Panasonic TH-50PH30E User manual

© Panasonic Corporation 2011
Unauthorized copying and distribution is a violation
of law.
Order Number PCZ1104079CE
High Definition Plasma Display
Model No. TH-50PH30E
TH-50PH30ER
GPH14DMON Chassis
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions----------------------------------------------- 3
1.1. General Guidelines---------------------------------------- 3
1.2. Touch-Current Check ------------------------------------- 3
2 Warning -------------------------------------------------------------- 4
2.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatically Sensitive (ES) Devices---------- 4
2.2. About lead free solder (PbF)---------------------------- 5
3 Service Navigation ----------------------------------------------- 6
3.1. Service Hint ------------------------------------------------- 6
3.2. Applicable signals ----------------------------------------- 7
4 Specifications ----------------------------------------------------- 9
5 Operating Instructions-----------------------------------------10
6 Service Mode -----------------------------------------------------12
6.1. CAT (Computer Aided Test) mode -------------------12
6.2. IIC mode structure (following items value is
sample data) -----------------------------------------------15
7 Troubleshooting Guide ----------------------------------------16
7.1. Self Check--------------------------------------------------16
7.2. No Power ---------------------------------------------------19
7.3. No Picture-------------------------------------------------- 19
7.4. Local screen failure-------------------------------------- 20
8 Disassembly and Assembly Instructions--------------- 21
8.1. Removal of Rear Cover -------------------------------- 21
8.2. Removal of D-Board------------------------------------- 21
8.3. Removal of HX-Board----------------------------------- 21
8.4. Removal of A-Board------------------------------------- 21
8.5. Removal of Fan------------------------------------------- 22
8.6. Removal of P-Board------------------------------------- 22
8.7. Removal of AC Inlet Assy------------------------------ 22
8.8. Removal of Speaker Terminal Block ---------------- 22
8.9. Removal of SN-Board----------------------------------- 22
8.10. Removal of SS-Board----------------------------------- 23
8.11. Removal of C1-Board ----------------------------------- 23
8.12. Removal of C2-Board ----------------------------------- 24
8.13. Removal of S1-Board ----------------------------------- 24
8.14. Removal of Front Glass, V1, V2-Board and
Cabinet Assy ---------------------------------------------- 24
8.15. Removal of Plasma Display Panel------------------- 26

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9 Measurements and Adjustments -------------------------- 29
9.1. Adjustment------------------------------------------------- 29
9.2. Adjustment------------------------------------------------- 30
10 Block Diagram --------------------------------------------------- 35
10.1. Main Block Diagram ------------------------------------ 35
10.2. Block (1 of 4) Diagram ---------------------------------- 36
10.3. Block (2 of 4) Diagram ---------------------------------- 37
10.4. Block (3 of 4) Diagram ---------------------------------- 38
10.5. Block (4 of 4) Diagram ---------------------------------- 39
11 Wiring Connection Diagram --------------------------------- 40
11.1. Wiring (1) --------------------------------------------------- 40
11.2. Wiring (2) --------------------------------------------------- 41
12 Schematic Diagram--------------------------------------------- 42
13 Printed Circuit Board ------------------------------------------ 42
14 Exploded View and Replacement Parts List ----------- 42
14.1. Exploded View -------------------------------------------- 42
14.2. Electrical Replacement Parts List-------------------- 42

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1 Safety Precautions
1.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight
out.
4. When servicing, observe the original lead dress.If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground
such as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1

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2Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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3 Service Navigation
3.1. Service Hint
Board Name Function Board Name Function
A Digital Signal Processor, Microcomputer
Audio Processor, Speaker Out Amplifier
C2 Data drive (Left)
S1 Power switch
D Format Converter, Plasma AI Processor
Sub-Field Processor, Sync Processor
V1 Remote receiver, LED-G, R
V2 Key switch
SN Scan drive, Scan out P Power supply
SS Sustain drive, Sustain out H3 Speaker terminal
C1 Data drive (Right) HX PC / RS-232C_Input terminal

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3.2. Applicable signals

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4 Specifications
Power Source 220 - 240 V AC, 50/60Hz
Power Consumption
Power on 230 W
Stand-by condition 0.5 W
Power off condition 0.3 W
Plasma Display panel Drive method: AC type
50-inch, 16:9 aspect ratio
Screen size 1,105 mm (W) ×622 mm (H) ×1,268 mm (diagonal)
(No. of pixels) 786,432 (1,024 (W) ×768 (H)) [3,072 ×768 dots]
Operating condition
Temperature 0 °C - 40 °C
Humidity 20 % - 80 %
Applicable signals
Colour System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) /
60i 60p 50i 50p 24p 25p 30p 24sF
PC signals VGA, SVGA, XGA
SXGA, UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
AV IN
VIDEO BNC 1.0 Vp-p (75-ohm)
AUDIO L-R RCA Pin jack ×2 0.5 Vrms
HDMI TYPE A Connector
COMPONENT / RGB IN
Y / G BNC with sync 1.0 Vp-p (75-ohm)
PB/CB/B BNC 0.7 Vp-p (75-ohm)
PR/CR/R BNC 0.7 Vp-p (75-ohm)
AUDIO L-R RCA Pin jack ×2 0.5 Vrms
DVI-D IN DVI-D 24 Pin Compliance with DVI Revision 1.0
Content Protection Compatible with HDCP 1.1
AUDIO Stereo mini jack (M3) ×1 0.5 Vrms
PC IN High-Density Mini D-sub 15 Pin Y or G with sync 1.0 Vp-p (75-ohm)
Y or G without sync 0.7 Vp-p (75-ohm)
PB/ CB/ B:0.7 Vp-p (75-ohm)
PR/ CR/ R:0.7 Vp-p (75-ohm)
HD / VD:1.0 - 5.0 Vp-p (high impedance)
AUDIO Stereo mini jack (M3) ×1 0.5 Vrms
SERIAL External Control Terminal
D-sub 9 Pin RS-232C compatible
EXT SP Speaker Terminal 6-ohm, 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter N2QAYB000535
Batteries R6 (UM3) Size x 2
Dimensions (W ×H ×D) 1,210 mm ×724 mm ×89 mm
Mass (weight)
main unit only approx. 31.0 Kg net
with speakers approx. 36.0 Kg
Notes:
• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
• This equipment complies with the EMC standards listed below.
EN55022, EN55024, EN61000-3-2, EN61000-3-3.

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5 Operating Instructions