Panasonic TH-65PHD8BK User manual

ORDERNO. ITD0509054CE
D10
High Definition PlasmaDisplay
TH-65PHD8BK / TH-65PHD8EK/ TH-65PHD8UK
GPH8DChassis
SPECIFICATIONS
Specifications
Power
Source (UK) 120 VAC, 50/60Hz
Power
Source (BK/EK) 220 -240 VAC, 50/60 Hz
Power
Consumption (UK)
Maximum 675 W
Stand-bycondition SaveOFF 0.7W, SaveON0.5W
Poweroff condition 0.2W
Power
Consumption (BK/EK)
Normal use 615 W
Stand-bycondition Saveoff 0.9W, Saveon 0.7W
Poweroff condition 0.35 W
Plasma
Displaypanel Drivemethod:ACtype65-inch, 16:9aspectratio
ContrastRatio 3000:1
Screen
size 56.5”(1,434 mm)(W)×31.7”(806 mm)(H)×65”(1,645 mm)(diagonal)
(No. ofpixels) 1,049,088 (1,366 (W)×768 (H)) [4,098 ×768 dots]
Operating
condition
Temperature 32 °F -104 °F (0°C-40 °C)
Humidity 20 %-80 %
Applicable
signals
ColorSystem NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480)/ 60i 60p, 625 (575)/ 50i 50p, 750 (720)/ 60p 50p, 1125 (1080)/ 60i 50i 24p 25p
30p
24sF .... SMPTE274M, 1250 (1080)/ 50i
PCsignals VGA, SVGA, XGA, SXGA, UXGA..... (compressed)
1

Horizontal scanning frequency15 -110 kHz
Vertical scanning frequency48 -120 Hz
Connection
terminals
AV VIDEOIN/ OUT(BNC) 1.0Vp-p (75-ohmorhigh impedance)
SVIDEOIN(MINI DIN4PIN) Y:1Vp-p (75-ohm), C:0.286 Vp-p (75-ohm)
AUDIOIN(RCAPINJACK ×2) 0.5Vrms (high impedance)
COMPONENT/ RGB(UK) Y/ G(BNC) 1.0Vp-p / composite(75-ohm)
0.7Vp-p / non-composite(75-ohm)
PB/B(BNC), PR/R(BNC) 0.7Vp-p (75-ohm)
AUDIOIN(RCAPINJACK ×2) 0.5Vrms (high impedance)
PC(UK) (HIGH-DENSITYMini-D-SUB 15PIN) R,G,B/ 0.7Vp-p (75-ohm)
HD, VD/ 1.0-5.0Vp-p (high impedance)
Component
Y:1.0Vp-p (75-ohm:includesync)
PB/ CB:0.7Vp-p (75-ohm)
PR/ CR:0.7Vp-p (75-ohm)
AUDIOIN(M3JACK) 0.5Vrms (high impedance)
PC(BK/EK) (HIGH-DENSITYMini-D-SUB 15PIN) R,G,B/ 0.7Vp-p (75-ohm)
HD, VD/ 1.0-5.0Vp-p (high impedance)
AUDIOIN(M3JACK) 0.5Vrms (high impedance)
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232CCOMPATIBLE
SPEAKERS(8 ) 20 W [10 W +10 W](10 %THD)
Accessories
Supplied
RemoteControl Transmitter EUR7636070R
(UK)
RemoteControl Transmitter EUR7636090R
(BK/EK)
Batteries (UK) 2×AA Size
Batteries (BK/EK) 2×R6Size
Fixing bands (TMME203)×2
Dimensions
(W ×H×D) 61.2”(1,554 mm)×36.4”(925 mm)×3.9”(99 mm)
(exclusiveofprotruding portion)
Mass
(weight) (UK)
main unitonly approx. 172.0lbs
with speakers approx. 181.7lbs
Mass
(weight) (BK/EK)
main unitonly approx. 78.0kg net
with speakers approx. 82.4kg
Notes
:
Design
and specificationsaresubjectto changewithout notice. Mass and dimensionsshownareapproximate.
This
equipment complies with theEMC standardslistedbelow. EN55022, EN55024, EN61000-3-2, EN61000-3-3. (BK/EK)

1. Applicablesignals
2. SafetyPrecautions
3

2.1. General Guidelines
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperlyinstalled.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrombeing exposedtoshock hazards.
2.1.1. LeakageCurrentColdCheck
1. Unplug theACcordand connect ajumperbetweenthetwoprongs
on theplug.
2. Measuretheresistance value, withanohmmeter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Whentheexposedmetallicparthas areturnpathtothechassis,
thereading shouldbebetween1M and 5.2M . / Whenthe
exposedmetal does nothaveareturnpathtothechassis, the
reading must be . Figure1
2.1.2. LeakageCurrentHotCheck (See Figure 1 .)
1. Plug theACcorddirectlyintotheACoutlet. Donotuse an
isolation transformerforthischeck.
2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F
capacitors, betweeneachexposedmetallicparton theset and a
good earthground suchas awaterpipe, as shownin Figure1.
3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to
measurethepotential across theresistor.
4

4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverse theACplug intheACoutlet and repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A
leakagecurrenttester(Simpson Model 229 orequivalent) maybe
usedtomake thehotchecks, leakagecurrentmust notexceed1/2
milliamp. Incase ameasurementisoutsideofthelimits specified,
thereisapossibilityofashock hazard, and theequipmentshould
berepairedand recheckedbeforeitisreturnedtothecustomer.
3. Prevention of ElectroStaticDischarge (ESD) to
ElectrostaticallySensitive(ES) Devices
Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such
componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical
ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectro staticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischarging ESDwrist strap, which
shouldberemovedforpotential shock reasonspriortoapplying
powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas aluminum
foil, topreventelectrostaticchargebuildup orexposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderRemovedevice. Somesolder
Removedevices notclassifiedas "anti-static(ESDprotected)"can
generate electrical chargesufficienttodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
5

6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, aluminumfoil orcomparable
conductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricity(ESD)sufficient
todamageanES device).
4. About lead free solder(PbF)
Note:Leadislistedas (Pb)intheperiodictableofelements.
Intheinformation below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.
TheLeadFree Solderusedinour manufacturing process and discussedbelowis(Sn+Ag+Cu).
ThatisTin(Sn), Silver(Ag)and Copper(Cu)although othertypes areavailable.
Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues.
For service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsolder
may beused.
PCBsmanufacturedusing leadfree solderwill have thePbF withinaleafSymbol
stampedon theback ofPCB.
Caution
-Pbfree solderhas ahighermelting pointthanstandardsolder.
Typicallythemelting pointis50 ~70 °F(30~40 °C)higher. Please
use ahigh temperaturesoldering iron and set itto700 ±20 °F(370
6

±10 °C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100
°For600 °C).
Ifyou must use Pbsolder, please completelyremoveall ofthePb
free solderon thepinsorsolderarea beforeapplying Pbsolder. If
thisisnotpractical, besuretoheat thePbfree solderuntil itmelts,
beforeapplying Pbsolder.
-Afterapplying PbF soldertodoublelayeredboards, please check
thecomponentsideforexcess solderwhichmayflow ontothe
opposite side. (see figurebelow)
SuggestedPbfree solder
Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu
(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan
alsobeused.
5. PCB Structuresheet of GPH8Dchassis
7

Board Name Function Remarks
DDigital Signal Processor,
FormatConverter,
PlasmaAIProcessor
1
JSlotInterface (Audio/Video/Sync
inputSwitch), SYNC processor,
Audioprocessor,
Speakeroutamplifier,
DC-DC converter
1
SS Sustaindrive 1
SC Scandrive 1
SU Scanout(Upper) 1
SD Scanout(Lower) 1
C1 DataDrive (UpperRight)
C2 DataDrive (UpperCenter)
C3 DataDrive (UpperLeft)
C4 DataDrive (LowerLeft)
C5 DataDrive (LowerCenter)
C6 DataDrive (LowerRight)
H3 Speakerterminal
S1 Powerswitch
SS2 Sustainout(Upper)
SS3 Sustainout(Lower)
V1 LED(stand-by/ Poweron)&
Remotereceiver 1
PB Fancontrol 1
P Linefilter, Powersupply 1
HX PC/ RS-232C
HB BNC CompositeVideo 2
HA BNC ComponentVideo 3
Remarks
1:Recommend PCB'sforinitial service forGPH8Dchassis.
2:ForTH-65PHD8BK/EK/UK
3:ForTH-65PHD8UK
6. Service Hint
8

Note:
Extension cablekitfor SlotBoard issuppliedas service fixtures and tools.
(PartNo. TZSC0704)
7. Disassembly
-To removeP.C.B., waitfor1minute afterpowerwas off for
dischargefromelectrolysiscapacitors.
- and marks indicate screw positions.
7.1. Removal oftheBack Cover
1. Removethescrews(×20 , ×9 , ×4 ) and thenremove
theBack Cover.
9

7.2. Removal oftheHA-Boardand theHB-Board
7.2.1. TH-65PHD8UK
-Removal oftheHB-Board
1. Removethe4screws(A)oftheHB Terminal Block and then
removetheHB Terminal Block.
2. Removethe4screws(B).
3. Removethe2screws(C)and thenremovetheHB-Board.
-Removal oftheHA-Board
1. Removethe4screws(D)oftheHATerminal Block and then
removetheHATerminal Block.
2. Removethe4screws(E).
3. Removethe2screws(F)and thenremovetheHA-Board.
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7.2.2. TH-65PHD8EK/BK
-Removal oftheHB-Board
1. Removethe4screws(G)oftheHB Terminal Block and then
removetheHB Terminal Block.
2. Removethe4screws(H).
3. Removethe2screws(J) and thenremovetheHB-Board.
7.3. Removal oftheSlotBlock
1. Disconnect thecouplers(J1, J3, J4, J5, J6, J7, J10, J34).
2. Removethe4screwsand thenremovetheSlotBlock.
11

7.4. Removal oftheJ-Board
1. RemovetheHATerminal Block and theHB Terminal Block.
(Reference toRemoval oftheHA-Boardand theHB-Board)
2. RemovetheSlotBlock.
(Reference toRemoval oftheSlotBlock)
3. Removethe8screwsand thenremovetheJ-Board.
7.5. Removal oftheHX-Board
1. RemovetheHATerminal Block and theHB Terminal Block.
(Reference toRemoval oftheHA-Boardand theHB-Board)
2. RemovetheSlotBlock.
(Reference toRemoval oftheSlotBlock)
3. RemovetheJ-Board.
(Reference toRemoval oftheJ-Board)
4. Removethe6screwsand thenremovetheSlotCase.
5. Removethe4Hexagonal-Headscrewsand the1screw oftheHX-
Boardand thenremovetheHX-Board.
12

7.6. Removal ofthePB-Board
1. Disconnect thecouplers(PB30, PB31, PB32, PB33, PB34, PB35,
PB37, PB38).
2. Removethe3scewqsand thenremovethePB-BoardBlock.
3. Removethe1screw and thenremovethePB-Board.
7.7. Removal oftheD-Board
1. RemovethePB-BoardBlock.(Reference toRemoval ofthePB-
Board)
2. Disconnect thecouplers(D1, D3, D5, D20, D25).
3. Removetheflexiblecables fromthecouplers(D31, D32, D33, D34).
4. Removethe3screwsand thenremovetheD-Board.
13

7.8. Removal oftheP-Board
1. Disconnect thecouplers(P2, P5, P9, P10, P11, P12, P23, P25, P30).
2. Removethe8screwsand thenremovetheP-Board.
7.8.1. Removal oftheP(P-1)-Board
1. Disconnect thecouplers(CN01, CN02, CN03).
2. Removethe5screws.(Top view)
3. Removethe8screws.(Bottomview)
14

4. RemovetheP(P-1)-Boardfromthe6molding props.
7.8.2. Removal oftheP(P-2)-Board
1. Disconnect thecouplers(CN05, CN06, CN08).
2. Removethe5screws.(Top view)
3. Removethe8screws.(Bottomview)
15

4. RemovetheP(P-2)-Boardfromthe6molding props.
Note:
-Whenassembling theP(P-1)-Boardand theP(P-2)-Board, the
position ofeachholeoftheinsulation sheets(A, B, C, D)isset to
theposition ofeachholeoftheP(P-1)-Boardand theP(P-2)-Board
and thenassemblethem. ( marks indicate setting positions.)
16

7.9. Removal oftheSU-Boardand theSD-Board
1. Disconnect thecouplers(SC45, SC46).
2. Removetheeach4screws.
3. SlidetheSU-Boardand theSD-Boardtotheleft (arrow1).
4. Disconnect thecoupler(SU45).
5. Removetheflexiblecables fromthecouplers(SU1, SU2, SU3, SU4)
and thenremovetheSU-Board.
6. Disconnect thecoupler(SD46).
7. Removetheflexiblecables fromthecouplers(SD1, SD2, SD3, SD4)
and thenremovetheSD-Board.
17

7.10. Removal oftheSC-Board
1. Disconnect thecouplers(PB31, PB32).
2. Removetheeach4screwsand thenremovetheFanBlock (C).
3. SlidetheSU-Boardand theSD-Boardtotheleft. (Refarence to
Removal oftheSU-Boardand theSD-Board)
4. Disconnect thecouplers(SC2, SC20, SC23).
5. Removethe10 screwsoftheSC-Boardand slidetheSC-Boardin
thedirection ofthearrow (A)and thenremovetheSC-Board.
Note:
RemovetheSC-Boardnottodamagetheflexiblecables oftheSU-
Boardand theSD-Board, parts on theSC-Board.
7.11. Removal oftheSS2-Boardand theSS3-Board
1. Disconnect thecoupler(SS23).
2. Removetheflexiblecables fromthecouplers(SS51, SS52).
3. Disconnect thecoupler(SS27).
4. Removetheflexiblecables fromthecouplers(SS57, SS58).
5. Removetheeach3screwsand thenremovetheSS2-Boardand
18

theSS3-Board.
7.12. Removal oftheSS-Board
1. Disconnect thecouplers(PB35, PB38).
2. Removethe4screwsand thenremovetheFanBlock (D).
3. Disconnect thecouplers(SS11, SS12, SS23, SS27, SS34, SS35,
SS42, SS44).
4. Removetheflexiblecables fromthecouplers(SS53, SS54, SS55,
SS56).
5. Removethe10 screwsoftheSS-Boardand slidetheSS-Boardin
thedirection ofthearrow (B)and thenremovetheSS-Board.
Note:
RemovetheSS-Boardnottodamagetheflexiblecables ofthe
PlasmaPanel and parts on theSS-Board.
19

7.13. Removal oftheH3-Board(L, R)
1. Removetheeach2screwsand thenremovetheSpeakerTerminal
Blocks (L, R).
2. Disconnect thecoupler(H37).
3. Removethe3screws(K)and thenremovetheH3-Board.
7.14. Removal oftheC1, C2, C3, C4, C5and theC6-Board
1. Removetheeach4screwsand thenremovetheFanBlocks (A, B).
2. Removetheeach2screwsand thenremovetheSpeakerTerminal
Blocks (L, R).
20