Panasonic TH32LHD7UY - LCD MONITOR User manual

©2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-32LHD7UY
TH-32LHD7UXK
TH-32LHD7UXS
TH-32LHD7EK
TH-32LHD7ES
TH-32LHD7BK
TH-32LHD7BS
LL10 Chassis
LCD Display
Specifications
Power Source
(UY/UXK/UXS Version)
120 V
A
C, 50 / 60 Hz
Power Source
(EK/ES/BK/BS Version)
220 - 240 V
A
C, 50
/
60 Hz
Power Consumption
(UY/UXK/UXS Version)
Maximum 234W
Stand-b
y
condition Save OFF 0.8 W, Save ON 0.6 W
Power off condition 0.2 W
Power Consumption
(EK/ES/BK/BS Version)
Normal use 165 W
Stand-b
y
condition Save off 1.0 W, Save on 0.8 W
Power off condition 0.4 W
LCD Displa
y
panel 1,366 × 768 pixels widescreen LCD panel
Contrast Ratio 800:1
Screen size 697.7 mm (W) × 392.3 mm (H) × 800.4 mm (diagonal)
(No. of pixels) 1,049,088 (1,366 (W) × 768 (H)) [4,096 × 768 dots]
Operating condition
Temperature 32 ° F - 104 ° F (0 ° C - 40 ° C)
Humidit
y
20 % - 80 %
Applicabl
e
signals
Colour System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)
/
50i 50p, 750 (720)
/
60p 50p, 1125 (1080) / 60i 50i 24p
25p 30p 24sF .... SMPTE274M, 1250 (1080) / 50i
Order Number : ITD0502001CE
D10
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PC signals WXGA display
SVGA, XGA, SXGA, UXG
A
..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
A
V VIDEO IN (BNC) 1.0 Vp-p (75-ohm or high impedance)
(EK/ES/B
K
/BS/U
Y
Version) VIDEO OUT (BNC) 1.0 Vp-p (low impedance)
S VIDEO IN (MINI DIN 4PIN) Y: 1.0 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
COMPONENT / RGB
(EK/ES/BK/BS/UY Version)
Y
/ G (BNC)
Y
or G with syn
c
1.0 Vp-p (75-ohm)
G without sync 0.7 Vp-p (75-ohm)
RB
/
B (BNC), P R/ R (BNC) 0.7 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
PC R, G, B : 0.7 Vp-p (75-ohm)
Component
Y
: 1.0 Vp-p (75-ohm)
PR
/
CR,PB
/
CB: 0.7 Vp-p (75-ohm)
HD, VD : 1.0 - 5.0 Vp-p (high impedance)
(HIGH-DENSIT
Y
D-SUB 15PIN)
A
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS ( 6 Ω) 16 W [ 8 W + 8 W ] (10 % THD)
Accessories Supplied
Remote Control Transmitter EUR646535
Batteries
A
A/UM3/R6 Size × 2
Fixing bands (TMME203) × 2
Ferrite core J0KF00000018 × 2, J0KG00000054 × 2
Dimensions (
W
×H×D) 805 mm × 499.6 mm × 102 mm (exclusive of protruding portion)
Mass (Weight) (UY
V
ersion)
main unit onl
y
approx. 37.5 lbs
with speakers approx. 46.3 lbs
Mass (Weight)
(UXK/UXS Version)
main unit onl
y
approx. 36.4 lbs
with speakers approx. 45.2 lbs
Mass (Weight)
(EK/ES/BK/BS Version)
main unit onl
y
approx. 17.0 kg net
with speakers approx. 21.0 kg
Notes:
· Design and specifications are subject to change without notice.Mass and dimensions shown are approximate.
· This equipment (EK/ES/BK/BS Version) complies with the EMC standards listed below.
EN55013, EN55020, EN55022, EN55024, EN61000-3-2, EN61000-3-3.
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1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 PCB Structure sheet of LL10 chassis 8
6 Service Hint 9
7 Disassembly / Exchange 10
7.1. Before exchanging the board 10
7.2. How to exchange the Board in condition the Pedestal
(Option) is installed in the LCD set. 11
7.3. How to exchange the Board in condition the Pedestal
(Option) is removed from the LCD set. 21
8 Location of Lead Wiring 25
9 Service mode 26
9.1. CAT (computer Aided Test) mode 26
9.2. IIC mode structure (following items value is sample data.)
28
10 Alignment 29
10.1. PC / RGB / NTSC / PAL / DVI / HD / 525i / 525p / 625i /
625p panel white balance 29
11 Trouble shooting guide 33
11.1. Self Check 33
11.2. No Power 34
11.3. No Picture 34
12 Option Setting 35
12.1. How to access and setting 35
12.2. Contents of Option Menu 36
13 Circuit Board Layout 37
13.1. PF-Board 37
13.2. HA-Board 38
13.3. Z-Board 39
13.4. HX-Board 40
13.5. R, S, H3 and V-Board 41
13.6. HB-Board 42
13.7. J-Board 43
13.8. D-Board 45
14 Schematic Diagrams 47
14.1. Schematic Diagram Notes 47
14.2. Main Block Diagram (1 of 2) 48
14.3. Main Block Diagram (2 of 2) 49
14.4. PF, HA and Z-Board Block Diagram 50
14.5. P, H3, V, S, HX and R-Board Block Diagram 51
14.6. HB-Board Block Diagram 52
14.7. J-Board Block Diagram 53
14.8. D-Board Block Diagram 54
14.9. PF, V, R and S-Board Schematic Diagram 55
14.10. HA-Board Schematic Diagram 56
14.11. HB-Board (1 fo 2) Schematic Diagram 57
14.12. HB-Board (2 fo 2) Schematic Diagram 58
14.13. HX-Board Schematic Diagram 59
14.14. J-Board (1 of 4) Schematic Diagram 60
14.15. J-Board (2 of 4) Schematic Diagram 61
14.16. J-Board (3 of 4) Schematic Diagram 62
14.17. J-Board (4 of 4) Schematic Diagram 63
14.18. D-Board (1 of 10) Schematic Diagram 64
14.19. D-Board (2 of 10) Schematic Diagram 65
14.20. D-Board (3 of 10) Schematic Diagram 66
14.21. D-Board (4 of 10) Schematic Diagram 67
14.22. D-Board (5 of 10) Schematic Diagram 68
14.23. D-Board (6 of 10) Schematic Diagram 69
14.24. D-Board (7 of 10) Schematic Diagram 70
14.25. D-Board (8 of 10) Schematic Diagram 71
14.26. D-Board (9 of 10) Schematic Diagram 72
14.27. D-Board (10 of 10) Schematic Diagram 73
14.28. Z-Board (1 of 2) and H3-Board Schematic Diagram 74
14.29. Z-Board (2 of 2) Schematic Diagram 75
15 Parts Location 77
15.1. Parts Location (1) 77
15.2. Parts Location (2) 78
15.3. Packing Exploded View 79
16 Replacement Parts List 80
16.1. Mechanical Replacement Parts List 80
16.2. Replacement Parts List Notes 81
16.3. Electrical Replacement Parts List 82
CONTENTS
Page Page
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1 Applicable signals
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2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to thechassis,the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outsideof the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistorsand
semiconductor"chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
whichshouldbe removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or
comparableconductivematerial).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
todamagean ES device).
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also beused.
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5 PCB Structure sheet of LL10 chassis
Board Name Function Remarks
D Digital Signal Processor 1
J Slot Interface & SYNC processor 1
Z Audio out, DC-DC converter
H3 Speaker terminal
S Power switch
V Operation SW.
R Power indicator & Remote receiver 1
PF Line filter 1
P Power supply 1
HX PC_type_Input terminal
HB BNC Composite/Component Video 2
HA BNC Component Video 2
Remarks
1.Recommend PCB´s for initial service for LL10 chassis.
2.Only for EK/ES/BK/BS/UY models.
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6 Service Hint
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7 Disassembly / Exchange
7.1. Before exchanging the board
· When exchanging the board, there are two kinds of the board, the board which can be exchange in condition the
pedestal(Option) is installed in the LCD set and the board which cannot be exchange if the pedestal(Option) is not removed
from the LCD set.
(Refer to the following list of the the board removal category.)
7.1.1. Board removal category
the board which can be exchange in
condition the pedestal(Option) is installed
in the LCD set.
the board which cannot be exchange if
the pedestal(Option) is not removed
from the LCD set.
[ Z ] Audio out, DC-DC converter Board —
[ H3 ] Speaker terminal Board —
FAN —
[ P ] Power supply Board —
[ V ] Operation SW Board —
[ S ] Power switch Board —
[ R ] Power indicator & Remote receiver Board —
[ HB ] BNC Composite/Component Video Board —
[ HA ] BNC Component Video Board —
[ J ] Slot Interface & SYNC processor Board —
[ HX ] PC_type_Input terminal Board —
[ D ] Digital Signal Processor Board —
[ PF ] Line filter Board ×
LCD module(finished) ×
· [ ]: Enable to exchange
· [ × ]: Disable to exchange
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7.2. How to exchange the Board in condition the Pedestal (Option) is
installed in the LCD set.
The following write explains how to exchange in condition the Speaker (Option) is installed in the LCD set.
7.2.1. Removal of the Speaker (L, R) (Option)
(1) Remove the Speaker cable (L, R).
(2) Remove the each of 2 Speaker fixed screws.
(3) Remove the Speaker (L, R)
7.2.2. Removal of the Rear Cover
(1) Remove the 17 screws (A) of the Rear Cover .
Caution:
Remove the Handles at that time.
(2) Remove the 10 screws (B) of the Rear Cover.
(3) Remove the 4 screws (C) of the Pedestal (Option).
(4) Remove the Rear Cover .
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7.2.3. Exchange of the Z-Board
(1) Disconnect the couplers (Z5, Z6, Z7, Z8, Z10, Z30, Z32).
(2) Remove the 4 screws of the Z-Board and then
remove the Z-Board.
7.2.4. Exchange of the H3-Board (R)
(1) Remove the 2 screws of the H3-Board (R) fixed angle.
(2) Disconnect the coupler (H37).
(3) Remove the 3 screws (D) and then remove the H3-Board (R).
(4) Exchange the new H3-Board.
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7.2.5. Exchange of the H3-Board (L)
(1) Remove the 1 screw of the H3-Board (L) fixed angle.
(2) Disconnect the coupler (H37).
(3) Remove the 3 screws (E) and then remove the H3-Board (L).
(4) Exchange the new H3-Board.
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7.2.6. Exchange of the Fan(L), (R)
(1) Disconnect the coupler from the Fan Ass’y (L), (R).
Fan (L): Coupler Z30
Fan (R): Coupler Z32
(2) Remove the each 3 screws of the Fan Ass’y (L), (R) and then
remove the Fan Ass’y (L), (R).
(3) Remove the 2 screws (V) of the Installation Plate (B) and then
remove the both of the Installation Plate (A) and tthe Installation
Plate (B).
(4) Remove the 4 Fan rubbers.
(5) Exchange the new Fan.
Caution when the Fan is installed:
Please exchange a new Fan Cushion (B) at the time of Fan
exchange.
Fan Cushion (B) : TMKG526
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7.2.7. Exchange of the P-Board
(1) Disconnect the couplers (P3, P5, P9, P10, P25, P27, P34).
(2) Remove the 7 screws of the P-Board and then remove the P-
Board.
(3) Exchange the new P-Board.
7.2.8. Exchange of the V-Board
(1) Remove the 2 screws (F) of the Control Button.
(2) Disconnect the coupler (V35) and then remove the V-Board and
the Control Button.
(3) Remove the 2 screws (G) and then remove the V-Board.
(4) Exchange the new V-Board.
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7.2.9. Exchange of the S-Board
(1) Remove the 2 screws (H) of the S-Board.
(2) Disconnect the coupler (S34) and then remove the S-Board and
the Power Button Bracket.
(3) Remove the 2 screws (J) and then remove the S-Board.
(4) Exchange the new S-Board.
7.2.10. Exchange of the R-Board
(1) Remove the V-Board and the Control Button Bracket.
(Refer to Exchange of the V-Board.)
(2) Remove the S-Board and the Power Button Bracket.
(Refer to Exchange of the S-Board.)
(3) Disconnect the coupler (R34) and then remove the R-Board.
(4) Exchange the new R-Board.
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7.2.11. Removal of the Slot Block
(1) Disconnect the couplers (J1, J3, J5, J6, J8, J10).
(2) Remove the 4 screws of the Slot Block and then remove the
Slot Block.
Caution
Remove the cable from clamper at that time according to
the necessity.
7.2.12. Exchange of the HA-Board
(1) Remove the Slot Block.
(Refer to Removal of the Slot Block.)
(2) Remove the 4 screws (K) of the HA Terminal Block and then
pull the HA Terminal Block in the direction of the arrow.
(3) Remove the 4 screws (L) of the Shield Plate.
(4) Remove the 2 screws (M) of the HA-Board Plate.
(5) Exchange the new HA-Board.
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7.2.13. Exchange of the HB-Board
(1) Remove the Slot Block.
(Refer to Removal of the Slot Block.)
(2) Remove the 4 screws (N) of the HB Terminal Block and then
pull the HB Terminal Block in the direction of the arrow.
(3) Remove the 4 screws (P) of the Shield Plate.
(4) Remove the 2 screws (R) of the HB-Board Plate.
(5) Exchange the new HB-Board.
7.2.14. Exchange of the J-Board
(1) Remove the Slot Block.
(Refer to Removal of the Slot Block.)
(2) Remove the HA Terminal Block.
(Refer to Exchange of the HA-Board.)
(3) Remove the HB Terminal Block.
(Refer to Exchange of the HB-Board.)
(4) Remove the 6 screws of the J-Board and then remove the
J-Board.
(5) Exchange the new J-Board.
Caution
Take care to connect the coupler (J14) at that time.
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7.2.15. Exchange of the HX-Board
(1) Remove the Slot Block.
(Refer to Removal of the Slot Block.)
(2) Remove the HA Terminal Block.
(Refer to Exchange of the HA-Board.)
(3) Remove the HB Terminal Block.
(Refer to Exchange of the HB-Board.)
(4) Remove the J-Board.
(Refer to Exchange of the J-Board.)
(5) Remove the 6 screws of the Slot Case and then remove the
Slot Case.
(6) Remove the 4 Hexagonal-Head Screws and the 1 screw of the
HX-Board and then remove the HX-Board.
(7) Exchange the new HX-Board.
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7.2.16. Exchange of the D-Board
(1) Remove the Fan (L).
(Refer to Exchange of the Fan (L), (R).)
(2) Disconnect the couplers (D1, D3, D5, D20, D24, D25, D27,
D34).
(3) Remove the 6 screws of the D-Board and then remove the both
of the D-Board and the Shield Case.
(4) Exchange the new D-Board.
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