,
P25).
2. Remove 8 screws and then remove P-Board.
6.8. Removal of D-Board
1. Remove the Slot Block.
(Refer to Removal of Slot Block)
2. Disconnect the connectors (D5, D20, D25).
3. Remove the Flexible Cables from the connectors (D31,
D32).
4. Remove 4 screws and then remove D-Board.
6.9. Removal of H3-Board (L, R)
1. Remove 2 screws and then remove the Speaker Terminal
Block (L, R).
2. Disconnect the connector (H37).
3. Remove 3 screws (G) and then remove H3-Board.
6.10. Removal of SU-Board and SD-
Board
1. Remove the Flexible Cables from the connectors (SU1,
SU2, SU3, SU4, SD1, SD2, SD3, SD4).
2. Remove 8 screws.
3. Disconnect the connectors (SU45, SD46).
4. Slide SU-Board and SD-Board to the left to remove SU-
Board and SD-Board from the connectors (SC41, SC42,
SC43, SC44).
11
TH-58PH10BK / TH-58PH10EK

6.11. Removal of SC-Board
1. Disconnect the connectors (SU45, SD46, SC2, SC20).
2. Remove 10 screws ( ) and then slide SC-Board to the right.
6.12. Removal of SS2-Board and
SS3-Board
1. Disconnect the connectors (SS23, SS24).
2. Remove the Flexible Cables from the connectors (SS52,
SS57).
3. Remove 4 screws and then remove SS2-Board and SS3-
Board.
6.13. Removal of SS-Board
1. Disconnect the connectors (SS11, SS12, SS23, SS24,
SS33, SS34, SS35).
2. Remove the Flexible Cables from the connectors (SS53,
SS54, SS55, SS56).
3. Remove 7 screws and then remove SS-Board.
6.14. Removal of C1, C2 and C3-
Board
1. Remove the Slot Block.
(Refer to Removal of Slot Block)
2. Remove 8 screws and then remove the Reinforcement
Angle (L, R).
6.14.1. Removal of C1-Board
1. Remove the Flexible Cables from the connectors (C10,
C11).
2. Remove 8 screws ( ) and then remove the Flexible Cables
from the connectors (CB1, CB2, CB3, CB4).
3. Remove 6 screws ( ) and then remove C1-Board.
12
TH-58PH10BK / TH-58PH10EK

6.14.2. Removal of C2-Board
1. Remove 3 screws and then remove the AC-Inlet Block.
2. Remove the Flexible Cables from the connectors (C20,
C21, C22).
3. Remove 8 screws ( ) and then remove the Flexible Cables
from the connectors (CB5, CB6, CB7, CB8).
4. Remove 6 screws ( ) and then remove C2-Board.
6.14.3. Removal of C3-Board
1. Remove 1 screw and then remove the Wire Support.
2. Remove the Flexible Cable from the connector (C32).
3. Disconnect the connectors (C33, C35).
4. Remove 6 screws ( ) and then remove the Flexible Cables
from the connectors (CB9, CB10, CB11).
5. Remove 5 screws ( ) and then remove C3-Board.
6.15. Removal of S1-Board
1. Remove 2 screws (H) and then remove the S1-Board Block.
2. Disconnect the connector (S34).
3. Remove 1 screw (J) and then remove S1-Board.
13
TH-58PH10BK / TH-58PH10EK

6.16. Removal of Fan
1. Disconnect the Fan Relay Connectors.
2. Remove 9 screws and then remove the 3 Fan Blocks.
3. Remove each 4 screws (K) and then remove the Fans.
4. Reassemble the Fans in reverse order.
5. Stick the Cushion (Fan) around the Fan.
Note:
The Cushion of Fan is not re-usable.
Please use a new one when Fan exchange.
6.17. Removal of V1-Board, V2-
Board and Operation Button
1. Remove the S1-Board Block.
(Refer to Removal of S1-Board)
2. Disconnect the connectors (DS2, DS15).
3. Remove 8 screws of the Escutcheon.
4. Pull the bottom of the Plasma Panel forward (arrow1).
5. Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).
6. Remove 20 screws and then remove the Fixed Angle (A, B,
C).
7. Remove 1 screw (L).
8. Disconnect the connector (V2) and then remove V1-Board.
9. Remove the Operation Button from V2-Board.
10. Disconnect the connector (V15) and then remove V2-
Board.
14
TH-58PH10BK / TH-58PH10EK

6.18. Removal of Escutcheon and
Front Glass
1. Remove the S1-Board Block.
(Refer to Removal of S1-Board)
2. Disconnect the connectors (DS2, DS15).
3. Remove 8 screws of the Escutcheon.
4. Pull the bottom of the Plasma Panel forward (arrow1).
5. Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).
6. Remove 25 screws and then remove the Fixed Angle (A, B,
C, D).
7. Remove the Front Glass.
Note: when Front Glass is exchanged
· Along each fixed Angles of an top and bottom, right
and left order and the sponge for the Front Glass is
pasted to the Front Glass.
Note
· The sponges are parts which cannot be recycled.
Please use the new article when you exchange the
Front Glass.
8. Remove 1 screw (L) and then remove V1-Board.
9. Remove V2-Board and Operation Button.
15
TH-58PH10BK / TH-58PH10EK

6.19. Removal of Plasma Panel
1. Disconnect the Fan Relay Connectors.
2. Remove 9 screws and then remove the 3 Fan Blocks.
3. Remove 8 screws and then remove the Reinforcement
Angle (L, R).
4. Disconnect the connectors (DS2, DS4, DS6, DS7, DS8,
DS15).
5. Remove the Flexible Cable from the connector (DS1).
6. Remove 4 screws and then remove the Slot Block.
7. Disconnect the connector (DN6).
8. Remove 4 screws and then remove DN-Board.
9. Remove 3 screws and then remove the Fixed Plate.
10. Disconnect the connectors (P2, P9, P11, P12, P25).
11. Remove 8 screws ( ) and then remove P-Board.
12. Remove 2 screws ( ) and then remove the Speaker
Terminal Block (L, R).
13. Disconnect the connector (D20).
14. Remove the Flexible Cables from the connectors (C11,
C21).
15. Remove 4 screws and then remove D-Board.
16
TH-58PH10BK / TH-58PH10EK

16. Remove SU-Board and SD-Board.
(Refer to Removal of SU-Board and SD-Board)
17. Remove 10 screws and then remove SC-Board.
18. Remove SS2-Board and SS3-Board.
(Refer to Removal of SS2-Board and SS3-Board)
19. Disconnect the connectors (SS33, SS34, SS35).
20. Remove the Flexible Cables from the connectors (SS53,
SS54, SS55, SS56).
21. Remove 7 screws and then remove SS-Board.
22. Remove 2 screws ( ) and then remove the S1-Board Block.
23. Remove 1 screw ( ) and then remove the Wire Support.
24. Remove 3 screws and then remove the AC-Inlet Block.
25. Remove the Flexible Cables from the connectors (C10,
C20, C22, C32).
26. Remove 8 screws of the Escutcheon.
27. Remove the 10 Spacers and Spacer Rings from the Plasma
Panel.
17
TH-58PH10BK / TH-58PH10EK

Caution:
· Please confirm the installation place of Spacer and
Spacer Ring when you exchange the Plasma Panel,
and install Spacer and Spacer Ring in an original
installation place after exchanging the Plasma
Panel.
28. Lift up the bottom of the Plasma Panel in the direction of the
arrow 1 and pull the Plasma Panel in the direction of the
arrow 2 and then remove the Plasma Panel.
18
TH-58PH10BK / TH-58PH10EK

7 Location of Lead Wiring
7.1. Location of Lead Wiring (1)
The lead wiring is dressed as shown in figure.
19
TH-58PH10BK / TH-58PH10EK

7.2. Location of Lead Wiring (2)
The lead wiring is dressed as shown in figure.
20
TH-58PH10BK / TH-58PH10EK